CN103660540B - Electronic device printing equipment - Google Patents
Electronic device printing equipment Download PDFInfo
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- CN103660540B CN103660540B CN201210362945.9A CN201210362945A CN103660540B CN 103660540 B CN103660540 B CN 103660540B CN 201210362945 A CN201210362945 A CN 201210362945A CN 103660540 B CN103660540 B CN 103660540B
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- ink
- electronic
- printing
- substrate
- printing ink
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- 238000007639 printing Methods 0.000 title claims abstract description 147
- 230000007246 mechanism Effects 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 8
- 230000009471 action Effects 0.000 claims description 14
- 238000010586 diagram Methods 0.000 claims description 13
- 230000033001 locomotion Effects 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 239000002105 nanoparticle Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910000846 In alloy Inorganic materials 0.000 claims description 2
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 2
- 230000001276 controlling effect Effects 0.000 claims 4
- 229910000807 Ga alloy Inorganic materials 0.000 claims 1
- WGCXSIWGFOQDEG-UHFFFAOYSA-N [Zn].[Sn].[In] Chemical compound [Zn].[Sn].[In] WGCXSIWGFOQDEG-UHFFFAOYSA-N 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000002360 preparation method Methods 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000000976 ink Substances 0.000 description 130
- 239000008187 granular material Substances 0.000 description 32
- 239000007789 gas Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004886 process control Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- RHKSESDHCKYTHI-UHFFFAOYSA-N 12006-40-5 Chemical compound [Zn].[As]=[Zn].[As]=[Zn] RHKSESDHCKYTHI-UHFFFAOYSA-N 0.000 description 1
- LLYXJBROWQDVMI-UHFFFAOYSA-N 2-chloro-4-nitrotoluene Chemical compound CC1=CC=C([N+]([O-])=O)C=C1Cl LLYXJBROWQDVMI-UHFFFAOYSA-N 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001006 Constantan Inorganic materials 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229920001167 Poly(triaryl amine) Polymers 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000691 Re alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000006011 Zinc phosphide Substances 0.000 description 1
- YRXWPCFZBSHSAU-UHFFFAOYSA-N [Ag].[Ag].[Te] Chemical compound [Ag].[Ag].[Te] YRXWPCFZBSHSAU-UHFFFAOYSA-N 0.000 description 1
- NDXSUDIGSOJBLQ-UHFFFAOYSA-N [In][Bi][Zn][Sn] Chemical compound [In][Bi][Zn][Sn] NDXSUDIGSOJBLQ-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- CZJCMXPZSYNVLP-UHFFFAOYSA-N antimony zinc Chemical compound [Zn].[Sb] CZJCMXPZSYNVLP-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- KBPGBEFNGHFRQN-UHFFFAOYSA-N bis(selanylidene)tin Chemical compound [Se]=[Sn]=[Se] KBPGBEFNGHFRQN-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- MPZNMEBSWMRGFG-UHFFFAOYSA-N bismuth indium Chemical compound [In].[Bi] MPZNMEBSWMRGFG-UHFFFAOYSA-N 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007640 computer printing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- KDSXXMBJKHQCAA-UHFFFAOYSA-N disilver;selenium(2-) Chemical compound [Se-2].[Ag+].[Ag+] KDSXXMBJKHQCAA-UHFFFAOYSA-N 0.000 description 1
- 238000005441 electronic device fabrication Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- YTHCQFKNFVSQBC-UHFFFAOYSA-N magnesium silicide Chemical compound [Mg]=[Si]=[Mg] YTHCQFKNFVSQBC-UHFFFAOYSA-N 0.000 description 1
- 229910021338 magnesium silicide Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- -1 methylsiloxane Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 238000010428 oil painting Methods 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- HOKBIQDJCNTWST-UHFFFAOYSA-N phosphanylidenezinc;zinc Chemical compound [Zn].[Zn]=P.[Zn]=P HOKBIQDJCNTWST-UHFFFAOYSA-N 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- DECCZIUVGMLHKQ-UHFFFAOYSA-N rhenium tungsten Chemical compound [W].[Re] DECCZIUVGMLHKQ-UHFFFAOYSA-N 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- GGYFMLJDMAMTAB-UHFFFAOYSA-N selanylidenelead Chemical compound [Pb]=[Se] GGYFMLJDMAMTAB-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- VDNSGQQAZRMTCI-UHFFFAOYSA-N sulfanylidenegermanium Chemical compound [Ge]=S VDNSGQQAZRMTCI-UHFFFAOYSA-N 0.000 description 1
- GKCNVZWZCYIBPR-UHFFFAOYSA-N sulfanylideneindium Chemical compound [In]=S GKCNVZWZCYIBPR-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- ALRFTTOJSPMYSY-UHFFFAOYSA-N tin disulfide Chemical compound S=[Sn]=S ALRFTTOJSPMYSY-UHFFFAOYSA-N 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229940048462 zinc phosphide Drugs 0.000 description 1
Landscapes
- Ink Jet (AREA)
Abstract
The invention provides a kind of device that electronic device can be manufactured in the way of directly printing.This electronic device printing equipment includes controller, print cartridge array mechanism and substrate-loading mechanism, wherein: described controller, is used for controlling described print cartridge array mechanism and described substrate-loading mechanism；Described print cartridge array mechanism, is used for providing electronic printing ink, and utilizes described electronic printing ink to carry out electronic printing；Described substrate-loading mechanism, is used for carrying electronic substrate.This device is the highest to environmental requirement, can significantly reduce the complexity of electronic device preparation technology, and reduce material consumption and pollution, improves make efficiency.
Description
Technical field
The present invention relates to electronic device manufacturing technology field, can be by electronic device particularly to one
The device directly printing out.
Background technology
Electronic device is typically made up of, in substantial amounts of research conductor, quasiconductor and insulant etc.
Extremely wide application is had with industrial technical field.Manufacturing and designing of electronic device is also always
The research core of electronics industry.Up to now, the processing of electronic device is continued to use very always
Complicated manufacturing process is carried out, and program is considerably complicated, and energy consumption is high, seriously polluted, cleaning
Processing cost is high.Its reason is, constitutes the conduction of electronic device, quasiconductor and insulated part
General carry out by high temperature deposition or by chemical reaction process, it is desirable to process conditions higher.
Such as, an electronic device relates to the elements such as conductor, quasiconductor and insulator, existing skill
Art is still difficult to ensure that whole element all can realize by the way of directly printing；Even if some is organic
Semi-conducting material or insulant can use spraying method to print, and the printing of conductor part is all the time
It it is a bottleneck.Because conductor is generally metal such as copper, aluminum etc., its fusing point is high, to reality
Now printing, it is necessary to first melted and spray at very high temperatures, this obviously can be to device
On low melting point organic semiconducting materials so that substrate damage, thus, this kind printing approach
The probability realized is less.
If it is envisioned that the whole manufacturing process of electronic device can be carried out in the way of directly printing,
Then will be expected to realize manufacturing the most efficiently, thus significantly change electronics and related industries
Present situation, until set up efficiently, the electronic device production model of greenization.
To this end, there has been proposed organic or polymer conductor material, but the electric conductivity of this kind of material
The most poor, and there is some problems in solution and impressionability；For obtaining more preferable solution,
Researchers then by organic or polymer, add that high conductivity nano-particle realizes can
The ink of printing, but the manufacture process of reality needs first to print, then by height more than hundreds of degree
Temperature makes this kind of ink that certain chemical reaction or even sintering to occur, and could finally deposit lower required leading
Body component, so, whole technique is the most considerably complicated.In a word, up to now, domestic and international work
Industry is not yet set up and rapid and simple can all be manufactured with mode of printing by electronic device
Equipment and technique.
If by electric conductivity ink, ink ductor and the insulation inks of codified with controllable
Mode is directly printed onto in substrate, just can form three-dimensional electronic device or even the combination of specific function
System, the most also can realize the three-dimensional assembling of complicated integrated circuit and system；This same
Time the complete series ink apparatus of electronic device printing given three-dimensional electricity that is integrated and that be uniformly controlled
Sub-device fabrication techniques is expected to amplify out brand-new advanced electronics production model.
Summary of the invention
(1) technical problem to be solved
It is an object of the invention to provide and a kind of electronic device can be manufactured in the way of directly printing
Device out, to solve existing electronic device fabrication schedule complexity, high material consumption, pollution
The problem that processing cost is high.
(2) technical scheme
In order to solve above-mentioned technical problem, the present invention proposes a kind of electronic device printing equipment.
Described printing equipment includes controller, print cartridge array mechanism and substrate-loading mechanism, wherein:
Described controller, is used for controlling described print cartridge array mechanism and described substrate-loading mechanism；
Described print cartridge array mechanism, is used for providing electronic printing ink, and utilizes described electronic seal
Brush ink carries out electronic printing；
Described substrate-loading mechanism, is used for carrying electronic substrate.
Optionally, described device farther includes the computer being connected with described controller, described
Computer is used for generating printing control instruction；Described controller is for receiving the print of described computer
Brush control instruction, and control described print cartridge array mechanism and described according to described printing control instruction
Substrate-loading mechanism.
Optionally, described print cartridge array mechanism include ink carriage, electronic printing ink cartridge and
Printer's ink head, wherein:
Described ink carriage, is used for supporting described electronic printing ink cartridge；
Described electronic printing ink cartridge, is used for providing described electronic printing ink；
Described printer's ink head, for utilizing the electronic printing ink in described electronic printing ink cartridge
Carry out electronic printing.
Optionally, described electronic printing ink includes: conductive metal ink, p-type or N-type
One or many in the nano-particle doping liquid of semiconductive ink, insulating properties ink or three
Kind.
Optionally, described print cartridge array mechanism include three rows be respectively provided with conductive metal ink,
Semiconductive ink and the described electronic printing ink cartridge of insulating properties ink, and often row have one or
Multiple described electronic printing ink cartridges.
Optionally, the inwall of described electronic printing ink cartridge is disposed with heating wire and thermocouple, uses
In the internal temperature of the described electronic printing ink cartridge of regulation and control, described electronic printing ink is made to keep liquid
State.
Optionally, described device farther includes the air-pot being connected with described controller, described
Air-pot is for providing pressed gas for described controller；Described controller passes through air inlet pipe and institute
State electronic printing ink cartridge to be connected, and provide pressed gas for described electronic printing ink cartridge.
Optionally, described device farther includes electromagnetic valve, and described electromagnetic valve is positioned at described air inlet
Pipe and the junction of described electronic printing ink cartridge, be used for controlling pressed gas in described air inlet pipe
Break-make.
Optionally, described substrate-loading mechanism farther includes substrate-loading platform and three-dimensional transmission
Parts, wherein:
Described substrate-loading platform, is used for carrying described electronic substrate；
Described three-dimensional drive disk assembly, is used for producing power and promotes described substrate-loading platform to carry out
Under, front and back with the three-dimensional motion of left and right.
Optionally, described print cartridge array mechanism farther includes the machinery being connected with described controller
Arm, described mechanical arm is used for controlling described electronic printing ink cartridge and carries out electronic printing.
(3) beneficial effect
The electronic device printing equipment that the present invention proposes, owing to introducing electronic printing ink, makes
Whole electronic device directly manufactures in the way of a kind of printing, preparation process at room temperature and
Can complete under normal condition, the highest to environmental requirement, the invalid loss of material is low, can significantly drop
Low electronic device and the complexity of integrated preparation technology thereof and cost, increase substantially it and make effect
Rate.The electronic device using the method to obtain, can be widely used for all trades and professions, particularly develops
Flexible electronic technology.The most expansible the directly printing for other types photoelectric device of this technology.
Accompanying drawing explanation
Fig. 1 is the structural representation of the electronic device printing equipment in one embodiment of the present invention.
Fig. 2 is the schematic diagram of the ink cartridge array in one embodiment of the present invention.
Fig. 3 is the structural representation of the electronic printing ink cartridge in one embodiment of the present invention.
Fig. 4 is the structural representation of the printer's ink head in one embodiment of the present invention.
Fig. 5 is the schematic diagram of the substrate-loading platform in one embodiment of the present invention.
Fig. 6 is the structural representation of the electronic device printing equipment in another embodiment of the present invention
Figure.
Fig. 7 is the structural representation of the litter mechanism in another embodiment of the present invention.
Fig. 8 is the structural representation of the electronic device printing equipment in another embodiment of the present invention
Figure.
Detailed description of the invention
The present invention proposes a kind of electronic device printing equipment.Described printing equipment include controller,
Print cartridge array mechanism and substrate-loading mechanism, wherein:
Described controller, is used for controlling described print cartridge array mechanism and described substrate-loading mechanism；
Described print cartridge array mechanism, is used for providing electronic printing ink, and utilizes described electronic seal
Brush ink carries out electronic printing；
Described substrate-loading mechanism, is used for carrying electronic substrate.
Above-mentioned electronic substrate can be fixed on by modes such as adhesive gel, snap close or generation negative pressure
On substrate-loading mechanism；Substrate be chosen as plastics, rubber, silicon, glass, silk fabrics, poly-two
At least one in methylsiloxane (PDMS), pottery, paper.
Optionally, described device farther includes the computer being connected with described controller, described
Computer is used for generating printing control instruction；Described controller is for receiving the print of described computer
Brush control instruction, and control described print cartridge array mechanism and described according to described printing control instruction
Substrate-loading mechanism.
Further, above computer is built-in with print control program, possesses Electronic Design automatic
Change function.Print control program farther includes circuit diagram drafting module and printing process controls mould
Block；Circuit diagram drafting module, for drawing the circuit diagram of electronic device to be printed, printed
Process control module generates printing control instruction according to described circuit diagram, and printing control instruction is sent out
Give controller.Its concrete function is described below:
Circuit diagram drafting module: the electronic component module data base that software has prestored common, uses
Family can call this data base in graphic interface, can also the most directly draw simultaneously
Go out the two dimension of the various complexity being made up of point, line, surface or the circuit components module of three-dimensional.With
Family must determine the size (such as live width and line length etc.) of each electronic devices and components and material properties (as
Conducting metal ink or insulation inks etc.).User combines various component modules, i.e. shape
Circuit diagram needed for one-tenth.
Printing process control module: software reads the circuit diagram that user draws, according to electronics unit device
Mutual alignment between part, Spatial infrastructure, generate each components and parts print order control instruction；Root
According to material properties and the size of electronic devices and components, generate print cartridge select and action directive (as
Ink head travel speed control etc.).Additionally, software also can monitor printing process in real time, can ring in time
Answer the warning that printing equipment is sent, and feed back corresponding control instruction.As sent out when printing equipment
Going out " ink " when being finished warning, software can suspend printing in time, waits that user changes print cartridge.
Optionally, described print cartridge array mechanism include ink carriage, electronic printing ink cartridge and
Printer's ink head, wherein:
Described ink carriage, is used for supporting described electronic printing ink cartridge；
Described electronic printing ink cartridge, is used for providing described electronic printing ink；
Described printer's ink head, for utilizing the electronic printing ink in described electronic printing ink cartridge
Carry out electronic printing.
The form of above-mentioned printer's ink head typically uses pin-hole type or brush type.
Optionally, described electronic printing ink includes: conductive metal ink, p-type or N-type
One or many in the nano-particle doping liquid of semiconductive ink, insulating properties ink or three
Kind.
Above-mentioned conductive metal ink include gallium, gallium-indium alloy, gallium ashbury metal, indium stannum alloy,
One or more in gallium-indium-tin alloy, gallium indium tin kirsite, gallium indium tin zinc bismuth alloy；P-type
Or N-type semiconductor ink includes rubrene rubrene, Benzo[b pentacene, poly-3-hexyl
Thiophene P3HT, poly-3,3 '-dialkyl group connect four thiophene PQT, poly-3 arylamine PTAA, trapezoidal poly-
One or more in compound BBL；Insulating properties ink includes polystyrene, polyimides, gathers
One or more in vinyl alcohol, polymethyl methacrylate, polyvinyl phenol.
Nano-particle in above-mentioned doping liquid can be selected for the platinum of particle diameter 1nm～900nm, gold,
Silver, copper, ferrum, aluminum, antimony, bismuth, cadmium, germanium, nickel, rhodium, tantalum, lead, tungsten, rhenium, constantan,
Tungsten-rhenium alloy, nickel-cadmium, CNT or Graphene；Or select germanium sulfide granule, selenium
Change germanium granule, telluride germanium granule, bismuth indium granule, indium arsenide granule, indium antimonide granule, oxygen
Change indium granule, indium phosphide granule, GaAs granule, gallium phosphide granule, indium sulfide granule, selenium
Change indium granule, indium tin oxide particles, telluride indium granule, particles of lead oxide, vulcanized lead granule,
Lead selenide granule, lead telluride granule, magnesium silicide granule, granules of stannic oxide, stannic chloride granule,
Tin disulfide granule, Tin diselenide. granule, telluride tin particles, Argentous sulfide. granule, silver selenide granule,
Silver telluride granule, tellurium oxide granule, Zinc oxide particles, zinc arsenide granule, zinc antimonide granule,
Zinc phosphide granule, zns particle, cadmium sulfide granule, boron oxide granule, zinc selenide granule or
Zinc telluridse granule etc..
Optionally, described print cartridge array mechanism include three rows be respectively provided with conductive metal ink,
Semiconductive ink and the described electronic printing ink cartridge of insulating properties ink, and often row have one or
Multiple described electronic printing ink cartridges.
Preferably, the inwall of described electronic printing ink cartridge is disposed with heating wire and thermocouple, uses
In the internal temperature of the described electronic printing ink cartridge of regulation and control, described electronic printing ink is made to keep liquid
State.
In the present invention, the type of drive of electronic printing ink may select gas pressure boosting, piezoelectricity/quiet
One in the driving of electric drive, motor/Electromagnetic Drive, thermal bubble type.
Optionally, when using the ink type of drive of gas pressure boosting, described device enters one
Step includes the air-pot being connected with described controller, and described air-pot is for carrying for described controller
For pressed gas；Described controller is connected with described electronic printing ink cartridge by air inlet pipe,
And provide pressed gas for described electronic printing ink cartridge.
Preferably, described device farther includes electromagnetic valve, and described electromagnetic valve is positioned at described air inlet
Pipe and the junction of described electronic printing ink cartridge, be used for controlling pressed gas in described air inlet pipe
Break-make.
Optionally, described substrate-loading mechanism farther includes substrate-loading platform and three-dimensional transmission
Parts, wherein:
Described substrate-loading platform, is used for carrying described electronic substrate；
Described three-dimensional drive disk assembly, is used for producing power and promotes described substrate-loading platform to carry out
Under, front and back with the three-dimensional motion of left and right.
Optionally, described print cartridge array mechanism farther includes the machinery being connected with described controller
Arm, described mechanical arm is used for controlling described electronic printing ink cartridge and carries out electronic printing.
Below in conjunction with the accompanying drawings, the detailed description of the invention to the present invention is made further to illustrate.
In one embodiment of the invention, printing equipment uses printer's ink head the most one-dimensional
Mobile, and substrate can move the structure of printing up and down, front and back with left and right three-dimensional.As it is shown in figure 1,
Electronic device printing equipment includes: be built-in with the computer 1 of print control program, air-pot 2,
Controller 3, print cartridge array mechanism and substrate-loading mechanism.Wherein, controller 3 is used for receiving
The printing control instruction of computer 1, and control print cartridge array computer according to described printing control instruction
Structure and the movement of substrate-loading mechanism and operation；Print cartridge array mechanism includes ink carriage 41, electricity
Sub-printing ink box 42 and printer's ink head 43, and the attribute of ink cartridge 42 and address all can give
With coding；Substrate-loading mechanism includes substrate-loading platform 51 and base 52, and base 52 is used for
Carry substrate-loading platform 51.
As it is shown in figure 1, print cartridge array mechanism includes ink carriage 41, electronic printing ink cartridge 42
And printer's ink head 43.As in figure 2 it is shown, ink carriage 41 is used for carrying ink cartridge array；Ink
Water box array is filled conductive metal ink, ink ductor and insulation inks respectively by three rows
Multiple cylindrical ink boxes 42 form.As it is shown on figure 3, the inwall of each ink cartridge 42 is arranged
There are heating wire 44 and thermocouple 45, in order to control temperature in print cartridge, make electronic printing ink in room
Liquid is kept under temperature environment.The bottom of ink cartridge 42 is connected with printer's ink head 43.Such as Fig. 4 institute
Showing, printer's ink head 43 can have various ways, including pen-type pencil type apparatus, ball pen type pen
Type device, printing equipment or spray nozzle type pencil type apparatus, and brush pen, oil painting brush or paintbrush etc.
Brush.Printer's ink head 43 can be along the vertical upper and lower one-dimensional movement of Z-direction.When a certain ink cartridge
During 42 selected execution printing action, coupled printer's ink head 43 can move down certain distance
(set by user's request) so that it is contact with electronic substrate or keep slight distance (depending on
Set by ink attribute)；When ink cartridge 42 time-out printing action, printer's ink head 43 moves on to
In situ.Print cartridge top is connected with thread forms with ink box cover.Air inlet on ink box cover and pressure
Gas is connected, and controls to be turned off and on state by electromagnetic valve.Controller 3 regulates from gas
The pressure of gas in pressure bottle 2, and by air inlet pipe, pressed gas is sent to ink cartridge 42, from
And make ink be extruded printer's ink head 43, and stick in substrate.
Above-mentioned substrate-loading mechanism, in addition to including substrate-loading platform 51 and base 52, also includes
One three-dimensional drive disk assembly.Described three-dimensional drive disk assembly can produce power and promote substrate-loading platform
51 precisely translate along tri-directions of X, Y and Z.Described Z-direction is vertically upward and downward directions,
Distance between mobile controllable ink head and the substrate of Z-direction, in order to printing；X-direction is level
Left and right directions, Y-direction is that the movement of direction before and after level, X and Y-direction can make accordingly
Black head in substrate, print out corresponding electronic devices and components by setup program.As it is shown in figure 5,
Electronic substrate can be fixed on substrate-loading by the way of adhesive gel, snap close or generation negative pressure
On platform 51.Print cartridge array mechanism is that the former is positioned at the latter with the mutual alignment of substrate-loading mechanism
Top, is connected to form one by connecting rod.
The printing process of above-mentioned electronic device printing equipment mainly comprises the steps that
The circuit diagram of the electronic device to be printed that S1, computer 1 are drawn according to user, raw
Become printing control instruction；
S2, controller 3, according to printing control instruction, control print cartridge array mechanism and substrate-loading
The movement of mechanism and location；
S3, by gas pressure boosting, electronic printing ink is extruded printer's ink head 43, and glues
It is attached in electronic substrate.
In step sl, user is by possessing the computer printing control of electric design automation function
Processing procedure sequence, draws out oneself required circuit diagram in software, and control is printed in generation accordingly
Instruction.
In step s 2, user connects circuit, adjusts substrate-loading platform and print by software
Position between brush ink head, recalls printing control instruction, starts printing process.Printing process
In, work ink head is commanded control and moves up and down, and substrate-loading platform does not stops according to instruction simultaneously
Ground is mobile, it is achieved the location between substrate and work ink head, in order to print out corresponding electronics unit
Device, thus the circuit diagram set by being formed.
Above-mentioned electronic devices and components can be combined as required, thus forms the integrated of specific function
Circuit.
To be printed complete, user closes print routine by software, then cuts off device power supply (DPS).
In another embodiment of the invention, printing equipment uses printer's ink head three-dimensional to move
Dynamic structure.As shown in Figure 6, electronic device printing equipment includes: computer 1, air-pot 2,
Controller 3, print cartridge array mechanism 4, substrate-loading mechanism and litter mechanism.Wherein, print cartridge
Array mechanism 4 includes ink carriage, electronic printing ink cartridge and printer's ink head；Substrate-loading machine
Structure includes substrate-loading platform 51 and base 52.
Ferrum concave station is had on the ink box cover of above-mentioned electronic printing ink cartridge.The Z litter 64 of litter mechanism
End has electromagnet boss.By cooperating of ferrum concave station and electromagnet boss, realize ink
The actions such as the movement of box, location.Air inlet on ink box cover is connected with pressed gas, passes through
Electromagnetic valve controls to be turned off and on state.Controller 3 regulates the pressure of gas in air-pot 2
Power, and by air inlet pipe, pressed gas is sent to ink cartridge, so that ink is extruded printing
Ink head, and stick in substrate.
As shown in Figure 6,7, it includes that 61, three, litter frame can edge respectively in described litter mechanism
X, Y, the litter of Z-direction motion (be called for short X litter 62 respectively, slide by Y litter 63 and Z
Pole 64) and slide block 65.The effect of litter frame 61 is fixing litter position.Three litter can
Controlled making translational motion.X litter 62 and Y litter 63 edge respectively under the drive of slide block 65
When X, Y-direction motion, Z litter 64 can be driven to move along corresponding direction.And Z is sliding
Pole 64 itself has the function moved along vertical Z-direction.Z litter 64 end is equipped with electricity
Magnet boss, this boss energizing magnetic, power-off i.e. loses magnetism.When performing printing action
Time, three litter move according to fixed route, so that electromagnet boss completes promptly print cartridge and (borrows
Magnetic assist), mobile print cartridge, perform printing action, return a series of actions such as print cartridge.
In the another embodiment of the present invention, electronic device printing equipment uses mechanical arm behaviour
The structure of control.As shown in Figure 8, this printing equipment includes: computer 1, air-pot 2, control
Device 3, print cartridge array mechanism 4, substrate-loading mechanism and mechanical arm.Wherein, print cartridge array computer
Structure 4 includes ink carriage, electronic printing ink cartridge and printer's ink head；Substrate-loading mechanism bag
Include substrate-loading platform 51 and base 52；Mechanical arm includes shrinking connecting-rod 71 and universal joint 72.
Ferrum concave station is had on the ink box cover of above-mentioned electronic printing ink cartridge.Connected with flexible by ferrum concave station
The electromagnet boss of bar 71 end cooperates, and realizes the actions such as the movement of print cartridge, location.
Mechanical arm includes shrinking connecting-rod 71 and universal joint 72.Shrinking connecting-rod 71 can be along pitman shaft
To movement, and universal joint 72 can regulate the direction of shrinking connecting-rod.Mechanical arm can be by control realization
Three dimensions is accurately positioned.Bottom mechanical arm, shrinking connecting-rod end is equipped with electromagnet boss, and this is convex
Platform energizing magnetic, power-off i.e. loses magnetism.When perform printing action time, mechanical arm according to
Fixed route is moved, so that electromagnet boss completes promptly print cartridge (by magnetic), mobile ink
The a series of actions such as box, execution printing action, return print cartridge.
The above embodiment is merely to illustrate the present invention, rather than limitation of the invention.Should
When pointing out, for the person of ordinary skill of the art, without departing from the technology of the present invention principle
On the premise of, it is also possible to making some improvement and replacement, these improve and replace and also should be regarded as this
The protection domain of invention.
Claims (7)
1. an electronic device printing equipment, it is characterised in that described device include controller,
Print cartridge array mechanism and substrate-loading mechanism, wherein:
Described controller, is used for controlling described print cartridge array mechanism and described substrate-loading mechanism；
Described print cartridge array mechanism, is used for providing electronic printing ink, and utilizes described electronic seal
Brush ink carries out electronic printing；
Described substrate-loading mechanism, is used for carrying electronic substrate；
Described print cartridge array mechanism includes ink carriage, electronic printing ink cartridge and printer's ink head,
Wherein:
Described ink carriage, is used for supporting described electronic printing ink cartridge；
Described electronic printing ink cartridge, is used for providing described electronic printing ink；
Described printer's ink head, for utilizing the electronic printing ink in described electronic printing ink cartridge
Carry out electronic printing；Described electronic printing ink includes: conductive metal ink, p-type or N
Type semiconductive ink, insulating properties ink or three nano-particle doping liquid in one or
Multiple；
Described conductive metal ink include gallium, gallium-indium alloy, gallium ashbury metal, indium stannum alloy,
One or more in gallium-indium-tin alloy, gallium indium tin kirsite, the secret alloy of gallium indium tin zinc；
Described device also includes the computer being connected with described controller, and described computer is used for reading
Take the circuit diagram that family is drawn, according to the mutual alignment between electronic devices and components, Spatial infrastructure,
Generate each electronic devices and components print order control instruction；Material properties according to electronic devices and components and
Size, generates electronic printing ink cartridge and selects and action directive；By described print order control
System instruction and printing ink box select and action directive sends to controller；
Described controller is used for receiving the printing control instruction of described computer, and according to described print
Brush control instruction controls described print cartridge array mechanism and described substrate-loading mechanism；
Described printing control instruction includes described print order control instruction and described printing ink box
Select and action directive.
Printing equipment the most according to claim 1, it is characterised in that described print cartridge array
Mechanism includes that three rows are respectively provided with conductive metal ink, semiconductive ink and insulating properties ink
Described electronic printing ink cartridge, and often row have one or more described electronic printing ink cartridge.
Printing equipment the most according to claim 1, it is characterised in that described electronic printing
The inwall of ink cartridge is disposed with heating wire and thermocouple, is used for regulating and controlling described electronic printing ink cartridge
Internal temperature, make described electronic printing ink keep liquid.
Printing equipment the most according to claim 1, it is characterised in that described device enters one
Step includes the air-pot being connected with described controller, and described air-pot is for carrying for described controller
For pressed gas；
Described controller is connected with described electronic printing ink cartridge by air inlet pipe, and is described
Electronic printing ink cartridge provides pressed gas.
Printing equipment the most according to claim 4, it is characterised in that described device enters one
Step includes that electromagnetic valve, described electromagnetic valve are positioned at described air inlet pipe and described electronic printing ink cartridge
Junction, for controlling the break-make of pressed gas in described air inlet pipe.
Printing equipment the most according to claim 1, it is characterised in that described substrate-loading
Mechanism farther includes substrate-loading platform and three-dimensional drive disk assembly, wherein:
Described substrate-loading platform, is used for carrying described electronic substrate；
Described three-dimensional drive disk assembly, is used for producing power and promotes described substrate-loading platform to carry out
Under, front and back with the three-dimensional motion of left and right.
Printing equipment the most according to claim 1, it is characterised in that described print cartridge array
Mechanism farther includes the mechanical arm being connected with described controller, and described mechanical arm is used for controlling institute
State electronic printing ink cartridge and carry out electronic printing.
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| CN105744748A (en) * | 2016-04-26 | 2016-07-06 | 北京梦之墨科技有限公司 | Manufacturing method and apparatus for carving type liquid metal circuit |
| CN105873370A (en) * | 2016-04-26 | 2016-08-17 | 北京梦之墨科技有限公司 | Printing method and device for inkjet and liquid metal mixed printing and product |
| CN106393967A (en) * | 2016-08-29 | 2017-02-15 | 浙江新长海新材料股份有限公司 | Automatic code imprinting machine of packaging bags |
| CN109940986B (en) * | 2017-12-20 | 2020-06-26 | 北京赛特超润界面科技有限公司 | Ink-jet printing device and method with controllable liquid conveying as patterned surface |
| CN109807907A (en) * | 2019-02-28 | 2019-05-28 | 西交利物浦大学 | Micro-nano line preparation facilities and micro-nano structure |
| CN110202941B (en) * | 2019-05-16 | 2020-07-28 | 苏州工业园区华松印务有限公司 | Ink feeding device for digital printing and using method thereof |
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