CN103599893A - Method for flushing lead frame raw materials of power integrated circuit - Google Patents

Method for flushing lead frame raw materials of power integrated circuit Download PDF

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Publication number
CN103599893A
CN103599893A CN201310414004.XA CN201310414004A CN103599893A CN 103599893 A CN103599893 A CN 103599893A CN 201310414004 A CN201310414004 A CN 201310414004A CN 103599893 A CN103599893 A CN 103599893A
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China
Prior art keywords
lead frame
water
raw
integrated circuit
flushing
Prior art date
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Application number
CN201310414004.XA
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Chinese (zh)
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CN103599893B (en
Inventor
郑康定
曹光伟
冯小龙
段华平
马叶军
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NINGBO KANGQIANG ELECTRONICS CO Ltd
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NINGBO KANGQIANG ELECTRONICS CO Ltd
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Priority to CN201310414004.XA priority Critical patent/CN103599893B/en
Publication of CN103599893A publication Critical patent/CN103599893A/en
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Publication of CN103599893B publication Critical patent/CN103599893B/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members

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  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

The invention relates to a method for flushing lead frame raw materials of a power integrated circuit. The method is characterized by comprising the steps of cleaning the lead frame raw materials through flushing rollers, wherein every two flushing rollers form a pair; clamping the raw materials between the two pairs of flushing rollers to perform rolling flushing on the raw materials, wherein pressure between the flushing rollers and the raw materials is kept constant through hydraulic pressure during flushing. Compared with the prior art, the method has the advantages that an oxidation layer on the surface of metal is removed by means of rolling flushing of the flushing rollers, the obtained metal surface is conform in color and luster, and the process is friendly to the environment; the pressure between the flushing rollers and the raw materials is kept constant through the hydraulic pressure during flushing, the flushing effect is uniform, and the color and the luster are conform; flushing materials are formed by bonding nylon wires and aluminum oxide powder, therefore, damage to products is avoided, and the oxidation layer can be removed completely.

Description

The raw-material method of cleaning with water of power integrated circuit lead frame
Technical field
The present invention relates to clean with water method, relate in particular to the raw-material method of cleaning with water of power integrated circuit lead frame, belong to the raw-material production technical field of lead frame.
Background technology
Power integrated circuit lead frame is mainly stamped to form by sheet metal strip, sheet metal strip is after machining and annealing, also need to remove surperficial oxide layer, conventional removal method is pickling, the pickle of acid cleaning process is generally the mixture of multiple acid, mainly contain sulfuric acid, nitric acid and hydrofluoric acid etc., the corrosivity of these mixed acid is very strong, there is very strong oxidisability simultaneously, the temperature of higher corrosive medium, this corrosion resisting property to anti-corrosion material has proposed very high requirement, volatilization and emission problem due to pickle, the method is very unfavorable aspect environmental protection, destruction to environment is larger, and its cost is higher, at the production cost that has to a certain degree increased product, therefore, a kind of new method of cleaning with water of exigence solves above-mentioned technical problem.
Summary of the invention
The present invention is just for the technical problem existing in prior art, a kind of raw-material method of cleaning with water of power integrated circuit lead frame is disclosed, the method is used the rolling of cleaning roller to clean the oxide layer of removing metal surface with water, color and luster is consistent more in the metal surface obtaining, whole process is without any pollution, environmental protection more, and cost is lower, has further reduced the production work cost of enterprise.
  
To achieve these goals, technical scheme of the present invention is as follows, the raw-material method of cleaning with water of power integrated circuit lead frame, is characterized in that, described method is as follows, to lead frame raw material, use cleaning roller to clean, two cleaning rollers partner, and raw material are clamped in the middle of two pairs of cleaning rollers, and raw material are rolled and cleaned with water, in cleaning process with water, by hydraulic pressure, keep pressure constant between cleaning roller and raw material.
As a further improvement on the present invention, the material of cleaning with water on described cleaning roller is formed by nylon yarn and aluminium oxide powder bonding, and described aluminium oxide powder is crossed 1500-2500 order.
As a further improvement on the present invention, the quantity of described cleaning roller is 4.
As a further improvement on the present invention, described cleaning roller pressure and angle can regulate arbitrarily, use ROLLING OIL to clean with cooling.
As a further improvement on the present invention, 4-6 ms/min of the gait of march of described cleaning roller, further guarantee the uniformity of cleaning with water.
As a further improvement on the present invention, the described cleaning roller one side amount of cleaning with water 0.005-0.015mm, by hydraulic-driven, the about 3-7 kilogram of pressure, the about 500-900 rev/min of roller rotating speed.
As a further improvement on the present invention, described in to clean the hydraulic-driven pressure rolling with water be 4 kilograms, 800 revs/min of roller rotating speeds, output surface roughness Rmax 1.1 μ m.
As a further improvement on the present invention, described in to clean the hydraulic-driven pressure rolling with water be 4 kilograms, 600 revs/min of roller rotating speeds, output surface roughness Rmax 1.2 μ m.
As a further improvement on the present invention, described in to clean the hydraulic-driven pressure rolling with water be 6 kilograms, 800 revs/min of output surface roughness Rmax 1.0 μ m of roller rotating speed.
As a further improvement on the present invention, described in to clean the hydraulic-driven pressure rolling with water be 6 kilograms, 600 revs/min of roller rotating speeds, output surface roughness Rmax 1.1 μ m.
With respect to prior art, beneficial effect of the present invention is as follows: the method is used the rolling of cleaning roller to clean the oxide layer of removing metal surface with water, color and luster is consistent more in the metal surface obtaining, process is environmental protection more, in cleaning process with water, applying hydraulic pressure keeps the pressure between cleaning roller and raw material to keep constant, make to clean effect with water even, color and luster is consistent; Clean material with water and formed by nylon yarn and aluminium oxide powder bonding, neither can cause damage to product, guaranteed again the thorough removing of oxide layer; In addition, cleaning roller pressure and angle can regulate arbitrarily, greatly facilitate carrying out smoothly of the work of cleaning with water, the described cleaning roller one side amount of cleaning with water 0.005-0.015mm, by hydraulic-driven, the about 3-7 kilogram of pressure, the about 500-900 rev/min of roller rotating speed, this arranges the further pressure constant between cleaning roller and raw material that guaranteed, makes to clean effect with water more even.
The specific embodiment
In order to deepen the understanding of the present invention and understanding, below in conjunction with the specific embodiment, the present invention is made further instructions and introduced.
embodiment 1:
A kind of raw-material method of cleaning with water of power integrated circuit lead frame, it is characterized in that, described method is as follows, to lead frame raw material, use cleaning roller to clean, two cleaning rollers partner, and raw material are clamped in the middle of two pairs of cleaning rollers, and raw material are rolled and cleaned with water, in cleaning process with water, by hydraulic pressure, keep pressure constant between cleaning roller and raw material.This is cleaned the pressure of applying between hydraulic pressure maintenance cleaning roller and raw material in process with water and keeps constant, makes to clean effect with water even, and color and luster is consistent.
embodiment 2:
As a further improvement on the present invention, the material of cleaning with water on described cleaning roller is formed by nylon yarn and aluminium oxide powder bonding, and described aluminium oxide powder is crossed 1500-2500 order.This is cleaned material with water and neither can cause damage to product, has guaranteed again the thorough removing of oxide layer.
embodiment 3:as a further improvement on the present invention, the quantity of described cleaning roller is 4, is divided into 2 groups, and 2 every group, two groups of rollers are clipped in the middle raw material to clean with water.
embodiment 4:as a further improvement on the present invention, described cleaning roller pressure and angle can regulate arbitrarily, use ROLLING OIL to clean with cooling.Further guaranteed the free degree of cleaning with water, easy to operate.
embodiment 5:as a further improvement on the present invention, 4-6 ms/min of the gait of march of described cleaning roller.
embodiment 6:as a further improvement on the present invention, the described cleaning roller one side amount of cleaning with water 0.005-0.015mm, by hydraulic-driven, the about 3-7 kilogram of pressure, the about 500-900 rev/min of roller rotating speed.
embodiment 7:as a further improvement on the present invention, described in to clean the hydraulic-driven pressure rolling with water be 4 kilograms, 800 revs/min of roller rotating speeds, output surface roughness Rmax 1.1 μ m.
embodiment 8:as a further improvement on the present invention, described in to clean the hydraulic-driven pressure rolling with water be 4 kilograms, 600 revs/min of roller rotating speeds, output surface roughness Rmax 1.2 μ m.
embodiment 9:as a further improvement on the present invention, described in to clean the hydraulic-driven pressure rolling with water be 6 kilograms, 800 revs/min of output surface roughness Rmax 1.0 μ m of roller rotating speed.
embodiment 10:as a further improvement on the present invention, described in to clean the hydraulic-driven pressure rolling with water be 6 kilograms, 600 revs/min of roller rotating speeds, output surface roughness Rmax 1.1 μ m.
The present invention can also will be combined to form new embodiment between embodiment.
It should be noted that above-described embodiment is only preferred embodiment of the present invention; be not used for limiting protection scope of the present invention; being equal to replacement or substituting of having done on the basis of the above all belongs to protection scope of the present invention, and protection scope of the present invention is as the criterion with claims.

Claims (10)

1. the raw-material method of cleaning with water of power integrated circuit lead frame, it is characterized in that, described method is as follows, to lead frame raw material, use cleaning roller to clean, two cleaning rollers partner, and raw material are clamped in the middle of two pairs of cleaning rollers, and raw material are rolled and cleaned with water, in cleaning process with water, by hydraulic pressure, keep pressure constant between cleaning roller and raw material.
2. the raw-material method for annealing of power integrated circuit lead frame according to claim 1, is characterized in that, the material of cleaning with water on described cleaning roller is formed by nylon yarn and aluminium oxide powder bonding, and described aluminium oxide powder is crossed 1500-2500 order.
3. the raw-material method for annealing of power integrated circuit lead frame according to claim 1, is characterized in that, the quantity of described cleaning roller is 4.
4. according to the raw-material method for annealing of power integrated circuit lead frame described in claim 1 or 2 or 3, it is characterized in that, described cleaning roller pressure and angle can regulate arbitrarily, use ROLLING OIL to clean with cooling.
5. the raw-material method for annealing of power integrated circuit lead frame according to claim 1, is characterized in that 4-6 ms/min of the gait of march of described cleaning roller.
6. according to the raw-material method for annealing of power integrated circuit lead frame described in claim 1 or 2 or 3, it is characterized in that, the described cleaning roller one side amount of cleaning with water 0.005-0.015mm, passes through hydraulic-driven, the about 3-7 kilogram of pressure, the about 500-900 rev/min of roller rotating speed.
7. the raw-material method for annealing of power integrated circuit lead frame according to claim 6, is characterized in that, described in to clean the hydraulic-driven pressure rolling with water be 4 kilograms, 800 revs/min of roller rotating speeds, output surface roughness Rmax 1.1 μ m.
8. the raw-material method for annealing of power integrated circuit lead frame according to claim 6, is characterized in that, described in to clean the hydraulic-driven pressure rolling with water be 4 kilograms, 600 revs/min of roller rotating speeds, output surface roughness Rmax 1.2 μ m.
9. the raw-material method for annealing of power integrated circuit lead frame according to claim 6, is characterized in that, described in to clean the hydraulic-driven pressure rolling with water be 6 kilograms, 800 revs/min of output surface roughness Rmax 1.0 μ m of roller rotating speed.
10. the raw-material method for annealing of power integrated circuit lead frame according to claim 6, is characterized in that, described in to clean the hydraulic-driven pressure rolling with water be 6 kilograms, 600 revs/min of roller rotating speeds, output surface roughness Rmax 1.1 μ m.
CN201310414004.XA 2013-09-12 2013-09-12 Method for flushing lead frame raw materials of power integrated circuit Active CN103599893B (en)

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Application Number Priority Date Filing Date Title
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CN103599893A true CN103599893A (en) 2014-02-26
CN103599893B CN103599893B (en) 2015-07-15

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008041446A1 (en) * 2006-09-29 2008-04-10 Nitto Denko Corporation Tape cartridge for cleaning work
CN201421841Y (en) * 2009-06-05 2010-03-10 三星电子株式会社 Lead frame and packaging part
CN102034781A (en) * 2009-09-25 2011-04-27 万国半导体有限公司 Semiconductor package for printing bonding material on lead frame and wafer and manufacturing method thereof
CN202238734U (en) * 2011-08-29 2012-05-30 江阴康强电子有限公司 Lead frame rinsing tank
US20120306031A1 (en) * 2011-05-31 2012-12-06 Freescale Semiconductor, Inc. Semiconductor sensor device and method of packaging same
CN103094240A (en) * 2012-12-15 2013-05-08 华天科技(西安)有限公司 High-density etched lead frame FCAAQFN package part and manufacture process thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008041446A1 (en) * 2006-09-29 2008-04-10 Nitto Denko Corporation Tape cartridge for cleaning work
CN201421841Y (en) * 2009-06-05 2010-03-10 三星电子株式会社 Lead frame and packaging part
CN102034781A (en) * 2009-09-25 2011-04-27 万国半导体有限公司 Semiconductor package for printing bonding material on lead frame and wafer and manufacturing method thereof
US20120306031A1 (en) * 2011-05-31 2012-12-06 Freescale Semiconductor, Inc. Semiconductor sensor device and method of packaging same
CN202238734U (en) * 2011-08-29 2012-05-30 江阴康强电子有限公司 Lead frame rinsing tank
CN103094240A (en) * 2012-12-15 2013-05-08 华天科技(西安)有限公司 High-density etched lead frame FCAAQFN package part and manufacture process thereof

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