CN103745664A - Display module - Google Patents
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- CN103745664A CN103745664A CN201310698006.6A CN201310698006A CN103745664A CN 103745664 A CN103745664 A CN 103745664A CN 201310698006 A CN201310698006 A CN 201310698006A CN 103745664 A CN103745664 A CN 103745664A
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- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000003292 glue Substances 0.000 claims abstract description 13
- 239000000084 colloidal system Substances 0.000 claims description 144
- 239000000203 mixture Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 abstract 9
- 239000002184 metal Substances 0.000 abstract 5
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 description 21
- 239000004033 plastic Substances 0.000 description 20
- 229920003023 plastic Polymers 0.000 description 20
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000004088 simulation Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004986 Cholesteric liquid crystals (ChLC) Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
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Abstract
A display module comprises a flexible substrate, an array circuit layer, a display layer, an electronic element, a fixed adhesive layer and a mixed adhesive layer. The array circuit layer is arranged on the flexible substrate. The array circuit layer has an active circuit region and a metal circuit region. The metal circuit area is arranged and electrically connected to one side of the active circuit area. The display layer is arranged on the active circuit region. The electronic element is arranged and electrically connected with the metal circuit area. The fixed glue layer is arranged in the metal circuit area and surrounds the electronic element. The mixed glue layer is arranged in the metal circuit area and is positioned between the display layer and the electronic element. The mixed glue layer is provided with at least one first glue body and at least one second glue body which are connected.
Description
Technical field
The present invention is about a kind of display module, and particularly a kind of have a display device of mixing glue-line.
Background technology
General plastic base (Plastic substrate) on the market has the characteristics such as pliability, flexible, lightweight, thin thickness, therefore be used in widely on flexible display device.But because plastic base easy residual stress after array (Array) technique, therefore follow-up while taking off plastic base from glass substrate, plastic base is just easily subject to the impact of residual stress and produces flexible, deflection, out-of-flatness or the deformation such as curling, and then causes the difficulty of contraposition between subsequent drive chip and plastic base.
For solve drive the difficulty in contraposition between chip and plastic base, the practice that manufacturer is general be the packaging technology that drives chip is moved to plastic base and takes off before, to avoid producing because of plastic base deformation the problem driving in chip and plastic base contraposition.But, though this practice can avoid producing plastic base and the problem that drives chip chamber contraposition, cause follow-up difficulty of taking off plastic base.For instance, drive chip package after plastic base, then driving chip surrounding coating encapsulation to drive the fixing glue of chip, and frame glue is set between display layer and fixing glue, because the rigidity of fixing glue is greater than frame glue, and the rigidity that drives chip and fixing glue is greater than the rigidity of display panel areas, therefore when taking off plastic base, off-type force increases and concentrates on the junction of the object of two different rigidity suddenly, taking off in plastic base process because separating the excessive circuit broken string that causes of Shi Ge district stress difference.Therefore, how to reduce plastic base produced off-type force separation with glass substrate to improve the making yield of display device, will be one of the problem that should focus on of manufacturer.
Summary of the invention
The invention reside in a kind of display module is provided, so as to reducing plastic base produced off-type force separation with glass substrate to improve the making yield of display device.
The disclosed display module of the present invention, comprises a flexible substrate, an array circuit layer, a display layer, an electronic component, a fixing glue-line and a mixing glue-line.Array circuit layer is arranged on flexible substrate.Array circuit floor has an active circuits district and a metallic circuit district.Metallic circuit district arranges and is electrically connected at a side in active circuits district.Display layer is arranged in active circuits district.Electronic component setting is also electrically connected at metallic circuit district.Fixing glue-line is located at metallic circuit district, and surrounds electronic component.Mix glue-line and be arranged at metallic circuit district and between display layer and electronic component.Mix glue-line and there is connected at least one the first colloid and at least one the second colloid.
The disclosed display module of the present invention, comprises a flexible substrate, an array circuit layer, a display layer, an electronic component and a mixing glue-line.Array circuit layer is arranged on flexible substrate.Array circuit floor has an active circuits district and a metallic circuit district.Metallic circuit district arranges and is electrically connected at a side in active circuits district.Display layer stacks on active circuits district.Electronic component is arranged at metallic circuit district.Fixing glue-line is located at metallic circuit district, and surrounds electronic component.Mixing glue-line is arranged at metallic circuit district and between display layer and fixing glue-line, wherein mixes glue-line and have multiple interfaces.
According to the disclosed display module of the invention described above, owing to thering are multiple interfaces between display layer and electronic component, therefore display module is taken off to produced off-type force can be scattered in each interface and the maximal value that effectively reduces off-type force from glass substrate, and then can avoid the circuit broken string of array circuit layer and improve the making yield of display module.
About the explanation of content of the present invention and the explanation of following embodiment, be in order to demonstration and explanation principle of the present invention above, and provide patent claim of the present invention further to explain.
Accompanying drawing explanation
Fig. 1 is the diagrammatic cross-section that stacks on a glass substrate according to the display module of first embodiment of the invention.
Fig. 2 is the floor map that the display module of Fig. 1 does not contain substrate.
The simulation schematic diagram of the off-type force that Fig. 3 produces for known display module when bestowing a pulling force of vertical display module.
The simulation schematic diagram of the off-type force that the display module that Fig. 4 to Fig. 6 is Fig. 1 produces when bestowing a pulling force of vertical display module.
The simulation schematic diagram of the off-type force that Fig. 7 produces when bestowing a pulling force of vertical display module with the display module of Fig. 8 Fig. 1.
Fig. 9 is the floor map that does not contain substrate according to the display module of second embodiment of the invention.
Figure 10 is the floor map that does not contain substrate according to the display module of third embodiment of the invention.
Figure 11 is the floor map that does not contain substrate according to the display module of fourth embodiment of the invention.
Wherein, Reference numeral:
10: display module
20: glass substrate
30: release layer
100: flexible substrate
200: array circuit layer
210: active circuits district
220: metallic circuit district
300: display layer
310: attachment surface
400: electronic component
500: fixing glue-line
600: mix glue-line
610: the first colloids
620: the second colloids
630: joint face
700: substrate
Embodiment
Please refer to Fig. 1 to Fig. 2, Fig. 1 is the diagrammatic cross-section that stacks on a glass substrate according to the display module of first embodiment of the invention.Fig. 2 is the floor map that the display module of Fig. 1 does not contain substrate.The display module 10 of the present embodiment, when carrying out array (Array) technique and driving chip package process (Chip on Plastic, COP), can be first located at display module 10 glass substrate 20.But, in order to facilitate, follow-up display module 10 is taken off from glass substrate 20, between display module 10 and glass substrate 20, be more provided with a release layer 30, release layer 30 is for having film separatory.That is to say, release layer 30 can be used to reduce the adhesion between display module 10 and glass substrate 20.The structure of display module 10 is below first described.
The display module 10 of the present embodiment comprises a flexible substrate 100, an array circuit layer 200, a display layer 300, an electronic component 400, a fixing glue-line 500 and a mixing glue-line 600.
Fixing glue-line 500 is located at metallic circuit district 220, and surrounds electronic component 400.That is to say, electronic component 400 sees through fixing glue-line 500 and is packaged in metallic circuit district 220.Fixing glue-line 500 is for example epoxy resin.
Mix glue-line 600 and be arranged at metallic circuit district 220 and between display layer 300 and fixing glue-line 500.Specifically, because fixing glue-line 500 surrounds electronic component 400, a side of mixing glue-line 600 is connected in the attachment surface 310 of display layer 300, and opposite side is connected in fixing glue-line 500.Mix glue-line 600 and there is connected at least one the first colloid 610 and at least one the second colloid 620, and the first colloid 610 and the second colloid 620 are directly contacted with respectively array circuit layer 200.The quantity system of the quantity of first colloid 610 of the present embodiment and the second colloid 620 is take multiple as example.These first colloids 610 are staggered respectively and are connected with these second colloids 620, and form multiple joint faces 630 in these first colloids 610 and the adjacent of these the second colloids 620.In addition, in the present embodiment, the rigidity of these the first colloids 610 differs from the rigidity of these the second colloids 620, makes to mix glue-line 600 and in each joint face 630 places, forms multiple interfaces that different material is had a common boundary.In the present embodiment, the rigidity of the first colloid 610 is greater than the rigidity of the second colloid 620, and for instance, the first colloid 610 is all epoxy resin with the material of fixing glue 500, and the material of the second colloid 620 is acryl glue.But not as limit, in other embodiments, the first colloid 610 also can be selected the colloid close with epoxy resin rigidity, and the second colloid 620 also can be selected the colloid close with acryl glue rigidity.Wherein these joint faces 630 are parallel in fact attachment surface 310.Cause each joint face 630 and attachment surface 310 approximately parallel situation because of mismachining tolerance so-called parallel in fact comprising.
Moreover, in the present embodiment, the first colloid 610 is identical with the thickness of the second colloid 620, and the first colloid 610 and the second colloid 620 width ratio in display layer 300 towards the direction (along the indicated direction of arrow a) of fixing glue-line 500 is 2 to 1,2 to 3 or 2 to 9.That is to say that the width of the first colloid 610 and the ratio of the width of the second colloid 620 are 2 to 1,2 to 3 or 2 to 9.The width of so-called the first colloid 610 is the space D 1 of the joint face 630 of the first colloid 610 relative both sides herein, and the width of the second colloid 620 is the space D 2 of the joint face 630 of the second colloid 620 relative both sides.
In the present embodiment and other embodiment, display module 10 more comprises a substrate 700.Substrate 700 stacks on display layer 300, and mixing glue-line 600 parts are attached at substrate 700.Substrate 700 is for example polaroid or contact panel.
At the display module 10 of the present embodiment, completed array (Array) technique and driven chip package process (Chip on Plastic, COP) afterwards, display module 10 can have been taken off from glass substrate 20.Display module 10 can produce off-type force when glass substrate 20 takes off, and off-type force can concentrate on the interface of different material conventionally and cause the breakage of circuit of array circuit layer to fall.But the display module 10 of the present embodiment because of between display layer 300 and fixing glue-line 500 because of arrange there are multiple interfaces (joint face 630) mix glue-line 600, make to take off that off-type force that display module 10 produces can be scattered in each interface and the maximal value that effectively reduces off-type force, and then can avoid the circuit broken string of array circuit layer and improve the making yield of display module 10.
Refer to Fig. 3 to Fig. 6, the simulation schematic diagram of the off-type force that Fig. 3 produces for known display module when bestowing a pulling force of vertical display module.The simulation schematic diagram of the off-type force that the display module that Fig. 4 to Fig. 6 is Fig. 1 produces when bestowing a pulling force of vertical display module.
First, as shown in Figure 3, a known display module that a mixed colloid is not set is taken off to produced off-type force maximum from glass substrate 20 and be about 725gf.
Then, as shown in Figure 4, the width take the first colloid 610 and the second colloid 620 in display layer 300 towards the direction of electronic component 400 is than when 2 to 1 embodiment carries out emulation, and the off-type force maximum that display module 10 takes off from glass substrate 20 is about 650gf.As shown in Figure 5, the width take the first colloid 610 and the second colloid 620 in display layer 300 towards the direction of electronic component 400 is than when 2 to 3 embodiment carries out emulation, and the off-type force maximum that display module 10 takes off from glass substrate 20 is about 153gf.As shown in Figure 6, the width take the first colloid 610 and the second colloid 620 in display layer 300 towards the direction of electronic component 400 is than when 2 to 9 embodiment carries out emulation, and the off-type force maximum that display module 10 takes off from glass substrate 20 is about 340gf.
From above-mentioned analog result, the shared ratio of the first colloid 610 is less than the ratio of the second colloid 620, no matter and why the width of the first colloid 610 and the second colloid 620 compares, all can effectively the maximal value of off-type force be down to below 700gf, therefore can effectively avoid the circuit broken string of array circuit layer, improve the making yield of display module 10.
Next, describe the first colloid 610 and the second colloid 620 in same width than time, the width dimensions of the first colloid 610 and the second colloid 620 is for the impact of off-type force.Please continue to refer to Fig. 5, Fig. 7 and Fig. 8, the simulation schematic diagram of the off-type force that the display module that Fig. 7 is Fig. 1 with Fig. 8 produces when bestowing a pulling force of vertical display module.
When the width dimensions ratio of the first colloid 610 and the second colloid 620 is 0.6 millimeter of ratio 0.9 millimeter (width is than 2:3), the off-type force maximum that display module 10 takes off from glass substrate 20 is about 153gf (as shown in Figure 5).
When the width dimensions ratio of the first colloid 610 and the second colloid 620 is 1.2 millimeters of ratios 1.8 millimeters (width is than 2:3), the off-type force maximum that display module 10 takes off from glass substrate 20 is about 530gf (as shown in Figure 7).
When the width dimensions ratio of the first colloid 610 and the second colloid 620 is 1.8 millimeters of ratios 2.7 millimeters (width is than 2:3), the off-type force maximum that display module 10 takes off from glass substrate 20 is about 470gf (as shown in Figure 8).
Simulate from above-mentioned three groups, the width of the first colloid 610 and the size of the second colloid 620 than identical prerequisite under, if the not identical maximal value that still can affect off-type force of width dimensions of the first colloid 610 of each group.
The arrangement mode of the first colloid 610 and the second colloid 620 is not limited to above-described embodiment.Refer to Fig. 9 to Figure 11.Fig. 9 is the floor map that does not contain substrate according to the display module of second embodiment of the invention.Figure 10 is the floor map that does not contain substrate according to the display module of third embodiment of the invention.Figure 11 is the floor map that does not contain substrate according to the display module of fourth embodiment of the invention.The embodiment of Fig. 9 to Figure 11 is similar to the embodiment of Fig. 1, therefore only describe with deviation.
As shown in Figure 9, the display layer 300 of the present embodiment has the attachment surface 310 being connected with mixing glue-line 600.Mix glue-line 600 and there is multiple the first colloids 610 and multiple the second colloid 620.These first colloids 610 are staggered respectively with these second colloids 620, and have a joint face 630 between the first adjacent colloid 610 and the second colloid 620.Joint face 630 presss from both sides an angle theta with attachment surface 310.The angle theta system of the present embodiment is example take right angle.But not as limit, in other embodiments, angle theta can be also acute angle or obtuse angle.
As shown in figure 10, the mixing glue-line 600 of the present embodiment has multiple the first colloids 610 and one second colloid 620.These first colloids 610 are located at array circuit layer 200 (as shown in Figure 1 above) with the arrangement mode of array.The second colloid 620 is around these the first colloids 610.The arrangement mode of these of the present embodiment the first colloid 610 is that array is arranged, but not as limit, in other embodiments, the arrangement mode of these the first colloids 610 also can radial arrangement or irregular alignment.
As shown in figure 11, the mixing glue-line 600 of the present embodiment has one first colloid 610 and multiple the second colloid 620.These second colloids 620 are located on array circuit layer 200 (as shown in Figure 1 above) with the arrangement mode of array.The first colloid 610 is around these the second colloids 620, and the width of these second colloids 620 in display layer 300 towards the direction (along the indicated direction of arrow b) of fixing glue-line 500 is from being close to display layer 300 toward gradually narrow away from display layer 300.
Because the width of these second colloids 620 in display layer 300 towards the direction (along the indicated direction of arrow b) of fixing glue-line 500 is from being close to display layer 300 toward gradually narrow away from display layer 300, therefore the ratio of the second colloid 620 and the first colloid 610 will increase progressively and subtract towards the direction of fixing glue-line 500 from display layer 300.In other words, the rigidity of colloid mixture 600 can increase progressively towards the direction of fixing glue-line 500 from display layer, and make to mix glue-line 600, reaches with fixing glue-line 500 effect that rigidity is connected, and then reduces the maximal value of off-type force.Thus, can avoid the circuit of array circuit layer 200 to break and the making yield of raising display module 10.
According to the disclosed display module of the invention described above, owing to thering are multiple interfaces between display layer and electronic component, therefore display module is taken off to produced off-type force can be scattered in each interface and the maximal value that effectively reduces off-type force from glass substrate, and then can avoid the circuit broken string of array circuit layer and improve the making yield of display module.
Certainly; the present invention also can have other various embodiments; in the situation that not deviating from spirit of the present invention and essence thereof; those of ordinary skill in the art can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the claims in the present invention.
Claims (19)
1. a display module, is characterized in that, comprises:
One flexible substrate;
An array circuit layer, is arranged on this flexible substrate, and this array circuit floor has an active circuits district and a metallic circuit district, and this metallic circuit district arranges and be electrically connected at a side in this active circuits district;
One display layer, is arranged in this active circuits district;
One electronic component, arranges and is electrically connected at this metallic circuit district;
One fixing glue-line, is located at this metallic circuit district, and surrounds this electronic component; And
One colloid mixture, is arranged at this metallic circuit district and between this display layer and this fixing glue-line, this mixing glue-line has connected at least one the first colloid and at least one the second colloid.
2. display module according to claim 1, is characterized in that, the rigidity of this at least one the first colloid differs from the rigidity of this at least one the second colloid.
3. display module according to claim 1, is characterized in that, this at least one first colloid and this at least one the second colloid are directly contacted with respectively this array circuit layer.
4. display module according to claim 3, it is characterized in that, this display layer has the attachment surface being connected with this mixing glue-line, the quantity of this at least one the first colloid is multiple, the quantity of this at least one the second colloid is multiple, those first colloids and those the second colloids are staggered respectively, and have a joint face between this adjacent first colloid and this second colloid, and this joint face is parallel in fact this attachment surface.
5. display module according to claim 4, is characterized in that, this at least one first colloid is 2 to 1,2 to 3 or 2 to 9 with the width ratio in the direction of this at least one the second colloid in this display layer towards this electronic component.
6. display module according to claim 3, is characterized in that, the quantity of this at least one the first colloid is multiple, and the quantity of this at least one the second colloid is one, and this second colloid is around those the first colloids.
7. display module according to claim 6, is characterized in that, those first colloids are located at this array circuit layer with the arrangement mode of array, and this second colloid is around those the first colloids.
8. display module according to claim 3, it is characterized in that, the quantity of this at least one the first colloid is one, the quantity of this at least one the second colloid is multiple, those second colloids are located on this array circuit layer with the arrangement mode of array, this first colloid is around those the second colloids, and the width in the direction of those the second colloids in this display layer towards this electronic component is from being close to this display layer toward gradually narrow away from this display layer.
9. display module according to claim 3, it is characterized in that, this display layer has the attachment surface being connected with this mixing glue-line, the quantity of this at least one the first colloid is multiple, the quantity of this at least one the second colloid is multiple, those first colloids and those the second colloids are staggered respectively, and have a joint face between this adjacent first colloid and this second colloid, and this joint face presss from both sides an angle with this attachment surface in fact.
10. display module according to claim 1, is characterized in that, more comprises a substrate, stacks on this display layer, and the part of this mixing glue-line is attached at this substrate.
11. 1 kinds of display modules, is characterized in that, comprise:
One flexible substrate;
An array circuit layer, is arranged on this flexible substrate, and this array circuit floor has an active circuits district and a metallic circuit district, and this metallic circuit district arranges and be electrically connected at a side in this active circuits district;
One display layer, stacks on this active circuits district;
One electronic component, is arranged at this metallic circuit district;
One fixing glue-line, is located at this metallic circuit district, and surrounds this electronic component; And
One mixing glue-line, is arranged at this metallic circuit district and between this display layer and this fixing glue-line, wherein this mixing glue-line has multiple interfaces.
12. display modules according to claim 11, is characterized in that, this mixing glue-line has connected multiple the first colloids and multiple the second colloid, and those first colloids and those the second colloid junctions form those interfaces.
13. display modules according to claim 12, is characterized in that, those first colloids and those the second colloids are staggered respectively.
14. display modules according to claim 13, is characterized in that, this display layer has the attachment surface being connected with this mixing glue-line, and those interfaces are parallel in fact this attachment surface.
15. display modules according to claim 12, is characterized in that, the rigidity of this at least one the first colloid differs from the rigidity of this at least one the second colloid.
16. display modules according to claim 11, is characterized in that, those interfaces and this metallic circuit district join.
17. display modules according to claim 11, it is characterized in that, this mixing glue-line has connected multiple the first colloids and one second colloid, and this second colloid is around those the first colloids, and those first colloids and those the second colloid junctions form those interfaces.
18. display modules according to claim 17, it is characterized in that, those first colloids are located at this array circuit layer with the arrangement mode of array, and this second colloid is around those the first colloids, and those first colloids and those the second colloid junctions form those interfaces.
19. display modules according to claim 11, it is characterized in that, this mixing glue-line has one first connected colloid and multiple the second colloid, those second colloids are located on this array circuit layer with the arrangement mode of array, this first colloid is around those the second colloids, and the width in the direction that those second colloids glue together towards this mixing in this display layer is from being close to this display layer toward gradually narrow away from this display layer, and those first colloids and those the second colloid junctions form those interfaces.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102134619 | 2013-09-25 | ||
| TW102134619A TWI476739B (en) | 2013-09-25 | 2013-09-25 | Display module |
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| Publication Number | Publication Date |
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| CN103745664A true CN103745664A (en) | 2014-04-23 |
| CN103745664B CN103745664B (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310698006.6A Active CN103745664B (en) | 2013-09-25 | 2013-12-18 | Display module |
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| CN (1) | CN103745664B (en) |
| TW (1) | TWI476739B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105206649A (en) * | 2015-09-28 | 2015-12-30 | 上海和辉光电有限公司 | Manufacturing method for display screen and display screen |
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| JP2007249014A (en) * | 2006-03-17 | 2007-09-27 | Citizen Miyota Co Ltd | Liquid crystal display device |
| CN102157110A (en) * | 2010-11-11 | 2011-08-17 | 友达光电股份有限公司 | Display device and manufacturing method thereof |
| CN102855816A (en) * | 2011-11-16 | 2013-01-02 | 友达光电股份有限公司 | Display device with flexible substrate and manufacturing method thereof |
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| TWI348046B (en) * | 2006-08-24 | 2011-09-01 | Au Optronics Corp | Liquid crystal display panel |
| US8188564B2 (en) * | 2007-12-27 | 2012-05-29 | Sharp Kabushiki Kaisha | Semiconductor device having a planarizing film formed in a region of a step portion |
| KR20110007134A (en) * | 2008-04-17 | 2011-01-21 | 아사히 가라스 가부시키가이샤 | Glass laminate, display panel with support, method for producing glass laminate and method for manufacturing display panel with support |
| US20100321282A1 (en) * | 2009-06-18 | 2010-12-23 | Himax Display, Inc. | Display module |
| TWI440930B (en) * | 2009-07-24 | 2014-06-11 | Au Optronics Corp | Flat panel display module |
| JP6068338B2 (en) * | 2011-07-06 | 2017-01-25 | パナソニック株式会社 | Method for manufacturing flexible device and flexible device |
| TWI449006B (en) * | 2011-10-05 | 2014-08-11 | Ind Tech Res Inst | Hybrid display device |
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- 2013-12-18 CN CN201310698006.6A patent/CN103745664B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007249014A (en) * | 2006-03-17 | 2007-09-27 | Citizen Miyota Co Ltd | Liquid crystal display device |
| CN102157110A (en) * | 2010-11-11 | 2011-08-17 | 友达光电股份有限公司 | Display device and manufacturing method thereof |
| CN102855816A (en) * | 2011-11-16 | 2013-01-02 | 友达光电股份有限公司 | Display device with flexible substrate and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105206649A (en) * | 2015-09-28 | 2015-12-30 | 上海和辉光电有限公司 | Manufacturing method for display screen and display screen |
| CN105206649B (en) * | 2015-09-28 | 2019-03-12 | 上海和辉光电有限公司 | A kind of preparation method and display screen showing screen |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201513068A (en) | 2015-04-01 |
| TWI476739B (en) | 2015-03-11 |
| CN103745664B (en) | 2016-06-08 |
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