CN103702516B - Printed circuit board coefficient calculation method and the system of calculating - Google Patents
Printed circuit board coefficient calculation method and the system of calculating Download PDFInfo
- Publication number
- CN103702516B CN103702516B CN201310697706.3A CN201310697706A CN103702516B CN 103702516 B CN103702516 B CN 103702516B CN 201310697706 A CN201310697706 A CN 201310697706A CN 103702516 B CN103702516 B CN 103702516B
- Authority
- CN
- China
- Prior art keywords
- coefficient
- flaggy
- harmomegathus
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention provides a kind of printed circuit board coefficient calculation method.Described printed circuit board coefficient calculation method, comprises the steps: to obtain the drilling information of printed circuit board；Each flaggy according to described drilling information searching coefficient to be calculated；Calculate the coefficient of each described flaggy；Output result of calculation is to each described flaggy corresponding.The present invention also provides for a kind of calculating system performing described printed circuit board coefficient calculation method.
Description
Technical field
The present invention relates to printed circuit board technology, in particular it relates to a kind of printed circuit board coefficient calculation method and calculating
System.
Background technology
In printed circuit board (Printed Circuit Board, PCB) makes, substrate will be through multiple high temperature or height
Pressure ring border, due to the physical characteristic of substrate, substrate can produce harmomegathus effect.Based on different manufacturing process, different substrate materials
Material, different structural textures etc., cause harmomegathus coefficient the most different.Therefore, needed to set each flaggy before producing
Coefficient, in order to final production printed circuit board out meets the requirement of client.In traditional printed circuit board coefficient calculations side
In method, one layer of printed circuit board coefficient can only be calculated every time, when printed circuit board is multilamellar, then need according to different flaggies
Calculate repeatedly, calculate process loaded down with trivial details.
Drilling is in printed circuit board commercial production, and the procedural document of one for drilling operating, is to carry for rig
For the coordinate file required for numerical control drilling in producing, instruction drill bit is holed in the mark position of program, completes printed circuit
The process of plate pore-forming.
Summary of the invention
For solving above-mentioned technical problem, the present invention provides a kind of printed circuit board coefficient calculation method.Meanwhile, the present invention is also
A kind of calculating system performing above-mentioned printed circuit board coefficient calculation method is provided.
The printed circuit board coefficient calculation method that the present invention provides, comprises the steps: to obtain the drilling of printed circuit board
Information；Each flaggy according to described drilling information searching coefficient to be calculated；Calculate the coefficient of each described flaggy；Output calculates
Result is to each described flaggy corresponding.
In a kind of preferred embodiment of the printed circuit board coefficient calculation method of present invention offer, search coefficient to be calculated
The step of each flaggy include: calculate, according to described drilling information, each flaggy that this drilling is had influence on；Judge each
The other type of the layer of described flaggy；The parameter that each described flaggy is corresponding is obtained according to the other type of layer.
In a kind of preferred embodiment of the printed circuit board coefficient calculation method of present invention offer, described drilling information bag
Include drilling layer and not and run through the number of plies.
In a kind of preferred embodiment of the printed circuit board coefficient calculation method of present invention offer, described drilling information is also
Including the parameter that the Quadratic Finite Element numerical value of described printed circuit board is corresponding with flaggy each described.
In a kind of preferred embodiment of the printed circuit board coefficient calculation method of present invention offer, each described flaggy pair
The parameter answered includes the boring harmomegathus coefficient according to the other classification of type of layer and harmomegathus penalty coefficient.
In a kind of preferred embodiment of the printed circuit board coefficient calculation method of present invention offer, each institute of described calculating
The step of the coefficient stating flaggy includes:
According to formula: Lx=Lˊx+Lˊˊx
Ly=Lˊy+Lˊˊy
Calculate minor face actual harmomegathus coefficient and the long limit actual harmomegathus coefficient of each described flaggy,
Wherein, LxFor minor face actual harmomegathus coefficient, LxFor minor face boring harmomegathus coefficient, LxSystem is compensated for minor face harmomegathus
Number, LyFor long limit actual harmomegathus coefficient, LyFor long limit boring harmomegathus coefficient, LyFor long limit harmomegathus penalty coefficient；
According to formula: Fx=X*Lx
Fy=Y*Ly
Calculate minor face film value and the long limit film value of each described flaggy,
Wherein, FxFor minor face film value, FyFor long limit film value, LxFor minor face actual harmomegathus coefficient, LyRise for long limit is actual
Contracting coefficient, X, Y are the Quadratic Finite Element numerical value of each described flaggy, represent the bond length of each described flaggy and the long length of side respectively
Degree.
The printed circuit board coefficient calculations system that the present invention provides, including: the other computing module of data obtaining module, layer, be
Number computing module and memory module, wherein,
Described data obtaining module is used for obtaining drilling information；
The other computing module of described layer calculates this drilling institute for the drilling information obtained according to described data obtaining module
Each flaggy having influence on, and parameter corresponding for each flaggy is passed to described coefficients calculation block；
Described coefficients calculation block calculates for the parameter that each flaggy according to the transmission of described layer other computing module is corresponding
The coefficient of each described flaggy, and result of calculation is passed to described memory module；
Described memory module is for receiving the result of calculation of described coefficients calculation block transmission, and result of calculation is stored
Each described flaggy corresponding.
In a kind of preferred embodiment of the printed circuit board coefficient calculations system of present invention offer, described acquisition of information mould
The drilling information that block obtains includes: drilling layer not, run through the number of plies, the Quadratic Finite Element numerical value of this printed circuit board, according to the other type of layer
The boring harmomegathus coefficient of classification and harmomegathus penalty coefficient.
In a kind of preferred embodiment of the printed circuit board coefficient calculations system of present invention offer, described layer does not calculate mould
Block is additionally operable to judge the other type of layer of each flaggy that this drilling affected.
The printed circuit board coefficient calculation method that the present invention provides, each institute drilling being had influence on according to layer other type
Stating flaggy to calculate, each described flaggy all uses identical computing formula, only need to obtain the parameter of corresponding flaggy, Ji Keji
Calculate the coefficient of this flaggy, be effectively improved coefficient calculations efficiency and accuracy rate.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, in embodiment being described below required for make
Accompanying drawing be briefly described, it should be apparent that, below describe in accompanying drawing be only some embodiments of the present invention, for
From the point of view of those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other according to these accompanying drawings
Accompanying drawing, wherein:
Fig. 1 is the schematic flow sheet of a kind of embodiment of printed circuit board coefficient calculation method that the present invention provides；
Fig. 2 is the structural representation of printed circuit board a kind of embodiment of coefficient calculations system that the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the present invention, those of ordinary skill in the art obtained under not making creative work premise all other
Embodiment, broadly falls into the scope of protection of the invention.
Refer to Fig. 1, the flow process signal of its a kind of embodiment of printed circuit board coefficient calculation method provided for the present invention
Figure.Described printed circuit board coefficient calculation method comprises the steps:
Step S1, obtains the drilling information of printed circuit board；
Specifically, before printed circuit board makes, first obtaining the drilling information of described printed circuit board, described drilling is believed
Breath includes that drilling layer not and runs through the number of plies.
Step S2, calculates, according to described drilling information, each flaggy that this drilling is had influence on；
As a rule, printed circuit board is formed by the compacting of multiple flaggies, it is therefore desirable to according to acquired drilling layer not and
Run through the drilling information such as the number of plies and calculate each flaggy that this drilling is had influence on.
Step S3, it is judged that the other type of the layer of each described flaggy；
Specifically, each the described flaggy being had influence on this drilling judges its layer of other type one by one.The other type of described layer
Can be generally divided into five kinds, respectively outer layer, solder mask, character layer, internal layer and catch point layer.
Step S4, obtains, according to the other type of layer, the parameter that each described flaggy is corresponding；
Specifically, according to the other type of layer, obtain the parameter that each described flaggy that this drilling had influence on is corresponding.Described ginseng
Number includes each described flaggy boring harmomegathus coefficient and harmomegathus penalty coefficient.Due to the physical characteristic of flaggy not phase each described
With, the minor face of each described flaggy and the harmomegathus effect on long limit also differ, and therefore, described boring harmomegathus coefficient includes that minor face bores
Hole harmomegathus coefficient and long limit boring harmomegathus coefficient, described harmomegathus penalty coefficient includes that minor face harmomegathus penalty coefficient and long limit harmomegathus are mended
Repay coefficient.
Step S5, calculates the coefficient of each described flaggy；
Specifically, the coefficient calculating each described flaggy includes calculating actual harmomegathus coefficient and the film of each described flaggy
Value, wherein, described actual harmomegathus coefficient includes minor face actual harmomegathus coefficient and long limit actual harmomegathus coefficient, and described film value includes
Minor face film value and long limit film value.
According to formula: Lx=Lˊx+Lˊˊx
Ly=Lˊy+Lˊˊy
Calculate minor face actual harmomegathus coefficient and the long limit actual harmomegathus coefficient of each described flaggy, wherein, LxReal for minor face
Border harmomegathus coefficient, LxFor minor face boring harmomegathus coefficient, LxFor minor face harmomegathus penalty coefficient, LyFor long limit actual harmomegathus coefficient, L
ˊyFor long limit boring harmomegathus coefficient, LyFor long limit harmomegathus penalty coefficient；
According to formula: Fx=X*Lx
Fy=Y*Ly
Calculate minor face film value and the long limit film value of each described flaggy, wherein, FxFor minor face film value, FyFor long limit
Film value, LxFor minor face actual harmomegathus coefficient, LyFor long limit actual harmomegathus coefficient, X, Y are the Quadratic Finite Element number of each described flaggy
Value, represents the bond length of each described flaggy and long edge lengths respectively.The Quadratic Finite Element numerical value of each described flaggy and described print
The Quadratic Finite Element numerical value of circuit board processed is equal.The Quadratic Finite Element numerical value of described printed circuit board can be by measuring described printed circuit board
Bond length and long edge lengths obtain.
Step S6, output result of calculation is to each described flaggy corresponding；
After the actual harmomegathus coefficient calculating each described flaggy and film value, result of calculation is exported accordingly
Each described flaggy.Meanwhile, the Quadratic Finite Element numerical value of each described flaggy is exported each described flaggy corresponding.
The printed circuit board coefficient calculation method that the present invention provides, each institute drilling being had influence on according to layer other type
Stating flaggy to calculate, each described flaggy all uses identical computing formula, only need to obtain the parameter of corresponding flaggy, Ji Keji
Calculate the coefficient of this flaggy, be effectively improved coefficient calculations efficiency and accuracy rate.
Based on above-mentioned printed circuit board coefficient calculation method, the present invention also provides for a kind of printed circuit board coefficient calculations system
Uniting, it can perform above-mentioned printed circuit board coefficient calculation method, refer to Fig. 2, and it is the printed circuit board that the present invention provides
The structural representation of a kind of embodiment of coefficient calculations system.Described printed circuit board coefficient calculations system 200 includes: acquisition of information
The other computing module 220 of module 210, layer, coefficients calculation block 230 and memory module 240, wherein,
Described data obtaining module 210 is used for obtaining drilling information；
The other computing module of described layer 220 calculates this for the drilling information obtained according to described data obtaining module 210
Each flaggy that drilling is had influence on, and parameter corresponding for each flaggy is passed to described coefficients calculation block 230；
Described coefficients calculation block 230 is used for the ginseng that each flaggy according to the transmission of described layer other computing module 220 is corresponding
Number calculates the coefficient of each described flaggy, and result of calculation passes to described memory module 240；
Described memory module 240 transmits the result of calculation of 230 for receiving described coefficients calculation block, and by result of calculation
Storage is to each described flaggy corresponding.
In a particular embodiment, the drilling information acquired in described data obtaining module 210 includes: user operation item number,
Printed circuit board name, drilling layer not, run through the number of plies, the Quadratic Finite Element numerical value of this printed circuit board, according to the other classification of type of layer
Boring harmomegathus coefficient and harmomegathus penalty coefficient.
In a particular embodiment, the other computing module 220 of described layer can be also used for judging each that this drilling had influence on
The other type of the layer of described flaggy.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this
Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology neck
Territory, is the most in like manner included in the scope of patent protection of the present invention.
Claims (8)
1. a printed circuit board coefficient calculation method, it is characterised in that comprise the steps:
Obtain the drilling information of printed circuit board；
Each flaggy according to described drilling information searching coefficient to be calculated；
Calculate the coefficient of each described flaggy, according to formula: Lx=L 'x+L″x
Ly=L 'y+L″y
Calculate minor face actual harmomegathus coefficient and the long limit actual harmomegathus coefficient of each described flaggy,
Wherein, LxFor minor face actual harmomegathus coefficient, L 'xFor minor face boring harmomegathus coefficient, L "xFor minor face harmomegathus penalty coefficient, LyFor
Long limit actual harmomegathus coefficient, L 'yFor long limit boring harmomegathus coefficient, L "yFor long limit harmomegathus penalty coefficient；
According to formula: Fx=X*Lx
Fy=Y*Ly
Calculate minor face film value and the long limit film value of each described flaggy,
Wherein, FxFor minor face film value, FyFor long limit film value, LxFor minor face actual harmomegathus coefficient, LyFor long limit actual harmomegathus system
Number, X, Y are the Quadratic Finite Element numerical value of each described flaggy, represent the bond length of each described flaggy and long edge lengths respectively；
Output result of calculation is to each described flaggy corresponding.
Printed circuit board coefficient calculation method the most according to claim 1, it is characterised in that look into according to described drilling information
The step looking for each flaggy of coefficient to be calculated includes:
Each flaggy that this drilling is had influence on is calculated according to described drilling information；
Judge the other type of layer of each described flaggy；
The parameter that each described flaggy is corresponding is obtained according to the other type of layer.
Printed circuit board coefficient calculation method the most according to claim 2, it is characterised in that described drilling information includes boring
Belt not and runs through the number of plies.
Printed circuit board coefficient calculation method the most according to claim 3, it is characterised in that described drilling information also includes
The parameter that the Quadratic Finite Element numerical value of described printed circuit board is corresponding with flaggy each described.
Printed circuit board coefficient calculation method the most according to claim 4, it is characterised in that each described flaggy is corresponding
Parameter includes the boring harmomegathus coefficient according to the other classification of type of layer and harmomegathus penalty coefficient.
6. a printed circuit board coefficient calculations system, it is characterised in that including: the other computing module of data obtaining module, layer, be
Number computing module and memory module, wherein,
Described data obtaining module is used for obtaining drilling information；
The other computing module of described layer calculates this drilling for the drilling information obtained according to described data obtaining module to be affected
Each flaggy arrived, and parameter corresponding for each flaggy is passed to described coefficients calculation block；
Described coefficients calculation block calculates each for the parameter that each flaggy according to the transmission of described layer other computing module is corresponding
The coefficient of described flaggy, and result of calculation is passed to described memory module, the step of the coefficient calculating described flaggy includes:
According to formula: Lx=L 'x+L″x
Ly=L 'y+L″y
Calculate minor face actual harmomegathus coefficient and the long limit actual harmomegathus coefficient of each described flaggy,
Wherein, LxFor minor face actual harmomegathus coefficient, L 'xFor minor face boring harmomegathus coefficient, L "xFor minor face harmomegathus penalty coefficient, LyFor
Long limit actual harmomegathus coefficient, L 'yFor long limit boring harmomegathus coefficient, L "yFor long limit harmomegathus penalty coefficient；
According to formula: Fx=X*Lx
Fy=Y*Ly
Calculate minor face film value and the long limit film value of each described flaggy,
Wherein, FxFor minor face film value, FyFor long limit film value, LxFor minor face actual harmomegathus coefficient, LyFor long limit actual harmomegathus system
Number, X, Y are the Quadratic Finite Element numerical value of each described flaggy, represent the bond length of each described flaggy and long edge lengths respectively；Institute
State memory module for receiving the result of calculation of described coefficients calculation block transmission, and result of calculation is stored corresponding each
Described flaggy.
Printed circuit board coefficient calculations system the most according to claim 6, it is characterised in that described data obtaining module obtains
The drilling information taken includes: drilling layer not, run through the number of plies, the Quadratic Finite Element numerical value of this printed circuit board, according to the other classification of type of layer
Boring harmomegathus coefficient and harmomegathus penalty coefficient.
Printed circuit board coefficient calculations system the most according to claim 6, it is characterised in that the other computing module of described layer is also
For judging the other type of layer of each flaggy that this drilling affected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310697706.3A CN103702516B (en) | 2013-12-17 | 2013-12-17 | Printed circuit board coefficient calculation method and the system of calculating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310697706.3A CN103702516B (en) | 2013-12-17 | 2013-12-17 | Printed circuit board coefficient calculation method and the system of calculating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103702516A CN103702516A (en) | 2014-04-02 |
| CN103702516B true CN103702516B (en) | 2016-10-05 |
Family
ID=50363882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310697706.3A Active CN103702516B (en) | 2013-12-17 | 2013-12-17 | Printed circuit board coefficient calculation method and the system of calculating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103702516B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307397B (en) * | 2015-09-16 | 2018-12-07 | 广州美维电子有限公司 | A kind of circuit board exposure method and device |
| CN105246258B (en) * | 2015-10-27 | 2018-08-07 | 珠海方正科技高密电子有限公司 | A kind of circuit board harmomegathus ratio control method and system |
| CN106793521B (en) * | 2016-12-30 | 2020-03-27 | 广州兴森快捷电路科技有限公司 | Method and system for manufacturing drilling or milling type engineering file of circuit board |
| TWI651589B (en) * | 2018-02-05 | 2019-02-21 | 志聖工業股份有限公司 | Detecting method of circuit board and exposing method of circuit board |
| CN112291929B (en) * | 2019-07-25 | 2021-06-22 | 苏州维嘉科技股份有限公司 | Drilling method and system of PCB tracing code and storage medium |
| CN111372394A (en) * | 2020-03-13 | 2020-07-03 | 江西景旺精密电路有限公司 | Method for improving deviation of multilayer PCB (printed circuit board) and multilayer PCB |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
| CN103200779A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Method for stretching interval of printed circuit boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002261443A (en) * | 2001-02-27 | 2002-09-13 | Kyocera Corp | Method of manufacturing circuit board |
-
2013
- 2013-12-17 CN CN201310697706.3A patent/CN103702516B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
| CN103200779A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Method for stretching interval of printed circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103702516A (en) | 2014-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103702516B (en) | Printed circuit board coefficient calculation method and the system of calculating | |
| CN103179812B (en) | The preparation method of high multistage HDI printed circuit board (PCB) | |
| CN103068170B (en) | Method of preparing aluminum base board short groove holes | |
| WO2015096665A1 (en) | Compensation method for pcb expansion and contraction | |
| CN104318052B (en) | A kind of evaluation method of low-permeability oil deposit water drive sweep efficiency | |
| CN104022050A (en) | Detection method for repeated position defects in batch of wafers | |
| CN103249270A (en) | Components with mechanically-bonded plastic and methods for forming such components | |
| CN106851975A (en) | A kind of rigid-flex combined board and preparation method thereof | |
| CN106662858A (en) | PCB drilling path configuration method | |
| CN104023486A (en) | Soft and hard multiple-layer circuit board and method for forming electrical testing locating hole thereof | |
| CN102929633B (en) | For program transformation method and the system of SMT processing procedure | |
| CN104750892A (en) | Three-dimensional modeling method for thickness-variable curved-surface part inner shape surface | |
| CN103200779B (en) | A kind of printed circuit board spacing drawing process | |
| CN104484747A (en) | Method for determining qualified rate of products by utilizing truncation samples | |
| CN103456238B (en) | The manufacture method of stereo identification adhesive piece | |
| CN109657265B (en) | Automatic expansion and contraction method for PCB circuit and drilling | |
| CN102930080B (en) | Rear panel large-small-hole drilling data processing method and rear panel manufacturing method | |
| CN106659001A (en) | Multilayer PCB expansion and shrinkage measuring compensation method | |
| CN104244590B (en) | The control method of circuit board outer layer deviation | |
| CN105965887B (en) | 3D model support structure algorithm implementation methods based on selective depression sintering technology | |
| CN104750750A (en) | GERBER file output method | |
| CN101398864A (en) | Circuit board making and emulating system and method | |
| CN106611039A (en) | Calculation method for hybrid solution of semantic similarity of ontology concept | |
| CN204408747U (en) | A kind of have the pcb board burying resistance | |
| CN108427788A (en) | A kind of plan view mask method and device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |