CN103617960B - A kind of transfer device of fragility thin slice - Google Patents
A kind of transfer device of fragility thin slice Download PDFInfo
- Publication number
- CN103617960B CN103617960B CN201310571584.3A CN201310571584A CN103617960B CN 103617960 B CN103617960 B CN 103617960B CN 201310571584 A CN201310571584 A CN 201310571584A CN 103617960 B CN103617960 B CN 103617960B
- Authority
- CN
- China
- Prior art keywords
- slide block
- thin slice
- support
- fragility
- transfer device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Abstract
The present invention relates to the transfer device of a kind of fragility thin slice, belong to accurate and Ultraprecision Machining field.Including stay cord, support and multiple motion, multiple motions are fixed on the base of support.Guide rail in motion is relatively fixed by bolt and bracket base, from cradle top through support mesopore, the wire guide through slide block is fixed on slide block stay cord, spring is placed between bracket base and slide block, absorption migration face by adhesive be fixed on slide block bottom its have columnar projections.This transfer device relies on the van der Waals interaction changed between fragility thin slice and absorption migration face to realize the absorption to fragility thin slice and desorption, decrease the pollution to fragility thin slice, ensure that the reliability of production process, and simple in construction, easy to operate, it is suitable for the process line operation of fragility thin slice.
Description
Technical field
The present invention relates to the transfer device of a kind of fragility thin slice, belong to accurate and Ultraprecision Machining field.
Background technology
Integrated circuit (IC) manufactures and is roughly divided into three parts: IC design, wafer manufacture and encapsulation, wherein wafer manufacture is that during whole IC manufactures, technical matters is the most complicated, it is maximum to invest, only photoetching process therein is accomplished by 20-30 procedure, therefore needs continuous transferring plates to realize the processing of next process in wafer manufacturing process.But due to the impact of the factors such as the fragility of the material of wafer own, thickness, transfer process there will be the danger of broken wafers.It is currently mainly used vacuum cup, controlled adhesion material and transfering belt etc. and completes the transfer of wafer, but operate comparatively laborious.It addition, in order to reduce granule to the pollution of wafer surface, raising wafer crudy, vacuumizing environment is likely to become a kind of selection, and so traditional vacuum cup transfer method will be no longer applicable.For this reason, it is necessary to carry out new exploration, develop a kind of suitable in various working when fragility thin slice transfer device to meet the engineering field demand to high-quality fragility thin slice.
Current bionics is of increased attention, and transfer bionics principle being applied to fragility thin slice is a kind of brand-new conception.Present research worker has discovered that the mechanism of the controlled adhesion of the Gekko Swinhonis based on Van der Waals force, and prepared excellent performance there is friction and anisotropic bionic functional surface of adhering.The contact area between surface is changed, it may be achieved the strong rapid translating adhered between easy desorption by the mode of texturing of control biomimetics function surface micro structure.In order to realize this controlled conversion, it is necessary to the geometry of the micro structure of bionic surface is designed, simultaneously need to design suitable motion.Therefore, the exploration of this invention has been carried out, it is intended to designing can device stable, transfer fragility thin slice efficiently when various working.
Summary of the invention
The purpose of the present invention is to propose to the transfer device of a kind of fragility thin slice, adopt based on having friction and anisotropic bionic functional surface of adhering, utilize the variant of guide rail slide block structure control bionic surface micro structure, change the contact area between surface, the regulation and control bionic functional surface adhesion strength to fragility thin slice, thus realizing the transfer device transfer to fragility thin slice.
The transfer device of the fragility thin slice that the present invention proposes, including stay cord, support and multiple motion；Having mesopore on described support, the plurality of motion is fixed on the base of support；Described motion is made up of slide block, spring, guide rail and absorption migration face；Described guide rail is L-shaped, and guide rail is relatively fixed by bolt and bracket base, and described slide block is arranged on the end of L-shaped guide rail, and slide block has wire guide, and from cradle top through support mesopore, the wire guide through slide block is fixed on slide block described stay cord；Described spring is placed between bracket base and slide block；Described absorption migration face is fixed on the bottom of slide block by adhesive, and there is columnar projections in described absorption migration face, and the long-pending end cross-sectional more than columnar projections of the root section of columnar projections is amassed.
The transfer device of the fragility thin slice that the present invention proposes, its advantage is:
1, the transfer device of the fragility thin slice of the present invention, the van der Waals interaction changed between fragility thin slice and absorption migration face is relied on to realize the absorption to fragility thin slice and desorption, therefore transfer device of the present invention decreases the pollution to fragility thin slice, and can use in vacuum environment, can be used for the production industry of semiconductor chip.
2, transfer device of the present invention adopts guide rail slide block mechanism, it is possible to makes being more uniformly stressed of fragility thin slice to be transferred, reduces the risk that fragility thin slice is broken because of unbalance stress, it is ensured that the reliability of production process, reduces production cost.
3, the simple in construction of transfer device of the present invention, easy to operate, is suitable for the process line operation of fragility thin slice.
Accompanying drawing explanation
Fig. 1 is the three dimensional structure schematic diagram of the transfer device of the fragility thin slice that the present invention proposes.
Fig. 2 is the rotation profile of Fig. 1.
Fig. 3 be the present invention transfer device in absorption migration face structural representation.
Fig. 4 is in transfer device of the present invention, and absorption migration face and fragility thin slice interact and make fragility chip sorption to the schematic diagram in absorption migration face.
Fig. 5 is that absorption migration face and fragility thin slice to be transferred interact and make fragility thin slice to be transferred from the attached schematic diagram of absorption migration emaciated face.
In Fig. 1-Fig. 5,1 is stay cord, and 2 is support, and 3 is slide block, and 4 is spring, and 5 is guide rail, and 6 is absorption migration face, and 7 is bolt, and 8 is the columnar projections on absorption migration face, and 9 is fragility thin slice to be transferred.
Detailed description of the invention
The transfer device of fragility thin slice that the present invention proposes, its structure as depicted in figs. 1 and 2, including stay cord 1, support 2 and multiple motion.Having mesopore on support 2, multiple motions are fixed on the base of support 1.Motion is made up of slide block 3, spring 4, guide rail 5 and absorption migration face 6.Guide rail 5 is L-shaped, and guide rail 5 is relatively fixed by the base of bolt 7 with support 1, and slide block 3 is arranged on the end of L-shaped guide rail, and slide block 3 has wire guide, and from the top of support 2 through support mesopore, the wire guide through slide block 3 is fixed on slide block 3 stay cord 1.Spring 4 is placed between bracket base and slide block 3.Absorption migration face 6 is fixed on the bottom of slide block 3 by adhesive, and absorption migration face 6 has columnar projections 8, and the long-pending end cross-sectional more than columnar projections of the root section of columnar projections is amassed, as shown in Figure 3.
Below in conjunction with accompanying drawing, introduce operation principle and the work process of transfer device of the present invention:
Transfer device of the present invention includes support 2, motion parts and absorption migration face 6, and support 2 can be coupled with multiple motions by flange arrangement, and then can realize the location to fragility thin slice.Absorption migration face 6 is fixed on the bottom of slide block 3 by adhesive.One end of guide rail 5 is fixed on the bottom of support 2 by bolt 7, and the other end is with position limiting structure, it is prevented that slide block 3 skids off guide rail.Wire guide is had with one end of limit part at guide rail 5, one end of stay cord 1 is fixed on slide block 3 by wire guide, other end is drawn by the wire guide at support 2 center, and stay cord 1 can pull after drawing the wire guide of support 2, so that slide block 3 can slide on guide rail 5.Slide block 3 passes through the borehole jack in the middle of it on guide rail 5.If the base of support 2 is circular, then guide rail 5 can be uniform in a circumferential direction on the base of support 2.Spring 4 is enclosed within guide rail 5, the end thereof contacts support 2 of spring 4, and the other end contacts with slide block 3, and spring 4, when fragility thin slice transfer device does not work, is in compressive state by the effect of slide block 3, stay cord 1 and support 2..
During work, absorption migration face 6 when fixing bottom slide block 3, it is ensured that the normal direction of columnar projections structural section smaller portions on absorption migration face 6 overlaps with the radial direction of support 2.By changing the area (controlling the size of adhesion strength) in absorption migration face 6, the fragility thin slice that adsorbable movement varies in weight.It addition, by the size changing transfer device, it is possible to surface have the fragility thin slice of structure carry out absorption migration.
The work process of transfer device of the present invention is: 1) by pulling stay cord 1 to make slide block 3 extrusion spring 4；2) traversing carriage 2 is close to being moved fragility thin slice, until being positioned at absorption migration face 6 and the fragility flap contact of slide block 3 lower end；3) pulling stay cord 1 to make fragility thin slice to be transferred and absorption migration face 6 interact, the contact area between fragility thin slice to be transferred and absorption migration face 6 increases, and van der Waals interaction therebetween increases, and fragility thin slice to be transferred adheres on absorption migration face 6；4) lift support 2 and it moved on to the position specified；5) support 2 is fallen, decontrol (pulling) stay cord 1, slide block 3 is outside (inwardly) motion under the effect of spring 4, contact area between absorption migration face 6 and fragility thin slice 9 to be transferred reduces, as shown in Figure 4, van der Waals interaction therebetween is less than the gravity of fragility thin slice to be transferred, and fragility thin slice to be transferred separates with absorption migration face 6, and final fragility thin slice to be transferred is transferred to the position specified.
Fig. 5 show absorption migration face and fragility thin slice to be transferred and interacts and make fragility thin slice to be transferred from the attached schematic diagram of absorption migration emaciated face, its process is, unclamp stay cord 1, making the interaction between fragility thin slice to be transferred and absorption migration face 6 release, fragility thin slice to be transferred unclamps from absorption migration face 6.
Claims (1)
1. the transfer device of a fragility thin slice, it is characterised in that this transfer device includes stay cord, support and multiple motion；Having mesopore on described support, the plurality of motion is fixed on the base of support；Described motion is made up of slide block, spring, guide rail and absorption migration face；Described guide rail is L-shaped, and guide rail is relatively fixed by bolt and bracket base, and described slide block is arranged on the end of L-shaped guide rail, and slide block has wire guide, and from cradle top through support mesopore, the wire guide through slide block is fixed on slide block described stay cord；Described spring is placed between bracket base and slide block；Described absorption migration face is fixed on the bottom of slide block by adhesive, and there is columnar projections in described absorption migration face, and the long-pending end cross-sectional more than columnar projections of the root section of columnar projections is amassed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310571584.3A CN103617960B (en) | 2013-11-13 | 2013-11-13 | A kind of transfer device of fragility thin slice |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310571584.3A CN103617960B (en) | 2013-11-13 | 2013-11-13 | A kind of transfer device of fragility thin slice |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103617960A CN103617960A (en) | 2014-03-05 |
| CN103617960B true CN103617960B (en) | 2016-06-29 |
Family
ID=50168663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310571584.3A Active CN103617960B (en) | 2013-11-13 | 2013-11-13 | A kind of transfer device of fragility thin slice |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103617960B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110854051A (en) * | 2019-09-11 | 2020-02-28 | 芜湖德锐电子技术有限公司 | Chip picking device |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103979030B (en) * | 2014-05-13 | 2016-03-30 | 上海宇航系统工程研究所 | The bionical dry adhering device of one kind gecko |
| CN104241169B (en) * | 2014-07-23 | 2016-09-28 | 太原风华信息装备股份有限公司 | Small-medium size crystal liquid substrate absorption and turnover device |
| CN106057723A (en) * | 2016-08-16 | 2016-10-26 | 厦门市三安光电科技有限公司 | Microcomponent transfer method and device, and electronic equipment |
| CN109192693B (en) * | 2018-08-22 | 2021-04-09 | 京东方科技集团股份有限公司 | Substrate fixing structure and substrate conveying device |
| CN110524563B (en) * | 2019-08-15 | 2020-10-30 | 清华大学 | Control device for adhesion and desorption |
| CN111515986B (en) * | 2020-04-29 | 2021-10-01 | 清华大学 | Adhesion and desorption mechanism and method for transferring target piece by adhesion and desorption mechanism |
| CN113782475A (en) * | 2020-06-10 | 2021-12-10 | 佛山市国星光电股份有限公司 | LED chip transfer structure, manufacturing method thereof and chip transfer method |
| CN113085428B (en) * | 2021-04-13 | 2023-03-24 | 霖鼎光学(上海)有限公司 | Stamping demolding device and demolding method based on Van der Waals force |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7762362B2 (en) * | 2006-04-17 | 2010-07-27 | The Board Of Trustees Of The Leland Stanford Junior University | Climbing with dry adhesives |
| US20080025822A1 (en) * | 2006-04-17 | 2008-01-31 | Sangbae Kim | Device and method for handling an object of interest using a directional adhesive structure |
| CN101890988B (en) * | 2010-06-02 | 2011-11-30 | 南京航空航天大学 | Adhesive toe for gecko robot and movement method thereof |
-
2013
- 2013-11-13 CN CN201310571584.3A patent/CN103617960B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110854051A (en) * | 2019-09-11 | 2020-02-28 | 芜湖德锐电子技术有限公司 | Chip picking device |
| CN110854051B (en) * | 2019-09-11 | 2022-03-01 | 深圳市奥维特机电有限公司 | Chip picking device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103617960A (en) | 2014-03-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103617960B (en) | A kind of transfer device of fragility thin slice | |
| CN104362228B (en) | The high-accuracy motion platform of marble | |
| CN106558526B (en) | A kind of included wafer seeks the manipulator of side sensor | |
| CN202712152U (en) | Push rod type wafer clamping device which is retractable through air cylinder | |
| CN103465270A (en) | Clamping device with self-locking mechanism | |
| CN103506904B (en) | A kind of using method of thin-wall bearing ferrule both ends of the surface grinder | |
| CN105774764A (en) | Lateral grabbing assembling device for new energy battery | |
| CN205673784U (en) | The transporter of automobile oil pipe welding production | |
| CN106856186B (en) | Silicon wafer handover precision control device, silicon wafer adsorption platform, silicon wafer transmission system and silicon wafer handover method | |
| CN203427046U (en) | Clamping device with self lock | |
| CN105448787A (en) | Transmission device and semiconductor processing equipment | |
| CN102424073A (en) | Rope climbing robot | |
| CN103426804B (en) | Plasma processing device | |
| CN204401127U (en) | Wafer electroplating device | |
| CN105586578A (en) | Slide disc transferring device for chemical vapor deposition equipment | |
| CN104649583A (en) | Glass permeability-enhancing liquid pulling and coating lifting mechanism | |
| CN107651442A (en) | A kind of automatic assembling tool hand for LED | |
| CN106571329A (en) | Wafer substrate support rack structure | |
| CN204108764U (en) | For improving the device of Manual-automatic integrated thinning single surface machining accuracy | |
| CN202855723U (en) | Adsorptive transmission mechanism | |
| CN220651982U (en) | Silicon wafer transfer device and silicon wafer processing equipment | |
| CN105489543A (en) | Adsorbing and transporting mechanism for ultra-thin wafer slices | |
| CN211295069U (en) | Novel integrated circuit production is with stabilizing shock attenuation frock clamp | |
| CN104803189A (en) | High-temperature moving spherical rearview mirror glass suction device | |
| CN219094858U (en) | Monocrystalline silicon mounting fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |