CN103635264B - 超声换能组件及其制造方法 - Google Patents

超声换能组件及其制造方法 Download PDF

Info

Publication number
CN103635264B
CN103635264B CN201280031923.2A CN201280031923A CN103635264B CN 103635264 B CN103635264 B CN 103635264B CN 201280031923 A CN201280031923 A CN 201280031923A CN 103635264 B CN103635264 B CN 103635264B
Authority
CN
China
Prior art keywords
layer
ultrasound transducer
electrode layer
transducer element
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280031923.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN103635264A (zh
Inventor
W·苏多尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of CN103635264A publication Critical patent/CN103635264A/zh
Application granted granted Critical
Publication of CN103635264B publication Critical patent/CN103635264B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Gynecology & Obstetrics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Physics & Mathematics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Manufacturing & Machinery (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
CN201280031923.2A 2011-06-27 2012-06-26 超声换能组件及其制造方法 Active CN103635264B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161501307P 2011-06-27 2011-06-27
US61/501,307 2011-06-27
PCT/IB2012/053216 WO2013001448A1 (en) 2011-06-27 2012-06-26 Ultrasound transducer assembly and method of manufacturing the same

Publications (2)

Publication Number Publication Date
CN103635264A CN103635264A (zh) 2014-03-12
CN103635264B true CN103635264B (zh) 2016-06-01

Family

ID=46704971

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280031923.2A Active CN103635264B (zh) 2011-06-27 2012-06-26 超声换能组件及其制造方法

Country Status (5)

Country Link
US (1) US9293690B2 (cg-RX-API-DMAC7.html)
EP (1) EP2723506B1 (cg-RX-API-DMAC7.html)
JP (1) JP6388536B2 (cg-RX-API-DMAC7.html)
CN (1) CN103635264B (cg-RX-API-DMAC7.html)
WO (1) WO2013001448A1 (cg-RX-API-DMAC7.html)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010033757A1 (en) 2008-09-18 2010-03-25 Naurex, Inc. Nmda receptor modulators and uses thereof
DE102012206875B4 (de) * 2012-04-25 2021-01-28 Robert Bosch Gmbh Verfahren zum Herstellen eines hybrid integrierten Bauteils und entsprechendes hybrid integriertes Bauteil
MX375286B (es) 2013-01-29 2025-03-06 Aptinyx Inc Moduladores de receptores nmda de espiro-lactama y sus usos.
BR112015018094A2 (pt) 2013-01-29 2017-07-18 Naurex Inc moduladores de receptor nmda de espiro-lactama e usos dos mesmos
ES2935352T3 (es) 2013-01-29 2023-03-06 Aptinyx Inc Moduladores de receptores NMDA de espiro-lactama y sus usos
CN105026401A (zh) 2013-01-29 2015-11-04 诺雷克斯股份有限公司 螺-内酰胺nmda受体调节剂及其用途
JP6419087B2 (ja) 2013-01-29 2018-11-07 アプティニックス インコーポレイテッド スピロラクタム系ｎｍｄａ受容体モジュレーターおよびその使用
EP3065886B1 (en) * 2013-11-04 2019-07-10 Koninklijke Philips N.V. High volume manufacture of single element ultrasound transducers
WO2015068080A1 (en) * 2013-11-11 2015-05-14 Koninklijke Philips N.V. Robust ultrasound transducer probes having protected integrated circuit interconnects
CN104916773B (zh) * 2014-03-14 2017-10-20 中国科学院苏州纳米技术与纳米仿生研究所 电致变形薄膜阵列、其制备方法及应用
EP3028772B1 (en) * 2014-12-02 2022-12-28 Samsung Medison Co., Ltd. Ultrasonic probe and method of manufacturing the same
KR102406927B1 (ko) * 2014-12-02 2022-06-10 삼성메디슨 주식회사 초음파 프로브 및 그 제조방법
JP6510290B2 (ja) * 2015-03-30 2019-05-08 キヤノンメディカルシステムズ株式会社 超音波プローブ及び超音波診断装置
EP3316791B1 (en) 2015-07-02 2020-08-05 Koninklijke Philips N.V. Multi-mode capacitive micromachined ultrasound transducer and associated devices and systems
WO2017201285A1 (en) 2016-05-19 2017-11-23 Aptinyx Inc. Spiro-lactam nmda receptor modulators and uses thereof
KR102128675B1 (ko) 2016-05-19 2020-06-30 앱티닉스 인크. 스피로-락탐 nmda 수용체 조정제 및 그의 용도
CA3026157A1 (en) * 2016-06-20 2017-12-28 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
JP6712917B2 (ja) * 2016-07-14 2020-06-24 株式会社日立製作所 半導体センサチップアレイ、および超音波診断装置
EA201990424A1 (ru) 2016-08-01 2019-08-30 Аптиникс Инк. Спиролактамовые модуляторы nmda-рецептора и их применение
JP2019527235A (ja) 2016-08-01 2019-09-26 アプティニックス インコーポレイテッド スピロ−ラクタム及びビス−スピロ−ラクタムｎｍｄａ受容体修飾因子及びその使用
KR102503590B1 (ko) 2016-08-01 2023-02-24 앱티닉스 인크. 스피로-락탐 nmda 수용체 조정제 및 그의 용도
SG11201900551WA (en) 2016-08-01 2019-02-27 Aptinyx Inc Spiro-lactam nmda receptor modulators and uses thereof
CA3031563C (en) 2016-08-01 2023-12-05 Aptinyx Inc. Spiro-lactam nmda modulators and methods of using same
EP3472430A4 (en) 2016-09-27 2020-01-08 Halliburton Energy Services, Inc. MULTIDIRECTIONAL ULTRASONIC TRANSDUCER FOR DOWNHOLE MEASUREMENTS
WO2018065405A1 (en) * 2016-10-03 2018-04-12 Koninklijke Philips N.V. Transducer arrays with air kerfs for intraluminal imaging
GB2555835B (en) * 2016-11-11 2018-11-28 Novosound Ltd Ultrasound transducer
SG11202007256PA (en) 2018-01-31 2020-08-28 Aptinyx Inc Spiro-lactam nmda receptor modulators and uses thereof
US11806191B2 (en) 2018-05-21 2023-11-07 General Electric Company Phased array transducers and wafer scale manufacturing for making the same
KR20190143179A (ko) * 2018-06-20 2019-12-30 삼성메디슨 주식회사 초음파프로브 및 그 제조방법
US12012413B2 (en) 2019-11-11 2024-06-18 Tenacia Biotechnology (Hong Kong) Co., Limited Methods of treating painful diabetic peripheral neuropathy
WO2021099618A1 (en) 2019-11-22 2021-05-27 Novioscan B.V. Robust, simple, and efficiently manufacturable transducer array
EP4398804A1 (en) * 2021-09-09 2024-07-17 Koninklijke Philips N.V. Intraluminal ultrasound imaging assembly with electrical connection for multi-row transducer array

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5774960A (en) * 1993-03-05 1998-07-07 Thomson-Csf Process for manufacturing a multi-element acoustic probe, especially an echograph probe
US5793149A (en) * 1995-07-26 1998-08-11 Francotyp-Postalia Ag & Co. Arrangement for plate-shaped piezoactuators and method for the manufacture thereof
EP0785826B1 (en) * 1994-10-14 1999-02-03 Parallel Design, Inc. Ultrasonic transducer array with apodized elevation focus
CN101069295A (zh) * 2004-10-15 2007-11-07 富士胶卷迪马蒂克斯股份有限公司 具有腔体和压电岛的微机电装置及形成具有压电换能器的装置的方法
CN100398224C (zh) * 2001-09-17 2008-07-02 Ge帕拉莱尔设计公司 换能器的频率和振幅旁瓣缩减
CN101662989A (zh) * 2006-11-03 2010-03-03 研究三角协会 使用挠曲模式压电换能器的增强的超声成像探头

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3697200B2 (ja) * 2001-11-07 2005-09-21 アロカ株式会社 超音波探触子
ES2285634T3 (es) * 2002-03-12 2007-11-16 Hamamatsu Photonics K. K. Metodo para dividir un siustrato.
TWI520269B (zh) * 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
JP5064797B2 (ja) * 2003-06-09 2012-10-31 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 音響活性集積電子機器を備えた超音波送受波器の設計方法
JP2007158467A (ja) * 2005-11-30 2007-06-21 Toshiba Corp 超音波プローブ及びその製造方法
US7892176B2 (en) 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20080315331A1 (en) 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5774960A (en) * 1993-03-05 1998-07-07 Thomson-Csf Process for manufacturing a multi-element acoustic probe, especially an echograph probe
EP0785826B1 (en) * 1994-10-14 1999-02-03 Parallel Design, Inc. Ultrasonic transducer array with apodized elevation focus
US5793149A (en) * 1995-07-26 1998-08-11 Francotyp-Postalia Ag & Co. Arrangement for plate-shaped piezoactuators and method for the manufacture thereof
CN100398224C (zh) * 2001-09-17 2008-07-02 Ge帕拉莱尔设计公司 换能器的频率和振幅旁瓣缩减
CN101069295A (zh) * 2004-10-15 2007-11-07 富士胶卷迪马蒂克斯股份有限公司 具有腔体和压电岛的微机电装置及形成具有压电换能器的装置的方法
CN101662989A (zh) * 2006-11-03 2010-03-03 研究三角协会 使用挠曲模式压电换能器的增强的超声成像探头

Also Published As

Publication number Publication date
US20140139072A1 (en) 2014-05-22
US9293690B2 (en) 2016-03-22
WO2013001448A1 (en) 2013-01-03
JP2014523689A (ja) 2014-09-11
EP2723506A1 (en) 2014-04-30
EP2723506B1 (en) 2017-02-15
CN103635264A (zh) 2014-03-12
JP6388536B2 (ja) 2018-09-12

Similar Documents

Publication Publication Date Title
CN103635264B (zh) 超声换能组件及其制造方法
JP5591549B2 (ja) 超音波トランスデューサ、超音波プローブ、超音波トランスデューサの製造方法
JP4969456B2 (ja) マイクロビームフォーマ及び医用超音波システム用再配布相互接続
CN1327976C (zh) 用于将声学元件装接到集成电路上的系统
RU2449418C2 (ru) Межсоединение по методу перевернутого кристалла через сквозные отверстия в микросхеме
US7892176B2 (en) Monitoring or imaging system with interconnect structure for large area sensor array
US20080315331A1 (en) Ultrasound system with through via interconnect structure
US20080178677A1 (en) Ultrasound Probe Assembly and Method of Fabrication
CN101237947A (zh) 弯曲的二维阵列换能器
EP2266712B1 (en) Transducer for ultrasonic diagnosis device and method for manufacturing the same
CN113948505A (zh) 用于多维换能器阵列的直接阵列上芯片
CN111147989B (zh) 具有用于多维换能器阵列的中介层的阵列上芯片
JP7049323B2 (ja) 超音波アレイ用の冗長な接続点を有するフレキシブル回路
JP2011110111A (ja) 超音波プローブ及び超音波プローブの製造方法
US11938514B2 (en) Curved shape piezoelectric transducer and method for manufacturing the same
US20240215951A1 (en) Connection for a multi-dimensional matrix transducer
JP6876645B2 (ja) 超音波プローブ及びその製造方法
JP2000214144A (ja) ２次元配列型超音波探触子
US11756520B2 (en) 2D ultrasound transducer array and methods of making the same
JP2010130592A (ja) 超音波探触子及び超音波探触子の作製方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant