CN103665323A - Novel latent curing agent of epoxy resin - Google Patents

Novel latent curing agent of epoxy resin Download PDF

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Publication number
CN103665323A
CN103665323A CN201310563913.XA CN201310563913A CN103665323A CN 103665323 A CN103665323 A CN 103665323A CN 201310563913 A CN201310563913 A CN 201310563913A CN 103665323 A CN103665323 A CN 103665323A
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CN
China
Prior art keywords
curing agent
epoxy resin
latent curing
neo
promotor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310563913.XA
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Chinese (zh)
Inventor
黄文成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN TRUETIME COMPOSITE MATERIAL Co Ltd
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KUNSHAN TRUETIME COMPOSITE MATERIAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by KUNSHAN TRUETIME COMPOSITE MATERIAL Co Ltd filed Critical KUNSHAN TRUETIME COMPOSITE MATERIAL Co Ltd
Priority to CN201310563913.XA priority Critical patent/CN103665323A/en
Publication of CN103665323A publication Critical patent/CN103665323A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

The invention discloses a novel latent curing agent of epoxy resin. The novel latent curing agent comprises the following components in percentage by weight: 45-55% of a curing agent, 10-20% of a modified imidazole accelerator, 5-10% of aluminum powder, 5-10% of asbestos powder, 10-20% of a toughening agent and 5-10% of a diluent, wherein the curing agent is dicyandiamide, organic hydrazide or aromatic amine, the toughening agent is nitrile rubber or polysulfide rubber, and the diluent is ethanol, acetone or ethylene glycol-ether. The curing agent disclosed by the invention is low in curing temperature, good in storage stability, low in viscosity, high in toughness, good in mechanical properties, low in toxicity, high pressure resistant, corrosion resistant, small in shrinkage deformation, wide in application range and is especially suitable for such industries as winding and pultrusion of insulating composite materials.

Description

A kind of neo-epoxy resin latent curing agent
Technical field:
The present invention relates to solidifying agent technical field, particularly a kind of novel epoxy resin lalent solidifying agent.
Background technology:
In the prior art, polyamide resin be mostly at present both at home and abroad conventional room temperature curing type based on epoxy resin bonding.But the curing reaction speed of this conventional adhesive is slower, inapplicable sharp work, cannot meet the quick-binding of building trade, the many-sided demands such as quick embedding location on mechanical electric apparatus industry production streamline.
Dyhard RU 100, organic hydrazides or aromatic amine during separately as solidifying agent solidification value high, and the shelf lives is very short.Glyoxaline compound can be used as the promotor of solidifying agent, and its usage quantity is few, just can cured epoxy resin in the middle temperature short period of time, but it is dystectic crystallization, mix difficulty with liquid-state epoxy resin, have certain volatility and water absorbability, to operating procedure, make troubles.
Summary of the invention:
The object of this invention is to provide a kind of neo-epoxy resin latent curing agent, the promotor in this solidifying agent is modified imidazole class promotor, and the solidification value of solidifying agent is low, good toughness, low toxicity, shrinkage strain is little, be widely used, particularly insulating composite material is wound around and the industry such as pultrusion.
For achieving the above object, neo-epoxy resin latent curing agent of the present invention comprises following composition by weight percentage: solidifying agent 45~55%, modified imidazole class promotor 10~20%, aluminium powder 5~10%, asbestos powder 5~10%, toughner 10~20%, thinner 5~10%.
As technique scheme preferably, described solidifying agent is Dyhard RU 100, organic hydrazides or aromatic amine.
As technique scheme preferably, described modified imidazole class promotor is to take Lewis acid as catalyzer, by imidazoles, reacts with alcohol, reacts 10h make imidazoles promotor at approximately 100 ℃.
As technique scheme preferably, described toughner is paracril or thiorubber.
As technique scheme preferably, described thinner is ethanol, acetone or glycol-ether.
Beneficial effect of the present invention is: it adds modified imidazole class promotor in Dyhard RU 100, organic hydrazides or aromatic amine curing agent is promotor.Modified imidazole class promotor is colourless transparent liquid, good with the intermiscibility of epoxy resin, acid anhydride type curing agent, and batching is long rear working life, and cured article has good electric property and mechanical property, and can reduce solidification value, shortens set time.Selecting paracril or thiorubber is toughner, and ethanol, acetone or glycol-ether are thinner, can strengthen the toughness of solidifying agent, the solidification value of the neo-epoxy resin latent curing agent therefore obtaining is low, storage stability is good, and viscosity is low, and toughness is high, there is good mechanical property, low toxicity, high pressure resistant, corrosion-resistant, shrinkage strain is little, be widely used, particularly insulating composite material is wound around and the industry such as pultrusion.
Embodiment:
Embodiment mono-:
Percentage meter by weight, the component of neo-epoxy resin latent curing agent and proportioning are: solidifying agent 45%, modified imidazole class promotor 15%, aluminium powder 8%, asbestos powder 8%, toughner 16%, thinner 8%.Solidifying agent is Dyhard RU 100, and modified imidazole class promotor is to take Lewis acid as catalyzer, by imidazoles, reacts with alcohol, at approximately 100 ℃ of reaction 10h, makes imidazoles promotor.Toughner is paracril.Thinner is ethanol.
Embodiment bis-:
Percentage meter by weight, the component of neo-epoxy resin latent curing agent and proportioning are: solidifying agent 50%, modified imidazole class promotor 20%, aluminium powder 5%, asbestos powder 5%, toughner 15%, thinner 5%.Solidifying agent is organic hydrazides; Modified imidazole class promotor is to take Lewis acid as catalyzer, by imidazoles, reacts with alcohol, at approximately 100 ℃ of reaction 10h, makes imidazoles promotor; Toughner is paracril; Thinner is acetone.
Embodiment tri-:
Percentage meter by weight, the component of neo-epoxy resin latent curing agent and proportioning are: solidifying agent 55%, modified imidazole class promotor 10%, aluminium powder 7%, asbestos powder 7%, toughner 11%, thinner 10%.Solidifying agent is aromatic amine; Modified imidazole class promotor is to take Lewis acid as catalyzer, by imidazoles, reacts with alcohol, at approximately 100 ℃ of reaction 10h, makes imidazoles promotor.Toughner is thiorubber.Described thinner is glycol-ether.
The foregoing is only embodiments of the invention; not thereby limit the scope of the invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.

Claims (5)

1. a neo-epoxy resin latent curing agent, is characterized in that comprising by weight percentage following composition: solidifying agent 45~55%, modified imidazole class promotor 10~20%, aluminium powder 5~10%, asbestos powder 5~10%, toughner 10~20%, thinner 5~10%.
2. neo-epoxy resin latent curing agent according to claim 1, is characterized in that: described solidifying agent is Dyhard RU 100, organic hydrazides or aromatic amine.
3. neo-epoxy resin latent curing agent according to claim 1, is characterized in that: described modified imidazole class promotor is to take Lewis acid as catalyzer, by imidazoles, reacts with alcohol, at approximately 100 ℃ of reaction 10h, makes imidazoles promotor.
4. neo-epoxy resin latent curing agent according to claim 1, is characterized in that: described toughner is paracril or thiorubber.
5. neo-epoxy resin latent curing agent according to claim 1, is characterized in that: described thinner is ethanol, acetone or glycol-ether.
CN201310563913.XA 2013-11-14 2013-11-14 Novel latent curing agent of epoxy resin Pending CN103665323A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310563913.XA CN103665323A (en) 2013-11-14 2013-11-14 Novel latent curing agent of epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310563913.XA CN103665323A (en) 2013-11-14 2013-11-14 Novel latent curing agent of epoxy resin

Publications (1)

Publication Number Publication Date
CN103665323A true CN103665323A (en) 2014-03-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105778050A (en) * 2016-03-25 2016-07-20 南通市福来特化工有限公司 Epoxy resin curing agent
CN111116870A (en) * 2019-12-31 2020-05-08 浙江华正新材料股份有限公司 Latent resin composition, prepreg and epoxy composite material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0057325A1 (en) * 1980-12-31 1982-08-11 Mobil Oil Corporation Epoxy-coating composition containing a hardener and an accelerator
US4420605A (en) * 1980-12-31 1983-12-13 Mobil Oil Corporation Coating compositions having dual curing mechanisms
US4742148A (en) * 1987-04-17 1988-05-03 Hexcel Corporation Modified imidazole latent epoxy resin catalysts and systems comprising them

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0057325A1 (en) * 1980-12-31 1982-08-11 Mobil Oil Corporation Epoxy-coating composition containing a hardener and an accelerator
US4420605A (en) * 1980-12-31 1983-12-13 Mobil Oil Corporation Coating compositions having dual curing mechanisms
US4742148A (en) * 1987-04-17 1988-05-03 Hexcel Corporation Modified imidazole latent epoxy resin catalysts and systems comprising them

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
刘全文等: "咪唑类环氧树脂固化剂研究进展", 《国外建材科技》 *
娄春华等: "有机酸改性咪唑环氧树脂固化促进剂的研究", 《化学与黏合》 *
娄春华等: "有机酸改性咪唑环氧树脂固化促进剂的研究", 《化学与黏合》, vol. 32, no. 2, 31 December 2010 (2010-12-31), pages 31 - 34 *
许文英等: "改性咪唑的合成及其促进EP/己二酰肼固化体系的研究", 《中国胶粘剂》 *
许文英等: "改性咪唑的合成及其促进EP/己二酰肼固化体系的研究", 《中国胶粘剂》, vol. 19, no. 11, 20 November 2010 (2010-11-20) *
陈也白: "环氧固化咪唑类促进剂BMI", 《上海化工》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105778050A (en) * 2016-03-25 2016-07-20 南通市福来特化工有限公司 Epoxy resin curing agent
CN111116870A (en) * 2019-12-31 2020-05-08 浙江华正新材料股份有限公司 Latent resin composition, prepreg and epoxy composite material
CN111116870B (en) * 2019-12-31 2023-12-26 浙江华正新材料股份有限公司 Latent resin composition, prepreg and epoxy composite material

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