CN103643099A - Liquid metal thermal interface material used at 150 DEG C and preparation method thereof - Google Patents
Liquid metal thermal interface material used at 150 DEG C and preparation method thereof Download PDFInfo
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- CN103643099A CN103643099A CN201310685629.XA CN201310685629A CN103643099A CN 103643099 A CN103643099 A CN 103643099A CN 201310685629 A CN201310685629 A CN 201310685629A CN 103643099 A CN103643099 A CN 103643099A
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Abstract
The invention discloses a liquid metal thermal interface material used at 150 DEG C and a preparation method thereof. The liquid metal thermal interface material comprises the following components by weight percent: 24-28% of bismuth, 9-15% of zinc, 7-10% of tin, 3-5% of silver, 1-6% of copper and the balance of indium. The liquid metal thermal interface material designed by the invention has the beneficial effects that the liquid metal thermal interface material has low thermal resistivity and suitable volume viscosity, is not easy to fall from a contact surface and can fully fill the gap between a heating element and a heat dissipation element in an electronic device and improve the heat dissipation property of the electronic device; besides, the liquid metal thermal interface material overcomes the defects that traditional materials have low thermal conduction values and small thermal conduction areas and the viscosity of the materials is difficult to control; the thermal interface material has great advantages to be applied to and popularized in the electronic device; with further application and constant popularization of the thermal interface material in the electronic device industry, the novel thermal interface material is bound to gradually replace traditional thermal interface materials, become the predominant thermal interface material of the electronic device and simultaneously promote the development and application of the electronic device.
Description
Technical field
The present invention relates to a kind of liquid metal thermal interface material, specifically, relate to a kind of liquid metal thermal interface material for 150 ℃ and preparation method thereof.
Background technology
Along with electronic product is towards gently, thin, in the time of short and little future development, electron device working temperature also significantly rises.Between device, interconnection density and interface exposure level have a significant impact the heat dispersion of whole system.In order to guarantee that electron device can, with top efficiency operation under normal working temperature, must effectively dispel the heat.In each device of electronic product heat radiation approach from inside to outside, except relying on finned and fan to improve radiating efficiency, for the heat interfacial material between heating element and radiator, be also a critical bottleneck of restriction electronic product radiating reliability.
Liquid metal is a kind of liquid heat sinking medium that presents under working temperature.Because have be far longer than silicone grease heat transfer coefficient and in the pyramidal top of dispelling the heat (liquid metal heat transfer coefficient: ~ 80W/m K, silicone grease: ~ 2W/m K).Liquid metal can be paste or paper tinsel shape at normal temperatures.The liquid metal of paper tinsel shape has enough mobility and fills the gap between heating element and radiator under working temperature, thereby effectively reduces the thermal contact resistance of whole system.The paper tinsel shape liquid metal thermal interface material using at present, fusing point is 60 ℃ of left and right.The electron device of working under more than 100 ℃ high temperature for some, such liquid metal is excessive in working temperature current downflow, is easy to cause side leakage, thereby causes short circuit.The stability of heat interfacial material work has great impact to the life-span of electronic package, and relevant product innovation is successfully developed has become the global problem that solution is badly in need of in high efficiency and heat radiation field.Liquid metal thermal interface material is due to its high reliability, high heat transfer property and embodied powerful advantage at Electronic Encapsulating Technology.
At present, be applied to the main problem of heat interfacial material of electronic product at 150 ℃ of temperature:
(1) heat transfer coefficient is low, and conventional polymer heat-transfer matcrial heat transfer coefficient maintains 2W/m K left and right.And the material aging speed that at high temperature works long hours is fast, the life-span only had about half a year, need to often change.
(2) fusing point is at the liquid metal thermal interface material of 60 ℃ of left and right during for 150 ℃ of left and right, and the viscosity controller of heat interfacial material is difficult, and the too low material of viscosity can be along with the rising of the temperature of electronic component is easily overflowed.
Summary of the invention
The excessive difficult problem of mobility while the object of the invention is to overcome the liquid metal work of existing fusing at 60 ℃, provide a kind of can be at about 150 ℃ fusings the liquid metal thermal interface materials of working in this temperature left and right.
To achieve these goals, the present invention adopts following technical scheme:
A liquid metal thermal interface material, is comprised of the component of following weight percentage: 24-28% bismuth, and 9-15% zinc, 7-10% tin, 3-5% silver, 1-6% copper, surplus is indium.
The preparation method of above-mentioned liquid metal thermal interface material, comprises the steps:
(1) melting: claim metallic substance according to formula, utilize plumbago crucible and vacuum induction furnace alloy to be carried out under vacuum to melting, when reaching smelting temperature, insulation makes metallic solution even, and alloy melt is cast into foundry goods;
(2) rolling: comprise following three phases: roughing: alloy-steel casting is put into roughing mill, and lubricated by ROLLING OIL, the passage of depressing of roughing is: 1mm-0.4mm-0.2mm-0.1mm; In roll: during the woollen after roughing is carried out, roll, lubricated by ROLLING OIL, under middle roll compacting, passage is: 0.1mm-0.06mm; Finish rolling: by material after rolling drop into finishing mill, by ROLLING OIL, be lubricated, the passage of depressing of finish rolling is 0.06mm-0.04mm;
(3) processed finished products: utilize organic solvent that the Alloy Foil obtaining is carried out to de-oiling processing, afterwards the Alloy Foil making is cut out through cutting machine, packing warehouse-in.Organic solvent is preferably acetone.
Compared with prior art, the present invention has following beneficial effect:
The liquid metal thermal interface material thermal resistivity of the present invention's design is low, and volume viscosity is applicable to, and is not easy to come off from contact surface.Can fully fill heating element in electron device and the space between radiator, improve its heat dispersion.In addition, the heat-conduction value that the liquid metal thermal interface material of the present invention's design has overcome traditional material is low, the shortcomings such as the difficult control of the little and viscosity of material of heat transfer area, application and the popularization of this heat interfacial material in electron device has great advantage, along with its deep application in electron device industry and constantly popularization, this novel heat interfacial material will progressively replace traditional heat interfacial material, becomes the leading heat interfacial material of electron device, promotes development and the application of electron device simultaneously.
Embodiment
Preparation method is as follows:
(1) melting: claim metallic substance according to formula, utilize plumbago crucible and vacuum induction furnace alloy to be carried out under vacuum to melting, when reaching smelting temperature, being incubated makes metallic solution even in 10 minutes, and alloy melt is cast to cooled and solidified in the container designing, finally obtain the foundry goods that specification is 100*30*1mm;
(2) rolling: the volume of the product of required heat interfacial material is little, and thickness is low, therefore need heat interfacial material to reach very high precision, by rolling, produces the product that thickness is 0.04mm.The operation of rolling comprises following three phases: roughing: alloy-steel casting is put into roughing mill, and lubricated by ROLLING OIL, the passage of depressing of roughing is: 1mm-0.4mm-0.2mm-0.1mm; In roll: during the woollen after roughing is carried out, roll, lubricated by ROLLING OIL, under middle roll compacting, passage is: 0.1mm-0.06mm; Finish rolling: by material after rolling drop into finishing mill, by ROLLING OIL, be lubricated, the passage of depressing of finish rolling is 0.06mm-0.04mm;
(3) processed finished products: utilize acetone that the Alloy Foil obtaining is carried out to de-oiling processing, afterwards the Alloy Foil making is tailored into the size of design width packing warehouse-in through cutting machine.
embodiment 1:
A liquid metal thermal interface material, by indium, bismuth, zinc, tin, silver and copper form, and its weight percentage is: 24% bismuth, 9% zinc, 10% tin, 5% silver medal, 6% bronze medal, indium 46%.The fusing point of alloy is 146-154 ℃.
Gained paper tinsel shape liquid metal thermal interface material is installed between heating element and radiator, and near working temperature, (150 ℃) fusing, can fill rapidly the space between calorifier and scatterer.This material has very high thermal conductivity (~ 68W/m K), can near operating temperature range, dispel the heat efficiently.Thereby make electronic component be cooled to quickly normal working temperature, thereby guarantee the normal work of electron device.
embodiment 2:
A liquid metal thermal interface material, by indium, bismuth, zinc, tin, silver and copper form, and its weight percentage is: 28% bismuth, 15% zinc, 7% tin, 3% silver medal, 1% bronze medal, indium 46%.The fusing point of alloy is 146-154 ℃.
Gained paper tinsel shape liquid metal thermal interface material is installed between heating element and radiator, and near working temperature, (150 ℃) fusing, can fill rapidly the space between calorifier and scatterer.This material has very high thermal conductivity (~ 68W/m K), can near operating temperature range, dispel the heat efficiently.Thereby make electronic component be cooled to quickly normal working temperature, thereby guarantee the normal work of electron device.
embodiment 3:
A liquid metal thermal interface material, by indium, bismuth, zinc, tin, silver and copper form, and its weight percentage is: 26% bismuth, 12% zinc, 9% tin, 4% silver medal, 4% bronze medal, indium 45%.The fusing point of alloy is 146-154 ℃.
Gained paper tinsel shape liquid metal thermal interface material is installed between heating element and radiator, and near working temperature, (150 ℃) fusing, can fill rapidly the space between calorifier and scatterer.This material has very high thermal conductivity (~ 68W/m K), can near operating temperature range, dispel the heat efficiently.Thereby make electronic component be cooled to quickly normal working temperature, thereby guarantee the normal work of electron device.
Claims (3)
1. a liquid metal thermal interface material, is characterized in that being comprised of the component of following weight percentage: 24-28% bismuth, and 9-15% zinc, 7-10% tin, 3-5% silver, 1-6% copper, surplus is indium.
2. the preparation method of liquid metal thermal interface material described in claim 1, is characterized in that comprising the steps:
(1) melting: claim metallic substance according to formula, utilize plumbago crucible and vacuum induction furnace alloy to be carried out under vacuum to melting, when reaching smelting temperature, insulation makes metallic solution even, and alloy melt is cast into foundry goods;
(2) rolling: comprise following three phases: roughing: alloy-steel casting is put into roughing mill, and lubricated by ROLLING OIL, the passage of depressing of roughing is: 1mm-0.4mm-0.2mm-0.1mm; In roll: during the woollen after roughing is carried out, roll, lubricated by ROLLING OIL, under middle roll compacting, passage is: 0.1mm-0.06mm; Finish rolling: by material after rolling drop into finishing mill, by ROLLING OIL, be lubricated, the passage of depressing of finish rolling is 0.06mm-0.04mm;
(3) processed finished products: utilize organic solvent that the Alloy Foil obtaining is carried out to de-oiling processing, afterwards the Alloy Foil making is cut out through cutting machine, packing warehouse-in.
3. preparation method as claimed in claim 2, is characterized in that, described organic solvent is acetone.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714530A (en) * | 2017-03-14 | 2017-05-24 | 苏州天脉导热科技有限公司 | Heat dissipation device based on metal phase change thermal conductivity and electric conductivity and using method thereof |
| CN109957695A (en) * | 2019-04-01 | 2019-07-02 | 杭州辰卓科技有限公司 | A kind of liquid metal thermal interface material of 80-120 degree heat dissipation and side leakage free |
| CN110142473A (en) * | 2019-06-05 | 2019-08-20 | 深圳市启晟新材科技有限公司 | A kind of liquid metal and technique for car surface scratch and pit reparation |
| CN113677148A (en) * | 2021-07-07 | 2021-11-19 | 中国科学院理化技术研究所 | Self-sealing type super-gas-dredging immersion type phase-change liquid-cooling reinforced heat dissipation plate and preparation method and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1442870A (en) * | 2002-03-06 | 2003-09-17 | 内桥艾斯泰克股份有限公司 | Alloy type hot melt fuse and fuse component |
| CN101812623A (en) * | 2009-02-19 | 2010-08-25 | 上海神沃电子有限公司 | Novel environment-friendly low-temperature alloy and preparation method thereof |
-
2013
- 2013-12-16 CN CN201310685629.XA patent/CN103643099B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1442870A (en) * | 2002-03-06 | 2003-09-17 | 内桥艾斯泰克股份有限公司 | Alloy type hot melt fuse and fuse component |
| CN101812623A (en) * | 2009-02-19 | 2010-08-25 | 上海神沃电子有限公司 | Novel environment-friendly low-temperature alloy and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714530A (en) * | 2017-03-14 | 2017-05-24 | 苏州天脉导热科技有限公司 | Heat dissipation device based on metal phase change thermal conductivity and electric conductivity and using method thereof |
| CN109957695A (en) * | 2019-04-01 | 2019-07-02 | 杭州辰卓科技有限公司 | A kind of liquid metal thermal interface material of 80-120 degree heat dissipation and side leakage free |
| CN110142473A (en) * | 2019-06-05 | 2019-08-20 | 深圳市启晟新材科技有限公司 | A kind of liquid metal and technique for car surface scratch and pit reparation |
| CN113677148A (en) * | 2021-07-07 | 2021-11-19 | 中国科学院理化技术研究所 | Self-sealing type super-gas-dredging immersion type phase-change liquid-cooling reinforced heat dissipation plate and preparation method and application thereof |
| CN113677148B (en) * | 2021-07-07 | 2024-01-19 | 中国科学院理化技术研究所 | Self-sealing super-hydrophobic immersed phase-change liquid-cooled reinforced heat dissipation plate and preparation method and application thereof |
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| CN103643099B (en) | 2015-08-26 |
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Address after: 315016 Zhejiang Province, Ningbo city Haishu District Cuibai Road No. 89 Ningbo advanced manufacturing industry public platform building 15 room 1509 Patentee after: Cao Shuai Address before: 102209 No. 6, building 202, building 20, Holiday Garden, beautiful tree, Beiqijia Town, Changping District, Beijing Patentee before: Cao Shuai |
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Address after: 528225, Nanhai Town, Nanhai District, Guangdong, Foshan Nanhai software science and technology information Avenue (R & D building, B building) 202A room Patentee after: Cao Shuai Address before: 315016 Zhejiang Province, Ningbo city Haishu District Cuibai Road No. 89 Ningbo advanced manufacturing industry public platform building 15 room 1509 Patentee before: Cao Shuai |
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Effective date of registration: 20161019 Address after: 315040 Zhejiang city of Ningbo province high tech Zone Juxian Road No. 1299 Building 9 floor, room 908 Patentee after: Ningbo Shinri branch metal materials Co. Ltd. Address before: 528225, Nanhai Town, Nanhai District, Guangdong, Foshan Nanhai software science and technology information Avenue (R & D building, B building) 202A room Patentee before: Cao Shuai |