CN103718010B - 构造为消除与应力相关的温度测量值的不准确性的微丝温度传感器以及制造所述传感器的方法 - Google Patents

构造为消除与应力相关的温度测量值的不准确性的微丝温度传感器以及制造所述传感器的方法 Download PDF

Info

Publication number
CN103718010B
CN103718010B CN201280012248.9A CN201280012248A CN103718010B CN 103718010 B CN103718010 B CN 103718010B CN 201280012248 A CN201280012248 A CN 201280012248A CN 103718010 B CN103718010 B CN 103718010B
Authority
CN
China
Prior art keywords
microfilament
temperature
main
microwire
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280012248.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN103718010A (zh
Inventor
B·L·克罗西亚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TSI Technologies LLC
Original Assignee
TSI Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TSI Technologies LLC filed Critical TSI Technologies LLC
Publication of CN103718010A publication Critical patent/CN103718010A/zh
Application granted granted Critical
Publication of CN103718010B publication Critical patent/CN103718010B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/36—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using magnetic elements, e.g. magnets, coils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G01K15/005—Calibration

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Measuring Fluid Pressure (AREA)
CN201280012248.9A 2011-03-09 2012-03-07 构造为消除与应力相关的温度测量值的不准确性的微丝温度传感器以及制造所述传感器的方法 Active CN103718010B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161464682P 2011-03-09 2011-03-09
US61/464,682 2011-03-09
US13/411,767 2012-03-05
US13/411,767 US9212955B2 (en) 2011-03-09 2012-03-05 Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors
PCT/US2012/028058 WO2012122258A2 (en) 2011-03-09 2012-03-07 Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors

Publications (2)

Publication Number Publication Date
CN103718010A CN103718010A (zh) 2014-04-09
CN103718010B true CN103718010B (zh) 2016-03-16

Family

ID=46795552

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280012248.9A Active CN103718010B (zh) 2011-03-09 2012-03-07 构造为消除与应力相关的温度测量值的不准确性的微丝温度传感器以及制造所述传感器的方法

Country Status (9)

Country Link
US (1) US9212955B2 (cg-RX-API-DMAC10.html)
EP (1) EP2684014B1 (cg-RX-API-DMAC10.html)
JP (1) JP5918278B2 (cg-RX-API-DMAC10.html)
CN (1) CN103718010B (cg-RX-API-DMAC10.html)
AU (1) AU2012225525B2 (cg-RX-API-DMAC10.html)
CA (1) CA2828774C (cg-RX-API-DMAC10.html)
ES (1) ES2665945T3 (cg-RX-API-DMAC10.html)
IL (1) IL228288B (cg-RX-API-DMAC10.html)
WO (1) WO2012122258A2 (cg-RX-API-DMAC10.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7385357B2 (en) 1999-06-21 2008-06-10 Access Business Group International Llc Inductively coupled ballast circuit
GB2478674B (en) 2009-01-06 2014-05-07 Access Business Group Int Llc Smart cookware
JP6144620B2 (ja) 2010-04-08 2017-06-07 アクセス ビジネス グループ インターナショナル リミテッド ライアビリティ カンパニー ＰＯＳ（ｐｏｉｎｔｏｆｓａｌｅ）誘導性システムと方法
FR2988172B1 (fr) * 2012-03-19 2014-12-26 Sc2N Sa Capteur de temperature
ES2555542B1 (es) * 2014-05-27 2016-10-19 Consejo Superior De Investigaciones Científicas (Csic) Sensor embebido para la medida continua de resistencias mecánicas en estructuras de material cementicio, método de fabricación del mismo, y sistema y método de medida continua de resistencias mecánicas en estructuras de material cementicio
DE102018222111A1 (de) * 2018-12-18 2020-06-18 Schott Ag Ofen, insbesondere Kühlofen
US12304157B2 (en) 2021-10-20 2025-05-20 Tsi Technologies Llc In-situ monitoring and control of induction welding of thermoplastic composites using amorphous or nanocrystalline microwire temperature sensors and self-centering antennae rail system
EP4542030A1 (en) * 2023-10-16 2025-04-23 Siemens Gamesa Renewable Energy A/S Method for detecting at least one property of a component of or for a wind turbine
CN117276846B (zh) * 2023-11-02 2024-03-05 广州博远装备科技有限公司 一种基于形状记忆合金的自适应短波天线

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070263699A1 (en) * 2006-05-09 2007-11-15 Thermal Solutions, Inc. Magnetic element temperature sensors
US20090262781A1 (en) * 2006-08-11 2009-10-22 Brian Rafael Shumaker Multipoint digital temperature acquisition system
US20100006562A1 (en) * 2006-05-09 2010-01-14 Thermal Solutions, Inc. Magnetic element temperature sensors
WO2010151453A2 (en) * 2009-06-25 2010-12-29 Tsi Technologies Llc Improved strain sensor

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2047539C3 (de) * 1970-09-26 1973-09-20 Gesellschaft Fuer Kernforschung Mbh, 7500 Karlsruhe Thermoelement
SU832505A2 (ru) * 1979-03-05 1981-05-23 Казанский Ордена Трудового Красного Зна-Мени Авиационный Институт Им.A.H.Туполева Нановеберметр
JPH0575631U (ja) * 1992-03-17 1993-10-15 ティーディーケイ株式会社 温度センサ
JPH1183641A (ja) * 1997-09-08 1999-03-26 Kurabe Ind Co Ltd ガラス封止型サーミスタ
JP2000146714A (ja) * 1998-11-06 2000-05-26 Oji Paper Co Ltd 蒸解釜用温度検出器
US6208253B1 (en) * 2000-04-12 2001-03-27 Massachusetts Institute Of Technology Wireless monitoring of temperature
AU2007249419B2 (en) * 2006-05-09 2012-10-04 Thermal Solutions, Inc. Magnetic element temperature sensors
US8192080B2 (en) 2007-01-23 2012-06-05 Tsi Technologies Llc Microwire-controlled autoclave and method
US8033715B2 (en) * 2007-11-08 2011-10-11 Illinois Institute Of Technology Nanoparticle based thermal history indicators
JP5049879B2 (ja) * 2008-05-28 2012-10-17 株式会社デンソー 温度センサ
US8485723B2 (en) 2009-08-12 2013-07-16 Tsi Technologies Llc One-time sensor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070263699A1 (en) * 2006-05-09 2007-11-15 Thermal Solutions, Inc. Magnetic element temperature sensors
US20100006562A1 (en) * 2006-05-09 2010-01-14 Thermal Solutions, Inc. Magnetic element temperature sensors
US20090262781A1 (en) * 2006-08-11 2009-10-22 Brian Rafael Shumaker Multipoint digital temperature acquisition system
WO2010151453A2 (en) * 2009-06-25 2010-12-29 Tsi Technologies Llc Improved strain sensor

Also Published As

Publication number Publication date
US20120230365A1 (en) 2012-09-13
IL228288B (en) 2018-01-31
CA2828774A1 (en) 2012-09-13
EP2684014B1 (en) 2018-02-28
WO2012122258A3 (en) 2012-12-13
US9212955B2 (en) 2015-12-15
JP5918278B2 (ja) 2016-05-18
ES2665945T3 (es) 2018-04-30
AU2012225525A1 (en) 2013-09-26
CN103718010A (zh) 2014-04-09
EP2684014A2 (en) 2014-01-15
CA2828774C (en) 2019-04-09
AU2012225525B2 (en) 2015-03-05
JP2014507671A (ja) 2014-03-27
WO2012122258A2 (en) 2012-09-13
EP2684014A4 (en) 2015-03-04

Similar Documents

Publication Publication Date Title
CA2828774C (en) Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors
CN103575331B (zh) 一种高温结构温度和应变的同时测试方法
US7794142B2 (en) Magnetic element temperature sensors
US8286497B2 (en) Strain sensor
US20120205837A1 (en) Microwire-controlled autoclave and method
CN104729418A (zh) 一种光纤光栅高温应变传感器的标定装置与方法
JP2014507671A5 (cg-RX-API-DMAC10.html)
EP3150998B1 (en) Embedded sensor for the continuous measurement of mechanical resistance in structures made from cementitious material, method for producing the sensor, and system and method for the continuous measurement of mechanical resistance in structures made from cementitious materials
CN108917831B (zh) 聚合物封装光栅传感器及传感器粘弹性效应的修正方法
CN102589744A (zh) 电感型温度传感器件
Zhang et al. Strain transfer analysis of a four-layer embedded fiber optic sensing model in an elastic state
CN108957364A (zh) 一种磁场传感器及磁场测量方法
CN1987944A (zh) 一种复合线型感温火灾探测器及其数据融合的报警方法
MD4456C1 (ro) Senzori de temperatură cu microconductori pentru eliminarea erorilor de măsurare a temperaturii dependente de tensiune
Wang et al. A circular target flow measurement system
GB2492047A (en) Non-contact stress monitoring by measuring induced current
CN105910549B (zh) 一种高精度传感光纤应变测量装置
Zhou et al. Design and Modeling of Vanadium Dioxide-Based High-Sensitivity Microfluidic Calorimetric Sensors
Adhreena et al. A STUDY OF FIBER BRAGG GRATING TEMPERATURE SENSOR FOR UNDER WATER TEMPERATURE MONITORING
Gong et al. Strain performance of fiber bragg grating sensor fixed by different adhesives
CN107796528B (zh) 一种能消除分布式光纤光栅受外界应力影响的封装方法
Im et al. FBG sensor probes with silver epoxy for tracing the maximum strain of structures
Li et al. FBG strain sensor based on thermal stress mechnism
Szewczyk et al. The temperature dependence of the magnetoelastic characteristics of cores for force sensors utilizing Fe70Ni8Si10B12 amorphous alloy
CN102564641A (zh) 基于长周期光纤光栅的悬挂式高温传感装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant