CN103745664B - Display module - Google Patents
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- CN103745664B CN103745664B CN201310698006.6A CN201310698006A CN103745664B CN 103745664 B CN103745664 B CN 103745664B CN 201310698006 A CN201310698006 A CN 201310698006A CN 103745664 B CN103745664 B CN 103745664B
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- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 34
- 239000000084 colloidal system Substances 0.000 claims description 109
- 239000003292 glue Substances 0.000 abstract description 12
- 239000010410 layer Substances 0.000 abstract 9
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 description 21
- 239000004033 plastic Substances 0.000 description 17
- 229920003023 plastic Polymers 0.000 description 17
- 238000004088 simulation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A display module comprises a flexible substrate, an array circuit layer, a display layer, an electronic element, a fixed adhesive layer and a mixed adhesive layer. The array circuit layer is arranged on the flexible substrate. The array circuit layer has an active circuit region and a metal circuit region. The metal circuit area is arranged and electrically connected to one side of the active circuit area. The display layer is arranged on the active circuit region. The electronic element is arranged and electrically connected with the metal circuit area. The fixed glue layer is arranged in the metal circuit area and surrounds the electronic element. The mixed glue layer is arranged in the metal circuit area and is positioned between the display layer and the electronic element. The mixed glue layer is provided with at least one first glue body and at least one second glue body which are connected.
Description
Technical field
The present invention is about a kind of display module, and particularly a kind of have the display device mixing glue-line.
Background technology
General plastic base (Plasticsubstrate) on the market has the characteristics such as pliability, flexible, lightweight, thickness is thin, therefore has been widely used on flexible display device. But it is because plastic base easy residual stress after array (Array) technique, therefore follow-up take off plastic base from glass substrate time, plastic base is easy for being subject to the impact and producing of residual stress to stretch, bends, out-of-flatness or the deformation such as curling, in turn results in the difficulty of para-position between subsequent drive chip and plastic base.
For the difficulty solved between driving chip and plastic base in para-position, the practice that manufacturer is general is the packaging technology of driving chip moved to before plastic base takes off, to avoid producing driving chip and the problem in plastic base para-position because of plastic base deformation. But, though this practice can avoid the problem of para-position between plastic base and driving chip that produces, but cause the follow-up difficulty taking off plastic base. For example, after driving chip is encapsulated in plastic base, then in the fixing glue of driving chip surrounding coating encapsulation driving chip, and frame glue is set between display layer and fixing glue, owing to the rigidity of fixing glue is more than frame glue, and the rigidity of driving chip and fixing glue is more than the rigidity of display panel areas, therefore when taking off plastic base, off-type force abruptly increase also concentrates on the junction of object of two different rigidity, excessive and cause circuit to break because separating Shi Ge district stress difference in taking off plastic base process. Therefore, how to reduce plastic base and separate produced off-type force with glass substrate to improve the making yield of display device, will be one of the problem that should focus on of manufacturer.
Summary of the invention
A kind of display module of offer is provided, separates produced off-type force to improve the making yield of display device so as to reducing plastic base with glass substrate.
The display module that disclosed herein, comprises a flexible substrate, an array circuit layer, a display layer, an electronic component, a fixing glue-line and a mixing glue-line. Array circuit layer is arranged on flexible substrate. Array circuit layer has an active circuit zone and a metal circuit zone. Metal circuit zone arranges and is electrically connected at the side of active circuit zone. Display layer is arranged in active circuit zone. Electronic component arranges and is electrically connected at metal circuit zone. Fixing glue-line is located at metal circuit zone, and surrounds electronic component. Mixing glue-line is arranged at metal circuit zone and between display layer and electronic component. Mixing glue-line has connected at least one first colloid and at least one second colloid.
The display module that disclosed herein, comprises a flexible substrate, an array circuit layer, a display layer, an electronic component and a mixing glue-line. Array circuit layer is arranged on flexible substrate. Array circuit layer has an active circuit zone and a metal circuit zone. Metal circuit zone arranges and is electrically connected at the side of active circuit zone. Display layer stacks on active circuit zone. Electronic component is arranged at metal circuit zone. Fixing glue-line is located at metal circuit zone, and surrounds electronic component. Mixing glue-line is arranged at metal circuit zone and between display layer and fixing glue-line, and wherein mixing glue-line has multiple interface.
Display module disclosed by the invention described above, owing to having multiple interface between display layer and electronic component, therefore by display module from glass substrate takes off the maximum that produced off-type force can be scattered in each seam and effectively reduce off-type force, and then it can be avoided that the circuit broken string of array circuit layer and improve the making yield of display module.
Above with respect to the explanation of present invention and the explanation system of implementation below in order to demonstrate and to explain principles of the invention, and the patent claim of the present invention is provided further to explain.
Accompanying drawing explanation
Fig. 1 is the generalized section that display module according to a first embodiment of the present invention stacks on a glass substrate.
Fig. 2 is the display module floor map without substrate of Fig. 1.
Fig. 3 is known display module simulation schematic diagram of produced off-type force in time bestowing a pulling force of vertically displayed module.
Fig. 4 to Fig. 6 is the display module of Fig. 1 simulation schematic diagram of produced off-type force in time bestowing a pulling force of vertically displayed module.
The display module of Fig. 7 and Fig. 8 Fig. 1 is the simulation schematic diagram of produced off-type force in time bestowing a pulling force of vertically displayed module.
Fig. 9 is the floor map without substrate of the display module according to a second embodiment of the present invention.
Figure 10 is the floor map without substrate of the display module according to a third embodiment of the present invention.
Figure 11 is the floor map without substrate of the display module according to a fourth embodiment of the present invention.
Wherein, accompanying drawing labelling:
10: display module
20: glass substrate
30: release layer
100: flexible substrate
200: array circuit layer
210: active circuit zone
220: metal circuit zone
300: display layer
310: attachment surface
400: electronic component
500: fixing glue-line
600: mixing glue-line
610: the first colloids
620: the second colloids
630: joint face
700: substrate
Detailed description of the invention
Refer to Fig. 1 to Fig. 2, Fig. 1 is the generalized section that display module according to a first embodiment of the present invention stacks on a glass substrate. Fig. 2 is the display module floor map without substrate of Fig. 1.Display module 10, when carrying out array (Array) technique with driving chip packaging technology (ChiponPlastic, COP), first can be located at a glass substrate 20 by the display module 10 of the present embodiment. But, follow-up display module 10 being taken off from glass substrate 20 to facilitate, between display module 10 and glass substrate 20, be more provided with a release layer 30, release layer 30 is for having thin film separatory. It is to say, release layer 30 can be used to reduce the adhesion between display module 10 and glass substrate 20. The structure of display module 10 is below first described.
The display module 10 of the present embodiment comprises a flexible substrate 100, the fixing glue-line 500 of an array circuit layer 200, display layer 300, electronic component 400, one and a mixing glue-line 600.
Flexible substrate 100 is made up of flexible material, for instance: plastics, and there is the characteristic of deflection, make display module 10 have the characteristic of deflection.
Array circuit layer 200 is arranged on flexible substrate 100, and is used for driving display layer 300. Array circuit layer 200 has active circuit zone 210 and a metal circuit zone 220. Metal circuit zone 220 arranges and is electrically connected at the side of active circuit zone 210.
Display layer 300 stacks in active circuit zone 210. The side of display layer 300 has an attachment surface 310. Display layer 300 can be the various retes with display characteristic such as liquid crystal layer, organic luminous layer, electrochromism (electro-chromic) layer, electronic ink layer, cholesteric liquid crystal layer, but is not limited.
Electronic component 400 arranges and is electrically connected at metal circuit zone 220. Electronic component 400 is such as driving chip.
Fixing glue-line 500 is located at metal circuit zone 220, and surrounds electronic component 400. It is to say, electronic component 400 is packaged in metal circuit zone 220 through fixing glue-line 500. Fixing glue-line 500 is such as epoxy resin.
Mixing glue-line 600 is arranged at metal circuit zone 220 and between display layer 300 and fixing glue-line 500. Specifically, owing to fixing glue-line 500 surrounds electronic component 400, the side of mixing glue-line 600 is connected to the attachment surface 310 of display layer 300, and opposite side is connected to fixing glue-line 500. Mixing glue-line 600 has connected at least one first colloid 610 and at least one second colloid 620, and the first colloid 610 and the second colloid 620 are directly contacted with array circuit layer 200 respectively. The quantity of first colloid 610 of the present embodiment and the quantity system of the second colloid 620 are for multiple. These first colloids 610 are staggered respectively with these second colloids 620 and are connected, and form multiple joint face 630 in the adjacent of these first colloids 610 with these the second colloids 620. It addition, in the present embodiment, the rigidity of these the first colloids 610 differs from the rigidity of these the second colloids 620 so that mixing glue-line 600 forms multiple interfaces that different material is had a common boundary in each joint face 630 place. In the present embodiment, the rigidity of the first colloid 610 is more than the rigidity of the second colloid 620, for example, the material of the first colloid 610 and fixing glue 500 is all epoxy resin, and the material of the second colloid 620 is acryl glue. But being not limited thereto, in other embodiments, the first colloid 610 can also select the colloid close with epoxy resin rigidity, and the second colloid 620 can also select the colloid close with acryl glue rigidity. Wherein these joint faces 630 are substantially parallel to attachment surface 310. So-called substantial parallel comprise because mismachining tolerance is caused each joint face 630 and the approximately parallel situation of attachment surface 310.
Furthermore, in the present embodiment, first colloid 610 is identical with the thickness of the second colloid 620, and the first colloid 610 and the second colloid 620 are 2 to 1,2 to 3 or 2 to 9 in display layer 300 towards the width ratio on the direction (direction along indicated by arrow a) of fixing glue-line 500. That is the ratio of the width of the width of the first colloid 610 and the second colloid 620 is 2 to 1,2 to 3 or 2 to 9. The width of so-called first colloid 610 is the space D 1 of the joint face 630 of the first colloid 610 opposite sides herein, and the space D 2 of the joint face 630 that the width of the second colloid 620 is the second colloid 620 opposite sides.
In the present embodiment and other embodiments, display module 10 more comprises a substrate 700. Substrate 700 stacks on display layer 300, and mixing glue-line 600 part is attached at substrate 700. Substrate 700 is such as polaroid or contact panel.
After the display module 10 of the present embodiment has completed array (Array) technique and driving chip packaging technology (ChiponPlastic, COP), display module 10 can be taken off from glass substrate 20. Display module 10 can produce off-type force from glass substrate 20 when taking off, and off-type force would generally concentrate on the seam of different material and cause the circuit drop of array circuit layer. But the display module 10 of the present embodiment because having the mixing glue-line 600 of multiple interface (joint face 630) because arranging between display layer 300 and fixing glue-line 500, make to take off the maximum that the produced off-type force of display module 10 can be scattered in each seam and effectively reduce off-type force, and then it can be avoided that the circuit broken string of array circuit layer and improve the making yield of display module 10.
Referring to Fig. 3 to Fig. 6, Fig. 3 is known display module simulation schematic diagram of produced off-type force in time bestowing a pulling force of vertically displayed module. Fig. 4 to Fig. 6 is the display module of Fig. 1 simulation schematic diagram of produced off-type force in time bestowing a pulling force of vertically displayed module.
First, as it is shown on figure 3, the known display module being not provided with a mixed colloid by takes off produced off-type force from glass substrate 20 and is about 725gf.
Then, as shown in Figure 4, with the first colloid 610 and the second colloid 620 when display layer 300 emulates towards the embodiment that the width ratio on the direction of electronic component 400 is 2 to 1, the off-type force that display module 10 takes off from glass substrate 20 is about 650gf. As it is shown in figure 5, with the first colloid 610 and the second colloid 620 when display layer 300 emulates towards the embodiment that the width ratio on the direction of electronic component 400 is 2 to 3, the off-type force that display module 10 takes off from glass substrate 20 is about 153gf. As shown in Figure 6, with the first colloid 610 and the second colloid 620 when display layer 300 emulates towards the embodiment that the width ratio on the direction of electronic component 400 is 2 to 9, the off-type force that display module 10 takes off from glass substrate 20 is about 340gf.
From above-mentioned analog result, ratio shared by first colloid 610 is less than the ratio of the second colloid 620, no matter and the width ratio of the first colloid 610 and the second colloid 620 is why, all effectively the maximum of off-type force can be down to below 700gf, therefore the circuit broken string of array circuit layer can be prevented effectively from and improve the making yield of display module 10.
It follows that describe the first colloid 610 and the second colloid 620 when same width ratio, the width dimensions of the first colloid 610 and the second colloid 620 is for the impact of off-type force.Please continue to refer to Fig. 5, Fig. 7 and Fig. 8, Fig. 7 and Fig. 8 is the display module of Fig. 1 simulation schematic diagram of produced off-type force in time bestowing a pulling force of vertically displayed module.
When the width dimensions ratio of the first colloid 610 and the second colloid 620 is 0.6 millimeter of ratio 0.9 millimeter (width ratio 2:3), the off-type force that display module 10 takes off from glass substrate 20 is about 153gf (as shown in Figure 5).
When the width dimensions ratio of the first colloid 610 and the second colloid 620 is 1.2 millimeters of ratios 1.8 millimeters (width ratio 2:3), the off-type force that display module 10 takes off from glass substrate 20 is about 530gf (as shown in Figure 7).
When the width dimensions ratio of the first colloid 610 and the second colloid 620 is 1.8 millimeters of ratios 2.7 millimeters (width ratio 2:3), the off-type force that display module 10 takes off from glass substrate 20 is about 470gf (as shown in Figure 8).
From above-mentioned three groups of simulations, under the premise that the first colloid 610 is identical with the width ratio of the size of the second colloid 620, if the width dimensions of the first colloid 610 of each group differs the maximum that still can affect off-type force.
The arrangement mode of the first colloid 610 and the second colloid 620 is not limited to above-described embodiment. Refer to Fig. 9 to Figure 11. Fig. 9 is the floor map without substrate of the display module according to a second embodiment of the present invention. Figure 10 is the floor map without substrate of the display module according to a third embodiment of the present invention. Figure 11 is the floor map without substrate of the display module according to a fourth embodiment of the present invention. The embodiment of Fig. 9 to Figure 11 is similar to the embodiment of Fig. 1, therefore only illustrates with deviation.
As it is shown in figure 9, the display layer 300 of the present embodiment has the attachment surface 310 being connected with mixing glue-line 600. Mixing glue-line 600 has multiple first colloid 610 and multiple second colloid 620. These first colloids 610 are staggered respectively with these second colloids 620, and have a joint face 630 between adjacent the first colloid 610 and the second colloid 620. Joint face 630 and attachment surface 310 press from both sides an angle theta. The angle theta system of the present embodiment is for right angle. But being not limited thereto, in other embodiments, angle theta can also be acute angle or obtuse angle.
As shown in Figure 10, the mixing glue-line 600 of the present embodiment has multiple first colloid 610 and one second colloid 620. These first colloids 610 are located at array circuit layer 200 (as shown in Figure 1 above) with the arrangement mode of array. Second colloid 620 is around these the first colloids 610. The arrangement mode of these first colloids 610 of the present embodiment is array arrangement, but is not limited thereto, and in other embodiments, the arrangement mode of these the first colloids 610 also can radial arrangement or irregular alignment.
As shown in figure 11, the mixing glue-line 600 of the present embodiment has one first colloid 610 and multiple second colloid 620. These second colloids 620 are located in array circuit layer 200 (as shown in Figure 1 above) with the arrangement mode of array. First colloid 610 around these the second colloids 620, and these second colloids 620 in display layer 300 towards the width on the direction (direction along indicated by arrow b) of fixing glue-line 500 from being close to display layer 300 toward tapered away from display layer 300.
Due to these second colloids 620 in display layer 300 towards the width on the direction (direction along indicated by arrow b) of fixing glue-line 500 from being close to display layer 300 toward tapered away from display layer 300, therefore the ratio of the second colloid 620 and the first colloid 610 will be incremented by from display layer 300 towards the direction of fixing glue-line 500 and subtracts.In other words, the rigidity of colloid mixture 600 can be incremented by from display layer towards the direction of fixing glue-line 500, and makes mixing glue-line 600 reach the effect that rigidity is connected with fixing glue-line 500, and then reduces the maximum of off-type force. Consequently, it is possible to the circuit broken string of array circuit layer 200 can be avoided and improves the making yield of display module 10.
Display module disclosed by the invention described above, owing to having multiple interface between display layer and electronic component, therefore by display module from glass substrate takes off the maximum that produced off-type force can be scattered in each seam and effectively reduce off-type force, and then it can be avoided that the circuit broken string of array circuit layer and improve the making yield of display module.
Certainly; the present invention also can have other various embodiments; when without departing substantially from present invention spirit and essence thereof; those of ordinary skill in the art can make various corresponding change and deformation according to the present invention, but these change accordingly and deform the protection domain that all should belong to the claims in the present invention.
Claims (11)
1. a display module, it is characterised in that comprise:
One flexible substrate;
An array circuit layer, is arranged on this flexible substrate, and this array circuit layer has an active circuit zone and a metal circuit zone, and this metal circuit zone arranges and be electrically connected at the side of this active circuit zone;
One display layer, is arranged in this active circuit zone;
One electronic component, is arranged in this metal circuit zone, and is electrically connected at this metal circuit zone;
One fixing glue-line, is located in this metal circuit zone, and surrounds this electronic component; And
One mixing glue-line, is arranged in this metal circuit zone and between this display layer and this fixing glue-line, and this mixing glue-line has connected multiple first colloids and multiple second colloids, and the plurality of first colloid and the plurality of second colloid are staggered respectively.
2. display module according to claim 1, it is characterised in that the rigidity of the plurality of first colloid differs from the rigidity of the plurality of second colloid.
3. display module according to claim 1, it is characterised in that the plurality of first colloid and the plurality of second colloid are directly contacted with this array circuit layer respectively.
4. display module according to claim 3, it is characterized in that, this display layer has the attachment surface being connected with this mixing glue-line, the plurality of first colloid and the plurality of second colloid are staggered respectively, and between this adjacent first colloid and this second colloid, there is a joint face, this joint face is parallel to this attachment surface.
5. display module according to claim 4, it is characterised in that the plurality of first colloid is 2 to 1,2 to 3 or 2 to 9 in this display layer towards the width ratio on the direction of this electronic component with the plurality of second colloid.
6. display module according to claim 3, it is characterized in that, this display layer has the attachment surface being connected with this mixing glue-line, the plurality of first colloid and the plurality of second colloid are staggered respectively, and between this adjacent first colloid and this second colloid, there is a joint face, this joint face and this attachment surface press from both sides an angle.
7. display module according to claim 1, it is characterised in that more comprise a substrate, stacks on this display layer, and the part of this mixing glue-line is attached at this substrate.
8. a display module, it is characterised in that comprise:
One flexible substrate;
An array circuit layer, is arranged on this flexible substrate, and this array circuit layer has an active circuit zone and a metal circuit zone, and this metal circuit zone arranges and be electrically connected at the side of this active circuit zone;
One display layer, stacks on this active circuit zone;
One electronic component, is arranged in this metal circuit zone;
One fixing glue-line, is located in this metal circuit zone, and surrounds this electronic component; And
One mixing glue-line, it is arranged in this metal circuit zone and between this display layer and this fixing glue-line, wherein this mixing glue-line has multiple interface, this mixing glue-line has connected multiple first colloids and multiple second colloids, the plurality of first colloid and the plurality of second colloid junction form those interfaces, and the plurality of first colloid and the plurality of second colloid are staggered respectively.
9. display module according to claim 8, it is characterised in that this display layer has the attachment surface being connected with this mixing glue-line, and those interfaces are parallel to this attachment surface.
10. display module according to claim 8, it is characterised in that the rigidity of the plurality of first colloid differs from the rigidity of the plurality of second colloid.
11. display module according to claim 8, it is characterised in that those interfaces connect with this metal circuit zone.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102134619A TWI476739B (en) | 2013-09-25 | 2013-09-25 | Display module |
| TW102134619 | 2013-09-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103745664A CN103745664A (en) | 2014-04-23 |
| CN103745664B true CN103745664B (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310698006.6A Active CN103745664B (en) | 2013-09-25 | 2013-12-18 | Display module |
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| CN (1) | CN103745664B (en) |
| TW (1) | TWI476739B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105206649B (en) * | 2015-09-28 | 2019-03-12 | 上海和辉光电有限公司 | A kind of preparation method and display screen showing screen |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2007249014A (en) * | 2006-03-17 | 2007-09-27 | Citizen Miyota Co Ltd | Liquid crystal display device |
| CN102157110A (en) * | 2010-11-11 | 2011-08-17 | 友达光电股份有限公司 | Display device and manufacturing method thereof |
| CN102855816A (en) * | 2011-11-16 | 2013-01-02 | 友达光电股份有限公司 | Display device with flexible substrate and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI348046B (en) * | 2006-08-24 | 2011-09-01 | Au Optronics Corp | Liquid crystal display panel |
| WO2009084125A1 (en) * | 2007-12-27 | 2009-07-09 | Sharp Kabushiki Kaisha | Semiconductor device manufacturing method and semiconductor device |
| JPWO2009128359A1 (en) * | 2008-04-17 | 2011-08-04 | 旭硝子株式会社 | GLASS LAMINATE, PANEL FOR DISPLAY DEVICE WITH SUPPORT AND METHOD FOR PRODUCING THEM |
| US20100321282A1 (en) * | 2009-06-18 | 2010-12-23 | Himax Display, Inc. | Display module |
| TWI440930B (en) * | 2009-07-24 | 2014-06-11 | Au Optronics Corp | Flat panel display module |
| US9093397B2 (en) * | 2011-07-06 | 2015-07-28 | Panasonic Corporation | Flexible device manufacturing method and flexible device |
| TWI449006B (en) * | 2011-10-05 | 2014-08-11 | Ind Tech Res Inst | Hybrid display device |
-
2013
- 2013-09-25 TW TW102134619A patent/TWI476739B/en active
- 2013-12-18 CN CN201310698006.6A patent/CN103745664B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007249014A (en) * | 2006-03-17 | 2007-09-27 | Citizen Miyota Co Ltd | Liquid crystal display device |
| CN102157110A (en) * | 2010-11-11 | 2011-08-17 | 友达光电股份有限公司 | Display device and manufacturing method thereof |
| CN102855816A (en) * | 2011-11-16 | 2013-01-02 | 友达光电股份有限公司 | Display device with flexible substrate and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103745664A (en) | 2014-04-23 |
| TWI476739B (en) | 2015-03-11 |
| TW201513068A (en) | 2015-04-01 |
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