CN103607837A - Printed circuit board structure - Google Patents
Printed circuit board structure Download PDFInfo
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- CN103607837A CN103607837A CN201310495933.8A CN201310495933A CN103607837A CN 103607837 A CN103607837 A CN 103607837A CN 201310495933 A CN201310495933 A CN 201310495933A CN 103607837 A CN103607837 A CN 103607837A
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- dielectric layer
- conductive patterns
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- openings
- circuit board
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Abstract
The invention discloses a printed circuit board structure. The printed circuit board structure comprises the following components of: a substrate which is provided with a plurality of first conductive patterns with a plurality of first openings formed therebetween; first dielectric layers which completely cover the plurality of first openings and partially cover the plurality of first conductive patterns; a plurality of second openings which are located between the plurality of first dielectric layers and arranged on the plurality of first conductive patterns; and a plurality of second conductive patterns, wherein one part of the second conductive patterns completely cover the second openings and partially cover the first dielectric layers, and the other part of the second conductive patterns are located on the first dielectric layers.
Description
Technical field
The invention belongs to art of printed circuit boards, particularly relate to a kind of circuit board of multilayer line that forms as insulating barrier by light-cured resin.
Background technology
Printed circuit board (PCB) adopts Layer increasing method to carry out the manufacture of wire line conventionally.The step of Layer increasing method comprises: get one and comprise and run through the conductive through hole of substrate and the substrate of circuit pattern layer, in conductive through hole, insert afterwards filling material, and then unify dielectric layer as increasing layer insulating in the surface pressure of substrate, wherein this dielectric layer covers aforesaid circuit pattern layer and its gap, after overcuring, on dielectric layer, carry out again laser drill, then carry out surface coarsening, and cover crystal seed layer, with photoresistance, form line pattern again, then carry out the plating of conductive layer, the crystal seed layer of finally removing photoresist layer and exposing forms so-called build-up circuit layer.But along with the circuit on circuit board is done thinner and thinner, for the requirement of substrate surface flatness also so increasingly strict.The dielectric layer using in tradition Layer increasing method is when curing, because its solvent comprising can volatilize along with Baking out, after solidifying, in dielectric layer surface, can form cave in abnormal, the not good phenomenon of surface flatness, have influence on the yield that manufacture on follow-up fine rule road.
For this reason, Chinese patent literature CN101389189B discloses a kind of circuit board, and it leads to and on substrate, forms the first wire pattern; On this substrate, cover the first dielectric layer, make this first dielectric layer cover this first wire pattern; Solidify this first dielectric layer; In this first dielectric layer surface, cover the second dielectric layer; Solidify this second dielectric layer, thereby via the covering of two-layer dielectric layer, to form depression abnormal thereby reduce dielectric layer surface, to realize the planarization of dielectric layer.If the document has also further proposed two-layer dielectric layer, cannot realize good planarization, continue to adopt the stacked structure of the 3rd layer of even more multi-layered dielectric layer, until form satisfied flatness.
Although above-mentioned document can finally be realized the planarization of dielectric layer, but because the dielectric layer of the document adopts the mode of Baking out to be cured, therefore, in some cases, probably only adopt two-layer dielectric layer cannot reach satisfied flatness, and have to continue to adopt more multi-layered dielectric layer to reach the object of planarization.This structure generates in application in reality, cannot improve formation efficiency.
Summary of the invention
The problems referred to above in view of prior art existence, the invention provides a kind of new construction of circuit board, the circuit board of this structure not only can obtain being satisfied with the dielectric layer of flatness, and can effectively reduce the complexity of manufacture process, can make fast printed circuit board (PCB), enhance productivity.
Board structure of circuit provided by the invention is: on substrate, have a plurality of the first conductive patterns, between described a plurality of the first conductive patterns, have a plurality of the first openings; The first dielectric layer, it covers a plurality of the first openings completely, and part covers a plurality of the first conductive patterns; A plurality of the second openings, it is between a plurality of the first dielectric layers and be positioned on a plurality of the first conductive patterns; A plurality of the second conductive patterns, wherein partially conductive pattern covers the second opening completely and partly covers the first dielectric layer, and another part conductive pattern is positioned on the first dielectric layer.
Wherein, the first dielectric layer is photocuring insualtion resin composition layer; Wherein, this photocuring insualtion resin composition layer is mixed by the material of following component: the light-cured resin of 22wt%-58wt%, the organic solvent of 33wt%-78wt%, the light trigger of 0.2wt-4wt%, the levelling agent of 0.8wt%-1.5wt%;
Wherein, light-cured resin is mixed by styrene and copolymer-maleic anhydride, epoxy resin and maleimide;
Wherein, organic solvent is the acid flux material such as formic acid or acetic acid; Or basic solvents such as ketone, ester or ether; Or neutral solutions such as aliphatic hydrocarbon, cycloalkane compound or some aromatic hydrocarbon solvent, such as specifically can be the neutral fluxes such as fatty alcohol, glycol ether, ethyl acetate, methylethylketone, gamma-butyrolacton, propionic acid-3-ether ethyl ester, butyl carbitol, butyl carbitol acetate, propylene glycol monomethyl ether, cyclohexane, dimethylbenzene or isopropyl alcohol;
Wherein, light trigger is to ethoxy ether phenylacetone, 2 such as 1-hydroxy cyclohexyl phenylketone, 2-hydroxy-2-methyl-1-, 4,6-trimethylbenzoyl ethoxyl phenenyl phosphine oxide, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, 4-methyldiphenyl ketone, 4,4 '-bis-(dimethylamino) benzophenone, 4,4 '-bis-(lignocaine) benzophenone or isopropyl thioxanthone;
Wherein, levelling agent is polyacrylate or organic siliconresin.
Accompanying drawing explanation
Fig. 1 is the printed circuit board arrangement schematic diagram of employing one deck dielectric layer of proposing of the present invention.
Fig. 2 is the printed circuit board arrangement schematic diagram of the two-layer dielectric layer of employing that proposes of the present invention.
Embodiment
Referring to Fig. 1, board structure of circuit provided by the invention is: on substrate 1, have a plurality of the first conductive patterns 2, between described a plurality of the first conductive patterns 2, have a plurality of the first openings 11; The first dielectric layer 3, it covers a plurality of the first openings 11 completely, and part covers a plurality of the first conductive patterns 2; A plurality of the second openings 12, it is between a plurality of the first dielectric layers 3 and be positioned on a plurality of the first conductive patterns 2; A plurality of the second conductive patterns 5, wherein partially conductive pattern covers the second opening 12 completely and partly covers the first dielectric layer 3, and another part conductive pattern is positioned on the first dielectric layer 3.
Wherein, the first dielectric layer 3 is photocuring insualtion resin composition layer; Wherein, this photocuring insualtion resin composition layer is mixed by the material of following component: the light-cured resin of 22wt%-58wt%, the organic solvent of 33wt%-78wt%, the light trigger of 0.2wt-4wt%, the levelling agent of 0.8wt%-1.5wt%;
Wherein, light-cured resin is mixed by styrene and copolymer-maleic anhydride, epoxy resin and maleimide;
Wherein, organic solvent is the acid flux material such as formic acid or acetic acid; Or basic solvents such as ketone, ester or ether; Or neutral solutions such as aliphatic hydrocarbon, cycloalkane compound or some aromatic hydrocarbon solvent, such as specifically can be the neutral fluxes such as fatty alcohol, glycol ether, ethyl acetate, methylethylketone, gamma-butyrolacton, propionic acid-3-ether ethyl ester, butyl carbitol, butyl carbitol acetate, propylene glycol monomethyl ether, cyclohexane, dimethylbenzene or isopropyl alcohol;
Wherein, light trigger is to ethoxy ether phenylacetone, 2 such as 1-hydroxy cyclohexyl phenylketone, 2-hydroxy-2-methyl-1-, 4,6-trimethylbenzoyl ethoxyl phenenyl phosphine oxide, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, 4-methyldiphenyl ketone, 4,4 '-bis-(dimethylamino) benzophenone, 4,4 '-bis-(lignocaine) benzophenone or isopropyl thioxanthone;
Wherein, levelling agent is polyacrylate or organic siliconresin.
The present invention, by adopting photocuring insualtion resin composition to be used as the first dielectric layer, is enough to form the dielectric layer that flatness meets the demands in general application.For example, after photocuring insualtion resin composition is spin-coated on substrate, via irradiation, photocuring insualtion resin composition is hardened, thereby form the first dielectric layer, this first dielectric layer can be controlled in 0.8 micron in the depression above the first opening.
Referring to Fig. 2, board structure of circuit provided by the invention is: on substrate 1, have a plurality of the first conductive patterns 2, between described a plurality of the first conductive patterns 2, have a plurality of the first openings 11; The first dielectric layer 3, it covers a plurality of the first openings 11 completely, and part covers a plurality of the first conductive patterns 2; The second dielectric layer 4, it is fitted in completely on the first dielectric layer 3 and forms; A plurality of the second openings 12, it is positioned on a plurality of the first conductive patterns 2, and connects the first dielectric layer 3 and the second dielectric layer 4 formation; A plurality of the second conductive patterns 5, wherein partially conductive pattern covers the second opening 12 completely and partly covers the second dielectric layer 4, and another part conductive pattern is positioned on the second dielectric layer 3.
Wherein the first dielectric layer 3 and the second dielectric layer 4 are all formed by photocuring insualtion resin composition layer, and described photocuring insualtion resin composition is identical with record in embodiment 1;
In this embodiment 2, described printed circuit board arrangement can be applicable to the occasion higher to required precision.Because if only apply the first dielectric layer, cannot meet precision machined requirement, can be after the first dielectric layer be cured, adopt same photocuring insualtion resin composition to continue to be spin-coated on the first dielectric layer, after illumination curing, form the second dielectric layer, now form the dual layer dielectric layer structure jointly being formed by the first dielectric layer and the second dielectric layer, in the depression above opening, further can be controlled in 0.3 micron.The structure adopting with respect to previously described patent documentation, the present invention only needs one deck dielectric layer can reach the technique effect that it just can reach by two-layer dielectric layer.If it is such to be similar to described patent documentation, adopt two-layer dielectric layer structure, the flatness that the present invention obtains just can be far superior to the scheme of above-mentioned document.
Above execution mode is described in detail the present invention, but above-mentioned execution mode is not intended to limit scope of the present invention, and protection scope of the present invention is defined by the appended claims.
Claims (3)
1. a printed circuit board arrangement, is characterized in that:
Described printed circuit board (PCB) has substrate, has a plurality of the first conductive patterns on substrate, between described a plurality of the first conductive patterns, has a plurality of the first openings; The first dielectric layer, it covers a plurality of the first openings completely, and part covers a plurality of the first conductive patterns; A plurality of the second openings, it is between a plurality of the first dielectric layers and be positioned on a plurality of the first conductive patterns; A plurality of the second conductive patterns, wherein partially conductive pattern covers the second opening completely and partly covers the first dielectric layer, and another part conductive pattern is positioned on the first dielectric layer.
2. a printed circuit board arrangement, is characterized in that:
Described printed circuit board (PCB) has substrate, has a plurality of the first conductive patterns on substrate, between described a plurality of the first conductive patterns, has a plurality of the first openings; The first dielectric layer, it covers a plurality of the first openings completely, and part covers a plurality of the first conductive patterns; The second dielectric layer, it is fitted in completely on the first dielectric layer and forms; A plurality of the second openings, it is positioned on a plurality of the first conductive patterns, and connects the first dielectric layer and the formation of the second dielectric layer; A plurality of the second conductive patterns, wherein partially conductive pattern covers the second opening completely and partly covers the second dielectric layer, and another part conductive pattern is positioned on the second dielectric layer.
3. printed circuit board arrangement as claimed in claim 1 or 2, is characterized in that:
Wherein, the first dielectric layer is photocuring insualtion resin composition layer; This photocuring insualtion resin composition layer is mixed by the material of following component: the light-cured resin of 22wt%-58wt%, the organic solvent of 33wt%-78wt%, the light trigger of 0.2wt-4wt%, the levelling agent of 0.8wt%-1.5wt%;
Wherein, light-cured resin is mixed by styrene and copolymer-maleic anhydride, epoxy resin and maleimide;
Wherein, organic solvent is the acid flux material such as formic acid or acetic acid; Or basic solvents such as ketone, ester or ether; Or neutral solutions such as aliphatic hydrocarbon, cycloalkane compound or some aromatic hydrocarbon solvent, such as specifically can be the neutral fluxes such as fatty alcohol, glycol ether, ethyl acetate, methylethylketone, gamma-butyrolacton, propionic acid-3-ether ethyl ester, butyl carbitol, butyl carbitol acetate, propylene glycol monomethyl ether, cyclohexane, dimethylbenzene or isopropyl alcohol;
Wherein, light trigger is to ethoxy ether phenylacetone, 2 such as 1-hydroxy cyclohexyl phenylketone, 2-hydroxy-2-methyl-1-, 4,6-trimethylbenzoyl ethoxyl phenenyl phosphine oxide, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, 4-methyldiphenyl ketone, 4,4 '-bis-(dimethylamino) benzophenone, 4,4 '-bis-(lignocaine) benzophenone or isopropyl thioxanthone;
Wherein, levelling agent is polyacrylate or organic siliconresin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310495933.8A CN103607837A (en) | 2013-10-21 | 2013-10-21 | Printed circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310495933.8A CN103607837A (en) | 2013-10-21 | 2013-10-21 | Printed circuit board structure |
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| Publication Number | Publication Date |
|---|---|
| CN103607837A true CN103607837A (en) | 2014-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310495933.8A Pending CN103607837A (en) | 2013-10-21 | 2013-10-21 | Printed circuit board structure |
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| CN (1) | CN103607837A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86103221A (en) * | 1985-04-12 | 1987-04-01 | 株式会社日立制造所 | Multilayer ceramic circuit board |
| CN1777348A (en) * | 2004-11-15 | 2006-05-24 | 三星电机株式会社 | Method of fabricating high density printed circuit board |
| CN101162364A (en) * | 2007-11-30 | 2008-04-16 | 京东方科技集团股份有限公司 | Photosensitive resin composition and method of making the same and film build method |
| CN101215369A (en) * | 2008-01-16 | 2008-07-09 | 京东方科技集团股份有限公司 | Optical cured resin, photosensitive resin composition and preparation method thereof |
| CN101290473A (en) * | 2008-05-26 | 2008-10-22 | 京东方科技集团股份有限公司 | Photosensitive resin composition and method of making the same |
| CN101389189A (en) * | 2007-09-10 | 2009-03-18 | 南亚电路板股份有限公司 | Circuit board producing method |
| CN101685256A (en) * | 2008-09-25 | 2010-03-31 | 富士胶片株式会社 | Photosensitive film manufacturing method, photosensitive film, photosensitive laminating body, permanent pattern forming method and printing circuit board |
| CN102196669A (en) * | 2010-03-17 | 2011-09-21 | 山荣化学有限公司 | Printed circuit board and manufacturing method thereof |
-
2013
- 2013-10-21 CN CN201310495933.8A patent/CN103607837A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86103221A (en) * | 1985-04-12 | 1987-04-01 | 株式会社日立制造所 | Multilayer ceramic circuit board |
| CN1777348A (en) * | 2004-11-15 | 2006-05-24 | 三星电机株式会社 | Method of fabricating high density printed circuit board |
| CN101389189A (en) * | 2007-09-10 | 2009-03-18 | 南亚电路板股份有限公司 | Circuit board producing method |
| CN101162364A (en) * | 2007-11-30 | 2008-04-16 | 京东方科技集团股份有限公司 | Photosensitive resin composition and method of making the same and film build method |
| CN101215369A (en) * | 2008-01-16 | 2008-07-09 | 京东方科技集团股份有限公司 | Optical cured resin, photosensitive resin composition and preparation method thereof |
| CN101290473A (en) * | 2008-05-26 | 2008-10-22 | 京东方科技集团股份有限公司 | Photosensitive resin composition and method of making the same |
| CN101685256A (en) * | 2008-09-25 | 2010-03-31 | 富士胶片株式会社 | Photosensitive film manufacturing method, photosensitive film, photosensitive laminating body, permanent pattern forming method and printing circuit board |
| CN102196669A (en) * | 2010-03-17 | 2011-09-21 | 山荣化学有限公司 | Printed circuit board and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 徐菲: "含氟光引发剂的合成及性能研究", 《中国优秀硕士学位论文全文数据库工程科技I辑》, no. 01, 15 January 2013 (2013-01-15), pages 6 - 12 * |
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Application publication date: 20140226 |