CN103681699A - Manufacturing method for camera module - Google Patents
Manufacturing method for camera module Download PDFInfo
- Publication number
- CN103681699A CN103681699A CN201210325127.1A CN201210325127A CN103681699A CN 103681699 A CN103681699 A CN 103681699A CN 201210325127 A CN201210325127 A CN 201210325127A CN 103681699 A CN103681699 A CN 103681699A
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- China
- Prior art keywords
- chip
- camera module
- substrate
- camera
- manufacturing
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Abstract
The quality of a camera module is closely related to the particle condition on the chip surface. Currently, the chip and a baseplate of the camera module are jointed in a way that the sensor surface of the chip faces upwards. The invention provides a new manufacturing method which is characterized in that the chip and the baseplate of the camera module are jointed in a way that the sensor surface of the chip faces downwards. The method can effectively reduce the problem of dust appearing during the manufacturing process of the camera module.
Description
Technical field
Mobile phone, extensively uses the camera module (camera module) that comprises camera chip in the electronic equipments such as digital camera.In the manufacture process of camera module, must guarantee that camera chip surface does not have dust, greasy dirt, the defects such as scratch.The present invention is a kind of a kind of joint method of camera module, and the method can effectively reduce the problem of the dust running in camera module production process.
Background technology
Whether the quality of camera module and chip surface have dust (particle) to have very large relation.The chip of camera module and the joint method of substrate are all that chip sensor surface engages upward at present.The present invention proposes a kind of new manufacture method, and the method can effectively reduce the problem of the dust running in camera module production process.
Summary of the invention
A manufacture method for camera module, is characterized in that: camera chip sensor sheet faces down, and substrate engages.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of chip and the substrate manufacture method while being electrically connected by gold thread
1, gold thread
2, gold goal
3, golden finger
4, substrate (substrate)
5, camera chip (sensor regions field surface is down)
Fig. 2 is the schematic diagram of chip and the substrate manufacture method while being electrically connected by conducting resinl
1, substrate (substrate)
2, conducting resinl
3, camera chip (sensor regions field surface is down)
4, substrate through-hole
Embodiment one: manufacture method when chip and substrate are electrically connected by gold thread
1, one of the golden finger that has of substrate faces down
2, one of the sensor region that has of camera chip is faced down,, the another side of chip and substrate are engaged to (die bond) from bottom to top
3, on the golden finger surface of substrate, plant ball
4, on the aluminium pad surface of chip, plant ball
5, with gold thread, the gold goal under aluminium pad and the gold goal under golden finger are engaged to (wire bond)
Embodiment two: manufacture method when chip and substrate are electrically connected by conducting resinl
1, camera chip had one of sensor region to face down to fix
2, on substrate, plant conducting resinl
3, there is one of conducting resinl to face up substrate,, the aluminium pad of substrate and camera chip is engaged from bottom to top.
Claims (1)
1. a manufacture method for camera module, is characterized in that:
Camera chip sensor sheet faces down, and substrate engages.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210325127.1A CN103681699A (en) | 2012-09-05 | 2012-09-05 | Manufacturing method for camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210325127.1A CN103681699A (en) | 2012-09-05 | 2012-09-05 | Manufacturing method for camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103681699A true CN103681699A (en) | 2014-03-26 |
Family
ID=50318718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210325127.1A Pending CN103681699A (en) | 2012-09-05 | 2012-09-05 | Manufacturing method for camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103681699A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2559101Y (en) * | 2002-06-24 | 2003-07-02 | 陈巧 | Image sensing element packing structure |
| CN1925163A (en) * | 2005-09-01 | 2007-03-07 | 南茂科技股份有限公司 | Glass coating package structure for image detector |
| CN101136341A (en) * | 2006-09-01 | 2008-03-05 | 今湛光学科技股份有限公司 | Crystal coated encapsulation method for preventing image sensing chip sensing section from polluting |
| KR101012700B1 (en) * | 2003-11-12 | 2011-02-09 | 삼성테크윈 주식회사 | Image sensor module, camera module with same and manufacturing method thereof |
-
2012
- 2012-09-05 CN CN201210325127.1A patent/CN103681699A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2559101Y (en) * | 2002-06-24 | 2003-07-02 | 陈巧 | Image sensing element packing structure |
| KR101012700B1 (en) * | 2003-11-12 | 2011-02-09 | 삼성테크윈 주식회사 | Image sensor module, camera module with same and manufacturing method thereof |
| CN1925163A (en) * | 2005-09-01 | 2007-03-07 | 南茂科技股份有限公司 | Glass coating package structure for image detector |
| CN101136341A (en) * | 2006-09-01 | 2008-03-05 | 今湛光学科技股份有限公司 | Crystal coated encapsulation method for preventing image sensing chip sensing section from polluting |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140326 |