CN103713209A - Substrate detection apparatus and substrate detection method - Google Patents
Substrate detection apparatus and substrate detection method Download PDFInfo
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- CN103713209A CN103713209A CN201310438974.3A CN201310438974A CN103713209A CN 103713209 A CN103713209 A CN 103713209A CN 201310438974 A CN201310438974 A CN 201310438974A CN 103713209 A CN103713209 A CN 103713209A
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- 239000000758 substrate Substances 0.000 title claims abstract description 120
- 238000001514 detection method Methods 0.000 title abstract description 11
- 239000000523 sample Substances 0.000 claims abstract description 116
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000007689 inspection Methods 0.000 claims description 129
- 238000003860 storage Methods 0.000 claims description 23
- 230000007423 decrease Effects 0.000 claims description 6
- 230000000630 rising effect Effects 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 230000033228 biological regulation Effects 0.000 claims description 2
- 238000004088 simulation Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 description 16
- 230000009471 action Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229920001342 Bakelite® Polymers 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 239000004637 bakelite Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000010801 machine learning Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The invention provides a substrate detection device capable of adjusting the press-in amounts of a plurality of detection probes of a detection head in an adequate value or range. The substrate detection device (10) can be used to measure the electrical characteristic of the substrate (1), and can be used to detect whether the substrate is good, and is provided with at least one detection head (20U or (20D)), a moving mechanism (50), a simulation operation part (15), and a control unit (70). The simulation operation part (15) can be used to adjust the operation in a simulated manner to adjust the movement amount of the detection head based on a movement mechanism (50). The control unit can be used to control the movement amount of the movement mechanism according to the operation amount of the simulation operation part, and then the press-in amounts of a plurality of detection probes of the detection head (20U) during the contact with the contacts of the substrate can be adjusted.
Description
Technical field
The present invention relates to base board checking device and substrate inspecting method, relate in particular to base board checking device and the substrate inspecting method of electrical characteristics that inspection for example has the substrate of a plurality of wiring patterns or contact.
In addition, the invention is not restricted to printed circuit board, and the inspection of electrical wiring in the various substrates such as the battery lead plate that can be applicable to use such as flexible base, board, multi-layer wire substrate, liquid crystal display or plasma display, semiconductor-sealing-purpose base plate for packaging, membrane carrier (film carrier).In this manual, these various circuit boards are referred to as to " substrate ".
Background technology
As base board checking device in the past, there is following structure: when measuring head (also referred to as checking head) is contacted with inspected object thing, the in the situation that of loose contact, make measuring head keep in touch state and slightly move to contact direction, and make to become between measuring head and inspected object conducting state (patent documentation 1).
The technology of patent documentation 1 be take the contact position in the plane of inspected object thing is finely tuned as object, rather than according to the kind of the substrate as inspected object thing, adjust the amount of being pressed into (or stroke) of the probe (also referred to as checking probe) of measuring head, therefore, cannot set suitably according to the kind of substrate the amount of being pressed into.
Herein, about the amount of being pressed into of probe, as shown in Fig. 3 of patent documentation 1, utilize the elastic force of spring to being inserted into the plunger application of force in pipe cylindraceous (also referred to as sleeve), and determine according to the amount of movement of the plunger in pipe.In addition, the amount of movement (amount of being pressed into of probe) that also has a plunger of a plurality of probes due to the deviation of the elastic force of spring or due to the warpage/bending of substrate different situations, this is also the reason that checks that precision reduces.
In addition, in the base board checking device in the past of the application applicant's manufacturing/sale, also there is following product: there is touch panel, check that operator operates the value key (or numerical key) being presented on touch panel, and the amount of being pressed into of the probe of input test head digitally.Above-mentioned base board checking device is in the past before the inspection of volume production substrate, in the adjusting stage of the amount of being pressed into, till making measuring head move to the position of the amount of being pressed into of numerical value input, visual or observe detected electrical characteristics on one side, be confirmed whether to become the suitable amount of being pressed on one side, or use in the lump these means on one side, Yi Bian confirm, repeatedly repeat the numerical value input of the amount of being pressed into and adjust to become the optimum state that is pressed into the movement of measuring head.
But, in the kind of the substrate of inspected object thing, not only there is the difference of the materials such as flexible base, board, bakelite (bakelite) substrate, material/the thickness of the difference of thickness, wiring pattern or contact etc. is also varied, in addition, also varied with the measuring head of substrate contacts itself, and there is one side substrate and double-sided substrate, therefore, be difficult to adjust each the suitable amount of being pressed into of various substrates, and the problem that exists the adjustment of the amount of being pressed into before volume production inspection to take a long time.
Especially, the in the situation that of double-sided substrate, must in the variation of countershaft at any time, for example, to an interarea (surface) amount of being pressed into of side, for example, adjust with the balance of the amount of being pressed into of another interarea (back side) side, therefore, for example, even if skilled inspection operator also will spend the long time (5～6 hours) in the adjustment of the amount of being pressed into.
Herein, must be in the variation of time shaft in the situation that of double-sided substrate the reason adjusted of the balance of the amount of being pressed into of effects on surface side and rear side be because: the size of the measuring head of face side is less than the measuring head of rear side mostly conventionally, when checking, be applied to the pressure that the surface of substrate produces with probe (inspection probe) on the back side different, if or substrate generation warpage or bending, between a plurality of probes, aspect contact, (result is aspect the amount of being pressed into) changes.In addition, because measuring head itself possesses a plurality of probes, there is small difference in the overhang of each probe, elastic property, rather than whole homogeneous, therefore, existence cannot be carried out according to design, if do not adjust practically the problem that just cannot adjust optimum value.
Patent documentation 1: Japanese kokai publication hei 5-322928 communique
Summary of the invention
Therefore, fundamental purpose of the present invention is to provide a kind of and can easily and promptly will checks that an amount of being pressed into of a plurality of inspection probes that comprise is adjusted into the base board checking device of suitable value or scope.
Another object of the present invention is to provide a kind of can shorten time for the amount of being pressed into that checks probe being adjusted into suitable value or scope, and can improve the base board checking device of operating efficiency.
The base board checking device of the first invention comprises the electrical characteristics of the substrate of contact for a plurality of inspections for measuring by forming a plurality of wiring patterns or contact, check that whether this substrate is good, and possess at least one inspection head, travel mechanism, simulated operation portion and control module.
Check that head comprises a plurality of inspection probes.Travel mechanism is by least making to check that head for example, moves from a vertical direction of an interarea with substrate (surface), makes a plurality of inspection probes contact with the inspection contact conducting of the regulation of this substrate.Simulated operation portion, by carrying out in analog adjustment operation, regulates the amount of movement of the inspection head based on travel mechanism.Control module is according to the operational ton of simulated operation portion, controls the amount of movement of travel mechanism, the amount of being pressed into when adjusting a plurality of inspection probes that check head and contacting with the inspection contact of substrate.
According to the base board checking device of the first invention, in the situation that adopted substrate is one side substrate, can easily and promptly the amount of being pressed into that checks a plurality of inspection probes that head comprises be adjusted into suitable value or scope.In addition, can shorten for adjusting the time of the amount of being pressed into, can improve operating efficiency.
The base board checking device of the second invention is in the first invention, and simulated operation portion is driver plate (dial) operating portion, also possesses input and represents that the amount of being pressed into is the operating switch of suitable state, and control module comprises storage unit.
Control module also comprises storage control part, and this storage control part is according to the operation of operating switch, and the relevant data of the amount of being pressed into that the operational ton to becoming the driver plate operating portion under the state of the suitable amount of being pressed into is corresponding are stored in storage unit.
Accordingly, by operation simulation operating portion and operating switch are combined, the more easily adjustment of the amount of being pressed into.
The base board checking device of the 3rd invention is in the second invention, also possess mode switch element, this mode switch element can switch to the arbitrary pattern in the checking mode of adjusting the adjusting pattern of the amount of being pressed into and check substrate under the state that makes a plurality of inspection probes and substrate contacts to become the mode of the amount of being pressed into of adjusting in advance.
When utilizing mode switch element to select adjustment modes, storage control part is stored in the data relevant to the amount of being pressed in storage unit.When utilizing mode switch element to select checking mode, control module is controlled the amount of movement of travel mechanism, and automatically adjustment checks the amount of being pressed into when a plurality of inspection probes of head contact with the inspection contact of substrate, checks that whether this substrate is good.
Accordingly, the suitable amount of being pressed into based on having adjusted under adjustment modes, when checking mode, the amount of being pressed in the time of can automatically adjusting a plurality of inspection probes and contact with the inspection contact of substrate correctly checks that whether this substrate is good.
The 4th invention is in the first invention or the 3rd invention, and the substrate that is applied to base board checking device is on its surface and this two sides, the back side, to form a plurality of wiring patterns or contact, comprise the double-sided substrate of contact for a plurality of inspections.In addition, about base board checking device, form as follows and check head, travel mechanism and control module.
That is, check that head comprises: the first inspection head that comprises a plurality of inspection probes that contact with contact conducting with surperficial a plurality of inspections of substrate; And comprise second of a plurality of inspection probes of contacting with contact conducting with a plurality of inspections at the back side of substrate and check head.Travel mechanism comprises: make the first inspection head from the upper position of substrate declines or position from declining rises the first travel mechanism; And make the second inspection head from the second travel mechanism of lower position rising or the decline of the position from rising of substrate.The operation of control module based on simulated operation portion, the amount of being pressed into when adjusting the first a plurality of inspection probes that check head and contact with contact with surperficial a plurality of inspections of substrate, and the be pressed into amount of a plurality of inspection probes of adjusting the second inspection while contacting with contact with a plurality of inspections at the back side of substrate.
Accordingly, in the situation that adopted substrate is double-sided substrate, can be easily and the amount of being pressed into of a plurality of inspection probes that promptly the inspection head of each face comprised be adjusted into suitable value or scope.In addition, can shorten significantly for adjusting the time of the amount of being pressed into, can further improve operating efficiency.
The 5th invention is in the 4th invention, and the substrate that is applied to base board checking device is on its surface and this two sides, the back side, to form a plurality of wiring patterns or contact, comprise the double-sided substrate of contact for a plurality of inspections.Base board checking device also possesses operating switch, and simulated operation portion and control module are constructed as follows.
That is, simulated operation portion comprises: adjustment first checks the first driver plate operating portion of the amount of being pressed into when a plurality of inspection probes of head contact with contact with the surperficial inspection of substrate; And adjustment second checks the second driver plate operating portion of the amount of being pressed into when a plurality of inspection probes of head contact with contact with the inspection at the back side of substrate.
Control module comprises storage unit, according to first operational ton of driver plate operating portion and the operation of operating switch, by to become the data that first under the state of the suitable amount of being pressed into check that the amount of being pressed into of head is relevant and be stored in storage unit, and according to second operational ton of driver plate operating portion and the operation of operating switch, by become the data that second under the state of the suitable amount of being pressed into check that the amount of being pressed into of head is relevant and be stored in storage unit.
Accordingly, in the situation that adopted substrate is double-sided substrate, can easily and more promptly the amount of being pressed into of the inspection of each face included a plurality of inspection probes be adjusted into suitable value or scope.In addition, can shorten significantly for adjusting the time of the amount of being pressed into, can further improve operating efficiency.
According to the present invention, can obtain can be easily and promptly the amount of being pressed into that checks an included a plurality of inspection probe is adjusted into the base board checking device of suitable value or scope.
In addition, can shorten for the amount of being pressed into that checks probe being adjusted into the time of suitable value or scope, can also obtain the effect that can improve operating efficiency.
Accompanying drawing explanation
Fig. 1 is the front view of the base board checking device of an embodiment of the invention.
Fig. 2 is the side view of inside of the base board checking device of an embodiment of the invention.
Fig. 3 is the stereographic map of inside of the base board checking device of an embodiment of the invention.
Fig. 4 is the block diagram of the base board checking device of an embodiment of the invention.
Fig. 5 means for the time variation of action and the figure of the relation of the amount of being pressed into of the base board checking device of an embodiment of the invention are described.
Fig. 6 illustrates to diagrammatic the figure of the state that checks probe accordingly with the time variation of Fig. 5 and the relation of the amount of being pressed into.
Fig. 7 illustrates on during the increase of the amount of being pressed into and minimizing two, and the time of Fig. 5 changes the figure with the relation of the amount of being pressed into.
Fig. 8 is for the process flow diagram of action of the base board checking device of an embodiment of the invention is described.
(description of reference numerals)
1: substrate; 10: base board checking device; 11: framework; 12: frame part; 13: window; 14: touch panel; 15: simulated operation portion (driver plate operating portion); 16: operating switch; 20U: top checks head (checking head); 20D: bottom checks head (checking head); 21u, 21d: check probe; 30: the first travel mechanisms (travel mechanism of X-direction); 40: the second travel mechanisms (travel mechanism of Y direction); 50: San travel mechanism (travel mechanism of Z-direction); 60: substrate carrying mechanism; 70: control circuit (control module); 71:CPU; 72: program storage part; 73:RAM; 74: metering circuit; 75: interface; 76: variohm; 77,79:A/D change-over circuit; 78: probe is selected circuit.
Embodiment
To describing for implementing optimal way of the present invention.
Fig. 1 is the front view of the base board checking device of an embodiment of the invention.In Fig. 1, base board checking device 10 comprises the framework 11 of rectangle.The four sides of the latter half of framework 11 is covered by panel, and the left and right of its first half consists of frame part 12, accordingly, in its front upper, is formed for taking out the window 13 of putting into substrate 1.
On the top of a frame part 12, touch panel 14 is installed, and is installed below the 15(of simulated operation portion, also referred to as driver plate operating portion 15) and operating switch 16.Touch panel 14 is for inputting the use state information used of setting or adjusting base board checking device 10, or for showing the result of inspection.In addition, touch panel 14 is for switching the demonstration of adjusting pattern and checking mode figure used (icon), various input informations or the demonstrations such as selection to them.
Simulated operation portion 15 comprises the driver plate (knob-operated portion) of for example rotatable operation.In near the frame part 12 periphery of simulated operation portion 15, be printed with scale.Above-mentioned simulated operation portion 15 is for regulating by rotating or rotate to desired scale position (or angle) amount of being pressed into.
In addition, as another example of simulated operation portion 15, if also can use the hand of decontroling operation to reset to the such roller driver plate in reference position (jog dial).As another example, also can adopt following form: the figure of driver plate or roller driver plate is presented on the picture of touch panel 14, so that the mode that described driver plate figure rotates on touch panel 14 operates, input in analog accordingly the adjustment of the amount of being pressed into.
In addition, another example as operating switch 16, also can adopt following form: the figure of operating switch is presented on the picture of touch panel 14, on touch panel 14, the figure of described operating switch is carried out to pressing operation, indication input has become the suitable amount of being pressed into accordingly.
In addition, in the example of Fig. 1, the situation that one group of simulated operation portion 15 and operating switch 16 is set and operates by switching is shown, but upside described later also can be set and check that a 20U and downside inspection are below 20D(, both are all referred to as " checking head ") these two groups, and individually operate.
Fig. 2 is the side view of the inside of the state after base board checking device side panel is pulled down.Fig. 3 is the stereographic map of the inside of base board checking device.
In Fig. 2 and Fig. 3, in the inside of the framework 11 of base board checking device 10, hold upside and check that a 20U and downside check a 20D, the first travel mechanism 30, the second travel mechanism 40, San travel mechanism 50 and substrate carrying mechanism 60.
The first travel mechanism 30 will check a 20U and check that a 20D moves and locates to X-direction (being Width from top view).The second travel mechanism 40 will check a 20U and check that a 20D moves and locates to Y direction (depth direction).San travel mechanism 50 be included in than on the surface level of conveying substrate 1 position closer to the top by check a 20U to Z-direction move and the travel mechanism 51 of locating and on than the surface level of conveying substrate 1 position more on the lower by the travel mechanism 52 that checks that a 20D moves and locates to Z-direction.
More specifically, check that a 20U is arranged in a plurality of inspection probe 21u rectangular, and make these check that probe 21u supports down and integratedly.Check that a 20D is arranged in a plurality of inspection probe 21d rectangular, and make these check that probe 21d supports upward and integratedly.
As described later shown in Fig. 6, check a plurality of inspection probe 21u of a 20U and check that a plurality of inspection probe 21d of a 20D utilize the elastic force of spring 213 to exert pressure to the plunger 212 being inserted in socket 211 cylindraceous, and adjust by the movement downward or upward of socket 211 amount of movement (stroke) that keeps freely plunger 212.
With reference to Fig. 3, the first travel mechanism 30 comprises two guiding supports 31,32, from top view, be horizontal (X-direction) and flatly by the left and right inwall fixed bearing in framework 11.In the first travel mechanism 30, the depth direction head portion of two guiding supports 41,42 that the second travel mechanism 40 is included is supported to the mode of sliding freely along directions X.
In addition, although omit in order to simplify in diagram, but be also provided with the drive division of X-direction, the drive division of above-mentioned X-direction moves and is positioned at the position of appointment for the second travel mechanism 40 that makes to be bearing in sliding freely in the first travel mechanism 30 to X-direction.
In addition, on the guiding support 41 of the second travel mechanism 40, travel mechanism 51 is supported to the mode of sliding freely in Y direction.On guiding support 42, check that Tou Yong travel mechanism 52 is supported to the mode of sliding freely in Y direction.That is, Yi Ge travel mechanism 51, under the state of directed support 41 supportings, utilizes drive division 43u to move in Y direction.In addition, another travel mechanism 52, under the state of directed support 42 supportings, utilizes drive division 43d to move in Y direction.These drive divisions 43u, 43d are used for example stepper motor.
The lower surface of Yi Ge travel mechanism 51, checks that a 20U is supported to lifting mode freely in Z-direction.Upper surface in another travel mechanism 52, checks that a 20D is supported to lifting mode freely in Z-direction.In addition, although omitted diagram, the inside of Dan travel mechanism 51, travel mechanism 52 is built-in with the drive division for making to check a 20U accordingly, checking the Z-direction that a 20D moves up and down.
Fig. 4 is the block diagram of the base board checking device of an embodiment of the invention.In Fig. 4, in base board checking device 10, comprise the control circuit (control module) 70 for carrying out various controls.The adjustment control of the amount of being pressed into that control circuit 70 carries out mobile control, the inspection 20U under adjustment modes of each travel mechanism 30,40,50 and substrate carrying mechanism 60 and/or checks a 20D is, the measurement of the conducting state of the substrate under checking mode and the whether good controls such as judgement.
Particularly, control circuit 70 comprises CPU71.On CPU71, via bus, be connected with program storage part 72, RAM73, metering circuit and interface 75.The various programs of CPU71 based on being stored in program storage part 72, in order to reach above-mentioned various controls, and carry out the processing of the process flow diagram shown in Fig. 8 described later.
RAM73 is read-write storage medium (or can be also hard disk etc.), and storage keeps the inspection 20U shown in Fig. 5 described later and/or checks the track data of the suitable amount of being pressed into changing by the time of a 20D.
In addition, the detection output separately of a plurality of inspection probe 21d that a plurality of inspection probe 21u that an inspection 20U is included and an inspection 20D are included selects circuit 78 to be selected successively with the constant cycle by probe, by A/D change-over circuit 77, carry out successively A/D conversion, and offer CPU71 via interface 75.
Fig. 5 illustrates for the time variation of adjustment action and the figure of the relation of the amount of being pressed into of the amount of being pressed into of base board checking device are described.In this Fig. 5, the passing of the amount of being pressed into that is configured in the inspection probe of upside with respect to substrate is illustrated in to the positive region of Z axis, the passing of the amount of being pressed into that is configured in the inspection probe of downside with respect to substrate is illustrated in to the negative region of Z axis.
In Fig. 5, each about the inspection probe 21u under the adjustment modes of the amount of being pressed into inspection probe 21d, shows the relation that the time changes the amount of being pressed into of (transverse axis) and Z-direction.
Especially, the first half of Z axis shows the state that the amount of being pressed into that operation by driver plate operating portion 15 is gently increased makes to check probe 21u increases the input of (becoming large downwards).The latter half of Z axis shows the state that the amount of being pressed into that operation by driver plate operating portion 15 is gently increased makes to check probe 21d increases the input of (upwards becoming large).
Fig. 6 changes with the time of Fig. 5 the figure that the state that checks probe is shown to diagrammatic accordingly with the relation of the amount of being pressed into.Below, with reference to Fig. 5 and Fig. 6, under adjustment modes, the summary of inputting and adjust the situation of the amount of being pressed into that checks the amount of being pressed into of probe 21u and check probe 21d describes.
Operator's operating touch panel 14 is selected adjustment modes, and inspection probe 21u or inspection probe 21d which side selection will adjust.
First, in the situation that adjust the amount of being pressed into (or marking and drawing the amount of being pressed into that input increases down) that checks probe 21u, operator makes driver plate operating portion 15 only rotate the angle of least unit, forms a plurality of inspection probe 21u surperficial state (t1) of contact substrate 1 lightly that makes to check a 20U.Under this state, the amount of being pressed into is zero, checks that probe 21u is initial contact condition.
Operator is the contact condition of visual a plurality of inspection probe 21u on one side, the surperficial state of the substrate 1 while being plunger 212 variation that embeds the amount of sockets 211, plunger 212 contact substrate 1, or observe the measuring state of the electrical characteristics of a plurality of inspection probe 21u, Yi Bian driver plate operating portion 15 is gently rotated to the amount of being pressed into is gently increased to the positive dirction (right-hand) increasing.Now, according to the timing of suitable increase, the i.e. order of t2, t3, t4 constantly, pressing operation switch 16 is indicated, to store the amount of being pressed into of each time point.Accordingly, the downward amount of being pressed into of a plurality of inspection probe 21u of an inspection 20U can be transfused to successively and store.
Reach the moment t5 of the suitable amount of being pressed into (or maximal value of the suitable amount of being pressed into), when pressing operation switch 16 and while having stored the amount of being pressed at that time, stopping the rotating operation (increasing indication) of driver plate operating portion 15.Under this state, the state that plunger 212 most preferably contacts in the checkpoint with substrate 1, there is elastic deformation in spring 213, and the power of pressing checkpoint of the elastic force based on spring 213 is preferred state.Like this, make the manual operation that track data (being also referred to as outline line) in situation that the amount of being pressed into gently increases can be by driver plate operating portion 15 and marked and drawed input.
In addition, in the situation that the amount of being pressed into surpasses suitable scope (higher limit) and becomes large, even if be configured to driver plate operating portion 15, be manipulated into further increase, also utilize control circuit 70 restrictions to check the movement of a 20U.
Operator carried out the plotting input of the track data of the suitable amount of being pressed into (training, teaching) after, make driver plate operating portion 15 to backwards rotation, the operation of the plotting input of exercising the state that the amount of being pressed into gently reduces of going forward side by side.Due to the above-mentioned amount of being pressed into is reduced, make to check that a 20U turns back to the operation of initial contact condition and processing is and increase contrary operation and processing, so description thereof is omitted.
On the other hand, Yi Bian the amount of being pressed into that checks probe 21d is increased, Yi Bian mark and draw in the situation of input, that adjusts the amount of being pressed into checks a 20D to liking, and the amount of being pressed into upwards increases.Because driver plate operating portion 15 and the operation of operating switch 16 are in the case substantially identical with the situation that checks a 20U with the processing of control circuit 70, therefore the description thereof will be omitted.
In addition, in the example of Fig. 5 and Fig. 6, illustrated in operation at driver plate operating portion 15 scope from minimum scale to maximum scale, to the situation that checks that the amount of being pressed into of any one party of probe 21u or inspection probe 21d is adjusted, but can be also following operation: the cue mark of driver plate operating portion 15 is centered by the middle position of top, using therefrom mind-set is right-hand, rotate as the operation that checks probe 21u, using the rotation to left as the operation that checks probe 21d.
In the above description, situation inspection probe 21u to spring 213 is illustrated, but check that probe 21u is not limited to such probe, so long as the probe being formed by the parts that form the elongated shape with pliability and electric conductivity just can similarly be adjusted.
Fig. 7 shows the time variation of Fig. 5 and the figure of the relation of the amount of being pressed on during the increase of the amount of being pressed into and minimizing two.Especially, show during the increase of the amount of being pressed into and minimizing two change curve of the amount of being pressed into changing along with the time.
In addition, although the change curve during each of the increase that the amount of being pressed into has been shown in diagram and minimizing is substantially identical waveform, according to the characteristic as checking the substrate 1 of object, can be also during increasing with reduce during the waveform that differs greatly.Its reason is: in the situation that making to check probe 21u contact/away from substrate 1, be subject to the characteristic of each substrate 1, check the characteristic of probe 21u, the impact of material is large, if under preferred state, do not make its contact/away from, can not produce the good status of electrically connecting that checks probe 21u and substrate 1.Therefore, during increase with reduce during during itself without be identical during, also can have different during.
In addition, in the present embodiment, under adjustment modes, be to make to check a 20U and check that a 20D approaches the operation of substrate 1 seriatim by rotation or revolving dial operating portion 15 substantially.
On the other hand, under pattern substrate 1 being checked at the track data with reference to marking and drawing the amount of being pressed into of input, can make to check a 20U and check a 20D alternately or side by side increases or reduces, to can obtain optimized movement.
Fig. 8 is for the process flow diagram of action of the base board checking device of an embodiment of the invention is described.Below, referring to figs. 1 through Fig. 8, along the flow process of Fig. 8, the concrete action of base board checking device is described.In addition, preferably this action, in the situation that base board checking device is implemented the adjustment modes of the previous stage of checking mode, is performed when inspection head is arranged on base board checking device, to make to check that head preferably contacts with substrate.
(upside checks the adjustment modes of the amount of being pressed into of probe 21u)
The model selection button that operator's operating touch panel 14 is shown and the icon of start button, select to check the adjustment modes of the amount of being pressed into of probe 21u.Correspondingly, the program of CPU71 based on being stored in program storage part 72 carried out following processing.
That is,, in step (mark with " S " in the following description and Fig. 8 simply represents) 1, judge whether to have selected adjustment modes.If be judged as, select adjustment modes, in S2, determined whether to check the adjustment modes of a 20U.If check the adjustment modes of a 20U, judge in S3 whether the operation of driver plate operating portion 15 has exceeded initial position (or zero point), and wait for that driver plate operating portion 15 is operated.If exceeded initial position, operated, made to check that a 20U declines, until the surperficial position of plunger 212 contact substrates 1 of a plurality of inspection probe 21u.Now that the amount of being pressed into is zero state.
In S5, judge whether driver plate operating portion 15 is operated to increasing direction.In the case, by operator, to the direction operation driver plate operating portion 15 gently increasing, therefore this is judged, and enter S6.In S6, make to check a 20U decline small quantity, make the amount of being pressed into of a plurality of inspection probe 21u only increase small quantity.
In S7, utilize a plurality of inspection probe 21u to measure successively electrical characteristics.This measurement is treated to: inspection probe selects circuit 78 to select successively a plurality of inspection probe 21u, and supplies with electric current.Now, utilize 77 pairs of A/D change-over circuits to carry out successively A/D conversion by the detected electric signal of a plurality of inspection probe 21u (analogue value), and offer CPU71 via interface 75.Accordingly, to by checking that electrical characteristics data that the detected amount of being pressed into of probe 21u is relevant are measured and being temporarily stored.
In addition, owing to also exist checking that whole inspection probe 21u of a 20U is not situation about contacting with the contact of the wiring pattern of substrate 1 or contact etc. simultaneously, therefore, also can utilize statistics gimmick for example, to existing the output of the inspection probe of effective detected value to carry out computing (calculating mean value) and as measurement result.
In S8, whether decision operation switch 16 is pressed.If operating switch 16 is not pressed, return to S5, and repeat S5～S8 processing until operating switch 16 be pressed, standby before operating switch 16 is pressed.
If be judged as operating switch 16, be pressed, in S9, for example, by the value storage (preservation) of the amount of being pressed into that should mark and draw input of a certain timing (in the example of Fig. 5, arbitrary timing of t1～t5) in RAM73.
In addition, in S10, whether the value of the amount of being pressed into that judgement is stored has reached the higher limit that should limit the excessive movement (decline) that checks a 20U.If reach higher limit, do not return to S5, and repeat the action of S5～S10.
Like this, the processing during the increase of the amount of being pressed into of execution inspection probe 21u.
In the case, if carry out rapidly the operation (rotation) of driver plate operating portion 15, gathering way soon of the amount of being pressed into, gathers way if gently carry out slow, thereby, can adjust according to the operation of driver plate operating portion 15 slope of a curve of increase.
On the other hand, in S10, if be judged as, reach higher limit, the decline of a restriction inspection 20U in S11.
Thus, with the higher limit of the scope of the amount of being pressed into suitable (in other words, press the point of arrival or inspection machine learning value) above mode of being failure to actuate applies restriction, accordingly, can prevent the excessive descent by the excessive caused inspection 20U of rotation of driver plate operating portion 15.
If after S11 or in above-mentioned S5, the operation that is judged as driver plate operating portion 15 is not to increase operation, enters S12.In S12, judge whether the operation of driver plate operating portion 15 reduces.If be judged as YES minimizing,, in S13, make to check a 20U rising small quantity, make the amount of being pressed into of a plurality of inspection probe 21u only reduce small quantity.
Then, in S14, carry out the measurement of the electrical characteristics of a plurality of inspection probe 21u and process, but because this processing is identical with S7, thereby description thereof is omitted.In S14, whether decision operation switch 16 is pressed.In the situation that not being pressed, return to S12, and repeat S12～S15 processing until operating switch 16 be pressed, standby before operating switch 16 is pressed.
If be judged as operating switch 16, be pressed,, in S16, the value of the amount of being pressed into that should mark and draw input of a certain timing (arbitrary timing of t1～t5) be stored in RAM73.
In S17, judgement checks whether a 20U turns back to the Z position of initial contact condition.If do not turn back to the position of initial contact condition, return to S12, and repeat the action of S12～S17.
Like this, to reduce the mode of the amount of being pressed into that checks probe 21U, carry out the processing of marking and drawing input.
If be judged as, check that a 20U has turned back to the position of the initial contact condition of Z axis,, in S18, make to check a 20U rising ormal weight, finish a series of adjustment modes, return to S1.
Like this, obtain during the increase of the amount of being pressed into that checks a 20U and the continuous curve of the value of storing in during reducing (, the curve that has connected the point of marking and drawing) as controlling for mobile the track data (curve data) that checks a 20U, and store in RAM73.During increasing, check can approach/contact substrate of a 20U, and during reducing, check that a 20U can be away from.In addition, during increasing and between during reducing, can carry out the inspection of substrate.
(downside checks the adjustment modes of the amount of being pressed into of probe 21d)
Under this pattern, operator operates on touch panel 14 icon of the model selection button that shows and start button etc., selects to check the adjustment modes of the amount of being pressed into of probe 21d.
Correspondingly, in above-mentioned S2, be judged as the adjustment that is not to check a 20U, in S21, be judged as YES the adjustment that checks a 20D.In addition, in S22, carry out the adjustment processing that checks a 20D.
It is in the action processed of the adjustment of the inspection 20U that illustrates in above-mentioned S3～S18 that the adjustment that checks a 20D is processed, except the mobile object of controlling with check a 20D replace the object that checks a 20U, mark and draw the input amount of being pressed into check probe 21d replace check probe 21u, moving direction rises during increasing and these of decline are put during reducing, roughly the same processing, therefore omits detailed explanation.
In addition, in the above description, narrated following situation: in the situation that substrate 1 is double-sided substrate, adjust the amount of movement that checks a 20U and check a 20D both sides, and individually adjust and mark and draw input checking probe 21u and the amount of being pressed into that checks probe 21d.But, certainly, the in the situation that of one side substrate, also can adjust an amount of movement that checks a 20U, only mark and draw the amount of being pressed into of input checking probe 21u.
In addition, if in the situation that substrate 1 is only one side to be exerted pressure and is easy to produce the flexible base, board of warpage, bending, also can alternately mark and draw the amount of being pressed into of input checking probe 21u and inspection probe 21d, to alternately exert pressure to surface and the back side.According to the present application, can provide the contact of optimum inspection head/away from state (movement) to substrate.
(checking mode based on track data)
Operator operates in the model selection button of demonstration on touch panel 14 and the icon of start button, selects the checking mode based on track data (or curve diagram data).Above-mentioned checking mode is to control to check that the amount of being pressed into of probe 21u, 21d checks pattern substrate 1, that carry out the original function of base board checking device 10.
With aforesaid operations correspondingly, in above-mentioned S2, be judged as the adjustment that is not to check a 20U, in S31, be judged as YES checking mode.In S32, based on scrutiny program, carry out the check processing of substrate 1.
Particularly, the track data of using with reference to an inspection 20U is carried out the processing of the amount of being pressed into of controlling a plurality of inspection probe 21u, and the track data of using with reference to an inspection 20D is carried out the processing of the amount of being pressed into of controlling a plurality of inspection probe 21d.Preferably, the control of the amount of being pressed into of the amount of being pressed into of a plurality of inspection probe 21u and a plurality of inspection probe 21d is processed into the upside making shown in Fig. 5 and with track data and downside, uses the time synchronized of track data, and alternately, gently changes (being referred to as synchronous operation).
On the other hand, if be judged as, not checking mode in S31, in S33, carry out other processing.After S32 or S33, finish a series of action (or returning to S1).
As described above, according to this embodiment, in the mode that does not make substrate 1 be shifted or be out of shape up and down, on one side to from checking probe 21u, the top contact substrate 1(workpiece of the plunger 212 of 21d) start to carry out Visual Confirmation till press the point of the many places of the point of arrival, alternately utilize driver plate operating portion 15 to regulate on one side and check a 20U, the amount of movement of 20D (result is for checking the amount of being pressed into of probe), and mark and draw and input and store, therefore, compare with the structure of digitally amount of movement numerical value being inputted, be easy to adjust, and can shorten significantly the time of marking and drawing input, can further increase work efficiency.
(variant embodiment)
Also can be in the following way: if to positive dirction rotating driver plate operating portion 15, make a upside inspection 20U and a downside inspection 20D synchronously approach substrate 1, if and to counter-rotation driver plate operating portion 15, make a upside inspection 20U and a downside inspection 20D synchronously to away from direction move.In addition, also can be in the following way: static at this place if hand leaves 15 of driver plate operating portions, if gently 15 gently actions of rotating driver plate operating portion, if promptly rotate action rapidly.
In addition, can be also such mode: do not adopt driver plate operating portion 15, and if press in the same manner with base board checking device in the past and press button, press automatically.
(utilizability in industry)
Base board checking device of the present invention is for the inspection of the electrical characteristics of the different various substrates of material, the forms etc. such as flexible base, board, bakelite substrate or one side substrate, double-sided substrate, and the usability in industry is high.
Claims (5)
1. a base board checking device, comprises the electrical characteristics of the substrate of contact for a plurality of inspections for measuring by forming a plurality of wiring patterns or contact, checks that whether this substrate is good, and described base board checking device possesses:
At least one that comprises a plurality of inspection probes checks head;
Travel mechanism, described travel mechanism makes described inspection head move from a vertical direction of at least one interarea with described substrate, and described a plurality of inspection probe is contacted with the inspection contact conducting of the regulation of described substrate;
Simulated operation portion, described simulated operation portion, by carrying out in analog adjustment operation, regulates the described amount of movement that checks head based on described travel mechanism; And
Control module, described control module, according to the operational ton of described simulated operation portion, is controlled the amount of movement of described travel mechanism, the amount of being pressed into when adjusting the described a plurality of inspection probes that check head and contacting with the inspection contact of described substrate.
2. base board checking device according to claim 1, wherein,
Described simulated operation portion is driver plate operating portion,
Described base board checking device also possesses the operating switch that the amount of being pressed into described in input indication is suitable state,
Described control module comprises storage unit,
Described control module also comprises storage control part, described storage control part is according to the operation of described operating switch, and the relevant data of the amount of being pressed into that the operational ton to becoming the described driver plate operating portion under the state of the suitable amount of being pressed into is corresponding are stored in described storage unit.
3. base board checking device according to claim 2, wherein,
Described base board checking device also possesses mode switch element, described mode switch element can switch to the arbitrary pattern in the checking mode that regulates the adjusting pattern of the amount of being pressed into and check described substrate under the state that makes described a plurality of inspection probes and described substrate contacts to become the mode of the amount of being pressed into having regulated in advance
When utilizing described mode switch element to select adjusting pattern, described storage control part is stored in the data relevant to the described amount of being pressed in described storage unit,
When utilizing described mode switch element to select checking mode, described control module is controlled the amount of movement of described travel mechanism, the amount of being pressed into while automatically regulating the described a plurality of inspection probes that check head to contact with the inspection contact of described substrate, checks that whether this substrate is good.
4. according to the base board checking device described in claim 1 or 3, wherein,
The substrate that utilizes described base board checking device inspection comprises a plurality of inspections of having formed a plurality of wiring patterns or contact with contact on the surface of substrate and this two sides, the back side,
Described inspection head comprises: the first inspection head that comprises a plurality of inspection probes that contact with contact conducting with surperficial a plurality of inspections of described substrate; And comprise second of a plurality of inspection probes of contacting with contact conducting with a plurality of inspections at the back side of described substrate and check head,
Described travel mechanism comprises: make described first to check the first travel mechanism that a upper position from described substrate declines or the position from declining rises; And make described second to check that head is from the second travel mechanism of lower position rising or the decline of the position from rising of described substrate,
The operation of described control module based on described simulated operation portion, the amount of being pressed into when adjusting the described first a plurality of inspection probes that check head and contact with contact with surperficial a plurality of inspections of described substrate, and the be pressed into amount of a plurality of inspection probes of adjusting described the second inspection while contacting with contact with a plurality of inspections at the back side of described substrate.
5. base board checking device according to claim 4, is characterized in that,
Described simulated operation portion comprises: the first driver plate operating portion of the amount of being pressed into when adjusting the described first a plurality of inspection probes that check head and contacting with contact with the surperficial inspection of described substrate; And the second driver plate operating portion of the amount of being pressed into when adjusting the described second a plurality of inspection probes that check head and contacting with contact with the inspection at the back side of described substrate,
Described base board checking device also possesses input indication in having become the operating switch of the state of the suitable amount of being pressed into,
Described control module comprises storage unit,
Described control module also comprises storage control part, described storage control part is according to described first operational ton of driver plate operating portion and the operation of described operating switch, by to become the data that described first under the state of the suitable amount of being pressed into check that the amount of being pressed into of head is relevant and be stored in described storage unit, and according to described second operational ton of driver plate operating portion and the operation of described operating switch, by become the data that described second under the state of the suitable amount of being pressed into check that the amount of being pressed into of head is relevant and be stored in described storage unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-218614 | 2012-09-28 | ||
| JP2012218614A JP2014071043A (en) | 2012-09-28 | 2012-09-28 | Substrate inspection device and substrate inspection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103713209A true CN103713209A (en) | 2014-04-09 |
Family
ID=50406336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310438974.3A Pending CN103713209A (en) | 2012-09-28 | 2013-09-24 | Substrate detection apparatus and substrate detection method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2014071043A (en) |
| KR (1) | KR20140042669A (en) |
| CN (1) | CN103713209A (en) |
| TW (1) | TW201418729A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105448218A (en) * | 2014-09-18 | 2016-03-30 | 三星显示有限公司 | Testing apparatus for testing display apparatus and method of testing the same |
| CN110133469A (en) * | 2019-05-31 | 2019-08-16 | 德淮半导体有限公司 | Semiconductor testing apparatus and its working method |
| CN110865293A (en) * | 2018-08-27 | 2020-03-06 | 日本麦可罗尼克斯股份有限公司 | Inspection apparatus and inspection method |
| CN112098692A (en) * | 2019-06-18 | 2020-12-18 | 旺矽科技股份有限公司 | Electronic component probe testing device |
| CN112161558A (en) * | 2020-09-29 | 2021-01-01 | 珠海博杰电子股份有限公司 | Automatic detection system for probe stroke |
| CN112198414A (en) * | 2019-07-08 | 2021-01-08 | 雅马哈精密科技株式会社 | Electrical inspection device and holding unit |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6613844B2 (en) * | 2015-11-25 | 2019-12-04 | 日本電産リード株式会社 | Inspection jig, substrate inspection apparatus, and substrate inspection method |
| US10707050B2 (en) * | 2018-07-26 | 2020-07-07 | Varian Semiconductor Equipment Associates, Inc. | System and method to detect glitches |
| KR102128175B1 (en) * | 2018-12-07 | 2020-06-30 | (주)서영 | Method of forming both sided pattern of nanostructure using nanoimprint method |
-
2012
- 2012-09-28 JP JP2012218614A patent/JP2014071043A/en active Pending
-
2013
- 2013-09-06 KR KR1020130107106A patent/KR20140042669A/en not_active Application Discontinuation
- 2013-09-24 CN CN201310438974.3A patent/CN103713209A/en active Pending
- 2013-09-25 TW TW102134533A patent/TW201418729A/en unknown
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105448218A (en) * | 2014-09-18 | 2016-03-30 | 三星显示有限公司 | Testing apparatus for testing display apparatus and method of testing the same |
| CN110865293A (en) * | 2018-08-27 | 2020-03-06 | 日本麦可罗尼克斯股份有限公司 | Inspection apparatus and inspection method |
| CN110865293B (en) * | 2018-08-27 | 2021-11-09 | 日本麦可罗尼克斯股份有限公司 | Inspection apparatus and inspection method |
| CN110133469A (en) * | 2019-05-31 | 2019-08-16 | 德淮半导体有限公司 | Semiconductor testing apparatus and its working method |
| CN112098692A (en) * | 2019-06-18 | 2020-12-18 | 旺矽科技股份有限公司 | Electronic component probe testing device |
| CN112098692B (en) * | 2019-06-18 | 2023-10-20 | 旺矽科技股份有限公司 | Electronic component needle-testing device |
| CN112198414A (en) * | 2019-07-08 | 2021-01-08 | 雅马哈精密科技株式会社 | Electrical inspection device and holding unit |
| CN112198414B (en) * | 2019-07-08 | 2024-04-26 | 雅马哈精密科技株式会社 | Electrical inspection device and holding unit |
| CN112161558A (en) * | 2020-09-29 | 2021-01-01 | 珠海博杰电子股份有限公司 | Automatic detection system for probe stroke |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201418729A (en) | 2014-05-16 |
| JP2014071043A (en) | 2014-04-21 |
| KR20140042669A (en) | 2014-04-07 |
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Application publication date: 20140409 |