CN103606390A - Leadless-silver-conductor slurry - Google Patents
Leadless-silver-conductor slurry Download PDFInfo
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- CN103606390A CN103606390A CN201310515867.6A CN201310515867A CN103606390A CN 103606390 A CN103606390 A CN 103606390A CN 201310515867 A CN201310515867 A CN 201310515867A CN 103606390 A CN103606390 A CN 103606390A
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Abstract
The invention discloses leadless-silver-conductor slurry which is characterized in that the leadless-silver-conductor slurry includes a silver powder, a leadless-glass powder, an organic adhesive and an additive.
Description
Technical field
The present invention relates to a kind of electrooptical device electrode with lead-free silver conductive paste used.
Background technology
Solar energy is a kind of inexhaustible clean type energy, along with the exhaustion day by day of fossil energy, seeks the active demand that continuable alternative energy source becomes countries in the world day by day.Photovoltaic cell is solar energy to be changed to a kind of semiconductor device of electric energy, is also the continuable clean energy resource of current countries in the world primary study.
Crystal silicon photovoltaic cell is the leading products on market at present, and its photoelectric conversion efficiency is higher.The basic structure of crystal silicon photovoltaic cell is by p-type silicon substrate, N-type emitter, anti-reflecting layer (TiO
2, SiO
2or Si
3n
4), positive silver electrode and back silver electrode form.Conductive silver slurry forms silver electrode by thick-film technique (printing, sintering) at the back side of crystal silicon solar batteries, can realize being coupled to each other and the output of electric current between solar battery sheet.Silver conductive paste comprises silver powder, glass dust, and organic carrier and additive, the quality of size performance will have a strong impact on electrical property and the mechanical performance of photovoltaic cell.
The conductivity of conductive silver slurry, adhesive force and reliability in the situation that sintering condition is certain, depend on conductive silver slurry in as the glass dust of inorganic bond phase.And silver powder is the conductive phase of silver paste, it has determined electrical property and the mechanical performance of slurry.As the glass dust of silver paste Binder Phase, it must guarantee after sintering that silver forms good contacting with silicon substrate.
At present, all leaded, cadmium, mercury, the product of the harmful substances such as Cr VI has been forbidden selling at EU market, and therefore, the object in environmental protection, develops a kind of unleaded silver conductive paste, for use in having become common recognition in the industry in photovoltaic cell.
Summary of the invention
The object of this invention is to provide a kind of photovoltaic cell silver conductive paste, it does not contain plumbous to meet the requirement of environmental protection; And after this silver conductive paste sintering, make silver electrode there is good adhesive force, to obtain good contact.
It is lead-free silver conductive paste used that the present invention proposes, and it is characterized in that: described Lead free silver conducting paste comprises: silver powder, lead-free glass powder, organic bond and additive;
Wherein, according to weight percent meter, the silver powder that contains 65wt%-75wt%, this silver powder is ball shape silver powder, its purity >=9.995%, its average grain diameter is 0.3-0.8 micron;
Described lead-free glass powder is that low-melting glass, its content are 3wt%-8wt%; Wherein, the Bi that consists of (percentage by weight): 58.3wt%-61.6wt% of this lead-free glass powder
2o
3, 19.7wt%-22.4wt% B
2o
3, the ZnO of 6.2wt%-8.5wt% is, the TiO of 7.5wt%-15.8wt%
2; The average grain diameter of this lead-free glass powder is not more than 5 microns;
The content of organic bond is 6wt%-12wt%; Consisting of of organic bond wherein: ethyl cellulose, terpinol and dibutyl carbitol (DBC), by weight percentage, the content of ethyl cellulose, terpinol and dibutyl carbitol (DBC) is respectively: 10wt%-15wt%, 30wt%-50wt%, 35wt%-60wt%;
The content of additive is: 5wt%-26wt%; Additive can be zinc resinate, and its average grain diameter is 0.8-1.5 micron; Additive can be also Ti, Zn, and Al, Fe, selects one or both in the oxide of In, and the average grain diameter of described oxide powder is not more than 0.8 micron.
The technique effect of Lead free silver conducting paste of the present invention:
The lead-free glass powder that slurry of the present invention adopts has lower softening point, and owing to not containing heavy metal lead, therefore can meet the requirement of environmental protection.Meanwhile, after its sintering, make silver electrode there is good adhesive force, can guarantee that silver electrode and silicon substrate form good contacting.
Embodiment
It is lead-free silver conductive paste used that the present invention proposes, and it is characterized in that: described Lead free silver conducting paste comprises: silver powder, lead-free glass powder, organic bond and additive;
Wherein, according to weight percent meter, the silver powder that contains 65wt%-75wt%, this silver powder is ball shape silver powder, its purity >=9.995%, its average grain diameter is 0.3-0.8 micron;
Described lead-free glass powder is that low-melting glass, its content are 3wt%-8wt%; Wherein, the Bi that consists of (percentage by weight): 58.3wt%-61.6wt% of this lead-free glass powder
2o
3, 19.7wt%-22.4wt% B
2o
3, the ZnO of 6.2wt%-8.5wt% is, the TiO of 7.5wt%-15.8wt%
2; The average grain diameter of this lead-free glass powder is not more than 5 microns;
The content of organic bond is 6wt%-12wt%; Consisting of of organic bond wherein: ethyl cellulose, terpinol and dibutyl carbitol (DBC), by weight percentage, the content of ethyl cellulose, terpinol and dibutyl carbitol (DBC) is respectively: 10wt%-15wt%, 30wt%-50wt%, 35wt%-60wt%;
The content of additive is: 5wt%-26wt%; Additive can be zinc resinate, and its average grain diameter is 0.8-1.5 micron; Additive can be also Ti, Zn, and Al, Fe, selects one or both in the oxide of In, and the average grain diameter of described oxide powder is not more than 0.8 micron.
Introduce the lead-free silver conductive paste used preparation method that the present invention proposes below, described method in turn includes the following steps:
(1) prepare lead-free glass powder;
(2) prepare organic bond;
(3) silver powder, lead-free glass powder, organic bond and additive are mixed according to certain ratio, lead-free silver conductive paste used to make.
Wherein, in step (1), the preparation technology of lead-free glass powder is: by the Bi of 58.3wt%-61.6wt%
2o
3, 19.7wt%-22.4wt% B
2o
3, the ZnO of 6.2wt%-8.5wt% is, the TiO of 7.5wt%-15.8wt%
2put into crucible, then in Muffle furnace, melting mixes, and smelting temperature is 1200-1300 degree Celsius, and smelting time is 1-2 hour; After this, by adding after the glass shrend of evenly fusing in polyurethane tank, carry out ball milling, after being dried, obtain the lead-free glass powder that average grain diameter is not more than 5 microns;
Wherein, in step (2), the preparation technology of organic bond is: ethyl cellulose, terpinol and dibutyl carbitol (DBC) that content is respectively 10wt%-15wt%, 30wt%-50wt%, 35wt%-60wt% evenly mix, and are heated to 70-90 degree Celsius, stirs 1-1.5 hour; After cooling, obtain transparent organic bond;
Wherein, in step (3), the additive of the organic bond of the lead-free glass powder of the silver powder of 65wt%-75wt%, 3wt%-8wt%, 6wt%-12wt% and 5wt%-26wt% is put into de-airing mixer, continue to stir 2-3 hour, form homogeneous mixture, through three-high mill, grind again, obtain lead-free silver conductive paste used.
Introduce the preferred embodiments of the present invention below:
It is lead-free silver conductive paste used that the present invention proposes, and it is characterized in that: described Lead free silver conducting paste comprises: silver powder, lead-free glass powder, organic bond and additive;
Wherein, according to weight percent meter, the silver powder that contains 70wt%, this silver powder is ball shape silver powder, its purity >=9.995%, its average grain diameter is 0.5 micron;
Described lead-free glass powder is that low-melting glass, its content are 5wt%; Wherein, the Bi that consists of (percentage by weight): 60wt% of this lead-free glass powder
2o
3, 21wt% B
2o
3, the ZnO of 7wt% is, the TiO of 12wt%
2; 3 microns of the average grain diameters of this lead-free glass powder;
The content of organic bond is 10wt%; Consisting of of organic bond wherein: ethyl cellulose, terpinol and dibutyl carbitol (DBC), by weight percentage, the content of ethyl cellulose, terpinol and dibutyl carbitol (DBC) is respectively: 12wt%, 45wt%, 43wt%;
The content of additive is: 15wt%; Additive can be zinc resinate, and its average grain diameter is 1 micron; Additive can be also Ti, Zn, and Al, Fe, selects one or both in the oxide of In, 0.5 micron of the average grain diameter of described oxide powder.
So far the present invention has been done to detailed explanation, but the embodiment of description above the preferred embodiments of the present invention just only, it is not intended to limit the present invention.Those skilled in the art can make any modification to the present invention, and protection scope of the present invention is limited to the appended claims.
Claims (2)
- One kind lead-free silver conductive paste used, it is characterized in that: described Lead free silver conducting paste comprises: silver powder, lead-free glass powder, organic bond and additive.
- 2. as claimed in claim 1 lead-free silver conductive paste used, it is characterized in that:Wherein, according to weight percent meter, the silver powder that contains 65wt%-75wt%, this silver powder is ball shape silver powder, its purity >=9.995%, its average grain diameter is 0.3-0.8 micron;Described lead-free glass powder is that low-melting glass, its content are 3wt%-8wt%; Wherein, the Bi that consists of (percentage by weight): 58.3wt%-61.6wt% of this lead-free glass powder 2o 3, 19.7wt%-22.4wt% B 2o 3, the ZnO of 6.2wt%-8.5wt% and the TiO of 7.5wt%-15.8wt% 2; The average grain diameter of this lead-free glass powder is not more than 5 microns;The content of organic bond is 6wt%-12wt%; Consisting of of organic bond wherein: ethyl cellulose, terpinol and dibutyl carbitol (DBC), by weight percentage, the content of ethyl cellulose, terpinol and dibutyl carbitol (DBC) is respectively: 10wt%-15wt%, 30wt%-50wt%, 35wt%-60wt%;The content of additive is: 5wt%-26wt%; Additive can be zinc resinate, and its average grain diameter is 0.8-1.5 micron; Additive can be also Ti, Zn, and Al, Fe, selects one or both in the oxide of In, and the average grain diameter of described oxide powder is not more than 0.8 micron.
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CN201310515867.6A CN103606390B (en) | 2013-10-26 | 2013-10-26 | Lead-free silver conductive paste used |
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CN201310515867.6A CN103606390B (en) | 2013-10-26 | 2013-10-26 | Lead-free silver conductive paste used |
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CN103606390A true CN103606390A (en) | 2014-02-26 |
CN103606390B CN103606390B (en) | 2016-04-06 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106952674A (en) * | 2017-02-24 | 2017-07-14 | 哈尔滨工业大学深圳研究生院 | It is a kind of can low-temperature sintering wiring thick film conductor paste and its application |
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CN101609850A (en) * | 2009-07-14 | 2009-12-23 | 中南大学 | Lead-free silver conductive paste used for positive electrode of solar battery and preparation technology thereof |
CN101789456A (en) * | 2010-03-05 | 2010-07-28 | 西安宏星电子浆料科技有限责任公司 | Lead-free aluminum paste for solar battery |
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CN102768871A (en) * | 2012-05-28 | 2012-11-07 | 杭州正银电子材料有限公司 | Composition of lead-free silver electrocondution slurry used for forming crystal silicon solar cell back electrode as well as preparation method thereof |
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2013
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Patent Citations (5)
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CN101271929A (en) * | 2008-05-04 | 2008-09-24 | 常州亿晶光电科技有限公司 | Lead-free solar cell silver paste and preparation method thereof |
CN101609850A (en) * | 2009-07-14 | 2009-12-23 | 中南大学 | Lead-free silver conductive paste used for positive electrode of solar battery and preparation technology thereof |
CN101789456A (en) * | 2010-03-05 | 2010-07-28 | 西安宏星电子浆料科技有限责任公司 | Lead-free aluminum paste for solar battery |
CN102760512A (en) * | 2012-05-28 | 2012-10-31 | 杭州正银电子材料有限公司 | Lead-free silver electroconductive slurry used for forming crystalline silicon solar cell front surface electrode, and preparation method thereof |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN106952674A (en) * | 2017-02-24 | 2017-07-14 | 哈尔滨工业大学深圳研究生院 | It is a kind of can low-temperature sintering wiring thick film conductor paste and its application |
CN106952674B (en) * | 2017-02-24 | 2019-02-19 | 哈尔滨工业大学深圳研究生院 | It is a kind of can low-temperature sintering wiring thick film conductor paste and its application |
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