TWI651589B - Detecting method of circuit board and exposing method of circuit board - Google Patents

Abstract

A circuit board detection method includes: a screening step and a regeneration step. The screening step is to perform X detection of the circuit board to be tested with a first preset value, and screen out Y suitable circuit boards capable of performing the exposure operation at the first preset value, and cannot be in the first Z eliminator boards that perform exposure operations at a preset value, and X = Y + Z. The reproducing step is to find a second preset value capable of performing an exposure operation on at least one of the Z culling boards. Thereby, the invention can effectively reduce the elimination rate of the circuit board and save production time.

Description

Circuit board detecting method and circuit board exposure method

The invention relates to a method for producing a circuit board, and to a method for detecting a circuit board and a method for exposing the circuit board.

Nowadays, the development of science and technology has led to the development of various electronic products, and various electronic products have mostly printed circuit boards as their basic components. Therefore, providing excellent printed circuit boards is the development direction that various manufacturers are pursuing. In the existing circuit board production method, the exposure operation of the circuit board needs to be implemented with the negative film, but the circuit board often deforms the circuit board due to the error in the manufacturing process, and thus the size of each circuit board is not completely the same. Therefore, when the board performs the exposure operation on the negative film, the alignment problem often occurs and the circuit board is eliminated.

Accordingly, the inventors believe that the above-mentioned defects can be improved, and that the invention has been studied with great interest and with the use of scientific principles, and finally proposes a present invention which is rational in design and effective in improving the above-mentioned defects.

Embodiments of the present invention provide a circuit board detecting method and a circuit board exposure method, which effectively improve defects caused by the existing circuit board manufacturing method.

The embodiment of the invention discloses a circuit board detecting method, comprising: a screening step: performing X detection of a circuit board to be tested with a first preset value, and filtering out an exposure operation capable of performing the exposure operation at the first preset value. Y compliant circuit boards, and Z eliminator boards that are not capable of performing exposure operations at the first predetermined value, and X = Y + Z; Regeneration step: finding a second preset value capable of causing at least one of the Z culling boards to perform an exposure operation.

Preferably, the first preset value is defined as a virtual size range in which the size of a first negative film is inwardly and outwardly expanded relative to an allowable error, and the second preset value is defined as a second A virtual size range in which the size of the backsheet is inwardly and outwardly expanded relative to the tolerance.

The embodiment of the invention also discloses a circuit board exposure method, comprising: the circuit board detecting method as described above; and an exposing step: sequentially performing Y exposure of the appropriate circuit boards according to the first preset value, And performing, according to the second preset value, the corresponding at least one of the eliminating circuit boards to perform an exposure operation.

In summary, the method for detecting a circuit board and the method for exposing the circuit board disclosed in the embodiments of the present invention can be performed in accordance with the size of each circuit board, and the screening step and the regeneration step are performed before the exposure operation is performed on the negative film. The problem that the circuit board and the negative film to be tested are in alignment during the exposure operation is avoided, and in the regeneration step, other suitable negative films are selected according to the above-mentioned elimination circuit board, thereby effectively reducing the elimination rate of the circuit board and saving production time.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings limits.

1‧‧‧Testing equipment

11‧‧‧ camera

12‧‧‧ arithmetic device

2‧‧‧ negative film

21‧‧‧ first negative

21P‧‧‧ Center Point

22‧‧‧ second negative

3‧‧‧Standard glass film

4‧‧‧Device board to be tested

41‧‧‧ Sigma board

42‧‧‧Retire the board

4P‧‧‧ Center Point

R1‧‧‧ first preset value

R2‧‧‧ second preset value

W‧‧‧Width direction

L‧‧‧ Length direction

FIG. 1 is a schematic flow chart of a method for detecting a circuit board according to the present invention.

2 is a functional block diagram of a detecting device used in the method for detecting a circuit board of the present invention.

FIG. 3 is a schematic diagram of a film and a preset value of the circuit board detecting method of the present invention.

4 is a schematic diagram (1) of a screening step of a circuit board detecting method according to the present invention.

FIG. 5 is a schematic diagram showing the screening steps of the circuit board detecting method of the present invention (2).

FIG. 6 is a schematic diagram showing the regeneration steps of the circuit board detecting method of the present invention.

FIG. 7 is a schematic flow chart of a method for exposing a circuit board of the present invention.

[Example 1]

1 to FIG. 6 is a first embodiment of the present invention. It should be noted that the related embodiments of the present invention are only used to specifically describe the embodiments of the present invention. The scope of the present invention is not to be construed as limiting the scope of the present invention.

As shown in FIG. 1 , the embodiment discloses a circuit board detecting method, and particularly relates to a method for detecting a circuit board before performing an exposure operation. The circuit board detecting method comprises the following steps: a preparation step, a screening step, and a regeneration step. The specific embodiments of the steps will be described below, but the following description is not intended to limit the necessary order of implementation of the various steps.

Preparation step: Referring to FIG. 2 and FIG. 3, a detecting device 1 is provided, including an imaging device 11 and an arithmetic device 12 electrically connected to the imaging device 11, thereby passing through the imaging device 11 of the detecting device 1 The following comparison or selection operations are performed with the arithmetic unit 12. The image capturing device 11 can capture images of the N types of the negative film 2 and X images of the circuit board 4 to be tested and transmit the image to the computing device 12. The above-mentioned negative film 2 and the circuit board 4 to be tested are substantially quadrangular in this embodiment, and the circuit board 4 to be tested in this embodiment refers to a circuit board which has not been subjected to an exposure operation with the negative film 2.

Further, the computing device 12 can compare the above-mentioned N kinds of negative films 2 and a standard glass negative film 3 (N is a positive integer greater than 1), and define each negative film 2 with respect to a shrinking operation of the circuit board exposure operation. coefficient. For example, the standard glass backsheet 3 has a first and a third expansion and contraction coefficient in the width direction W and the length direction L, and the computing device 12 can be based on the images of the various negative films 2 and the image of the standard glass negative film 3 described above. And comparing the dimensions in the width direction W and the length direction L, borrowing The expansion and contraction coefficients (for example, 0.995, 1.005) of the various negative films 2 in the width direction W and the longitudinal direction L are defined.

Furthermore, the standard glass backsheet 3 of the present embodiment may be transparent, so as to facilitate the positioning of the two types of the backsheets 2 on opposite surfaces of the standard glass backsheet 3, so that the camera device 11 can simultaneously obtain standard glass. The image of the backsheet 3 and the two types of film 2 placed thereon, in turn, allows the computing device 12 to simultaneously perform the expansion and contraction coefficient calculations of the two types of film 2 described above. It should be noted that, in this embodiment, the image of the standard glass backsheet 3 and the two kinds of the negative film 2 placed thereon are simultaneously taken by the image capturing device 11 as the criterion for judging the shrinkage coefficient of the film 2, but the present invention does not exclude Implemented in other ways. For example, the image of the standard glass backsheet 3 can be pre-set in the computing device 12 so that the imaging device 11 can capture the image of the various negative films 2, and then the arithmetic unit 12 can perform the calculation of the expansion and contraction coefficient of the negative film 2.

The screening step is as follows: Referring to FIG. 4 and FIG. 5, the detection of the X circuit boards 4 to be tested is performed by using a first preset value R1, and the exposure operation can be performed under the first preset value R1. Y compliant circuit boards 41 and Z eliminating circuit boards 42 that are not capable of performing exposure operations at the first predetermined value R1. Where X=Y+Z, X is a positive integer, and Y and Z are all integers not less than zero. In this embodiment, the first preset value R1 is defined as a virtual size range in which the size of the first negative film 21 is inwardly and outwardly expanded relative to an allowable error (eg, less than 35 micrometers) (eg, In Fig. 3, an area surrounded by an inner rectangular dotted line and an outer rectangular dotted line adjacent to the edge of the first negative film 21). Furthermore, the N types of negative films 2 include the first negative film 21 described above, that is, the image pickup device 11 has captured the image of the first negative film 21 and transferred it to the arithmetic device 12.

In more detail, the computing device 12 selects the circuit board under test 4 capable of performing the exposure operation within the tolerance of the N kinds of negative films 2 according to the images of the X circuit boards to be tested. The first film 21 having the largest number. And the computing device 12 is based on the image of the first film 21 transmitted from the camera 11 With respect to the X images of the circuit board 4 to be tested, the Y adaptive circuit boards 41 and the Z eliminating circuit boards 42 are determined.

Further, in the present embodiment, the screening step is to sequentially stack the first negative film 21 on each circuit board 4 to be tested, and the center point 21P of the first negative film 21 is substantially aligned or adjacent to The center point 4P of the circuit board 4 to be tested is stacked; then, when the difference in size between the first film 21 and the circuit board 4 to be tested is greater than or less than the tolerance (Fig. 5), Then, the stacked circuit board 4 to be tested is determined to be a circuit board 42. Conversely, when the size difference between the first film 21 and the circuit board 4 to be tested is within the tolerance, 4), the stacked circuit boards 4 to be tested are determined to be a suitable circuit board 41. Further, although the above is exemplified by the center point 21P of the first film 21 being substantially aligned or adjacent to the center point 4P of the circuit board 4 to be tested, the present invention is not limited thereto. The center point 21P and the center point 4P are generally defined in the present embodiment as the intersection of the lines of all their vertices with respect to the center of the plane.

In other words, the process of judging the difference in size between the first film 21 and the circuit board 4 to be tested may be: the first film 21 is pre-positioned at four corners (not shown) Marked), and the four corners of the circuit board 4 to be tested are also pre-arranged with corresponding alignment portions (not shown). One of the alignment portions of the first film 21 is substantially aligned with one of the alignment portions of the circuit board 4 to be tested, and then the other alignment portions of the first film 21 and the circuit board 4 to be tested are stacked. The distance value between the adjacent alignment portions, and then comparing the distance value and the tolerance; if one of the distance values measured by the first film 21 and the circuit board 4 to be tested in the four corners is greater than the tolerance, Then, the circuit board 4 to be tested is stacked to determine that the circuit board 42 is eliminated.

Regeneration Step: Referring to FIG. 6, a second preset value R2 capable of causing at least one of the Z reject boards 42 to perform the exposure operation is found. Wherein, when Z is greater than 1, the Z culling circuit boards 42 can Performing an exposure operation (M is greater than 1 and less than a positive integer of Z) according to the M preset values, the M preset values include the second preset value R2, and may further include a third preset value, Four preset values, a fifth preset value, and the like. Furthermore, among the M preset values, the second preset value R2 is the most cullable circuit board 42 capable of performing an exposure job. In this embodiment, the second preset value R2 is defined as a virtual size range in which the size of the second negative film 22 is inwardly and outwardly expanded relative to the tolerance, and the N negative films 2 include The second backsheet 22 described above.

More specifically, the arithmetic unit 12 determines the second negative film 22 capable of performing exposure work on at least one of the eliminating circuit boards 42 within the allowable error based on the images of the Z eliminating circuit boards 42. For example, the first film 21 has a coefficient of expansion and contraction of 1.005, and the size difference between the circuit board 42 shown in FIG. 5 and the first film 21 is smaller than the tolerance, so the computing device 12 is smaller than The coefficient of expansion and contraction of the first film 21 is one of the screening conditions, and is selected in the remaining film 2, for example, this embodiment selects the second film 22 having a coefficient of expansion and contraction of 0.995 as shown in FIG.

Therefore, in order to ensure that the size of each circuit board is not completely the same, the circuit board 4 to be tested in this embodiment performs the above-mentioned circuit board detection method before performing the exposure operation on the negative film 2, thereby avoiding the circuit board 4 and the negative film to be tested. 2 A problem of alignment occurs during the exposure operation, and the circuit board detection method can select other suitable negative films according to the above-mentioned elimination circuit board 42 through the regeneration step, thereby effectively reducing the elimination rate of the circuit board and saving production time.

[Embodiment 2]

Referring to FIG. 7, which is a second embodiment of the present invention, the present embodiment is similar to the above-mentioned first embodiment, and the same portions are not described again, and the main differences between the two embodiments are as follows.

Specifically, the embodiment discloses a circuit board exposure method, including the circuit board detecting method and the exposure step according to the first embodiment. Wherein the exposure step And: causing the Y adaptive circuit boards 41 to perform an exposure operation according to the first preset value R1, and exposing the corresponding at least one of the eliminating circuit boards 42 according to the second preset value R2 operation. Further, the corresponding eliminator circuit board 42 is respectively subjected to an exposure operation according to the M kinds of preset values.

It should be noted that if the number of the eliminating circuit boards 42 corresponding to a certain preset value is too small (for example, less than three), the manufacturing cost of performing the exposure step only for the excessively small eliminating circuit board 42 is required. On the contrary, it is higher than directly discarding the above-mentioned excessively-removed circuit board 42, so that the above-mentioned too few eliminated circuit boards 42 can be directly discarded without further performing the above-described exposure step.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and all equivalent changes and modifications made by the scope of the present invention should be included in the scope of the present invention.

Claims (8)

A circuit board detecting method includes: a screening step: performing X detection of a circuit board to be tested with a first preset value, and filtering out Y suitable circuit boards capable of performing an exposure operation under the first preset value And Z culling boards that cannot perform the exposure operation under the first preset value, and X=Y+Z, X is a positive integer, Y and Z are all integers not less than zero; and a regeneration step: Finding a second preset value capable of performing an exposure operation on at least one of the Z culling boards; wherein, in the filtering step, the first preset value is defined as a a size of the first negative film that is inwardly and outwardly expanded relative to a tolerance, and the second predetermined value is defined as a size of the second negative film that is inwardly reduced relative to the tolerance And a virtual size range of the outward expansion, the first negative film is sequentially stacked on each of the circuit boards to be tested, and the center point of the first negative film is aligned or adjacent to the stacked circuit to be tested a center point of the board, when the first film is overlapped with the to-be-tested When the difference in size of the road board is greater than or less than the tolerance, the stacked circuit boards to be tested are determined to be a circuit board, and vice versa, when the first film and the circuit to be tested are stacked When the difference in size of the board is within the tolerance, the board to be tested stacked is determined to be a suitable circuit board. The circuit board detecting method according to claim 1, wherein, in the reproducing step, when Z is greater than 1, the Z rejecting boards are capable of performing an exposure operation according to M preset values, and M is greater than 1 and less than A positive integer of Z, and the M preset values include the second preset value. The circuit board detecting method of claim 2, wherein among the M types of the preset values, the number of the eliminated circuit boards capable of performing the exposure operation of the second preset value is the most. The circuit board detecting method according to claim 1, further providing a camera device And an arithmetic device electrically connected to the image capturing device, wherein the image capturing device captures an image of the first film and X images of the circuit board to be tested and transmits the image to the computing device, and the operation And determining, according to the image of the first film and the images of the X circuit boards to be tested, Y Y-shaped circuit boards and Z-excluding circuit boards. The circuit board detecting method according to claim 4, wherein, in the reproducing step, the computing device determines that at least one of the tolerances can be within the tolerance according to the images of the Z pieces of the circuit board The second negative film on which the circuit board is subjected to an exposure operation. The circuit board detecting method of claim 1, further comprising: an image capturing device and an arithmetic device electrically connected to the image capturing device; before the screening step, the image capturing device captures images of N kinds of negative films And X images of the circuit board to be tested are transmitted to the computing device; in the screening step, the computing device is based on X images of the circuit board to be tested, in the N types of the film And selecting the first negative film having the largest number of circuit boards to be tested capable of performing an exposure operation within the tolerance, and N is a positive integer greater than 1. The method of detecting a circuit board according to claim 6, wherein the N types of the negative film comprise the second negative film; before the screening step, the arithmetic device compares the N types of the negative film and a standard glass negative film, and Each of the negatives defines a coefficient of increase and decrease associated with the exposure operation of the board. A method for exposing a circuit board, comprising: the method for detecting a circuit board according to claim 1, and an exposing step: sequentially performing Y exposure operations on the adaptive circuit board according to the first preset value, and The second preset value causes the corresponding at least one of the defrosting boards to perform an exposure operation.