CN103715209B - Dustproof chip module structure - Google Patents
Dustproof chip module structure Download PDFInfo
- Publication number
- CN103715209B CN103715209B CN201210377924.4A CN201210377924A CN103715209B CN 103715209 B CN103715209 B CN 103715209B CN 201210377924 A CN201210377924 A CN 201210377924A CN 103715209 B CN103715209 B CN 103715209B
- Authority
- CN
- China
- Prior art keywords
- bulge
- bracing frame
- lens
- dust
- chip module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000010419 fine particle Substances 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 claims description 4
- 230000008450 motivation Effects 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000000428 dust Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 210000004247 hand Anatomy 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 208000017983 photosensitivity disease Diseases 0.000 description 1
- 231100000434 photosensitization Toxicity 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Studio Devices (AREA)
- Lens Barrels (AREA)
Abstract
Disclosed in the invention is a dustproof chip module structure comprising a substrate, a chip, a support frame, a transparent substrate, and a lens holder. To be specific, the chip is configured on the substrate and has a sensing zone; the support frame is configured on the substrate and has a first projection structure; the transparent substrate is configured on the support frame and is aligned at the sensing zone approximately; and the lens holder is configured on the support frame and a lens is fixed in the lens holder and is aligned at the transparent substrate and the sensing zone approximately. The lens has a second projection structure; and the second projection structure and the first projection structure are configured relatively so as to block particles that might enter the chip module structure.
Description
Technical field
The present invention relates to a kind of semiconductor subassembly modular structure, particularly to the structure of a kind of utilization lens and bracing frame
Design enters the dust-proof chip module structure on the surface of transparency carrier to reduce particle.
Background technology
Traditional camera module includes an image sensor and one or more lens group.Lens group is arranged at image sensor
On, the image of incident ray is reflected to image sensor.The camera module with image sensor can apply to
Digital camera, digitized video recorder, mobile phone, intelligent mobile phone, monitor and other have the electronic product of camera function.
Among camera module, less and less with the Pixel Dimensions among image sensor, dust is for image quality
Impact also more and more significant.In existing design, between lens and lens mount, have no special design.Therefore, either
External dust or lens and dust produced by lens mount assembling, all can enter in the gap between lens and lens mount
Inside camera module, and affect the image quality of camera module.
According to the shortcoming of above known techniques, the present invention proposes a kind of brand-new dust-proof chip module structure, to carry
Rise the image quality of camera module.
Content of the invention
The defect existing for prior art and deficiency, it is an object of the invention to provide a kind of dust-proof chip dies agllutination
Structure, enters into transparency carrier to reduce particle.
Another object of the present invention is to provide a chip dies agllutination with the bracing frame of bulge-structure and the dust-proof of lens
Structure, to stop possibly into the particle within modular structure.
For reaching above-mentioned purpose, the present invention employs the following technical solutions：
A kind of dust-proof chip module structure is it is characterised in that include：
One substrate；
One chip, is configured on substrate, has a sensing region；
One bracing frame, is configured on substrate, and bracing frame has one first bulge-structure；And
One lens mount, is configured on bracing frame, and lens are fixed on be aligned sensing region among lens mount；
Wherein lens have one second bulge-structure, and the second bulge-structure and the first bulge-structure relative configuration can to stop
The particle within modular structure can be entered.
Above-mentioned bracing frame has one and is formed at groove structure therein to receive or to accommodate chip, with a perforation structure with profit
Exposed out in the sensing region of chip.Bracing frame has a circular groove structure, positioned at the side of perforation structure, annular groove
Structure is so that transparency carrier is configured thereon that.Second bulge-structure is extended in the opposite direction with the first bulge-structure, the
Two bulge-structures and the first bulge-structure are separated by a spacing in horizontal direction.
Its chips is attached on substrate through one first adhesion layer, and bracing frame is attached to through one second adhesion layer
On substrate, lens mount is attached on bracing frame through one the 3rd adhesion layer.Additionally, the first bulge-structure is located at bracing frame
Upper surface, the second bulge-structure be located at lens side bottom.Wherein lens mount is a working of plastics or a drive mechanism, drives
Motivation structure includes a voice coil motor or a MEMS.
The above is in order to illustrate the purpose of the present invention, to reach the technological means of this purpose and the advantage of its generation etc.
Deng.And the present invention can be from the narration of preferred embodiments below and so that reader is able to rear accompanying drawings and claim clear
Solution.
Brief description
Said modules, and this creation further feature and advantage, after the content and its schema of reading embodiment, will
Become apparent from：
Fig. 1 shows the sectional view of the chip module structure of an integration bracing frame and image sensor.
Fig. 2 shows the dust-proof chip module structure of an embodiment of a bracing frame with bulge-structure and lens
Sectional view.
Fig. 3 shows the dust-proof chip module structure of another embodiment of a bracing frame with bulge-structure and lens
Sectional view.
Specific embodiment
The present invention will coordinate embodiment to be specified in down with the schema enclosed.It should be appreciated that person is all of enforcement in the present invention
Example is only illustration and is used, and is not used to limit.Therefore remove the enforcement exception in literary composition, the present invention also can be widely used in other real
Apply in example.And the present invention is not limited to any embodiment, should be with the claim enclosed and its equivalent fields depending on.
The present invention provide a kind of dust-proof chip module structure, modular structure utilize bracing frame one first bulge-structure with
And the relative position between one second bulge-structure of lens, with the fine particle of reduction or an anti-blocking part along optical module
(lens) side wall and enter transparency carrier, the image quality of result remote-effects to camera module.In other words, the module of the present invention
Structure utilizes the structure design of lens and bracing frame, can be effectively reduced or anti-blocking fine particle is along lens and drive mechanism
Or the slot between lens mount and travel further into transparency carrier, thus lifting image sensor image quality.
The sectional view of the chip module structure of lens mount and image sensor is integrated in Fig. 1 display.As shown in figure 1, wherein
Lens mount is integrated transparency carrier and image sensor and is become a modular structure with photosensitization, and it can apply to handss
The camera module of machine.Wherein chip module structure mainly includes substrate 100, chip 101, bracing frame 104, transparency carrier 106, thoroughly
Mirror 107 and lens mount 108.
Among the present invention, lens mount 108 integrates lens 107, transparency carrier 106, bracing frame 104, chip 101 and base
Plate 100 is to form cube modular structure.
The lens mount 108 of the present invention can be simple working of plastics or drive mechanism/assembly (actuator), is attached to support
On frame 104；And bracing frame 104 is attached on substrate 100 to complete the modular structure of the present invention.For example, above-mentioned drive
Motivation structure or assembly include voice coil motor (Voice Coil Motor：VCM structure design) or MEMS (MEMS) knot
Structure.At present in imaging device, voice coil motor is widely used in the camera lens part driving camera module, to be focused.
Chip 101 can be attached on substrate 100 through a conductive layer or non-conductive adhesion layer 102.Conductive layer is permissible
As an adhesion layer 102, it is formed on substrate 100.In one embodiment of this invention, the material of conductive layer includes conducting resinl
Or conducting film, through a printing, coating or other processing procedure to form a pattern glue on substrate.Conductive material layer can select
Coat on substrate 100 to property.For example, chip 101 be an image sensor, its upper surface have a sensing region with
And engagement pad is formed thereon.Substrate 100 is a printed circuit board (PCB) or flexible printed wiring board.The size of substrate 100 is compared with chip
101 size is big, is beneficial to chip 101 and is adhered completely on substrate 100.
One adhesion layer 103 is formed on substrate 100 (side).Bracing frame 104 is attached to base by adhesion layer 103
On plate 100, and chip 101 is configured between bracing frame 104 and substrate 100.Bracing frame 104 has：One be formed at therein
Groove structure, to receive or to accommodate chip 101；One perforation structure has the sensing (actively) that open area is beneficial to chip 101
Region and engagement pad can exposed out.Additionally, the side of the perforation structure of bracing frame 104 has a circular groove structure, its
On have accommodation space so that transparency carrier 106 is configured thereon that.That is, bracing frame 104 is carried transparency carrier 106.Thoroughly
Bright substrate 106 is, for example, the substrate that a glass substrate or other transparent material are formed, and is configured on substrate 100 to cover shadow
As the top of the sensing region of sensor chip 101, result produces the gap (pothole) between transparency carrier 106 and sensing region.
Transparency carrier 106 covers the sensing region of image sensing chip 101, can reduce particle pollution good with Lifting Modules block structured
Rate.Transparency carrier 106 can be identical with sensing region occupied area or slightly larger.
Transparency carrier (glass substrate) 106 can be circular or square kenel.Transparency carrier (glass substrate) 106 can select
Selecting property it is coated with infrared coating to be used as filtering, for being filtered through the light wave of a certain wave band of lens 107.
One adhesion layer 105 is formed on bracing frame 104 (side), and adhesion layer 105 is passed through in the bottom of lens mount 108
And be attached on bracing frame 104.Wherein lens 107 are fixed among lens mount 108, through lens mount 108 to support lens
107.Additionally, lens mount 108 can also be fixed on bracing frame 104 to support lens 107.Modular structure in the present embodiment
In, transparency carrier 106 is configured under lens mount 108, and between lens 107 and chip 101.In other words, lens 107 are rough
Be aligned transparency carrier 106 and chip 101.
After modular structure is completed, between lens mount 108 and lens 107 possibly cannot completely closely sealed and in the two
Seam crossing have small gap, and also have between bracing frame 104, transparency carrier 106 and lens 107 one (close) closing
Space.Therefore, the fine particle 109 of a part is by along the slot (side between lens 107 and drive mechanism or lens mount 108
Wall) and under, move into transparency carrier 106 further in above-mentioned closing space, and pollute transparency carrier 106 surface.Result
Remote-effects are to the image quality of image sensor 101.In other words, in the modular structure of Fig. 1, the fine particle of a part can
The transparency carrier 106 of lower half can be entered along the clearance gap (side wall) of the lens 107 of the first half and lens mount 108, and
And fine particle will stay on above transparency carrier 106, result has influence on light by transparency carrier 106 after image sensing
Imaging on device 101.
As shown in Fig. 2 an embodiment of the dust-proof chip module structure of the display present invention.In the present embodiment, lens
And support frame structure is with the lens 107 of Fig. 1 and bracing frame 104 structure difference：The support frame structure bag of the present embodiment
Include bracing frame 104 structure of Fig. 1 and one first bulge-structure 104a, the lens 107 that the lens arrangement of the present embodiment includes Fig. 1 are tied
Structure and one second bulge-structure (rib) 107a.Second bulge-structure 107a is oppositely disposed with the first bulge-structure 104a to stop
Possibly into the particle in modular structure.For example, the bottom (lower surface) in lens 107 increases by the second bulge-structure
107a, and the upper surface in bracing frame 104 increases another first bulge-structure 104a.Second bulge-structure 107a is located at lens
The bottom of 107 side.Second bulge-structure 107a of lens 107 will not touch bracing frame 104, and the of bracing frame 104
One bulge-structure 104a also will not touch lens 107, has influence on modular structure lower half with the first half avoiding modular structure.
Second bulge-structure 107a is not also contacted with each other with the first bulge-structure 104a.In one embodiment, the second bulge-structure 107a
It is separated by a spacing with the first bulge-structure 104a in horizontal direction, and then extend toward rightabout in vertical direction.For example,
Second bulge-structure 107a of lens 107 extends (down extending) toward bracing frame 104 and the upper surface close to bracing frame 104, and
First bulge-structure 104a of bracing frame 104 then extends (up extending) toward lens 107 and the bottom close to lens 104.At this
In embodiment, the second bulge-structure 107a of lens 107 is not exposed to bracing frame 104, still has therebetween space.Therefore,
Along the clearance gap (side wall) of lens 107 and the lens mount 108 of the first half and the vertical a part of fine particle moving down
Being possible to can be into or by the space between the second bulge-structure 107a bottom (lower surface) and bracing frame 104 upper surface.By
It is separated by a spacing in the second bulge-structure 107a and the first bulge-structure 104a in horizontal direction, therefore fine particle is also possible to
Reach the first bulge-structure 104a.However, because the first bulge-structure 104a extends toward rightabout in vertical direction, therefore arriving
Reach the first bulge-structure 104a can be blocked without continuing toward transparency carrier 106 to move.These fine particles only can stop
It is not to cross the upper surface of the first bulge-structure 104a in the side of the first bulge-structure 104a.That is, these small grains
Son can be lived by shelves and be stayed between the second bulge-structure 107a and the first bulge-structure 104a.Therefore, fine particle will not
Rest on above transparency carrier 106, thus particle can be excluded and affect the probability of image sensor 101.Recited above
Fine particle is, for example, external dust or lens and dust produced by lens mount assembling.
In one embodiment, the height of the bottom surface of the second bulge-structure 107a is less than or is equal to the first bulge-structure 104a
Top surface height.
In one embodiment, the second bulge-structure 107a and lens 107 are integrally formed, or the second bulge-structure 107a
It is fixed on the bottom of lens 107 from lens 107 for different materials.Similarly, the first bulge-structure 104a and bracing frame 104
It is integrally formed, or the first bulge-structure 104a is fixed on the top of bracing frame 104 from bracing frame 104 for different materials
Portion.
For lifting a preferred embodiment, the first bulge-structure 104a of bracing frame 104 is located at the side of transparency carrier 106,
Have influence on the light of entrance to avoid contact with or cover transparency carrier 106.
In the present invention, the second bulge-structure 107a of lens 107 and the first bulge-structure 104a of bracing frame 104 is equal
Outside the region of bracing frame 104 carrying transparency carrier 106.
As shown in figure 3, another embodiment of the chip module structure of particle protection of the display present invention.In the present embodiment
In, chip module structure does not include transparency carrier 106, or transparency carrier 106 is integrated among lens mount 108；Other knots
Structure part refer to the narration that Fig. 2 is made.
In one embodiment, substrate 100 is a printed circuit board (PCB).The material of substrate 100 can be organic substrate, such as glass
Cloth epoxide resin type (FR5 or FR4), BMI-triazine resin (Bismaleimide Triazine：BT).This
Outward, glass, pottery and silicon can also be used as the materials of substrate 100.
The above, the only specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, all should contain
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should described be defined by scope of the claims.
Claims (11)
1. a kind of dust-proof chip module structure is it is characterised in that include：
One substrate；
One chip, is configured on substrate, has a sensing region；
One transparency carrier, is covered in the sensing region of this chip；
One bracing frame, is configured on substrate, and bracing frame has one first bulge-structure；And
One lens mount, is configured on bracing frame, and lens are fixed on be aligned sensing region among lens mount；
Wherein lens have one second bulge-structure, and the second bulge-structure may be entered with stopping with the first bulge-structure relative configuration
Enter the particle within modular structure, wherein this first bulge-structure is located at the inner side edge of this second bulge-structure, and this is first convex
Play structure and this second bulge-structure and be separated by a spacing in horizontal direction, then extend toward rightabout in vertical direction, and this
The height of the bottom surface of two bulge-structures be less than or be equal to the first bulge-structure top surface height so that from this lens mount with
Gap between lens by fine particle can be blocked by this first bulge-structure and stay in the second bulge-structure and first
Between bulge-structure；
And this first bulge-structure is located at the side of this transparency carrier, the first bulge-structure and this second bulge-structure all position simultaneously
Beyond the regional extent of this base plate carrying transparency carrier, have influence on the light of entrance to avoid contact with or cover this transparency carrier
Line.
2. dust-proof chip module structure according to claim 1 is it is characterised in that bracing frame has one is formed at wherein
Groove structure to receive or to accommodate chip, the sensing region being beneficial to chip with a perforation structure is exposed out.
3. dust-proof chip module structure according to claim 1 is it is characterised in that chip is attached through one first adhesion layer
On substrate, bracing frame is attached on substrate through one second adhesion layer, lens mount is through one the 3rd adhesion layer
It is attached on bracing frame.
4. dust-proof chip module structure according to claim 1 is it is characterised in that the first bulge-structure is located at bracing frame
Upper surface, the second bulge-structure be located at lens side bottom.
5. dust-proof chip module structure according to claim 1 is it is characterised in that lens mount is a working of plastics or a drive
Motivation structure, drive mechanism includes a voice coil motor or a MEMS.
6. dust-proof chip module structure according to claim 1 is it is characterised in that this transparency carrier is configured at bracing frame
On, it is directed at sensing region.
7. dust-proof chip module structure according to claim 6 is it is characterised in that bracing frame has one is formed at wherein
Groove structure to receive or to accommodate chip, the sensing region being beneficial to chip with a perforation structure is exposed out.
8. dust-proof chip module structure according to claim 6 is it is characterised in that chip is attached through one first adhesion layer
On substrate, bracing frame is attached on substrate through one second adhesion layer, lens mount is through one the 3rd adhesion layer
It is attached on bracing frame.
9. dust-proof chip module structure according to claim 6 is it is characterised in that the first bulge-structure is located at bracing frame
Upper surface, the second bulge-structure be located at lens side bottom.
10. dust-proof chip module structure according to claim 6 is it is characterised in that lens mount is a working of plastics or a drive
Motivation structure, drive mechanism includes a voice coil motor or a MEMS.
11. dust-proof chip module structures according to claim 6 are it is characterised in that the height of the bottom surface of the second bulge-structure
Degree is less than or equal to the height of the top surface of the first bulge-structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210377924.4A CN103715209B (en) | 2012-10-08 | 2012-10-08 | Dustproof chip module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210377924.4A CN103715209B (en) | 2012-10-08 | 2012-10-08 | Dustproof chip module structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103715209A CN103715209A (en) | 2014-04-09 |
| CN103715209B true CN103715209B (en) | 2017-02-15 |
Family
ID=50408046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210377924.4A Active CN103715209B (en) | 2012-10-08 | 2012-10-08 | Dustproof chip module structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103715209B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105321973B (en) * | 2015-09-25 | 2019-01-22 | 江西芯创光电有限公司 | A kind of flip camera and preparation method thereof |
| CN112188047B (en) * | 2019-07-05 | 2021-08-03 | 华为技术有限公司 | Image sensor assembly and camera assembly |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1248130A (en) * | 1998-08-10 | 2000-03-22 | 奥林巴斯光学工业株式会社 | Camera assembly |
| CN102449996A (en) * | 2009-06-05 | 2012-05-09 | 柯尼卡美能达精密光学株式会社 | Imaging device and method of producing imaging device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5372986B2 (en) * | 2011-03-11 | 2013-12-18 | シャープ株式会社 | Camera module and manufacturing method thereof |
-
2012
- 2012-10-08 CN CN201210377924.4A patent/CN103715209B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1248130A (en) * | 1998-08-10 | 2000-03-22 | 奥林巴斯光学工业株式会社 | Camera assembly |
| CN102449996A (en) * | 2009-06-05 | 2012-05-09 | 柯尼卡美能达精密光学株式会社 | Imaging device and method of producing imaging device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103715209A (en) | 2014-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7643081B2 (en) | Digital camera module with small sized image sensor chip package | |
| KR20190113856A (en) | Photographing module and mold photosensitive assembly and manufacturing method thereof, and electronic device | |
| CN101950751B (en) | Image sensor and encapsulating method thereof | |
| CN109244067B (en) | Portable electronic device and image acquisition module and image sensing assembly thereof | |
| CN203387598U (en) | Camera module optical sensing assembly and camera module | |
| CN101281286A (en) | Solid-state image sensing device and electronic apparatus comprising same | |
| CN207382411U (en) | Camera module and the electronic equipment with camera module | |
| KR100638720B1 (en) | A camera module for minimizing defects caused by particles on an optical filter | |
| TW201410008A (en) | Image sensor module and camera module | |
| CN103715209B (en) | Dustproof chip module structure | |
| TWI500119B (en) | Image sensor device and the encapsulant module thereof | |
| CN1873992A (en) | Package of image sensor, and packaging procedure | |
| CN104347644B (en) | Visual detector and correlation technique with lens subassembly | |
| CN107544195A (en) | Focus camera module and its focus control and focus adjustment method | |
| WO2012093426A1 (en) | Semiconductor module | |
| JP2017139258A (en) | Imaging device package and imaging device | |
| CN116980736A (en) | Optical lens, assembly process method thereof, camera module and electronic equipment | |
| US8872296B2 (en) | Chip module structure for particles protection | |
| CN103579258B (en) | Embedded substrate modular structure | |
| CN100550984C (en) | Image sensing element and preparation method thereof | |
| CN203423183U (en) | Electronic device, and lens assembly for same | |
| CN207382410U (en) | Camera module and the electronic equipment with camera module | |
| CN103716513A (en) | Module structure of support frame on chip | |
| CN211184084U (en) | Filter assembly, camera module and electronic equipment | |
| TWI485457B (en) | Holder on chip module structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HONGXIANG OPTOELECTRONICS CO., LTD. Effective date: 20141011 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20141011 Address after: Taipei City, Taiwan, China Applicant after: Lite-On Technology Corporation Address before: Taoyuan County, Taiwan, China Zhongshan North Road section 159, Yangmei Applicant before: Hong Xiang Photoelectric Co., Ltd. |
|
| C14 | Grant of patent or utility model | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| GR01 | Patent grant | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170119 Address after: No. 25 West Road, Science City, Guangzhou high tech Industrial Development Zone, Guangdong, China Applicant after: Lite-On Electronic (Guangzhou) Co., Ltd. Applicant after: Guangbao Sci-Tech Co., Ltd. Address before: Taipei City, Taiwan, China Applicant before: Guangbao Sci-Tech Co., Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20181105 Address after: No. 25 West Road, Science City, Guangzhou high tech Industrial Development Zone, Guangdong, China Patentee after: Guangzhou Lijing Creative Technology Limited Address before: 510730 Guangdong Guangzhou hi tech Industrial Development Zone, 25 West Road, science city. Co-patentee before: Lite-On Technology Corporation Patentee before: Lite-On Electronic (Guangzhou) Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211123 Address after: 510525 No.2 Ruitai Road, Huangpu District, Guangzhou City, Guangdong Province Patentee after: Guangzhou Development Zone Lijing Technology Co., Ltd Address before: 510663 No. 25 West spectral Road, Guangzhou hi tech Industrial Development Zone, Guangdong Patentee before: LUXVISIONS INNOVATION Ltd. |
|
| TR01 | Transfer of patent right |