CN103746818B - A kind of signal connection system between network switch support plate and sandwich plate - Google Patents
A kind of signal connection system between network switch support plate and sandwich plate Download PDFInfo
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- CN103746818B CN103746818B CN201310740409.2A CN201310740409A CN103746818B CN 103746818 B CN103746818 B CN 103746818B CN 201310740409 A CN201310740409 A CN 201310740409A CN 103746818 B CN103746818 B CN 103746818B
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- support plate
- connector
- plate
- sandwich
- sandwich plate
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Abstract
The present invention provides the signal connection system between a kind of network switch support plate and sandwich plate, including support plate, sandwich plate, the first connector and the second connector, wherein, it is connected between the support plate and the sandwich plate by first connector and the second connector；4 3.3V power pins and 8 5V power pins are defined on the support plate；The size of the sandwich plate is 150mm*100mm；The structure of first connector and the second connector is identical.Signal connection system between the network switch support plate and sandwich plate of the present invention overcomes the defects of XMC sandwich plates can not meet cooling requirements；Solves the problems, such as single wide XMC sandwich plates power deficiency；It is too small to also solve single wide XMC interlayers plate suqare, can not mask placement device the problem of.
Description
Technical field
The present invention relates to a kind of signal connection method, more particularly to the letter between a kind of network switch support plate and sandwich plate
Number connection system.
Background technology
In the prior art, computer motherboard is to use modularized design, be functionally generally divided into processor part and
Peripheral interface part.In order to configure conveniently, it is easy to maintenance and cost-effective, generally by processor part and peripheral interface part
Separately design, complete machine function is realized by two plate interconnections.Under normal circumstances, processor part is realized that periphery connects by sandwich plate
Oral area point is realized by support plate.
At present in industrial control computer and consumer computer realm, connected between support plate and sandwich plate generally using
Golden finger connected mode or XMC standards.
Golden finger connected mode is simple in construction, in consumer field using more, as being exactly to adopt between PCI video cards and mainboard
Connected with golden finger+neck mode.The advantages of golden finger connected mode for design is simple, cost is low, shortcoming be resistance to shock it is poor,
Dust tightness is poor.When equipment reaches certain rank, the company between support plate golden finger neck and interlayer edge connector using scene vibration
Connecing to misplace, and short circuit between adjacent leads can occur under serious conditions, so as to cause whole support plate can not normal work.In height
In dirt environment, due to much time using, there can be many dusts between support plate golden finger neck and daughter board golden finger connector
Particle.If golden finger pin can closely not cause hot-spot, can cause to carry when situation is serious by larger electric current, connection
Open circuit or short circuit occur between plate and sandwich plate.
Industrial control field generally use XMC standards.XMC standards have clear stipulaties to physical dimension, signal definition etc.,
Modularized design is realized under certain condition and environment, is designed for simplifying, shortening design cycle etc. serves very big
Effect.However, the shortcomings that XMC standards is that can not fully meet actual demand, it is necessary to do some changes.In actual use,
Do not allow on XMC normed spaces using double wide sandwich plates, and single wide sandwich plate can not meet to require in heat sink design.Example
Such as, in actual use, selected device size layout is beyond single wide XMC area, but if using double wide folders
Layer card, clearance spaces are again a lot, will result in the waste of plank area and chassis space.For another example locate used in sandwich plate
Reason device heating is larger, and single wide XMC149mm*74mm size can not meet device radiating requirements, and by the shadow of package size
Ring, and do not allow using double wide sandwich plates.It is then desired to a kind of size is meeting work(between single wide and double wide sandwich plates
It can meet radiating requirements again while energy.According to XMC standards, the maximum load current of each bonder terminal is 1A, is used
Main XMC connectors, support plate 3.3V power supplys provide 4 pin to the sandwich plate for meeting XMC standards, and maximum can provide electric current and be altogether
4*1A=4A.It is to realize in the case where not increasing pin if meeting the more electric currents of sandwich plate needs of XMC standards
, therefore need to redefine the quantity of power pins.In view of framework and processor that selection is different, between support plate and sandwich plate
Data traffic signals and management signal are different.In order to meet regulatory requirement, it is necessary to be re-started calmly to the signal of connector
Justice, in order to meet actual demand.
The content of the invention
In view of the above the shortcomings that prior art, it is an object of the invention to provide a kind of network switch support plate and folder
Signal connection system between laminate, which overcomes the shortcomings that golden finger can not use under vibration, also solves XMC standards
Because size and current needs are fixed and the problem of can not realize flexible configuration.
In order to achieve the above objects and other related objects, the present invention is provided between a kind of network switch support plate and sandwich plate
Signal connects system, including support plate, sandwich plate, the first connector and the second connector, wherein, the support plate and the sandwich plate
Between be connected by first connector and the second connector；4 3.3V power pins and 8 5V are defined on the support plate
Power pins；The size of the sandwich plate is 150mm*100mm；The structure of first connector and the second connector is identical.
System is connected according to the signal between above-mentioned network switch support plate and sandwich plate, wherein：First connector
Laterally include A, B, C, D, E, F totally 6 row, longitudinal direction includes 1-19 totally 19 row, the signal definition such as following table of each pin：
| A | B | C | D | E | F | |
| 1 | DP00+ | DP00- | VCC3_3MP | DP10+ | DP10- | VCC5 |
| 2 | GND | GND | I2C1_SCL | GND | GND | MRSTI- |
| 3 | DP01+ | DP01- | VCC3_3MP | DP11+ | DP11- | VCC5 |
| 4 | GND | GND | I2C1_SDA | GND | GND | MRSTO- |
| 5 | DP02+ | DP02- | VCC3_3MP | DP12+ | DP12- | VCC5 |
| 6 | GND | GND | I2C2_SCL | GND | GND | ID0 |
| 7 | DP03+ | DP03- | VCC3_3MP | DP13+ | DP13- | VCC5 |
| 8 | GND | GND | I2C2_SDA | GND | GND | ID1 |
| 9 | DP04+ | DP04- | D0 | DP14+ | DP14- | VCC5 |
| 10 | GND | GND | D1 | GND | GND | ID2 |
| 11 | DP05+ | DP05- | D2 | DP15+ | DP15- | VCC5 |
| 12 | GND | GND | D3 | GND | GND | ID3 |
| 13 | DP06+ | DP06- | D4 | DP16+ | DP16- | VCC5 |
| 14 | GND | GND | D5 | GND | GND | NC |
| 15 | DP07+ | DP07- | D6 | DP17+ | DP17- | VCC5 |
| 16 | GND | GND | D7 | GND | GND | COM1_TXD |
| 17 | DP08+ | DP08- | D8 | DP18+ | DP18- | COM1_RXD |
| 18 | GND | GND | D9 | GND | GND | COM2_TXD |
| 19 | DP09+ | DP09- | D10 | DP19+ | DP19- | COM2_RXD |
System is connected according to the signal between above-mentioned network switch support plate and sandwich plate, wherein：Second connector
Laterally include A, B, C, D, E, F totally 6 row, longitudinal direction includes 1-19 totally 19 row, the signal definition such as following table of each pin：
System is connected according to the signal between above-mentioned network switch support plate and sandwich plate, wherein：First connector
It is integrated in the second connector on the sandwich plate.
System is connected according to the signal between above-mentioned network switch support plate and sandwich plate, wherein：On the sandwich plate
Fin can cover whole sandwich plate.
System is connected according to the signal between above-mentioned network switch support plate and sandwich plate, wherein：First connector
The power supply for being used to provide the support plate with the second connector supplies the sandwich plate, and realizes the support plate and the sandwich plate
Between data transfer.
Signal connection system between network switch support plate according to claim 1 and sandwich plate, it is characterised in that：
If reseting logic control chip, on the sandwich plate, reset of the sandwich plate to the support plate is controlled；If
On the support plate, reset of the support plate to the sandwich plate is controlled reseting logic control chip.
As described above, the signal connection system between the network switch support plate and sandwich plate of the present invention, has beneficial below
Effect：
（1）Overcome the defects of XMC sandwich plates can not meet cooling requirements；
（2）Solves the problems, such as single wide XMC sandwich plates power deficiency；
（3）It is too small to solve single wide XMC interlayers plate suqare, can not mask placement device the problem of.
Brief description of the drawings
Fig. 1 is shown as being integrated with the structural representation of the sandwich plate of two interlayer connector for substrate in the present invention.
Component label instructions
1 sandwich plate
21 first connectors
22 second connectors
Embodiment
Illustrate embodiments of the present invention below by way of specific instantiation, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also pass through specific realities different in addition
The mode of applying is embodied or practiced, the various details in this specification can also be based on different viewpoints with application, without departing from
Various modifications or alterations are carried out under the spirit of the present invention.
It should be noted that the diagram provided in the present embodiment only illustrates the basic conception of the present invention in a schematic way,
Then the component relevant with the present invention is only shown in schema rather than is painted according to component count, shape and the size during actual implement
System, kenel, quantity and the ratio of each component can be a kind of random change during its actual implementation, and its assembly layout kenel also may be used
Can be increasingly complex.
For practical service environment, network switch support plate of the invention is combined gold with the signal connection system between sandwich plate
Finger connected mode and XMC standards, there is provided the signal connection scheme between a kind of network switch support plate and sandwich plate, realize
The close connection of support plate and sandwich plate, while meet demand of the sandwich plate to radiating, electric current and Interface Expanding.
In signal connection system between the network switch support plate and sandwich plate of the present invention, pass through two interlayer connector for substrate
Realize the signal connection between network switch support plate and sandwich plate.Reference picture 1, two interlayer connector for substrate are the first connector
21 and second connector 22 be integrated on sandwich plate 1, and the first connector 21 is identical with the structure of the second connector 22.In this hair
In a bright preferred embodiment, sandwich plate connector model is：Samtec part number ASP-105885-01.Support plate
Connector model is：Samtec part number ASP-105884-01.Support plate connector and interlayer connector for substrate are one public
One mother supports the use.
In the present invention, the first connector and the second connector mainly complete following function：
（1）The power supply that support plate is provided supplies sandwich plate, so that interlayer board chip uses；
（2）Realize the data transfer between support plate and sandwich plate；That is sandwich plate data processing chip and support plate data processing
Between chip or external interface, data communication is realized by the first connector and the second connector；
（3）Realize the reset control between sandwich plate and support plate；
（4）The data reference clock that sandwich plate is provided sends support plate to.
In systems, sandwich plate complete data operation, logical operation, reset, data control etc. function, typically by with
The chips such as the CPU of data-handling capacity, internal memory composition, therefore the size of sandwich plate must meet minimum system in most cases
Requirement to interlayer board size.In the present invention, the size of sandwich plate is 150mm*100mm；And meet the XMC folders of international standard
The size of laminate is 150mm*74mm, and so as to solve, singly wide XMC interlayers plate suqare is too small in the prior art, can not mask placement device
The problem of.Meanwhile the maximum of fin can cover whole sandwich plate on sandwich plate of the present invention, so as to overcome XMC sandwich plates without
Method meets the defects of cooling requirements.
Meanwhile in order to solve the problems, such as XMC sandwich plates power deficiency in the prior art, power supply of the present invention to support plate
Signal has re-started definition.4 3.3V power pins and 8 5V power pins are defined on support plate.According to each pin
1A Current calculations can be provided, by two interlayer connector for substrate, the power that support plate can provide to sandwich plate is 52.2W.
Wherein, the signal that the first connector 21 can provide is as shown in table 1 below.
The signal that table 1, the first connector 21 are provided
| Signal | Description | Type |
| DP[00..19] | Difference signal pair | It is undetermined |
| MSCL[0:1] | I2C serial clock signals | LVTTL |
| MSDA[0:1] | I2C serial data signals | LVTTL |
| UART[0:1] | Meet RS232 standard signals | LVTTL |
| MRSTI# | Reseting input signal | LVTTL |
| MRSTO# | Reset output signal | LVTTL |
| ID | Board identification signal | LVTTL |
| VPWR | Power supply | 3.3V and 5V |
For signals DP [00..19], it is necessary to determine its class signal according to the actual use situation of support plate and sandwich plate
Type.
The signal that second connector 22 provides is as shown in table 2 below.
The signal that table 2, the second connector 22 are provided
| Signal | Description | Type |
| DP[00..19] | Difference signal pair | It is undetermined |
| D[0:37] | Self-defined signal | LVTTL |
| GND | Signal ground |
Equally, in the second connector 22, for signals DP [00..19], it is necessary to actual use according to support plate and sandwich plate
Situation determines its signal type.
In the present invention, the first connector 21 and the second connector 22 laterally include A, B, C, D, E, F totally 6 row, longitudinally include
1-19 19 is arranged totally.The signal definition of specific each pin is as follows.
The signal definition of table 3, the first connector 21
The signal definition of table 4, the second connector 22
| A | B | C | D | E | F | |
| 1 | DP20+ | DP20- | D11 | DP30+ | DP30- | D30 |
| 2 | GND | GND | D12 | GND | GND | D31 |
| 3 | DP21+ | DP21- | D13 | DP31+ | DP31- | D32 |
| 4 | GND | GND | D14 | GND | GND | D33 |
| 5 | DP22+ | DP22- | D15 | DP32+ | DP32- | D34 |
| 6 | GND | GND | D16 | GND | GND | D35 |
| 7 | DP23+ | DP23- | D17 | DP33+ | DP33- | D36 |
| 8 | GND | GND | D18 | GND | GND | D37 |
| 9 | DP24+ | DP24- | D19 | DP34+ | DP34- | D38 |
| 10 | GND | GND | D20 | GND | GND | D39 |
| 11 | DP25+ | DP25- | D21 | DP35+ | DP35- | D40 |
| 12 | GND | GND | D22 | GND | GND | D41 |
| 13 | DP26+ | DP26- | D23 | DP36+ | DP36- | D42 |
| 14 | GND | GND | D24 | GND | GND | D43 |
| 15 | DP27+ | DP27- | D25 | DP37+ | DP37- | D44 |
| 16 | GND | GND | D26 | GND | GND | D45 |
| 17 | DP28+ | DP28- | D27 | DP38+ | DP38- | D46 |
| 18 | GND | GND | D28 | GND | GND | D47 |
| 19 | DP29+ | DP29- | D29 | DP39+ | DP39- | D48 |
System is connected by the signal between above-mentioned network switch support plate and sandwich plate, 40 pairs of high speed numbers can be achieved in the present invention
According to transmission, connector allow signal flank speed be 3.125GHZ；It can realize that support plate and sandwich plate configure by I2C buses
The transmission of information；Sandwich plate by UART interface can realize Debugging message printing or with remote host communication function；Support plate and
The reset implementation of sandwich plate is very flexible；If reseting logic control chip, on sandwich plate, reseting controling signal can be realized
Control of the sandwich plate to support plate peripheral interface chip；If reseting logic control chip, on support plate, reseting controling signal can be real
Reset control of the existing support plate to sandwich plate；The power supply that support plate provides to sandwich plate is 3.3V and 5V, 3.3V power supply maximum current are
4A, 5V power supply maximum current are 8A；4 ID signals can be provided simultaneously, are advantageous to the identification of sandwich plate and support plate.
In summary, the signal connection system between network switch support plate of the invention and sandwich plate overcomes XMC interlayers
Plate can not meet the defects of cooling requirements；Solves the problems, such as single wide XMC sandwich plates power deficiency；Also solve single width
XMC interlayer plate suqares are too small, can not mask placement device the problem of.So the present invention effectively overcome it is of the prior art it is a variety of lack
Put and have high industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
Know the personage of this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (6)
- A kind of 1. signal connection system between network switch support plate and sandwich plate, it is characterised in that：Including support plate, sandwich plate, First connector and the second connector, wherein, first connector and the second connector are integrated on the sandwich plate；It is described It is connected between support plate and the sandwich plate by first connector and the second connector；4 are defined on the support plate 3.3V power pins and 8 5V power pins；The size of the sandwich plate is 150mm*100mm；The structure of first connector and the second connector is identical.
- 2. the signal connection system between network switch support plate according to claim 1 and sandwich plate, it is characterised in that：Institute Stating the first connector laterally includes A, B, C, D, E, F totally 6 row, and longitudinal direction includes 1-19 totally 19 row, and the signal definition of each pin is such as Following table：
- 3. the signal connection system between network switch support plate according to claim 1 and sandwich plate, it is characterised in that：Institute Stating the second connector laterally includes A, B, C, D, E, F totally 6 row, and longitudinal direction includes 1-19 totally 19 row, and the signal definition of each pin is such as Following table：
- 4. the signal connection system between network switch support plate according to claim 1 and sandwich plate, it is characterised in that：Institute Whole sandwich plate can be covered by stating the fin on sandwich plate.
- 5. the signal connection system between network switch support plate according to claim 1 and sandwich plate, it is characterised in that：Institute State the power supply that the first connector and the second connector are used to provide the support plate and supply the sandwich plate, and realize the support plate Data transfer between the sandwich plate.
- 6. the signal connection system between network switch support plate according to claim 1 and sandwich plate, it is characterised in that：Such as On the sandwich plate, then reset of the sandwich plate to the support plate is controlled fruit reseting logic control chip；It is if multiple On the support plate, reset of the support plate to the sandwich plate is controlled position logic control chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310740409.2A CN103746818B (en) | 2013-12-27 | 2013-12-27 | A kind of signal connection system between network switch support plate and sandwich plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310740409.2A CN103746818B (en) | 2013-12-27 | 2013-12-27 | A kind of signal connection system between network switch support plate and sandwich plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103746818A CN103746818A (en) | 2014-04-23 |
| CN103746818B true CN103746818B (en) | 2018-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310740409.2A Expired - Fee Related CN103746818B (en) | 2013-12-27 | 2013-12-27 | A kind of signal connection system between network switch support plate and sandwich plate |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109495278B (en) * | 2018-09-30 | 2021-03-23 | 天津市英贝特航天科技有限公司 | Network card based on XMC standard interface |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1716880A (en) * | 2004-07-01 | 2006-01-04 | 华为技术有限公司 | Detector |
| CN102402246A (en) * | 2010-09-15 | 2012-04-04 | 研祥智能科技股份有限公司 | Board card assembly |
| CN103163987A (en) * | 2011-12-15 | 2013-06-19 | 鸿富锦精密工业（深圳）有限公司 | Solid state drive combination |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013006499A2 (en) * | 2011-07-01 | 2013-01-10 | Samtec, Inc. | Transceiver and interface for ic package |
-
2013
- 2013-12-27 CN CN201310740409.2A patent/CN103746818B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1716880A (en) * | 2004-07-01 | 2006-01-04 | 华为技术有限公司 | Detector |
| CN102402246A (en) * | 2010-09-15 | 2012-04-04 | 研祥智能科技股份有限公司 | Board card assembly |
| CN103163987A (en) * | 2011-12-15 | 2013-06-19 | 鸿富锦精密工业（深圳）有限公司 | Solid state drive combination |
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| Publication number | Publication date |
|---|---|
| CN103746818A (en) | 2014-04-23 |
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