CN103681442A - Upwards-protruding needle magnetic fixing mechanism - Google Patents
Upwards-protruding needle magnetic fixing mechanism Download PDFInfo
- Publication number
- CN103681442A CN103681442A CN201310697058.1A CN201310697058A CN103681442A CN 103681442 A CN103681442 A CN 103681442A CN 201310697058 A CN201310697058 A CN 201310697058A CN 103681442 A CN103681442 A CN 103681442A
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- China
- Prior art keywords
- upwards
- protruding needle
- magnet
- fixing mechanism
- prominent upper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to an upwards-protruding needle magnetic fixing mechanism, and belongs to the technical field of mechanical automation. The fixing mechanism comprises an upwards-protruding needle base and a guiding cover, and an upwards-protruding needle is arranged on the upwards-protruding needle base and vertically moves in a hole of the guiding cover. A magnet with weak magnetic force is installed at the bottom of the upwards-protruding needle base, and the upwards-protruding needle horizontally moves through the magnet. A magnetic fixing mode is adopted in the magnetic fixing mechanism, so that the upwards-protruding needle magnetic fixing mechanism is conveniently assembled and adjusted. The magnet only limits displacement of the upwards-protruding needle in the vertical direction, and the upwards-protruding needle can be adjusted in any horizontal direction within the scope of the magnet. Meanwhile, accuracy requirements for machining related parts are reduced, and therefore the machining cost is reduced. As mechanical limiting is eliminated, the related parts can be generally used, and the universality of the parts is improved.
Description
Technical field
The present invention relates to a kind of prominent upper pin magnetic fixed mechanism, it belongs to mechanical automation technical field.
Background technology
In semiconductor loading device, topmost function is got wafer and sticky wafer exactly, wherein wafer is taken smoothly from crystalline substance dish away to Yao Kaotushang mechanism and is coordinated to realize with grasping mechanism.
Tu Shang mechanism, is to make brilliant dish above want removed wafer exceed brilliant dish and other wafer, and will makes wafer separation from crystalline substance dish, only with such grasping mechanism, could wafer be taken away by the mode of vacuum.
Can complete the topmost parts of above-mentioned action is prominent upper pins.Near pin top on prominent, having guide housing, prominent upper needle stand and guide housing are separately fixed on different parts, and prominent upper pin will move up and down in the hole of guide housing.Because grasping mechanism is to take wafer away by vacuum mode, so the position of prominent upper pin is extremely important, first will with the central alignment of grasping mechanism, second will move in vertical direction.
Because the volume of wafer is done less and less, the diameter of prominent upper pin also will be done littlely, and the cooperation of each parts requires higher, and prominent upper pin and guide housing are not mounted on same part, and all can not adjust in the horizontal direction, this has more increased the difficulty coordinating, processing cost is inevitable to rise thereupon.。
Summary of the invention
In order to solve the problems of the technologies described above, invented a kind of prominent upper pin magnetic fixed mechanism, prominent upper pin can be adjusted arbitrarily in the horizontal direction, reduced manufacturing cost.
The technical solution adopted for the present invention to solve the technical problems is: a kind of prominent upper pin magnetic fixed mechanism, comprise prominent upper needle stand and guide housing, on needle stand, be provided with on prominent prominent on pin, prominent upper pin moves up and down in the hole of guide housing; On dashing forward, a magnet is installed in the bottom of needle stand, and magnet is arranged on the magnet holder of bottom.
The invention has the beneficial effects as follows: this prominent upper pin magnetic fixed mechanism comprises prominent upper needle stand and guide housing, and prominent upper pin is located on prominent upper needle stand, and moves up and down in the hole of guide housing; On dashing forward, the weak magnet of a magnetic force is installed in the bottom of needle stand, and prominent upper pin is moved in the horizontal direction.This mechanism adopts magnetic fixed form, facilitates install and adjust.Magnet has only limited the displacement of prominent upper pin vertical direction, and within the scope of magnet, prominent upper pin can be adjusted at horizontal any direction.Relaxed required precision when the relevant spare and accessory parts of processing simultaneously, reduced processing cost, and there is no mechanical position limitation, relevant spare and accessory parts can be general, improved the versatility of spare and accessory parts.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described.
Fig. 1 is a kind of prominent upper pin magnetic fixed mechanism structure chart.
In figure: 1, prominent upper pin, 2, guide housing, 3, prominent upper needle stand, 4, magnet, 5, magnet holder.
Embodiment
Fig. 1 shows a kind of prominent upper pin magnetic fixed mechanism.Prominent upper pin magnetic fixed mechanism comprises prominent upper needle stand 3 and guide housing 2, and prominent upper pin 1 is located on prominent upper needle stand 3, and moves up and down in the hole of guide housing 2; On dashing forward, the weak magnet 4 of a magnetic force is installed in the bottom of needle stand 3, and prominent upper pin 1 is moved in the horizontal direction.Guide housing 2 is pin top on close dashing forward.
During work, first prominent upper pin 1 is installed on prominent upper needle stand 3, magnet 4 is contained on magnet holder 5, again magnet holder 5 is raised to peak, prominent upper needle stand 3 is put on magnet 4, then prominent upper pin 1 is loaded onto and passed to guide housing 2,4 of magnet have limited the displacement of prominent upper pin 1 vertical direction, in magnet 4 scopes, prominent upper pin 1 can be adjusted at horizontal any direction, finally adjusts Tu Shang mechanism and makes it concentric with grasping mechanism.
Claims (1)
1. a prominent upper pin magnetic fixed mechanism, comprises prominent upper needle stand (3) and guide housing (2), it is characterized in that: on described dashing forward, on needle stand (3), be provided with prominent upper pin (1), prominent upper pin (1) moves up and down in the hole of guide housing (2); On dashing forward, a magnet (4) is installed in the bottom of needle stand (3), and magnet (4) is arranged on the magnet holder (5) of bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310697058.1A CN103681442A (en) | 2013-12-18 | 2013-12-18 | Upwards-protruding needle magnetic fixing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310697058.1A CN103681442A (en) | 2013-12-18 | 2013-12-18 | Upwards-protruding needle magnetic fixing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103681442A true CN103681442A (en) | 2014-03-26 |
Family
ID=50318591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310697058.1A Pending CN103681442A (en) | 2013-12-18 | 2013-12-18 | Upwards-protruding needle magnetic fixing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103681442A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200979559Y (en) * | 2006-11-10 | 2007-11-21 | 宜特电子股份有限公司 | A magnetic fixed substructure of a probe-bed |
| US20080086874A1 (en) * | 2006-10-16 | 2008-04-17 | Asm Assembly Automation Ltd. | Die detachment apparatus comprising pre-peeling structure |
| CN201259886Y (en) * | 2008-06-20 | 2009-06-17 | 艾逖恩机电(深圳)有限公司 | thimble module |
| CN202003972U (en) * | 2010-07-13 | 2011-10-05 | 江门市新侨光电科技有限公司 | Wafer pushing device used for die bonder |
| CN102254852A (en) * | 2011-08-23 | 2011-11-23 | 南通富士通微电子股份有限公司 | Thimble cap of die bonder |
| CN102489931A (en) * | 2011-11-30 | 2012-06-13 | 方大新材料（江西）有限公司 | Device for automatic welding and random positioning and automatic clamping and resetting |
| CN202931671U (en) * | 2012-10-26 | 2013-05-08 | 上海斐讯数据通信技术有限公司 | Support thimble applied to surface mount device |
-
2013
- 2013-12-18 CN CN201310697058.1A patent/CN103681442A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080086874A1 (en) * | 2006-10-16 | 2008-04-17 | Asm Assembly Automation Ltd. | Die detachment apparatus comprising pre-peeling structure |
| CN200979559Y (en) * | 2006-11-10 | 2007-11-21 | 宜特电子股份有限公司 | A magnetic fixed substructure of a probe-bed |
| CN201259886Y (en) * | 2008-06-20 | 2009-06-17 | 艾逖恩机电(深圳)有限公司 | thimble module |
| CN202003972U (en) * | 2010-07-13 | 2011-10-05 | 江门市新侨光电科技有限公司 | Wafer pushing device used for die bonder |
| CN102254852A (en) * | 2011-08-23 | 2011-11-23 | 南通富士通微电子股份有限公司 | Thimble cap of die bonder |
| CN102489931A (en) * | 2011-11-30 | 2012-06-13 | 方大新材料（江西）有限公司 | Device for automatic welding and random positioning and automatic clamping and resetting |
| CN202931671U (en) * | 2012-10-26 | 2013-05-08 | 上海斐讯数据通信技术有限公司 | Support thimble applied to surface mount device |
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Legal Events
| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140326 |
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| RJ01 | Rejection of invention patent application after publication |