CN103668360A - Non-cyanide gold-palladium alloy plating liquid and plating method - Google Patents
Non-cyanide gold-palladium alloy plating liquid and plating method Download PDFInfo
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- CN103668360A CN103668360A CN201310284709.4A CN201310284709A CN103668360A CN 103668360 A CN103668360 A CN 103668360A CN 201310284709 A CN201310284709 A CN 201310284709A CN 103668360 A CN103668360 A CN 103668360A
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- Prior art keywords
- gold
- plating liquid
- cyanogen
- palldium alloy
- plating
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- 238000007747 plating Methods 0.000 title claims abstract description 79
- 239000007788 liquid Substances 0.000 title claims abstract description 50
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 title abstract description 7
- 229910001252 Pd alloy Inorganic materials 0.000 title abstract 6
- 238000000034 method Methods 0.000 title description 2
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 13
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 10
- 239000011669 selenium Substances 0.000 claims abstract description 10
- 150000002940 palladium Chemical class 0.000 claims abstract description 5
- SDKPSXWGRWWLKR-UHFFFAOYSA-M sodium;9,10-dioxoanthracene-1-sulfonate Chemical compound [Na+].O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] SDKPSXWGRWWLKR-UHFFFAOYSA-M 0.000 claims abstract description 5
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 claims description 34
- 239000000956 alloy Substances 0.000 claims description 30
- 229910045601 alloy Inorganic materials 0.000 claims description 30
- 210000000981 epithelium Anatomy 0.000 claims description 22
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- 150000003016 phosphoric acids Chemical class 0.000 claims description 8
- -1 amine compound Chemical class 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 150000003863 ammonium salts Chemical class 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 5
- 229910019142 PO4 Inorganic materials 0.000 abstract description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract description 3
- 239000010452 phosphate Substances 0.000 abstract description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 abstract 4
- POJWUDADGALRAB-UHFFFAOYSA-N allantoin Chemical class NC(=O)NC1NC(=O)NC1=O POJWUDADGALRAB-UHFFFAOYSA-N 0.000 abstract 1
- 229940091258 selenium supplement Drugs 0.000 description 7
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 3
- 235000011007 phosphoric acid Nutrition 0.000 description 3
- 239000004254 Ammonium phosphate Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 2
- 235000019289 ammonium phosphates Nutrition 0.000 description 2
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 2
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 2
- 235000011130 ammonium sulphate Nutrition 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000005660 chlorination reaction Methods 0.000 description 2
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 2
- RNGFNLJMTFPHBS-UHFFFAOYSA-L dipotassium;selenite Chemical compound [K+].[K+].[O-][Se]([O-])=O RNGFNLJMTFPHBS-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910021505 gold(III) hydroxide Inorganic materials 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 229940045641 monobasic sodium phosphate Drugs 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- BFPJYWDBBLZXOM-UHFFFAOYSA-L potassium tellurite Chemical compound [K+].[K+].[O-][Te]([O-])=O BFPJYWDBBLZXOM-UHFFFAOYSA-L 0.000 description 2
- 150000003342 selenium Chemical class 0.000 description 2
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 2
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 2
- 150000003497 tellurium Chemical class 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 235000019798 tripotassium phosphate Nutrition 0.000 description 2
- 229910000404 tripotassium phosphate Inorganic materials 0.000 description 2
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 2
- WDCYWAQPCXBPJA-UHFFFAOYSA-N 1,3-dinitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC([N+]([O-])=O)=C1 WDCYWAQPCXBPJA-UHFFFAOYSA-N 0.000 description 1
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- PMYDPQQPEAYXKD-UHFFFAOYSA-N 3-hydroxy-n-naphthalen-2-ylnaphthalene-2-carboxamide Chemical compound C1=CC=CC2=CC(NC(=O)C3=CC4=CC=CC=C4C=C3O)=CC=C21 PMYDPQQPEAYXKD-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 206010006784 Burning sensation Diseases 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 description 1
- PNRYLQGKCSQOGH-UHFFFAOYSA-N [Te]I Chemical compound [Te]I PNRYLQGKCSQOGH-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- BIGPRXCJEDHCLP-UHFFFAOYSA-N ammonium bisulfate Chemical compound [NH4+].OS([O-])(=O)=O BIGPRXCJEDHCLP-UHFFFAOYSA-N 0.000 description 1
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- XXFBOXZYQLMDQA-UHFFFAOYSA-N bromoselanyl selenohypobromite Chemical compound Br[Se][Se]Br XXFBOXZYQLMDQA-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- VIEXQFHKRAHTQS-UHFFFAOYSA-N chloroselanyl selenohypochlorite Chemical compound Cl[Se][Se]Cl VIEXQFHKRAHTQS-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- DRGYXGZFRXFMHF-UHFFFAOYSA-N diazanium;tellurate Chemical compound [NH4+].[NH4+].[O-][Te]([O-])(=O)=O DRGYXGZFRXFMHF-UHFFFAOYSA-N 0.000 description 1
- SRRYZMQPLOIHRP-UHFFFAOYSA-L dipotassium;tellurate Chemical compound [K+].[K+].[O-][Te]([O-])(=O)=O SRRYZMQPLOIHRP-UHFFFAOYSA-L 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 229910000397 disodium phosphate Inorganic materials 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- BVTBRVFYZUCAKH-UHFFFAOYSA-L disodium selenite Chemical compound [Na+].[Na+].[O-][Se]([O-])=O BVTBRVFYZUCAKH-UHFFFAOYSA-L 0.000 description 1
- XERQTZLDFHNZIC-UHFFFAOYSA-L disodium;tellurate Chemical compound [Na+].[Na+].[O-][Te]([O-])(=O)=O XERQTZLDFHNZIC-UHFFFAOYSA-L 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- JCDVTZPJEWWGHU-UHFFFAOYSA-N gold sulfurous acid Chemical compound [Au].S(O)(O)=O JCDVTZPJEWWGHU-UHFFFAOYSA-N 0.000 description 1
- WDZVNNYQBQRJRX-UHFFFAOYSA-K gold(iii) hydroxide Chemical compound O[Au](O)O WDZVNNYQBQRJRX-UHFFFAOYSA-K 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- LIAWOTKNAVAKCX-UHFFFAOYSA-N hydrazine;dihydrochloride Chemical compound Cl.Cl.NN LIAWOTKNAVAKCX-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- FXADMRZICBQPQY-UHFFFAOYSA-N orthotelluric acid Chemical compound O[Te](O)(O)(O)(O)O FXADMRZICBQPQY-UHFFFAOYSA-N 0.000 description 1
- RFLFDJSIZCCYIP-UHFFFAOYSA-L palladium(2+);sulfate Chemical compound [Pd+2].[O-]S([O-])(=O)=O RFLFDJSIZCCYIP-UHFFFAOYSA-L 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- YAZJAPBTUDGMKO-UHFFFAOYSA-L potassium selenate Chemical compound [K+].[K+].[O-][Se]([O-])(=O)=O YAZJAPBTUDGMKO-UHFFFAOYSA-L 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- ZLIBICFPKPWGIZ-UHFFFAOYSA-N pyrimethanil Chemical compound CC1=CC(C)=NC(NC=2C=CC=CC=2)=N1 ZLIBICFPKPWGIZ-UHFFFAOYSA-N 0.000 description 1
- JPJALAQPGMAKDF-UHFFFAOYSA-N selenium dioxide Chemical compound O=[Se]=O JPJALAQPGMAKDF-UHFFFAOYSA-N 0.000 description 1
- MCAHWIHFGHIESP-UHFFFAOYSA-N selenous acid Chemical compound O[Se](O)=O MCAHWIHFGHIESP-UHFFFAOYSA-N 0.000 description 1
- 235000010288 sodium nitrite Nutrition 0.000 description 1
- 229960001881 sodium selenate Drugs 0.000 description 1
- 239000011655 sodium selenate Substances 0.000 description 1
- 235000018716 sodium selenate Nutrition 0.000 description 1
- 229960001471 sodium selenite Drugs 0.000 description 1
- 239000011781 sodium selenite Substances 0.000 description 1
- 235000015921 sodium selenite Nutrition 0.000 description 1
- VOADVZVYWFSHSM-UHFFFAOYSA-L sodium tellurite Chemical compound [Na+].[Na+].[O-][Te]([O-])=O VOADVZVYWFSHSM-UHFFFAOYSA-L 0.000 description 1
- OHYAUPVXSYITQV-UHFFFAOYSA-M sodium;hydrogen selenite Chemical compound [Na+].O[Se]([O-])=O OHYAUPVXSYITQV-UHFFFAOYSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention provides non-cyanide gold-palladium alloy plating liquid which enables the appearance of a plating film to be good and definitely inhibits the plating film from generating breakage and other defects. The characteristics are that the non-cyanide gold-palladium alloy plating liquid containing gold salt, palladium salt, and appearance modifying agent contains phosphate as the appearance modifying agent and tellurium and/or selenium. In addition, preferably, the non-cyanide gold-palladium alloy plating liquid further contains allantoin compounds. According to the invention, the gold-palladium alloy plating film having a good appearance and being inhibited from breakage and other defects can be obtained even if the gold-palladium alloy plating liquid is non-cyanide.
Description
Technical field
The present invention relates to Jin ?palldium alloy plating liquid, particularly non-cyanogen be Jin ?palldium alloy plating liquid.
Background technology
In the past, the gold-palldium alloy in palldium alloy was as the applicable material in the bonding parts such as electric terminal.Therefore, various gold-palladium plating liquids is proposed.
As gold-palldium alloy plating liquid of prior art, consider environmental problem etc., gold-palldium alloy plating liquid (for example, Japanese documentation 1,2) that non-cyanogen is is proposed.Gold-palldium alloy the plating liquid that is for this non-cyanogen, with regard to not using cyanogen, although good on environment, by being difficult to adjust the tendency that plating liquid forms, the outward appearance of the plating epithelium of formation has not good situation.In addition, according to situation difference, have the generation of plating epithelium cracked, cannot be applicable to the situation of the bonding parts such as electric terminal.
[look-ahead technique document]
[patent documentation]
[patent documentation 1] Japanese kokai publication sho 62-139893 communique
[patent documentation 2] TOHKEMY 2010-84178 communique
Summary of the invention
[problem that invention wish solves]
The present invention is based on above-mentioned situation, disclose a kind of plating epithelium outward appearance that makes good, can really suppress gold-palldium alloy plating liquid that plating epithelium produces the non-cyanogen system of the defect such as cracked.
The means of [Xie Decision Ke Questions]
The invention is characterized in that the non-cyanogen that contains golden salt, palladium salt is in gold-palldium alloy plating liquid, contain the phosphoric acid salt as outward appearance adjusting agent, and contain wallantoin (hydantoin) based compound.
Non-cyanogen of the present invention is in gold-palldium alloy plating liquid, and phosphoric acid salt has makes the good effect of plating epithelium outward appearance, specifically effectively suppresses the phenomenon of burning of plating epithelium.And by wallantoin compound, can realize in neutrality and without precipitation, wait the stable plating liquid producing to alkaline region.
In the present invention, phosphoric acid salt can be used tertiary sodium phosphate, Tripotassium phosphate, SODIUM PHOSPHATE, MONOBASIC, potassium primary phosphate, Sodium phosphate dibasic, dipotassium hydrogen phosphate, ammonium phosphate, phosphoric acid, Secondary ammonium phosphate, primary ammonium phosphate etc.
This phosphoric acid salt is preferably scaled 0.1g/L to 150g/L with phosphoric acid.While not reaching 0.1g/L, the outward appearance of plating epithelium has deteriorated tendency, easily produces and burns.While surpassing 150g/L, it is unstable that electroplate liquid becomes.
In addition, in the present invention, as wallantoin compound, can be wallantoin, 1-methyl wallantoin, 1,3-dimethyl wallantoin, 5,5-dimethyl wallantoin, 1-methyl alcohol-5,5-dimethyl wallantoin, 5,5-phenylbenzene wallantoin etc.
In the present invention, while containing wallantoin compound, be preferably 0.1g/L to 150g/L.While reaching 0.1g/L, plating liquid does not become unstable, and while surpassing 150g/L, outward appearance becomes bad.
Non-cyanogen of the present invention is in gold-palldium alloy plating liquid, preferably also contains the more than a kind of tellurium and/or selenium.While containing above-mentioned tellurium, selenium, can effectively suppress plating epithelium and produce cracked.
Tellurium in the present invention, selenium can be tellurium salt, the contained person of selenium salt.As tellurium salt, can use ammonium tellurate, potassium tellurate, sodium tellurate, telluric acid, potassium tellurite, sodium tellurite, tellurium bromide, tellurium chloride, telluronium iodide, tellurium oxide etc.In addition,, as selenium salt, can use potassium selenate, sodium selenate, barium selenate, tin anhydride, potassium selenite, Sodium Selenite, selenous acid, Selenium monobromide, Selenium monochloride, selenium oxide, sodium hydroselenite etc.
It is 0.001g/L to 10g/L that the amount of tellurium, selenium is preferably tellurium, and selenium is 0.001g/L to 10g/L.In addition,, while containing both, the total amount of tellurium and selenium is preferably 0.001g/L to 10g/L.When amount does not reach 0.001g/L, cannot obtain cracked inhibition, while surpassing 10g/L, the plating liquid unsettled tendency that becomes.
Non-cyanogen of the present invention is that the Pd misfit agent in gold-palldium alloy plating liquid is preferably any of amine compound, ammonium salt.As amine compound, can use quadrol etc.As ammonium salt, can use ammonium sulfate, ammonium chloride, ammonium nitrate, ammonium citrate, monoammonium sulfate etc.
Non-cyanogen of the present invention is in gold-palldium alloy plating liquid, as golden salt can use chlorination auric acid, sulfurous acid gold, wallantoin is golden, thio urea is golden, auric hydroxide etc., as palladium salt, can use ammonum chloropalladate, palladium amine vitriol, dinitrobenzene diamines palladium, Palladous chloride, palladous sulfate, urea palladium salt, quadrol palladium etc.In addition, in liquid, the preferred gold concentration of concentration is 0.1g/L to 50g/L, and the liquid that palladium concentration is 0.1g/L to 50g/L forms.When gold concentration does not reach 0.1g/L, it is bad that outward appearance becomes, and while surpassing 50g/L, it is unstable that plating liquid becomes.In addition, when palladium concentration does not reach 0.1g/L, it is bad that outward appearance becomes, and while surpassing 50g/L, it is unstable that electroplate liquid becomes.
Use the solution and coating method of plating liquid of the present invention preferably 25 to 80 ℃ of liquid temperatures, current density 0.1 is to 100A/dm
2condition is carried out plating.This is because the speed of separating out of liquid temperature plating while reaching 25 ℃ reduces, the plating liquid unsettled tendency that becomes while surpassing 80 ℃.In addition, with regard to current density, though the impact of the agitation condition while being significantly subject to plating, yet at 0.1A/dm
2with next, cannot separate out good gold-palldium alloy, 100A/dm
2below there is easy generation outward appearance to burn the tendency cracked with epithelium.Gold-palldium alloy plating liquid of the present invention can contain conducting salt and buffer reagent etc.For example, can use the inorganic salt such as vitriol, phosphoric acid salt, nitrate, muriate, and the organic carboxyl acid such as lactic acid, citric acid, oxysuccinic acid with and salt, the organic phosphoric acids such as HEDP with and the more than a kind of salt.
The present invention also provides a kind of electronic component, and having by above-mentioned non-cyanogen is the plating epithelium of the formed gold-palldium alloy of gold-palldium alloy solution and coating method.
[effect of invention]
According to the present invention, even if be the plating liquid of non-cyanogen system, also can form outward appearance good, can suppress the plating epithelium of the gold-palldium alloy of the defect such as cracked.
Embodiment
Below, with regard to embodiments of the present invention, with reference to embodiment, explain orally in detail.
Table 1 means that the plating of studying in present embodiment forms.
Table 1 is to use chlorination auric acid as solubility gold salt, uses four hydrazine dichloride palladiums as soluble palladium salt.Use ammonium sulfate, ammonium chloride, tertiary sodium phosphate, SODIUM PHOSPHATE, MONOBASIC, Tripotassium phosphate, potassium primary phosphate, ammonium phosphate, dipotassium hydrogen phosphate, Sodium Nitrite, sodium-chlor as conducting salt, buffer reagent, misfit agent and outward appearance adjusting agent, use 5,5-dimethyl wallantoin, as wallantoin compound, is used potassium tellurite, potassium selenite as tellurium, selenium.
[table 1]
The evaluation of each plating liquid shown in relevant table 1 is to carry out in the following manner.
With regard to plating condition, liquid pH is with potassium hydroxide and sodium hydroxide, sulfuric acid adjustment, makes pH7.0, and the temperature of plating liquid makes 60 ℃.Current density makes 0.1 to 10A/dm
2.Test film is that the Cu test sample plate processed of bottoming plating (strike plating) is carried out in use through Ni and Au, and forming thickness is the plating epithelium of 0.5 μ m to 1.0 μ m.
The assessment item of each plating liquid is separated out ratio for investigating the Pd that separates out outward appearance, plating epithelium of plating epithelium.With regard to separating out outward appearance, be to confirm the plating epithelium after plating by visual and metaloscope, carry out ocular estimate.In addition, to separate out ratio be to use fluorescent X-ray film thickness gauge (SFT-9550) to measure to the Pd of plating epithelium.The evaluation result of each electroplate liquid is in Table 2.
[table 2]
Secondly, the result of study of the high speed plating of relevant high current density is described.High speed plating Processing Test is that current density changes to 10 to 60A/dm by the plating liquid of the embodiment 7 of use table 1
2, form the thick plating epithelium of 0.5 μ m and carry out.Condition is that plating liquid measure is 2L, and liquid temperature is 45 ℃, and flow is about 15L/min, and the Cu test sample plate processed of bottoming plating is carried out in use through Ni and Au.In addition, as the assessment item of high speed plating, be the outward appearance of separating out of investigation plating epithelium, the plated thickness of plating epithelium, Pd separates out ratio.It the results are shown in Table 3.60A/dm
2time obtained burning sensation slightly, but the epithelium of no problem in practical.
[table 3]
| Electric current (A/dm 2) | Thickness (μ m) | Pd separates out ratio (%) | Outward appearance |
| 10 | 0.62 | 30 | ○ |
| 20 | 0.68 | 30 | ○ |
| 30 | 0.70 | 31 | ○ |
| 40 | 0.82 | 33 | ○ |
| 50 | 0.72 | 37 | ○ |
| 60 | 0.61 | 34 | ▲ |
[utilizability in industry]
According to the present invention, even if be gold-palldium alloy plating liquid of non-cyanogen system, also can form outward appearance good, and the plating epithelium of gold-palldium alloy of being suppressed of the defect such as cracked.In addition,, by changing the concentration in plating liquid, the plating that can corresponding carry out with low current density is to the high speed plating of high current density.
Claims (6)
1. non-cyanogen is gold-palldium alloy plating liquid, it is characterized in that, and in the non-cyanogen that contains golden salt, palladium salt, outward appearance adjusting agent, be in gold-palldium alloy plating liquid, contain the phosphoric acid salt as outward appearance adjusting agent, with wallantoin based compound.
2. non-cyanogen according to claim 1 is gold-palldium alloy plating liquid, it is characterized in that, also contains the more than a kind of tellurium and/or selenium.
3. non-cyanogen according to claim 1 and 2 is gold-palldium alloy plating liquid, it is characterized in that, also contains palladium misfit agent, and described palladium misfit agent is any of amine compound, ammonium salt.
4. non-cyanogen according to claim 1 and 2 is gold-palldium alloy plating liquid, it is characterized in that, as the phosphoric acid salt of outward appearance adjusting agent, with phosphoric acid, is scaled 0.1g/L to 150g/L, and tellurium and/or selenium are 0.001g/L to 10g/L.
5. non-cyanogen is gold-palldium alloy solution and coating method, it is characterized in that, using the non-cyanogen as described in any one in claim 1 to 4 is gold-palldium alloy plating liquid, and in 25 ℃ to 80 ℃ of liquid temperatures, current density 0.1 is to 100A/dm
2condition carry out plating.
6. an electronic component, is characterized in that, having by the non-cyanogen described in claim 5 is the plating epithelium of the formed gold-palldium alloy of gold-palldium alloy solution and coating method.
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| JP2012191178A JP5758361B2 (en) | 2012-08-31 | 2012-08-31 | Non-cyanide gold-palladium alloy plating solution and plating method |
| JP2012-191178 | 2012-08-31 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106283141A (en) * | 2016-08-11 | 2017-01-04 | 江捷新 | Bullion rose golden surface processes plating solution, preparation method and electro-plating method thereof |
| CN108950617A (en) * | 2018-07-11 | 2018-12-07 | 广州传福化学技术有限公司 | A kind of Zinc-nickel alloy electroplating liquid and its electroplating technology containing tellurium |
| CN109477233A (en) * | 2016-06-06 | 2019-03-15 | 联邦科学和工业研究组织 | The method of Pd-Au alloy-layer is formed on substrate |
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| CN108950617A (en) * | 2018-07-11 | 2018-12-07 | 广州传福化学技术有限公司 | A kind of Zinc-nickel alloy electroplating liquid and its electroplating technology containing tellurium |
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| Publication number | Publication date |
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| JP2014047394A (en) | 2014-03-17 |
| TW201408824A (en) | 2014-03-01 |
| JP5758361B2 (en) | 2015-08-05 |
| CN103668360B (en) | 2016-08-10 |
| TWI558858B (en) | 2016-11-21 |
| KR101546009B1 (en) | 2015-08-20 |
| KR20140029148A (en) | 2014-03-10 |
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