CN103728350A - 包含热导式气体传感器的集成电路 - Google Patents
包含热导式气体传感器的集成电路 Download PDFInfo
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- CN103728350A CN103728350A CN201310475651.1A CN201310475651A CN103728350A CN 103728350 A CN103728350 A CN 103728350A CN 201310475651 A CN201310475651 A CN 201310475651A CN 103728350 A CN103728350 A CN 103728350A
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- sensor
- integrated circuit
- humidity
- sensitive layer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/14—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
- G01N27/18—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by changes in the thermal conductivity of a surrounding material to be tested
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
- G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/56—Investigating or analyzing materials by the use of thermal means by investigating moisture content
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
- G01N33/0031—General constructional details of gas analysers, e.g. portable test equipment concerning the detector comprising two or more sensors, e.g. a sensor array
- G01N33/0032—General constructional details of gas analysers, e.g. portable test equipment concerning the detector comprising two or more sensors, e.g. a sensor array using two or more different physical functioning modes
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12188372.2 | 2012-10-12 | ||
EP12188372.2A EP2720034B1 (en) | 2012-10-12 | 2012-10-12 | Integrated Circuit comprising a relative humidity sensor and a thermal conductivity based gas sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103728350A true CN103728350A (zh) | 2014-04-16 |
CN103728350B CN103728350B (zh) | 2017-04-12 |
Family
ID=47049029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310475651.1A Active CN103728350B (zh) | 2012-10-12 | 2013-10-12 | 包含热导式气体传感器的集成电路 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9372166B2 (zh) |
EP (1) | EP2720034B1 (zh) |
CN (1) | CN103728350B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106082102A (zh) * | 2016-07-12 | 2016-11-09 | 上海申矽凌微电子科技有限公司 | 集成温度湿度气体传感的传感器电路制造方法及传感器 |
CN107607152A (zh) * | 2017-07-18 | 2018-01-19 | 上海申矽凌微电子科技有限公司 | 传感器的制造方法及传感器 |
CN107632044A (zh) * | 2016-07-18 | 2018-01-26 | 意法半导体有限公司 | 小型气体分析器 |
US10557812B2 (en) | 2016-12-01 | 2020-02-11 | Stmicroelectronics Pte Ltd | Gas sensors |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2559996B1 (en) | 2011-08-16 | 2017-11-22 | Nxp B.V. | Gas sensor |
DE102012107440A1 (de) * | 2012-08-14 | 2014-05-15 | Hella Kgaa Hueck & Co. | Verfahren zur Erzeugung einer nicht-vollkeramischen Oberfläche . |
DE102013104043A1 (de) * | 2013-04-22 | 2014-10-23 | Epcos Ag | Sensorbauelement und Verfahren zu dessen Herstellung |
JP6021761B2 (ja) * | 2013-08-27 | 2016-11-09 | 日立オートモティブシステムズ株式会社 | ガスセンサ装置 |
EP2884242B1 (en) | 2013-12-12 | 2021-12-08 | ams International AG | Sensor Package And Manufacturing Method |
US9453807B2 (en) | 2014-04-08 | 2016-09-27 | Ams International Ag | Thermal conductivity gas sensor with amplification material |
US9778238B2 (en) | 2014-09-09 | 2017-10-03 | Ams International Ag | Resonant CO2 sensing with mitigation of cross-sensitivities |
US9658179B2 (en) | 2015-06-24 | 2017-05-23 | Infineon Technologies Ag | System and method for a MEMS transducer |
US10605823B2 (en) | 2016-02-25 | 2020-03-31 | m.Cube, Inc. | Multiple MEMS device and methods |
CN109073582B (zh) * | 2016-05-23 | 2020-10-27 | 日立汽车系统株式会社 | 湿度测量装置 |
TWI601686B (zh) * | 2016-08-03 | 2017-10-11 | 國立交通大學 | Method for manufacturing semiconductor gas sensing device and semiconductor gas sensing device |
FR3098914B1 (fr) | 2019-07-19 | 2021-09-24 | St Microelectronics Rousset | Procede de detection d’humidite dans un circuit integre et circuit integre associe |
CN113203769B (zh) * | 2021-04-15 | 2022-11-04 | 电子科技大学 | 一种高气密性的微型热导检测器及其制作方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004037180A (ja) * | 2002-07-02 | 2004-02-05 | Denso Corp | 集積化センサ装置 |
US20080315333A1 (en) * | 2005-10-14 | 2008-12-25 | Stmicroelectronics S.R.L. | Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device |
CN102081070A (zh) * | 2011-02-16 | 2011-06-01 | 西安交通大学 | 碳纳米管薄膜三电极乙炔传感器及其浓度测量方法 |
US20110226041A1 (en) * | 2004-04-02 | 2011-09-22 | ChipSensors Limited. | Integrated CMOS porous sensor |
CN102405524A (zh) * | 2009-02-20 | 2012-04-04 | 国家半导体公司 | 集成电路微模块 |
US20120244655A1 (en) * | 2011-03-04 | 2012-09-27 | Texas Instruments Incorporated | Backgrind process for integrated circuit wafers |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005106802A (ja) * | 2003-07-10 | 2005-04-21 | Canon Inc | 環境センサー、環境測定装置及び環境測定システム |
CN1961209A (zh) * | 2004-04-02 | 2007-05-09 | 蒂莫西·卡明斯 | 集成电子传感器 |
US20050247107A1 (en) * | 2004-05-06 | 2005-11-10 | Honeywell International, Inc. | Relative humidity sensor enclosed with kapton type heater |
US7243541B1 (en) * | 2006-03-30 | 2007-07-17 | Honeywell International Inc. | Combi-sensor for measuring multiple measurands in a common package |
CH701654B1 (fr) * | 2007-02-15 | 2011-02-28 | Neroxis Sa | Capteur de gaz. |
US7832269B2 (en) * | 2007-06-22 | 2010-11-16 | Honeywell International Inc. | Packaging multiple measurands into a combinational sensor system using elastomeric seals |
US8024970B2 (en) * | 2008-06-12 | 2011-09-27 | Honeywell International Inc. | Passive humidity sensors and methods for temperature adjusted humidity sensing |
US7842544B2 (en) * | 2009-02-20 | 2010-11-30 | National Semiconductor Corporation | Integrated circuit micro-module |
US8823007B2 (en) * | 2009-10-28 | 2014-09-02 | MCube Inc. | Integrated system on chip using multiple MEMS and CMOS devices |
US8476084B1 (en) * | 2010-05-24 | 2013-07-02 | MCube Inc. | Method and structure of sensors or electronic devices using vertical mounting |
US8652961B1 (en) * | 2010-06-18 | 2014-02-18 | MCube Inc. | Methods and structure for adapting MEMS structures to form electrical interconnections for integrated circuits |
EP2420826A1 (en) | 2010-08-17 | 2012-02-22 | Nxp B.V. | Integrated Circuit and Manufacturing Method Therefor |
US9103705B2 (en) * | 2012-02-27 | 2015-08-11 | Freescale Semiconductor, Inc. | Combined environmental parameter sensor |
EP2645091B1 (en) * | 2012-03-30 | 2018-10-17 | ams international AG | Integrated circuit comprising a gas sensor |
-
2012
- 2012-10-12 EP EP12188372.2A patent/EP2720034B1/en active Active
-
2013
- 2013-10-07 US US14/047,137 patent/US9372166B2/en active Active
- 2013-10-12 CN CN201310475651.1A patent/CN103728350B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004037180A (ja) * | 2002-07-02 | 2004-02-05 | Denso Corp | 集積化センサ装置 |
US20110226041A1 (en) * | 2004-04-02 | 2011-09-22 | ChipSensors Limited. | Integrated CMOS porous sensor |
US20080315333A1 (en) * | 2005-10-14 | 2008-12-25 | Stmicroelectronics S.R.L. | Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device |
CN102405524A (zh) * | 2009-02-20 | 2012-04-04 | 国家半导体公司 | 集成电路微模块 |
CN102081070A (zh) * | 2011-02-16 | 2011-06-01 | 西安交通大学 | 碳纳米管薄膜三电极乙炔传感器及其浓度测量方法 |
US20120244655A1 (en) * | 2011-03-04 | 2012-09-27 | Texas Instruments Incorporated | Backgrind process for integrated circuit wafers |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106082102A (zh) * | 2016-07-12 | 2016-11-09 | 上海申矽凌微电子科技有限公司 | 集成温度湿度气体传感的传感器电路制造方法及传感器 |
CN106082102B (zh) * | 2016-07-12 | 2017-12-15 | 上海申矽凌微电子科技有限公司 | 集成温度湿度气体传感的传感器电路制造方法及传感器 |
CN107632044A (zh) * | 2016-07-18 | 2018-01-26 | 意法半导体有限公司 | 小型气体分析器 |
US10429330B2 (en) | 2016-07-18 | 2019-10-01 | Stmicroelectronics Pte Ltd | Gas analyzer that detects gases, humidity, and temperature |
US10557812B2 (en) | 2016-12-01 | 2020-02-11 | Stmicroelectronics Pte Ltd | Gas sensors |
US11543378B2 (en) | 2016-12-01 | 2023-01-03 | Stmicroelectronics Pte Ltd | Gas sensors |
CN107607152A (zh) * | 2017-07-18 | 2018-01-19 | 上海申矽凌微电子科技有限公司 | 传感器的制造方法及传感器 |
WO2019015138A1 (zh) * | 2017-07-18 | 2019-01-24 | 上海申矽凌微电子科技有限公司 | 传感器的制造方法及传感器 |
Also Published As
Publication number | Publication date |
---|---|
EP2720034A1 (en) | 2014-04-16 |
CN103728350B (zh) | 2017-04-12 |
US20140102172A1 (en) | 2014-04-17 |
EP2720034B1 (en) | 2016-04-27 |
US9372166B2 (en) | 2016-06-21 |
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