CN103619122A

CN103619122A - Chamfering omission-preventable circuit board and circuit board manufacture method

Info

Publication number: CN103619122A
Application number: CN201310532564.5A
Authority: CN
Inventors: 李飞宏; 许人元; 唐景利
Original assignee: Victory Giant Technology Huizhou Co Ltd
Current assignee: Victory Giant Technology Huizhou Co Ltd
Priority date: 2013-10-31
Filing date: 2013-10-31
Publication date: 2014-03-05
Anticipated expiration: 2033-10-31
Also published as: CN103619122B

Abstract

The invention relates to a chamfering omission-preventable circuit board and a circuit board manufacture method. The chamfering omission-preventable circuit board comprises a circuit board body; the circuit board body is provided with a plurality of connecting fingers; the upper end of each connecting finger is processed to form a chamfered portion; two ends of the chamfered portion of any one connecting finger are both connected with lead lines; one fool-proof PAD is connected between any two adjacent lead lines; and any two adjacent connecting fingers, two lead lines which are connected with the chamfered portions of any two adjacent connecting fingers and the fool-proof PAD can form an open-circuit network. The chamfering omission-preventable circuit board of the invention is advantageous in simple manufacture, low cost and great improvement of work efficiency. With the chamfering omission-preventable circuit board and the circuit board manufacture method adopted, clients will not receive circuit boards with the un-chamfered upper ends of connecting fingers.

Description

A kind of wiring board and wiring board preparation method that can leakproof hypotenuse

Technical field

The present invention relates to a kind of wiring board field, relate in particular to a kind of wiring board and wiring board preparation method that can leakproof hypotenuse.

Background technology

Printed wiring board, in processing and manufacturing process, can pass through a plurality of horizontal production lines and rectilinear production-line technique flow process, different in the processing method of each technological process.For PCB circuit board plant, often occur that the plate of hypotenuse does not drain to end product quality management and control, more seriously personnel not sight check flow to client, cause customer complaint even to be paid an indemnity, this bad when the machine-shaping goldfinger bevel personnel neglect leak hypotenuse not self check arrive, or because of the plate of hypotenuse of managing improperly not, directly take rear operation shipment and fail to find, cause the plate current that leaks hypotenuse to go out, my company improves from product design source for this reason, pcb board goldfinger bevel place is increased to fool-proof design, at present my company import this comprehensively can leakproof hypotenuse pcb board.

Summary of the invention

According to an aspect of the present invention, a kind of wiring board that can leakproof hypotenuse is provided, comprise wiring board body, on described wiring board body, there are many golden fingers 1, the upper part of described golden finger is processed and is formed a hypotenuse place 2 through processing, the two ends at the hypotenuse place that described golden finger is arbitrary are all connected with lead-in wire 4, between described wantonly two adjacent legs 4, be all connected with a fool proof PAD 3, described wantonly two adjacent golden fingers, two lead-in wires 4 that are connected with the hypotenuse place of described wantonly two adjacent golden fingers and described fool proof PAD 3 form open circuit networks.

Further, the lead-in wire 4 in the middle of described fool proof PAD 3 and hypotenuse place 2 is positioned at the mid point at hypotenuse place 2.

Further, described hypotenuse place 2 is adding fool proof PAD 3 when its degree of depth intermediate value is greater than 1.0mm.

Further, described fool proof PAD 3 sizes are 8*60mil.

Further, described fool proof PAD 3 is 12mil to the center line at hypotenuse place 2.

According to another object of the present invention, a kind of wiring board preparation method of wiring board that can leakproof hypotenuse is provided, comprise the steps:

Make wiring board body: first according to traditional wiring board, make flow process and make a wiring board body;

Processing hypotenuse place: the upper end of every golden finger on wiring board body processes a hypotenuse place (2), and the right angle of the upper end at this hypotenuse place (2) is processed into fillet;

Connect lead-in wire: the two ends at the hypotenuse place of arbitrary of described golden finger are connected with lead-in wire (4);

Fool proof PAD is set: between described wantonly two adjacent legs (4), be all connected with a fool proof PAD(3).

Further, before the described step that fool proof PAD is set, need to test fool proof PAD(3) to the center line of hypotenuse place (2), be 12mil.

The application is with respect to prior art, and it has following advantage and beneficial effect:

The application by adding fool proof PAD and connecting short circuit between two gold finger leads, golden finger after hypotenuse, its short circuit place cuts away becomes normal open circuit, when through electrical measurement, between these two golden fingers, for opening a way, be normal, if electrical measurement is short circuit is the wiring board that leaks hypotenuse, adopt the wiring board of this kind of structure rapid for leakproof hypotenuse accuracy of judgement, break traditions by the technique of artificial visual examination, reduce artificial inspection leakage, greatly improved detection speed and quality yield.This can leakproof hypotenuse wiring board makes simple and easyly, with low cost, greatly increases work efficiency, and guarantees that goldfinger bevel operation can not be missed to client.

Accompanying drawing explanation

In order to be illustrated more clearly in the technical scheme of the embodiment of the present invention, in describing embodiment below, needed accompanying drawing is done simple introduction, apparent, the accompanying drawing the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.

Fig. 1 is the golden finger structure schematic diagram in an a kind of embodiment in can the wiring board of leakproof hypotenuse in the present invention.

Fig. 2 is the golden finger structure schematic diagram in a kind of another embodiment in can the wiring board of leakproof hypotenuse of the present invention.

Embodiment

Below by embodiment, by reference to the accompanying drawings technical scheme of the present invention is carried out to clear, complete description; obviously; described embodiment is only a part of embodiment of the present invention; rather than whole embodiment; based on embodiments of the invention; those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.

In this article, relational language, such as first and second, top and bottom etc., can be used for an entity and another entity or action to distinguish, and not inevitable requirement or adopt described entity or action between this type of relation or the order of any reality.Term " comprises ", " comprising " or other any variants, be intended to contain and exclusively have, comprise that technique, method, article or the device of enumerating element not only comprise described element for one time, but also can comprise that other do not express process that list or described, method, object product or the intrinsic element of device.By " comprising ... " the element guiding, not more multiple constraint in the situation that, and is not precluded within process, method, article or the device that comprises described element and has extra similar elements.

Embodiment 1

A kind of wiring board that can leakproof hypotenuse, comprise wiring board body, on described wiring board body, there are many golden fingers 1, golden finger structure schematic diagram in as shown in Figure 1 a kind of embodiment in can the wiring board of leakproof hypotenuse, this golden finger one has 6, the upper part of this golden finger 1 is processed and is formed a hypotenuse place 2 through processing, the two ends at the hypotenuse place that golden finger is arbitrary are all connected with lead-in wire 4, between described wantonly two adjacent legs 4, be all connected with a fool proof PAD 3, wantonly two adjacent golden fingers, two lead-in wires 4 that are connected with the hypotenuse place of described wantonly two adjacent golden fingers and described fool proof PAD 3 form open circuit networks.

Continue referring to Fig. 1, in this embodiment, lead-in wire 4 in the middle of fool proof PAD 3 and hypotenuse place 2 is positioned at the mid point at hypotenuse place 2, certainly, in other embodiment, this position can be departed from the mid point at hypotenuse place 2 a little, but also should be near the axis at hypotenuse place 2, in addition, this hypotenuse place 2 should add fool proof PAD 3 when its degree of depth intermediate value is greater than 1.0mm, otherwise will cause measure error, in the preferred embodiment shown in Fig. 1, the size of fool proof PAD 3 is 8*60mil, and in addition, fool proof PAD 3 is 12mil to the center line at hypotenuse place 2.

When this wiring board of test has or not leakage hypotenuse, whether test lead 4 has electric current, and in this embodiment, test result is no current, is open circuit, therefore without leaking hypotenuse.

Embodiment 2

As different from Example 1, in this wiring board, exist and leak hypotenuse, as shown in Figure 2, golden finger 100 is the golden finger of not processing through hypotenuse, and it is connected by fool proof PAD 300 and a lead-in wire with adjacent golden finger, and it is short-circuit condition, when testing with testing tool, show circuit and pass through.

Embodiment 3

?wiring board preparation method that can leakproof hypotenuse, comprises the steps: to make wiring board body: first according to traditional wiring board, make flow process and make a wiring board body; Processing hypotenuse place: the upper end of every golden finger on wiring board body processes a hypotenuse place 2, and the right angle of the upper end at this hypotenuse place 2 is processed into fillet; Connect lead-in wire: at the two ends at the hypotenuse place of arbitrary of described golden finger, be connected with lead-in wire 4; Fool proof PAD is set: between described wantonly two adjacent legs 4, be all connected with a fool proof PAD 3.Further, before the described step that fool proof PAD is set, needing to test fool proof PAD 3 is 12mil to the center line at hypotenuse place 2.

The above embodiment has only expressed preferred embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.

Claims

One kind can leakproof hypotenuse wiring board, comprise wiring board body, on described wiring board body, there are many golden fingers (1), the upper part of described golden finger (1) is processed and is formed a hypotenuse place (2) through processing, it is characterized in that, the two ends at the hypotenuse place that described golden finger is arbitrary are all connected with lead-in wire (4), between described wantonly two adjacent legs (4), be all connected with a fool proof PAD(3), described wantonly two adjacent golden fingers, two lead-in wires (4) and the described fool proof PAD(3 that are connected with the hypotenuse place of described wantonly two adjacent golden fingers) form an open circuit network.
2. a kind of wiring board that can leakproof hypotenuse as claimed in claim 1, is characterized in that described fool proof PAD(3) be positioned at the mid point of hypotenuse place (2) with the lead-in wire (4) in the middle of hypotenuse place (2).
3. a kind of wiring board that can leakproof hypotenuse as claimed in claim 1, is characterized in that, described hypotenuse place (2) is adding fool proof PAD(3 when its degree of depth intermediate value is greater than 1.0mm).
4. a kind of wiring board that can leakproof hypotenuse as claimed in claim 1, is characterized in that described fool proof PAD(3) size is 8*60mil.
5. a kind of wiring board that can leakproof hypotenuse as claimed in claim 1, is characterized in that described fool proof PAD(3) to the center line of hypotenuse place (2), be 12mil.
6. a wiring board preparation method who prepares a kind of wiring board that can leakproof hypotenuse described in claim 1-5, is characterized in that comprising the steps:

Make wiring board body: first according to traditional wiring board, make flow process and make a wiring board body;

Processing hypotenuse place: the upper end of every golden finger on wiring board body processes a hypotenuse place (2), and the right angle of the upper end at this hypotenuse place (2) is processed into fillet;

Connect lead-in wire: the two ends at the hypotenuse place of arbitrary of described golden finger are connected with lead-in wire (4);

Fool proof PAD is set: between described wantonly two adjacent legs (4), be all connected with a fool proof PAD(3).
7. a kind of wiring board preparation method as claimed in claim 6, is characterized in that, before the described step that fool proof PAD is set, needs to test fool proof PAD(3) to the center line of hypotenuse place (2), be 12mil.