CN103660051B - 包括晶体硅在内的脆硬性材料切割用金刚线及其切割系统 - Google Patents
包括晶体硅在内的脆硬性材料切割用金刚线及其切割系统 Download PDFInfo
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- CN103660051B CN103660051B CN201210326414.4A CN201210326414A CN103660051B CN 103660051 B CN103660051 B CN 103660051B CN 201210326414 A CN201210326414 A CN 201210326414A CN 103660051 B CN103660051 B CN 103660051B
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- Prior art keywords
- diamond
- wire
- cutting
- diamond wire
- crystalline silicon
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 129
- 239000010432 diamond Substances 0.000 title claims abstract description 129
- 238000005520 cutting process Methods 0.000 title claims abstract description 82
- 239000000463 material Substances 0.000 title claims abstract description 46
- 229910021419 crystalline silicon Inorganic materials 0.000 title claims abstract description 34
- 239000006061 abrasive grain Substances 0.000 claims abstract description 37
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 33
- 239000010959 steel Substances 0.000 claims abstract description 33
- 239000002245 particle Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 45
- 229910052710 silicon Inorganic materials 0.000 claims description 45
- 239000010703 silicon Substances 0.000 claims description 45
- 239000002173 cutting fluid Substances 0.000 claims description 7
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 230000001050 lubricating effect Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 4
- 239000002210 silicon-based material Substances 0.000 description 12
- 208000037656 Respiratory Sounds Diseases 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210326414.4A CN103660051B (zh) | 2012-09-06 | 2012-09-06 | 包括晶体硅在内的脆硬性材料切割用金刚线及其切割系统 |
Applications Claiming Priority (1)
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CN201210326414.4A CN103660051B (zh) | 2012-09-06 | 2012-09-06 | 包括晶体硅在内的脆硬性材料切割用金刚线及其切割系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103660051A CN103660051A (zh) | 2014-03-26 |
CN103660051B true CN103660051B (zh) | 2015-11-18 |
Family
ID=50299428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201210326414.4A Active CN103660051B (zh) | 2012-09-06 | 2012-09-06 | 包括晶体硅在内的脆硬性材料切割用金刚线及其切割系统 |
Country Status (1)
Country | Link |
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CN (1) | CN103660051B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106695516A (zh) * | 2017-02-18 | 2017-05-24 | 湖州师范学院 | 不导电板材线切割加工机 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4092972A (en) * | 1977-02-11 | 1978-06-06 | Crystal Systems, Inc. | Process of cutting wafers |
US4384564A (en) * | 1981-01-22 | 1983-05-24 | Crystal Systems Inc. | Process of forming a plated wirepack with abrasive particles only in the cutting surface with a controlled kerf |
CN201283606Y (zh) * | 2008-08-11 | 2009-08-05 | 魏莲君 | 超细金刚石切割线 |
CN102152416A (zh) * | 2011-01-27 | 2011-08-17 | 王楚雯 | 金刚石线锯及其制备方法 |
-
2012
- 2012-09-06 CN CN201210326414.4A patent/CN103660051B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4092972A (en) * | 1977-02-11 | 1978-06-06 | Crystal Systems, Inc. | Process of cutting wafers |
US4384564A (en) * | 1981-01-22 | 1983-05-24 | Crystal Systems Inc. | Process of forming a plated wirepack with abrasive particles only in the cutting surface with a controlled kerf |
CN201283606Y (zh) * | 2008-08-11 | 2009-08-05 | 魏莲君 | 超细金刚石切割线 |
CN102152416A (zh) * | 2011-01-27 | 2011-08-17 | 王楚雯 | 金刚石线锯及其制备方法 |
Also Published As
Publication number | Publication date |
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CN103660051A (zh) | 2014-03-26 |
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Effective date of registration: 20190925 Address after: Room 501, Office Building of Market Supervision Bureau of Langchuan Avenue, Jianping Town, Langxi County, Xuancheng City, Anhui Province Patentee after: Xuancheng Geith Intellectual Property Operations Co., Ltd. Address before: 430070 Hubei Province, Wuhan city Hongshan District Luoyu Road No. 1037 Patentee before: Wu Hao |
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Effective date of registration: 20201211 Address after: 343900 East Industrial Park, Suichuan County, Ji'an City, Jiangxi Province Patentee after: Suichuan Tianma CNC Co.,Ltd. Address before: Room 501, office building, Langchuan Avenue, Jianping Town, Langxi County, Xuancheng City, Anhui Province Patentee before: Xuancheng Geith Intellectual Property Operations Co.,Ltd. |