CN103627146A - Preparation and application of high-flexibility phosphorus-containing halogen-free epoxy resin - Google Patents
Preparation and application of high-flexibility phosphorus-containing halogen-free epoxy resin Download PDFInfo
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- CN103627146A CN103627146A CN201310547795.3A CN201310547795A CN103627146A CN 103627146 A CN103627146 A CN 103627146A CN 201310547795 A CN201310547795 A CN 201310547795A CN 103627146 A CN103627146 A CN 103627146A
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Abstract
The invention relates to preparation of a high-flexibility phosphorus-containing halogen-free epoxy resin, which comprises the following steps: 1. adding a phosphorus-containing catalyst into compounds disclosed as general formula (1) and general formula (2) or general formula (3) to perform pre-reaction to generate a resin a; 2. reacting a compound disclosed as general formula (4) or general formula (5) or general formula (6) with an organic phosphorous compound with a reactive hydrogen atom under the action of a phosphorus-containing catalyst to generate a phosphorus-containing epoxy resin B; and 3. uniformly mixing A and B, adding a phosphorus-containing catalyst to generate the finished product, and dropwisely adding a solvent for dissolution. The epoxy resin is used for preparing prepregs and copper clad plates. The phosphorus-containing halogen-free epoxy resin is free of any halogen and does not use bromine to implement flame retardancy; and the prepared copper clad plate has the advantages of high flexibility, high peel strength and favorable manufacturability. The epoxy resin solves the problems of low peel strength and poor flexibility.
Description
Technical field
The present invention relates to a kind of have good snappiness phosphor-containing halogen-free prime ring epoxy resins preparation and application.
Background technology
At present, various industrial circles, as electronics, electronic component all will be in heat or flame incombustible characteristic.Therefore the phosphorous epoxy resin that, has a flame retardant properties is usually used in covering in copper panel.Epoxy resin is introduced halogen in epoxy resin structural in producing, and the flame retardant properties of epoxy resin excellence can be provided.Using at present as being exactly brominated epoxy resin widely, is to manufacture the main epoxy resin of producing electronics and electronic component.Used electronic component that brominated epoxy resin is produced into and electronics when running into burning or discarded burn processing, these halogen-containing epoxy resin cured products can produce the poisonous etchant gas that has, as halocarbon, halogen and Dioxins, human health is brought to great harm, cause environmental pollution.
On Vehicles Collected from Market, beyond halogen, fire retarding epoxide resin is mainly phosphorus-containing flame-retardant epoxy resin, and phosphorous epoxy resin is done the fire-retardant copper panel of covering, and having a common problem is that anti-stripping is low, and snappiness is poor, and poor processability causes very large impact to non-halogen process.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, a kind of have good snappiness phosphor-containing halogen-free prime ring epoxy resins preparation and application are provided.This phosphor-containing halogen-free prime ring epoxy resins does not contain the fire retarding epoxide resin of any halogen and does not use bromine fire-retardant, and the copper panel of covering of making has good snappiness, high resistance stripping and good process.Solved the problem that anti-stripping is low, snappiness is poor.
The object of the present invention is achieved like this:
A kind of have a preparation of good snappiness phosphor-containing halogen-free prime ring epoxy resins, and its minute three-step reaction forms:
1. general formula (1) and general formula (2) or general formula (3) add phosphorus-containing catalyst and carry out pre-reaction and generate Resin A;
2. again by general formula (4) or general formula (5) or general formula (6) and the phosphorus-containing catalyst generation phosphorous epoxy resin B for organo phosphorous compounds with a reactive hydrogen atom;
3. again A and B are mixed to interpolation phosphorus-containing catalyst generation finished product, drip solvent and dissolve;
Structural formula:
R is: H or CH
3;
Resin A formula of (1) in the present invention is (0.1-1) with the mol ratio of general formula (2) or general formula (3): (2-5), being more suitable for is (0.5-1): (2-4); Also more be suitable for (0.75-1): (3-4), if the too little chain extension that causes of ratio is not enough, if ratio causes too greatly chain extension too large, affect back segment reaction.
Phosphorous epoxy resin B of the present invention by general formula (4) or general formula (5) or general formula (6) with there is an organo phosphorous compounds with the active hydrogen atom of phosphorus atom binding, as DOPO(9, mix-10-phospho hetero phenanthrene-10-oxide compound of 10-dihydro-9-oxy), its phosphorus content is 1-4%, be preferable over 1-3%, the preferred 1.5-3% that is chosen in, also more preferably in 2.0-3.0%.
In the present invention reactions steps 3. in the ratio of Resin A be 1-30%, be preferably 1-20%, preferred being chosen between 1-10, also preferred being chosen between 1-8%.
Phosphorous Cat of the present invention is: any one in triphenylphosphine, tributylphosphine, trimethoxy phosphine, triethyl phosphine, ethyl (or butyl) triphenyl phosphorus hydrochlorate, consumption is 50-1000PPM, be preferably 650-800PPM, 50-600PPM more preferably, also 50-500PPM more preferably.
The phosphorous Cat solvent of the present invention is any one or the compound use in acetone ACE, butanone MEK, toluene TOL, propylene glycol monomethyl ether PM.
As the stiffening agent of phosphorous epoxy resin of the present invention, can use the Common Curing Agents of epoxy resin, as Dyhard RU 100, these solidifying agent of DDM, DDS can separately can also compound uses.
There is an application for good snappiness phosphor-containing halogen-free prime ring epoxy resins, at above-mentioned phosphor-containing halogen-free epoxy resin, add solidifying agent, with glasscloth, soak to dry and make prepreg, and with being pressed into copper foil coveredization plate after tinsel stack.
Prepreg method by the preparation of above-mentioned halogen-free phosphorus-containing epoxy resin is as follows: the method for preparing prepreg not the following describes restriction.Add solidifying agent and curing catalyst to stir the phosphorous epoxy of above-mentioned halogen and be made into glue, then glasscloth being put into glue soaks, then with baking oven baking, make prepreg, and then by the folded tinsel of upper and lower Ge Jia for preparing of prepreg, then with press intensification pressing, solidify.
Compared with prior art, the invention has the beneficial effects as follows:
This phosphor-containing halogen-free prime ring epoxy resins does not contain the fire retarding epoxide resin of any halogen and does not use bromine fire-retardant, and the copper panel of covering of making has good snappiness, high resistance stripping and good process.Solved the problem that anti-stripping is low, snappiness is poor.
Embodiment
Embodiment 1:
To being equipped with in the round-bottomed flask of electric stirring, reflux condensing tube, thermometer, add 192g dihydroxyphenyl propane (BPA), logical nitrogen protection, opens heating unit BPA is heated to molten state, starts stirring, and temperature is remained between 170 ℃～175 ℃.Add 0.06g triphenylphosphine dissolved 10 minutes, start vacuum pump the air in four-hole round-bottomed flask is taken away, be extracted into-0.095Mpa keeps 10 minutes below, passes into nitrogen vacuum breaker.By 108g basis epoxy (the liquid epoxy of bisphenol A-type, epoxy equivalent (weight) is 185g/Eq) be heated to 150 ℃, with peristaltic pump, with 60 minutes, at the uniform velocity add in four-hole round-bottomed flask, add rear maintenance reaction 60 minutes, after reaction finishes, be evacuated down to-0.095Mpa is following 10 minutes, logical nitrogen vacuum breaker obtains resin a, by material flow out be placed in the hopper of nitrogen cooling, shatter use, hydroxyl equivalent is 265g/eq.
Embodiment 2:
Repeat embodiment 1, wherein BPA amount changes 213g into, and basic epoxy amount is 87g, and all the other,, all with embodiment 1, obtain resin b, and hydroxyl equivalent is 214g/Eq.
Embodiment 3:
Repeat embodiment 1, wherein BPA amount changes 192g into, and discharge ring epoxy resins is 108g, and all the other,, all with embodiment 1, obtain resin c, and hydroxyl equivalent is 224g/Eq.
Embodiment 4:
Repeat embodiment 1, wherein BPA changes BPF into, measures as 213g, and basic epoxy is 87g, and all the other steps, all with embodiment 1, obtain resin d, and hydroxyl equivalent is 181g/Eq.
Embodiment 5:
To electric stirring is housed, reflux condensing tube, after adding 230.6g novolac epoxy (F51) to be heated to 100 ℃ in the round-bottomed flask of thermometer, start and stir, then add 54.4g DOPO and 0.07g triphenylphosphine, control in round-bottomed flask temperature and be 100 ℃ stir after 5 minutes be evacuated down to-below 0.095Mpa, keep 10 minutes, logical nitrogen vacuum breaker, rise controlling temperature to 165-170 ℃, keeping reaction within 60 minutes, to cool to 120-130 ℃ adds the resin a 15g of embodiment 1 preparation to add 0.15g iodate ethyl triphenyl phosphine, be evacuated down to-below 0.095Mpa, keep 10 minutes, logical nitrogen vacuum breaker, intensification temperature control reacts 90 minutes between 175-180 ℃, be evacuated down to-below 0.095Mpa, use nitrogen vacuum breaker, with pear shape separatory funnel, add 100g butanone, obtain the phosphorous epoxy EP1 of finished product, phosphorus content is 2.6g, epoxy equivalent (weight) is 301g/Eq.
Embodiment 6:
Repeat embodiment 5, wherein the resin a of embodiment 1 preparation is replaced by the resin b of embodiment 2 preparations, and the neither change of all the other steps, obtains finished product phosphorous epoxy resin EP2, and phosphorus content is 2.6g, and epoxy equivalent (weight) is 306g/Eq.
Embodiment 7:
Repeat embodiment 5, wherein the resin a of embodiment 1 preparation is replaced by the resin c of embodiment 3 preparations, and the neither change of all the other steps, obtains finished product phosphorous epoxy resin EP3, and phosphorus content is 2.6g, and epoxy equivalent (weight) is 305g/Eq.
Embodiment 8:
Repeat embodiment 5, wherein the resin a of embodiment 1 preparation is replaced by the resin d of embodiment 4 preparations, and the neither change of all the other steps, obtains finished product phosphorous epoxy resin EP4, and phosphorus content is 2.6g, and epoxy equivalent (weight) is 310g/Eq.
Comparative example 1:
To being equipped with in the round-bottomed flask of electric stirring, reflux condensing tube, thermometer, add phenolic aldehyde epoxy 245.6g, DOPO54.4g, triphenylphosphine 0.06g, start each control of intensification temperature control at 100 ℃, stir after 10 minutes, start vacuum pump vacuum is extracted into-below 0.095Mpa, keep 10 minutes, use nitrogen vacuum breaker, add 100g butanone in resin; Obtain comparative example resin, phosphorus content is 2.6g, and epoxy equivalent (weight) is 264g/Eq.
The sclerosis of epoxy resin and the manufacture of prepreg:
In order to control the performance of the epoxy resin of preparing in above-described embodiment, use Dyhard RU 100 [consumption is 100g epoxy (100% solid) * 21 ÷ epoxy resin equivalent * 0.5] to use as stiffening agent Bing, glyoxal ethyline (for the 300ppm amount of resin) is cured reaction as curing catalyst, with DMF, as solvent, the solid content of glue is controlled between 60-65%.
Deployed glue is evenly coated on glass pricker dimension cloth (7628 type), and is dried 3 minutes at 170 ℃, obtain prepreg.
Get 8 prepregs and stack, upper and lower 1OZ Copper Foil of Ge Jia, is placed in press with 35kgf/ ㎝ 2 pressure, and 180 ℃ of hot pressing 120 minutes, obtains being with copper-clad laminate.
Data by table 1 can find out, used the loss that respectively has the several years above the phosphor-containing halogen-free prime ring epoxy resins Tg of technical characterstic of the present invention, but anti-stripping is greatly improved, and thermal shocking are also greatly improved.The present invention can provide the good anti-stripping in surface and interlaminar bonding power as can be seen here, and sheet material obtains good snappiness, has improved the processibility of PBC plate, has improved working (machining) efficiency, reduces quality bad.
Table 1:
| Resin | Unit | EP1 | EP2 | EP3 | EP4 | Comparative resin 1 |
| Phosphorus content | % | 2.6 | 2.6 | 2.6 | 2.6 | 2.6 |
| Epoxy equivalent (weight) | g/Eq | 301 | 306 | 305 | 310 | 264 |
| Dyhard RU 100 amount | g | 3.49 | 3.43 | 3.44 | 3.39 | 3.98 |
| Methylimidazole amount | g | 0.03 | 0.03 | 0.03 | 0.03 | 0.04 |
| Gel time | s | 230 | 233 | 228 | 235 | 220 |
| Tg | ℃ | 144 | 145 | 140 | 142 | 148 |
| The anti-stripping in surface | N/mm | 1.58 | 1.6 | 1.57 | 1.59 | 1.41 |
| The anti-stripping of interlayer | N/mm | 0.62 | 0.64 | 0.62 | 0.60 | 0.45 |
| 288 ℃ of floating welderings | s | ＞300 | ＞300 | ＞300 | ＞300 | ＞300 |
| 288 ℃ of immersed solder | s | 250 | 230 | 235 | 225 | 230 |
| 288 ℃ of thermal shockings (10s/20s) | Inferior | ＞15 | ＞15 | ＞15 | ＞15 | 10 |
| Fire-retardant (UL-94) | Grade | V0 | V0 | V0 | V0 | V0 |
Claims (10)
1. one kind has good snappiness phosphor-containing halogen-free prime ring epoxy resins preparation, it is characterized in that: its minute three-step reaction forms:
1. general formula (1) and general formula (2) or general formula (3) add phosphorus-containing catalyst and carry out pre-reaction and generate Resin A;
2. again by general formula (4) or general formula (5) or general formula (6) and the phosphorus-containing catalyst generation phosphorous epoxy resin B for organo phosphorous compounds with a reactive hydrogen atom;
3. again A and B are mixed to interpolation phosphorus-containing catalyst generation finished product, drip solvent and dissolve;
Structural formula:
R is: H or CH
3;
。
2. a kind of good snappiness phosphor-containing halogen-free prime ring epoxy resins preparation that has according to claim 1, is characterized in that, the mol ratio of described Resin A formula of (1) and general formula (2) or general formula (3) is in (0.1～1): (2～5).
3. a kind of good snappiness phosphor-containing halogen-free prime ring epoxy resins preparation that has according to claim 1, is characterized in that, the organo phosphorous compounds that described step has a reactive hydrogen atom in is 2. that 9,10-dihydro-10-oxygen-phosphine is assorted luxuriant and rich with fragrance.
4. a kind of good snappiness phosphor-containing halogen-free prime ring epoxy resins preparation that has according to claim 1, it is characterized in that, described phosphorous epoxy resin B, its phosphorus content is 1-4%, the reactions steps 3. ratio of middle Resin A is 1-30%, be preferably 1-20%, preferred being chosen between 1-10, also preferred being chosen between 1-8%.
5. a kind of good snappiness phosphor-containing halogen-free prime ring epoxy resins preparation that has according to claim 1, it is characterized in that, described phosphorus-containing catalyst be in triphenylphosphine, tributylphosphine, trimethoxy phosphine, triethyl phosphine, ethyl triphenyl phosphoric acid salt, butyl triphenyl phosphoric acid salt any one or several.
6. a kind of good snappiness phosphor-containing halogen-free prime ring epoxy resins preparation that has according to claim 1, is characterized in that, described solvent is one or more in acetone, toluene, butanone, propylene glycol monomethyl ether.
7. there is an application for good snappiness phosphor-containing halogen-free prime ring epoxy resins, it is characterized in that, by the finished product of preparation in one of claim 1-6, any one in interpolation nitrogen-containing hardener Dyhard RU 100, DDM solidifying agent, DDS solidifying agent; Be prepared into glue, glasscloth immersed to baking in glue and make prepreg.
8. a kind of application with good snappiness phosphor-containing halogen-free prime ring epoxy resins according to claim 7, it is characterized in that, while preparing glue, also add curing catalyst, described curing catalyst is any one in glyoxal ethyline, 2-methyl-4 ethyl imidazol(e), 2-phenylimidazole.
9. a kind of application with good snappiness phosphor-containing halogen-free prime ring epoxy resins according to claim 7, it is characterized in that, the prepreg being prepared from superposes and in 1 tinsel of the upper and lower Ge Jia of prepreg, puts into the press that can rise temperature control and carries out hot pressing and make phosphor-containing halogen-free and cover copper panel.
10. a kind of application with good snappiness phosphor-containing halogen-free prime ring epoxy resins according to claim 8, it is characterized in that, the prepreg being prepared from superposes and in 1 tinsel of the upper and lower Ge Jia of prepreg, puts into the press that can rise temperature control and carries out hot pressing and make phosphor-containing halogen-free and cover copper panel.
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| CN201310547795.3A CN103627146B (en) | 2013-11-08 | 2013-11-08 | One has excellent snappiness phosphor-containing halogen-free prime ring epoxy resins preparations and applicatio |
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|---|---|---|---|
| CN201310547795.3A CN103627146B (en) | 2013-11-08 | 2013-11-08 | One has excellent snappiness phosphor-containing halogen-free prime ring epoxy resins preparations and applicatio |
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| CN103627146B CN103627146B (en) | 2016-06-01 |
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Cited By (3)
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| CN110964176A (en) * | 2019-12-18 | 2020-04-07 | 四川东材科技集团股份有限公司 | Preparation method of high-heat-resistance phosphorus-containing epoxy resin |
| CN112538155A (en) * | 2020-11-02 | 2021-03-23 | 建滔（江苏）化工有限公司 | Phosphorus-containing halogen-free epoxy resin and preparation method and application thereof |
| CN114801348A (en) * | 2022-05-25 | 2022-07-29 | 江门建滔积层板有限公司 | Preparation process of high-flame-retardance heat-resistant 22F copper-clad plate |
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| CN110964176A (en) * | 2019-12-18 | 2020-04-07 | 四川东材科技集团股份有限公司 | Preparation method of high-heat-resistance phosphorus-containing epoxy resin |
| CN112538155A (en) * | 2020-11-02 | 2021-03-23 | 建滔（江苏）化工有限公司 | Phosphorus-containing halogen-free epoxy resin and preparation method and application thereof |
| CN114801348A (en) * | 2022-05-25 | 2022-07-29 | 江门建滔积层板有限公司 | Preparation process of high-flame-retardance heat-resistant 22F copper-clad plate |
| CN114801348B (en) * | 2022-05-25 | 2023-02-03 | 江门建滔积层板有限公司 | Preparation process of high-flame-retardance heat-resistant 22F copper-clad plate |
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| CN103627146B (en) | 2016-06-01 |
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Effective date of registration: 20160823 Address after: 511600 Guangdong city of Qingyuan province Fogang County Shek Kok town Ring Road South Industrial Zone Kingboard Industrial Park Patentee after: Kingboard (Fogang) Laminate Plate Co., Ltd. Address before: Huang Tu Zhen Shi Zhuang Bei Lu, Jiangyin City, Jiangsu province 214445 Carsem Wuxi City No. 2 Patentee before: Kingboard Chemical Co., Ltd. (Jiangsu) |