CN103617961A - An attracting disc mechanism for moving semiconductor chips - Google Patents
An attracting disc mechanism for moving semiconductor chips Download PDFInfo
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- CN103617961A CN103617961A CN201310521713.8A CN201310521713A CN103617961A CN 103617961 A CN103617961 A CN 103617961A CN 201310521713 A CN201310521713 A CN 201310521713A CN 103617961 A CN103617961 A CN 103617961A
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- hole
- cock body
- leakage
- face
- gas leakage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The invention discloses an attracting disc mechanism for moving semiconductor chips. The attracting disc mechanism comprises a handle and a cover plate. A base plate is installed on the bottom surface of the cover plate. A movable through hole plug formed by a top plug body and a bottom plug body and leakage through holes are installed in clearance fit. The width of a top air-guiding rib is more than that of a bottom air-guiding rib. The diameters of a bottom end face portion and a top end face portion are more than those of the leakage through holes. The distance between the top end face portion and the bottom end face portion of the movable through hole plug is more than the thicknesses of the leakage through holes. Therefore, the movable through hole plug is guaranteed to move up and down along the leakage through holes. When the bottom plug body of the leakage through holes encloses the leakage through holes, air flow enters from nozzles. When the top plug body of the leakage through holes encloses the leakage through holes, the air flow enters from the leakage through holes. The attracting disc mechanism resolves a technical problem that crystalline grains are easy to damage when adsorbed in a semiconductor crystalline grain manufacturing process and greatly increases an adsorption rate so as to increase a product yield rate and decrease resource loss.
Description
Technical field
The present invention relates to a kind of instrument for diode production, be specifically related to a kind of transfer of semiconductor chip sucking disc mechanism.
Background technology
Existing semiconductor grain often relates to multiple production technology, need to carry out semiconductor grain transfer.Prior art crystal grain in the process of absorption or transfer often can be encountered prewelding ship and assembly welding ship, damages possibly crystal grain, causes product finally bad; Secondly, because the reason of valve evenness or the reason of valve wearing and tearing make indivedual valves and intercrystalline every causing whole dish crystal grain not suck up completely too greatly.
Prior art solves the problems of the technologies described above, and adopts the technical scheme of Chinese Patent Application No. 201110217430.5, and it is documented in a reference leakage device is installed on original sucker.Original sucker is on sucker base plate, to process several required suction nozzles, the groove of certain depth is dug as vacuum cavity in base plate back, in alignment pin pilot hole, alignment pin is installed, is then covered cover plate, by the mode of fastened by screw, by screw hole, base plate and cover plate are fixed.Two connecting rods are installed on cover plate and are connected with handle, connecting rod and handle inside are all through holes, form vacuum loop, are loaded on suction nozzle, complete the design of sucker.This class sucker tends to crush crystal grain in the process of using.Crystal grain is normally put at one with the metal of a lot of square holes or above graphite cake, has a crystal grain in each square hole.When sucker is when inhaling crystal grain; in the process declining; gas is to pass through suction nozzle all the time; when suction nozzle also has 1 millimeter crystal grain just to be held apart from crystal grain; now sucker also continues down to move, and with the crystal grain that held, continues down motion, and if crystal grain has an off normal when being held; in the process declining, will encounter the edge of metallic plate or graphite cake square hole wounded, thereby crystal grain will be weighed.Secondly, prior art suction nozzle is being to adsorb in working order always, and this easily causes the adsorption time of crystal grain long, more easily causes crystal grain off normal.Again, because graphite boat is placed a large amount of semiconductor grains, and semiconductor grain is small-sized, often once adsorb simultaneously a large amount of tiny semiconductor crystal grain have unavoidably a small amount of semiconductor grain fail absorption on, and cause needing multiple adsorb, the frequency that has greatly increased operation, is unfavorable for the lifting of efficiency.
Summary of the invention
The object of the invention is to provide a kind of transfer of semiconductor chip sucking disc mechanism, this sucking disc mechanism has improved the technical problem easily crystal grain being weighed wounded while adsorbing crystal grain in semiconductor grain manufacture process, and greatly improved adsorption rate, thus improved product yield, reduce resource loss.
For achieving the above object, the technical solution used in the present invention is: a kind of transfer of semiconductor chip sucking disc mechanism, described graphite boat has the crystal grain groove of placing semiconductor grain, described Acetabula device comprises: the handle and the cover plate that are inside provided with the first cavity, this handle one end is provided with the valve being communicated with described the first cavity, this handle lower surface is provided with at least one first air vent hole being communicated with described the first cavity, described cover plate is provided with and corresponding the second air vent hole of described the first air vent hole, and a gas connection pipe is communicated with described the first air vent hole and the second air vent hole; One base plate is installed on described cover plate lower surface, and this base plate forms the second cavity being communicated with described the first cavity by side plate with cover plate, is provided with several for adsorbing suction nozzle and at least two gas leakage through holes of described semiconductor grain on described base plate;
The movable through hole plug being comprised of upper cock body and lower cock body coordinates installation with described gas leakage via clearance, on this, cock body has upper end face and is fixed on the upper fixed leg of upper surface subordinate surface central authorities, on this, fixed leg periphery has at least two upper air guide muscle alternately, described lower cock body has lower end face and is fixed on the lower fixed leg of lower end face upper face center, this lower fixed leg periphery has at least two lower air guide muscle alternately, described top plug body is positioned at the second cavity and embeds described gas leakage through hole, described lower cock body in base plate below embeds described gas leakage through hole and the lower fixed leg of cock body and the upper fixed leg of upper cock body be fixedly connected with, the width of described upper air guide muscle is greater than the width of described lower air guide muscle, the diameter of described lower end face and upper end face is greater than the diameter of described gas leakage through hole, the upper end face of described movable through hole plug and the distance between the face of lower end are greater than the thickness of gas leakage through hole, thereby guarantee this movable through hole plug can along gas leakage through hole advance up and down, when through hole is leaked gas in the lower cock body sealing of movable through hole plug, air-flow flows into from described suction nozzle, and when through hole is leaked gas in the upper cock body sealing of movable through hole plug, air-flow flows into from described gas leakage through hole,
The number of above-mentioned upper air guide muscle is three, and angle is 120 ° mutually, and the number of above-mentioned lower air guide muscle is three, and angle is 120 ° mutually, above-mentioned upper air guide muscle and lower air guide muscle are positioned on straight line, above-mentioned base plate lower surface and be positioned at gas leakage bore periphery there is installation base.
Related content in technique scheme is explained as follows:
1,, in such scheme, described base plate lower surface is also provided with for the alignment pin with described graphite boat location.
2, in such scheme, described lower fixed leg, and upper fixed leg between by threaded engagement, fix.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
Sucking disc mechanism of the present invention has improved the technical problem easily crystal grain being weighed wounded while adsorbing crystal grain in semiconductor grain manufacture process, and has greatly improved adsorption rate, thereby has improved product yield, reduces resource loss; The outstanding installation base of lower cock body under free state, vacuum can spill by the air guide muscle side of movable through hole plug.When sucker descending motion goes to inhale crystal grain, suction nozzle during apart from 1 millimeter of crystal grain crystal grain do not held because vacsorb is missed by gas leakage through hole, pull of vacuum is not enough to hold crystal grain.Sucker continues down motion, movable through hole plug first pushes up on the metal or graphite cake of placing crystal grain, movable through hole plug shrinks inward, now sucker has moved and has put in place and can not down move again, movable through hole plug shrinks inward rear vital qi and cannot from gas leakage through hole, miss, all vacuum gas just form negative pressure by suction nozzle, and at this moment crystal grain be just adsorbed.When crystal grain is held, sucker cannot down move again, thereby avoids crystal grain to encounter metal or the graphite cake edge of placing crystal grain, has avoided the crushed problem of crystal grain; Secondly, Acetabula device of the present invention greatly reduces the adsorption time of absorption crystal grain, and crystal grain is being adsorbed in a flash, has effectively avoided the off normal of crystal grain, and has saved the time, and production operation personnel's operation requirements is greatly reduced.
Accompanying drawing explanation
Accompanying drawing 1 is the main TV structure schematic diagram of sucking disc mechanism of the present invention;
Accompanying drawing 2 is sucking disc mechanism working state structure schematic diagram of the present invention;
Accompanying drawing 3 is sucking disc mechanism free state structural representation of the present invention;
Accompanying drawing 4 is the left TV structure schematic diagram of accompanying drawing 1;
Accompanying drawing 5 is cock body schematic perspective view under the present invention;
Accompanying drawing 6 is cock body schematic perspective view in the present invention;
Accompanying drawing 7 is activity through hole plug schematic perspective view of the present invention;
Accompanying drawing 8 is the normal laying state front view of semiconductor grain;
Accompanying drawing 9 is the vertical view of accompanying drawing 8;
Accompanying drawing 10 is the improper laying state front view of semiconductor grain;
Accompanying drawing 11 is the vertical view of accompanying drawing 10.
In above accompanying drawing: 1, the first cavity; 2, handle; 3, cover plate; 4, valve; 5, the first air vent hole; 6, the second air vent hole; 7, gas connection pipe; 8, base plate; 9, side plate; 10, the second cavity; 11, suction nozzle; 12, gas leakage through hole; 13, upper cock body; 14, lower cock body; 15, movable through hole plug; 16, upper end face; 17, upper fixed leg; 18, upper air guide muscle; 19, lower end face; 20, lower fixed leg; 21, lower air guide muscle; 22, installation base; 23, alignment pin; 24, semiconductor grain; 25, crystal grain groove.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described:
Embodiment: a kind of transfer of semiconductor chip sucking disc mechanism, described graphite boat has the crystal grain groove of placing semiconductor grain, described Acetabula device comprises: the handle 2 and the cover plate 3 that are inside provided with the first cavity 1, these handle 2 one end are provided with the valve 4 being communicated with described the first cavity 1, these handle 2 lower surfaces are provided with at least one first air vent hole 5 being communicated with described the first cavity 1, described cover plate 3 is provided with corresponding the second air vent hole 6, one gas connection pipes 7 of described the first air vent hole 5 and is communicated with described the first air vent hole 5 and the second air vent hole 6; One base plate 8 is installed on described cover plate 3 lower surfaces, this base plate 8 forms by side plate 9 the second cavity 10 being communicated with described the first cavity 1 with cover plate 3, is provided with several for adsorbing suction nozzle 11 and at least two gas leakage through holes 12 of described semiconductor grain on described base plate 8;
The movable through hole plug 15 and described gas leakage through hole 12 matched in clearance that upper cock body 13 and lower cock body 14, consist of are installed, on this, cock body 13 has upper end face 16 and is fixed on the upper fixed leg 17 of upper end face 16 lower surface central authorities, on this, fixed leg 17 peripheries have at least two upper air guide muscle 18 alternately, described lower cock body 14 has lower end face 19 and is fixed on the lower fixed leg 20 of lower end face 19 upper face center, these lower fixed leg 20 peripheries have at least two lower air guide muscle 21 alternately, described upper cock body 13 is positioned at the second cavity 10 and embeds described gas leakage through hole 12, described lower cock body 14 in base plate 8 belows embed described gas leakage through hole 12 and the lower fixed leg 20 of cock body 14 and the upper fixed leg 17 of upper cock body 13 be fixedly connected with, the width of described upper air guide muscle 18 is greater than the width of described lower air guide muscle 21, the diameter of described lower end face 19 and upper end face 16 is greater than the diameter of described gas leakage through hole 12, the upper end face 16 of described movable through hole plug 15 and the distance between lower end face 19 are greater than the thickness of gas leakage through hole 12, thereby guarantee this movable through hole plug 15 can along gas leakage through hole 12 advance up and down, when through hole 12 is leaked gas in lower cock body 14 sealings of movable through hole plug 15, air-flow flows into from described suction nozzle 11, and when through hole 12 is leaked gas in upper cock body 13 sealings of movable through hole plug 15, air-flow flows into from described gas leakage through hole 12.
The number of above-mentioned upper air guide muscle 18 is three, and angle is 120 ° mutually, and the number of above-mentioned lower air guide muscle 21 is three, and angle is 120 ° mutually, and above-mentioned upper air guide muscle 18 and lower air guide muscle 21 are positioned on straight line.
Above-mentioned base plate 8 lower surfaces and be positioned at gas leakage through hole 12 peripheries and there is installation base 22.
Above-mentioned base plate 8 lower surfaces are also provided with for the alignment pin 23 with described graphite boat location.
While adopting above-mentioned transfer of semiconductor chip to use sucking disc mechanism, improve the technical problem easily crystal grain being weighed wounded while adsorbing crystal grain in semiconductor grain manufacture process, and greatly improved adsorption rate, thereby improved product yield, reduced resource loss; The outstanding installation base of lower cock body under free state, vacuum can spill by the air guide muscle side of movable through hole plug.When sucker descending motion goes to inhale crystal grain, suction nozzle during apart from 1 millimeter of crystal grain crystal grain do not held because vacsorb is missed by gas leakage through hole, pull of vacuum is not enough to hold crystal grain.Sucker continues down motion, movable through hole plug first pushes up on the metal or graphite cake of placing crystal grain, movable through hole plug shrinks inward, now sucker has moved and has put in place and can not down move again, movable through hole plug shrinks inward rear vital qi and cannot from gas leakage through hole, miss, all vacuum gas just form negative pressure by suction nozzle, and at this moment crystal grain be just adsorbed.When crystal grain is held, sucker cannot down move again, thereby avoids crystal grain to encounter metal or the graphite cake edge of placing crystal grain, has avoided the crushed problem of crystal grain; Secondly, Acetabula device of the present invention greatly reduces the adsorption time of absorption crystal grain, and crystal grain is being adsorbed in a flash, has effectively avoided the off normal of crystal grain, and has saved the time, and production operation personnel's operation requirements is greatly reduced.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that Spirit Essence is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.
Claims (3)
1. a transfer of semiconductor chip sucking disc mechanism, described graphite boat has the crystal grain groove (25) of placement semiconductor grain (24), described Acetabula device comprises: the handle (2) and the cover plate (3) that are inside provided with the first cavity (1), this handle (2) one end is provided with the valve (4) being communicated with described the first cavity (1), this handle (2) lower surface is provided with at least one first air vent hole (5) being communicated with described the first cavity (1), described cover plate (3) is provided with and corresponding the second air vent hole of described the first air vent hole (5) (6), one gas connection pipe (7) is communicated with described the first air vent hole (5) and the second air vent hole (6), it is characterized in that: a base plate (8) is installed on described cover plate (3) lower surface, this base plate (8) forms the second cavity (10) being communicated with described the first cavity (1) by side plate (9) with cover plate (3), be provided with several for adsorbing suction nozzle (11) and at least two gas leakage through holes (12) of described semiconductor grain on described base plate (8),
The movable through hole plug (15) being comprised of upper cock body (13) and lower cock body (14) is installed with described gas leakage through hole (12) matched in clearance, cock body on this (13) has upper end face (16) and is fixed on the upper fixed leg (17) of upper end face (16) lower surface central authorities, fixed leg on this (17) periphery has at least two upper air guide muscle (18) alternately, described lower cock body (14) has lower end face (19) and is fixed on the lower fixed leg (20) of lower end face (19) upper face center, this lower fixed leg (20) periphery has at least two lower air guide muscle (21) alternately, described upper cock body (13) is positioned at the second cavity (10) and embeds described gas leakage through hole (12), described lower cock body (14) in base plate (8) below embeds described gas leakage through hole (12) and the lower fixed leg (20) of cock body (14) and the upper fixed leg (17) of upper cock body (13) be fixedly connected with, the width of described upper air guide muscle (18) is greater than the width of described lower air guide muscle (21), the diameter of described lower end face (19) and upper end face (16) is greater than the diameter of described gas leakage through hole (12), the upper end face (16) of described movable through hole plug (15) and the distance between lower end face (19) are greater than the thickness of gas leakage through hole (12), thereby guarantee this movable through hole plug (15) can along gas leakage through hole (12) advance up and down, when through hole (12) is leaked gas in lower cock body (14) sealing of movable through hole plug (15), air-flow flows into from described suction nozzle (11), when through hole (12) is leaked gas in upper cock body (13) sealing of movable through hole plug (15), air-flow flows into from described gas leakage through hole (12), the number of described upper air guide muscle (18) is three, and angle is 120 ° mutually, the number of described lower air guide muscle (21) is three, and angle is 120 ° mutually, described upper air guide muscle (18) and lower air guide muscle (21) are positioned on straight line, described base plate (8) lower surface and be positioned at gas leakage through hole (12) periphery and there is installation base (22).
2. sucking disc mechanism according to claim 1, is characterized in that: described base plate (8) lower surface is also provided with for the alignment pin (23) with described graphite boat location.
3. sucking disc mechanism according to claim 1, is characterized in that: between described lower fixed leg (20) and upper fixed leg (17), by threaded engagement, fix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310521713.8A CN103617961B (en) | 2011-12-31 | 2011-12-31 | Transfer semiconductor chip sucking disc mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310521713.8A CN103617961B (en) | 2011-12-31 | 2011-12-31 | Transfer semiconductor chip sucking disc mechanism |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110457925.5A Division CN102543815B (en) | 2011-12-31 | 2011-12-31 | Sucking disc device used for transferring semi-conductor crystal grains on graphite boat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103617961A true CN103617961A (en) | 2014-03-05 |
| CN103617961B CN103617961B (en) | 2016-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310521713.8A Active CN103617961B (en) | 2011-12-31 | 2011-12-31 | Transfer semiconductor chip sucking disc mechanism |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019061574A1 (en) * | 2017-09-29 | 2019-04-04 | 富准精密电子（鹤壁）有限公司 | Vacuum suction disc |
| CN110391166A (en) * | 2018-04-19 | 2019-10-29 | 苏州固锝电子股份有限公司 | Chip transmitting device for integrated circuit |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101630651A (en) * | 2008-07-16 | 2010-01-20 | 力成科技股份有限公司 | Chip pick-up component |
| CN201966192U (en) * | 2010-12-01 | 2011-09-07 | 中微半导体设备(上海)有限公司 | Static sucker with double contact surfaces |
| CN102263050A (en) * | 2011-08-01 | 2011-11-30 | 苏州固锝电子股份有限公司 | Device for moving semiconductor crystalline grains on graphite boat |
-
2011
- 2011-12-31 CN CN201310521713.8A patent/CN103617961B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101630651A (en) * | 2008-07-16 | 2010-01-20 | 力成科技股份有限公司 | Chip pick-up component |
| CN201966192U (en) * | 2010-12-01 | 2011-09-07 | 中微半导体设备(上海)有限公司 | Static sucker with double contact surfaces |
| CN102263050A (en) * | 2011-08-01 | 2011-11-30 | 苏州固锝电子股份有限公司 | Device for moving semiconductor crystalline grains on graphite boat |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019061574A1 (en) * | 2017-09-29 | 2019-04-04 | 富准精密电子（鹤壁）有限公司 | Vacuum suction disc |
| CN110391166A (en) * | 2018-04-19 | 2019-10-29 | 苏州固锝电子股份有限公司 | Chip transmitting device for integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103617961B (en) | 2016-07-06 |
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