CN113097261B - Display panel and manufacturing method thereof - Google Patents

Display panel and manufacturing method thereof Download PDF

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Publication number
CN113097261B
CN113097261B CN202110311618.XA CN202110311618A CN113097261B CN 113097261 B CN113097261 B CN 113097261B CN 202110311618 A CN202110311618 A CN 202110311618A CN 113097261 B CN113097261 B CN 113097261B
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display panel
wire
display
substrate
display area
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CN113097261A (en
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赵云
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/127Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The embodiment of the invention discloses a display panel and a manufacturing method thereof. The display panel includes: the first substrate and the second substrate are oppositely arranged; the frame glue is connected between the first substrate and the second substrate and arranged around the display area of the display panel; the first substrate comprises a first wire and a second wire, the first wire is located on one side, away from the display area, of the frame glue, the second wire is located in the display area, and the first wire and the second wire are insulated. The embodiment of the invention separates the first wire and the second wire by the frame glue, thereby avoiding the electrostatic damage in the display area when the static enters the first wire from the edge of the display panel and improving the antistatic damage capability of the display panel.

Description

Display panel and manufacturing method thereof
Technical Field
The invention relates to the field of display, in particular to a display panel and a manufacturing method thereof.
Background
Along with the improvement of the product quality requirement of the display panel, the requirement of people on the anti-static damage capability of the display panel is higher and higher, and how to improve the anti-static capability of the display panel is a great improvement direction of the display panel.
In the conventional display panel, the wires which are not electrically connected with the display device or the driving chip in the display area and the wires which are electrically connected with the display device and the driving chip are close to each other, so that when static electricity enters the wires which are not electrically connected with the display device or the driving chip in the display area, the display device or the driving chip is easily damaged.
Therefore, a display panel and a method for fabricating the same are needed to solve the above-mentioned problems.
Disclosure of Invention
The embodiment of the invention provides a display panel and a manufacturing method thereof, and aims to solve the technical problem that an existing display panel is damaged due to the fact that static electricity enters a wire which is not electrically connected with a display device or a driving chip in a display area.
An embodiment of the present invention provides a display panel, including:
the first substrate and the second substrate are oppositely arranged;
the frame glue is connected between the first substrate and the second substrate and is arranged around the display area of the display panel;
the first substrate comprises a first wire and a second wire, the first wire is located on one side, away from the display area, of the frame glue, the second wire is located in the display area, and the first wire and the second wire are insulated.
In an embodiment, the display panel further includes a non-display area surrounding the display area, the non-display area includes a binding area located on one side of the display area and a non-binding area other than the binding area, and the first trace is located in the non-binding area.
In an embodiment, the non-binding region includes a first sub-region located on the same side of the display region as the binding region, and the second trace is located in a region of the non-binding region other than the first sub-region.
In an embodiment, the display panel further includes a driving chip located in the bonding region, a third trace connecting the second trace and the driving chip, and a protective layer located on the third trace.
In one embodiment, the protective layer and the sealant have a first contact portion.
In an embodiment, the protective layer and the sealant have a first contact portion, and the first contact portion is located in the non-display region.
In an embodiment, the display panel further includes a display device located in the display area, and the second trace is connected to the display device.
In one embodiment, the sealant is made of an insulating polymer material, and the width of the sealant in the first direction is 0.5 mm to 3 mm;
the first direction is a direction perpendicular to the extending direction of the frame glue in the plane of the display panel.
In an embodiment, the first trace includes an anti-static trace, and the anti-static trace is grounded, or the anti-static trace includes a plurality of electrostatic discharge units.
In one embodiment, the electrostatic discharge unit includes a protrusion protruding in a direction away from the display area, the protrusion forming a discharge tip.
The embodiment of the invention also provides a manufacturing method of the display panel, which comprises the following steps:
forming a first routing and a second routing on a substrate;
forming frame glue on the substrate, wherein the frame glue is arranged around a display area of the display panel;
the first wire is located on one side, far away from the display area, of the frame glue, the second wire is located in the display area, and the first wire and the second wire are insulated.
Has the beneficial effects that: the embodiment of the invention separates the first wire from the second wire by using the frame glue, thereby avoiding the electrostatic damage in the display area when static enters the first wire from the edge of the display panel and improving the antistatic damage capability of the display panel.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic view of a first structure of a display panel according to an embodiment of the present invention;
FIG. 2 is a diagram illustrating a second structure of a display panel according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a third structure of a display panel according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a fourth structure of a display panel according to an embodiment of the present invention;
fig. 5 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Furthermore, it should be understood that the detailed description herein is intended only to illustrate and explain the present invention, and is not intended to limit the present invention.
Because the wiring which is not electrically connected with the display device or the driving chip in the display area and the wiring which is electrically connected with the display device and the driving chip are close to each other, when static electricity enters the wiring which is not electrically connected with the display device or the driving chip in the display area, the static electricity is easy to enter the display device or the driving chip in the display area from the wiring which is not electrically connected with the display device or the driving chip in the display area, and the problem of damage to the display device or the driving chip is caused.
The embodiment of the invention provides a display panel and a manufacturing method thereof. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 1 to 4, the display panel 100 includes:
a first substrate and a second substrate 107 disposed opposite to each other;
the frame sealant 101 is connected between the first substrate and the second substrate 107, and the frame sealant 101 is arranged around the display area 109 of the display panel 100;
the first substrate includes a first trace 102 and a second trace 103, the first trace 102 is located on a side of the sealant 101 away from the display area 109, the second trace 103 is located in the display area 109, and the first trace 102 is insulated from the second trace 103.
In the embodiment of the invention, the frame adhesive 101 is used for separating the first wire 102 from the second wire 103, so that the electrostatic damage in the display area 109 caused by the static electricity entering the first wire 102 from the edge of the display panel 100 is avoided, and the antistatic damage capability of the display panel 100 is improved.
The technical solution of the present invention will now be described with reference to specific embodiments.
Referring to fig. 1 to fig. 4, in the present embodiment, the display panel 100 further includes a non-display area surrounding the display area 109, the non-display area includes a bonding area 110 located at one side of the display area 109 and a non-bonding area except the bonding area 110, and the first trace 102 is located in the non-bonding area.
In this embodiment, the first trace 102 may be a dummy trace, a filling block, a character identifier (for distinguishing different display panels), an anti-static trace, or the like that is not electrically connected to the first trace 102.
The Display panel 100 may be a liquid crystal Display panel, an OLED (Organic electroluminescent diode) Display panel, a QLED (Quantum Dot Light Emitting Diodes) Display panel, or other types of Display panels.
In this embodiment, the display panel 100 further includes a display device 104 located in the display area 109, and the second trace 103 is electrically connected to the display device 104.
When the display panel 100 is an OLED display panel, the display device 104 may include a thin film transistor layer on a substrate 106 of the display panel 100, the thin film transistor layer including a thin film transistor; and the light-emitting device layer is positioned on the thin film transistor layer and can comprise an anode layer positioned on the thin film transistor layer, a light-emitting material layer positioned on the anode layer and a cathode layer positioned on the light-emitting material layer.
In this embodiment, the display panel 100 includes a first substrate and a second substrate 107 disposed opposite to the first substrate.
The first substrate includes the substrate 106, the thin film transistor layer, the first trace 102, the second trace 103, and the display device 104.
The second substrate 107 includes a cover plate layer, and the material of the cover plate layer may be glass.
The sealant 101 is located between the first substrate and the second substrate 107, and is used for bonding, fixing and sealing the first substrate and the second substrate 107.
In this embodiment, the second trace 103 may be a scan line, a data line, or another trace electrically connected to the display device 104 in the display area 109.
The second trace 103 may be electrically connected to the thin film transistor, the anode layer, or the cathode layer, and the second trace 103 may also be the cathode layer or the anode layer.
In this embodiment, the non-binding region includes a first sub-region located on the same side of the display region as the binding region 110, and the first trace 102 is located in a region of the non-binding region other than the first sub-region.
By disposing the first trace 102 in the non-bonding region except for the first sub-region, it is avoided that the first trace 102 is too close to the trace located in the bonding region 110 in the first sub-region close to the bonding region 110, which causes electrostatic damage in the bonding region 110 or the display region 109 when static electricity enters the first trace 102 from the edge of the display panel 100.
In this embodiment, the binding region 110 may be disposed adjacent to the display region, or the display panel 100 further includes a bending region between the display region and the binding region 110, or the display panel 100 further includes a fan-out region between the display region 109 and the bending region.
When the display panel 100 further includes the bending region, the bonding region 110 is bent to a side of the substrate 106 of the display panel 100 away from the light emitting side of the display panel 100 through the bending region.
In this embodiment, the display panel 100 further includes a driving chip 105 located in the bonding region 110, a third trace 108 connecting the second trace 103 and the driving chip 105, and a protection layer 111 located on the third trace 108.
In this embodiment, when the display area 109 is disposed adjacent to the bonding area 110, the third trace 108 may be located in the bonding area 110; when the display panel 100 further includes a bending region between the display region 109 and the bonding region 110, the third trace 108 may be located in the bending region and the bonding region 110; when the display panel 100 further includes a fan-out region located between the display region 109 and the bending region, the third trace 108 may be located in the fan-out region, the bending region, and the bonding region 110.
In this embodiment, the third trace 108 and the second trace 103 may be disposed on the same layer, or the third trace 108 and the second trace 103 may be disposed on different layers.
When the third trace 108 and the second trace 103 are disposed on the same layer, the third trace 108 and the second trace 103 may be integrally disposed, that is, the third trace 108 and the second trace 103 may be formed by using the same material and in the same process.
In this embodiment, since the second trace 103 is located on a side of the sealant 101 away from the first trace 102, in order to electrically connect the second trace 103 and the driving chip 105, the third trace 108 at least includes a first connecting portion located on a same side of the sealant 101 as the first trace 102. Therefore, the protection layer 111 is configured to protect the first connection portion, so as to prevent static electricity from entering the first connection portion after entering the first trace 102, which may cause damage to the display device 104 or the driving chip 105.
The material of the protection layer 111 may be ultraviolet glue, silica gel, blue gel, or other materials with insulating property.
In this embodiment, the protective layer 111 and the sealant 101 have a first contact portion.
In this embodiment, the protective layer 111 and the sealant 101 have the first contact portion, so as to completely protect the first connection portion.
In this embodiment, the protective layer 111 can cover the bonding area 110 to protect the third trace 108 and the driving chip 105.
In this embodiment, the first contact portion is located in the non-display area.
In this embodiment, the first contact portion may be located on a side of the sealant 101 away from the display region 109.
By limiting the first contact portion to a side of the sealant 101 away from the display region 109, it is avoided that the first contact portion extends between the substrate 106 and the sealant 101 or between the sealant 101 and the second substrate 107 of the display panel 100, which results in a decrease in the bonding effect between the first substrate and the second substrate 107 and affects the product quality of the display panel 100.
In this embodiment, a distance between the first wire 102 and the sealant 101 is greater than 0, and a distance between the second wire 103 and the sealant 101 is greater than 0.
In this embodiment, by making the distance between the first wire 102 and the sealant 101 greater than 0 and the distance between the second wire 103 and the sealant 101 greater than 0, the sealant 101 is prevented from being damaged by static electricity released between the first wire 102 and the second wire 103, which is beneficial to improving the product quality of the display panel 100.
In this embodiment, the sealant 101 is made of an insulating polymer material, and the width of the sealant 101 is 0.5 mm to 3 mm in the first direction;
the first direction is a direction perpendicular to the extending direction of the sealant 101 in the plane of the display panel 100.
In this embodiment, the sealant 101 may be made of epoxy resin or other insulating polymer materials.
In this embodiment, the extending direction of the sealant 101 is parallel to the side of the display region 109.
When the width of the sealant 101 is less than 0.5 mm, the width of the sealant 101 is too small, and the contact area between the sealant 101 and the first substrate and the second substrate 107 is too small, so that the adhesive force between the first substrate and the second substrate 107 is too low, which is not favorable for sealing the display area 109 of the display panel 100 and bonding the first substrate and the second substrate 107; when the width of the sealant 101 is greater than 3 mm, the width of the sealant 101 is too wide, which is not beneficial to reducing the width of the frame area of the display panel 100 and affects the use feeling of the user on the display panel 100; when the width of the sealant 101 is 0.5 mm to 3 mm, the adhesive force between the first substrate and the second substrate 107 is not too low due to the small width of the sealant 101, and the width of the frame area of the display panel 100 is not easily reduced due to the too wide width of the sealant 101.
In this embodiment, in the second direction, the thickness of the sealant 101 may be 4 to 20 micrometers. The second direction is a direction perpendicular to a plane in which the display panel 100 is located.
When the thickness of the sealant 101 is less than 4 μm, the thickness of the sealant 101 is too small, which results in too low adhesion between the first substrate and the second substrate 107, and is not favorable for sealing the display region 109 of the display panel 100 and bonding the first substrate and the second substrate 107; when the thickness of the sealant 101 is less than or equal to 20 micrometers, the first substrate and the second substrate 107 can be bonded, and therefore, the thickness of the sealant 101 is 4 micrometers to 20 micrometers.
In this embodiment, the first trace 102 includes an anti-static trace, and the anti-static trace is grounded, or the anti-static trace includes a plurality of electrostatic discharge units.
In this embodiment, when the anti-static trace includes a plurality of the electrostatic discharge units, the electrostatic discharge units include protrusions protruding away from the display area 109.
The bumps form discharge tips for timely releasing static electricity, so as to prevent static electricity from being released between the first wire 102 and the second wire 103 and causing damage to the display device 104 or the driving chip 105 due to static electricity entering the second wire 103.
In the embodiment of the invention, the frame adhesive 101 is used for separating the first wire 102 from the second wire 103, so that the electrostatic damage in the display area 109 caused by the static electricity entering the first wire 102 from the edge of the display panel 100 is avoided, and the antistatic damage capability of the display panel 100 is improved.
Referring to fig. 1 to fig. 5, an embodiment of the invention further discloses a manufacturing method of a display panel, including:
s100, forming a first trace 102 and a second trace 103 on a substrate 106.
S200, forming a sealant 101 on the substrate 106, wherein the sealant 101 surrounds the display region 109 of the display panel 100.
The first trace 102 is located on a side of the sealant 101 away from the display area 109, and the second trace 103 is located in the display area 109, where the first trace 102 is insulated from the second trace 103.
In the manufacturing method of the display panel provided by the embodiment of the invention, the frame adhesive 101 is used for separating the first wire 102 from the second wire 103, so that the static damage in the display area 109 caused when static enters the first wire 102 from the edge of the display panel 100 is avoided, and the antistatic damage capability of the display panel 100 is improved.
The technical solution of the present invention will now be described with reference to specific embodiments.
Referring to fig. 1 to 5, in the present embodiment, the method for manufacturing the display panel further includes:
and S300, forming a display device 104 in the display area 109.
In this embodiment, step S300 may be performed before step S100, after step S100 and before step S200, or step S300 may be performed simultaneously with step S100.
In this embodiment, the first trace 102 may be a virtual trace, a padding block, a character identifier (for distinguishing different display panels), an antistatic trace, or the like that is not electrically connected to the first trace 102.
The display panel 100 may be a liquid crystal display panel, an OLED display panel, a QLED display panel, or other types of display panels.
When the display panel 100 is an OLED display panel, the display device 104 may include a thin-film transistor layer on a substrate 106 of the display panel, the thin-film transistor layer including a thin-film transistor; and the light-emitting device layer is positioned on the thin film transistor layer and can comprise an anode layer positioned on the thin film transistor layer, a light-emitting material layer positioned on the anode layer and a cathode layer positioned on the light-emitting material layer.
In this embodiment, the second trace 103 may be a scan line, a data line, or another trace electrically connected to the display device 104 in the display area 109.
The second wire 103 may be a wire electrically connected to the thin film transistor, or electrically connected to the anode layer, or electrically connected to the cathode layer, and the second wire 103 may also be the cathode layer or the anode layer.
In this embodiment, the display panel includes a first substrate and a second substrate that are disposed opposite to each other, and the first substrate includes the substrate, the first trace, the second trace, and the display device.
In this embodiment, after step S200, the method for manufacturing a display panel further includes:
s400, providing a second substrate 107, wherein the second substrate 107 is attached to the first substrate through the sealant 101.
The sealant 101 is connected between the first substrate and the second substrate 107, and the sealant 101 is disposed around the display region 109 of the display panel 100, and is used for bonding, fixing and sealing the first substrate and the second substrate 107.
In this embodiment, the sealant 101 is made of an insulating polymer material, and the width of the sealant 101 is 0.5 mm to 3 mm in the first direction;
the first direction is a direction perpendicular to the extending direction of the sealant 101 in the plane of the display panel 100.
In this embodiment, the sealant 101 may be made of epoxy resin or other insulating polymer materials.
In this embodiment, the extending direction of the sealant 101 is parallel to the side of the display region 109.
When the width of the sealant 101 is less than 0.5 mm, the width of the sealant 101 is too small, and the contact areas of the sealant 101 and the first substrate and the second substrate 107 are too small, so that the adhesive force between the first substrate and the second substrate 107 is too low, which is not favorable for sealing the display area 109 of the display panel 100 and bonding the first substrate and the second substrate 107; when the width of the sealant 101 is greater than 3 mm, the width of the sealant 101 is too wide, which is not beneficial to reducing the width of the frame area of the display panel 100 and affects the use feeling of the user on the display panel 100; when the width of the sealant 101 is 0.5 mm to 3 mm, the adhesive force between the first substrate and the second substrate 107 is not too low due to the small width of the sealant 101, and the width of the frame area of the display panel 100 is not easily reduced due to the too wide width of the sealant 101.
In the present embodiment, in the second direction, the thickness of the sealant 101 may be 4 to 20 micrometers. The second direction is a direction perpendicular to a plane in which the display panel 100 is located.
When the thickness of the sealant 101 is less than 4 micrometers, the thickness of the sealant 101 is too small, which results in too low adhesive force between the first substrate and the second substrate 107, and is not favorable for sealing the display region 109 of the display panel 100 and adhering the first substrate and the second substrate 107; when the thickness of the sealant 101 is less than or equal to 20 micrometers, the first substrate and the second substrate 107 can be bonded together, and thus the thickness of the sealant 101 is 4 micrometers to 20 micrometers.
In this embodiment, the method for manufacturing a display panel further includes:
s500, binding the driver chip 105 in the binding region 110 of the display panel 100.
In this embodiment, the display panel 100 further includes a third trace 108 connecting the driving chip 105 and the second trace 103, and the third trace 108 and the second trace 103 may be formed in the same process by using the same material.
And S600, forming a protective layer 111 in the binding region 110.
In this embodiment, the material of the protection layer 111 may be ultraviolet glue, silica gel, blue glue, or other materials with insulating property.
In the embodiment of the invention, the frame adhesive 101 is used for separating the first wire 102 from the second wire 103, so that electrostatic damage in the display area 109 caused by static electricity entering the first wire 102 from the edge of the display panel 100 is avoided, and the antistatic damage capability of the display panel is improved.
The embodiment of the invention discloses a display panel and a manufacturing method thereof. The display panel includes: the first substrate and the second substrate are oppositely arranged; the frame glue is connected between the first substrate and the second substrate and arranged around the display area of the display panel; the first substrate comprises a first wire and a second wire, the first wire is located on one side, away from the display area, of the frame glue, the second wire is located in the display area, and the first wire and the second wire are insulated. The embodiment of the invention separates the first wire from the second wire by using the frame glue, thereby avoiding the electrostatic damage in the display area when static enters the first wire from the edge of the display panel and improving the antistatic damage capability of the display panel.
The display panel and the manufacturing method thereof provided by the embodiment of the invention are described in detail above, and the principle and the embodiment of the invention are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for those skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed, and in summary, the content of the present specification should not be construed as limiting the present invention.

Claims (7)

1. A display panel, comprising:
the first substrate and the second substrate are oppositely arranged;
the frame glue is connected between the first substrate and the second substrate and arranged around the display area of the display panel;
the first substrate comprises a first wire and a second wire, the first wire is positioned on one side of the frame glue, which is far away from the display area, the second wire is positioned in the display area, and the first wire and the second wire are insulated;
the display panel further comprises a non-display area surrounding the display area, the non-display area comprises a binding area located on one side of the display area and a non-binding area except the binding area, and the first routing is located in the non-binding area;
the display panel further comprises a driving chip positioned in the binding region, a third wire connecting the second wire and the driving chip, and a protective layer positioned on the third wire;
the protective layer and the frame glue are provided with a first contact part, and the first contact part is positioned on one side of the frame glue, which is far away from the display area.
2. The display panel according to claim 1, wherein the non-binding region includes a first sub-region located on the same side of the display region as the binding region, and the second trace is located in a region of the non-binding region other than the first sub-region.
3. The display panel according to claim 1, wherein the display panel further comprises a display device located in the display area, and the second trace is connected to the display device.
4. The display panel according to claim 1, wherein the sealant is made of an insulating polymer material, and the sealant has a width of 0.5 mm to 3 mm in the first direction;
the first direction is a direction perpendicular to the extending direction of the frame glue in the plane of the display panel.
5. The display panel according to claim 1, wherein the first trace comprises an anti-static trace, the anti-static trace is grounded, or the anti-static trace comprises a plurality of electrostatic discharge units.
6. The display panel according to claim 5, wherein the electrostatic discharge unit includes a projection projecting in a direction away from the display area, the projection forming a discharge tip.
7. A method for manufacturing a display panel is characterized by comprising the following steps:
forming a first wire and a second wire on a substrate;
forming frame glue on the substrate, wherein the frame glue is arranged around a display area of the display panel;
binding a driving chip in a binding area of the display panel;
forming a protective layer in the binding region;
the first wire is positioned on one side of the frame glue away from the display area, the second wire is positioned in the display area, and the first wire and the second wire are insulated;
the display panel further comprises a non-display area surrounding the display area, the non-display area comprises a binding area located on one side of the display area and a non-binding area except the binding area, and the first routing is located in the non-binding area;
the display panel further comprises a driving chip positioned in the binding region, a third wire connecting the second wire and the driving chip, and the protective layer positioned on the third wire;
the protective layer and the frame glue are provided with a first contact part, and the first contact part is positioned on one side of the frame glue, which is far away from the display area.
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