CN103596363A - Composite flexible substrate - Google Patents
Composite flexible substrate Download PDFInfo
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- CN103596363A CN103596363A CN201310520489.0A CN201310520489A CN103596363A CN 103596363 A CN103596363 A CN 103596363A CN 201310520489 A CN201310520489 A CN 201310520489A CN 103596363 A CN103596363 A CN 103596363A
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- flexible substrate
- conductive pattern
- base material
- compound
- resin
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Abstract
The invention discloses a composite flexible substrate. The composite flexible substrate is characterized by comprising a first flexible substrate body and a second flexible substrate body. The first flexible substrate body and the second flexible substrate body are bonded together through electric conduction bonding agents.
Description
Technical field
The present invention relates to a kind of printed base plate field, particularly relate to a kind of compound flexible substrate.
Background technology
Flexible substrate (flexible printed circuit board, FPCB) is due to its special bent character, so a large amount of being applied in portable electric appts.Compound flexible substrate is that multi-disc is had to the circuit board structure that the flexible substrate of conductive pattern combines.By compound flexible substrate, can be by electronics miniaturization.
But in prior art, compound flexible substrate all connects by connector conventionally, and this connected mode not only complicate fabrication process, cost cannot reduce, and the more important thing is, owing to having had more connector, therefore the further miniaturization of compound flexible substrate is restricted.
Summary of the invention
The present invention is directed to the problem that prior art exists, a kind of compound flexible substrate is provided, this flexible substrate can connect without connector, thereby can realize further miniaturization.
The compound flexible substrate that the present invention proposes, has following structure:
Compound flexible substrate comprises the first flexible substrate and the second flexible substrate, and described the first flexible substrate and the second flexible substrate combine by electroconductive binder; Wherein, the first flexible substrate is one side flexible substrate, and it comprises the first base material, covers the first conductive pattern and first registration holes on the first base material surface;
The second flexible substrate is double-faced flexible substrate, it comprises the second base material, cover respectively the second conductive pattern and the 3rd conductive pattern on the first base material two sides, wherein, the second conductive pattern surface does not cover insulating barrier, the 3rd conductive pattern surface coverage has insulating barrier, and the second registration holes;
Wherein, the second registration holes alignment of the first registration holes of the first flexible substrate and the second flexible substrate, the first conductive pattern of described the first flexible substrate is bonded together by the second conductive pattern of electroconductive binder and described the second flexible substrate;
Wherein, described the first and second base material are formed by mylar, for example polyimides, polyimides acid imide or polyethylene naphthalenedicarboxylate formaldehyde;
Electroconductive binder is comprised of conductive particle, binder resin, curing agent and lytic agent.Described conductive particle is nano-level conducting particle, and conductive particle is for example silver, nickel or copper, and particle diameter is 100-200 nanometer.Described binder resin is for example mylar, epoxy resin or polyimide resin.When mylar is used as binder resin, isocyanate compound is as curing agent.When mylar is used as binder resin, curing agent is selected isocyanate compound.When epoxy resin is used as binder resin, curing agent is selected amines or imidazolium compounds.Lytic agent is for example cellulose solvent or butyl carbitol acetate.
Wherein, described insulating barrier is insulating resin.
Accompanying drawing explanation
Fig. 1 is the generalized section of the compound flexible substrate that proposes of the present invention.
Embodiment
Referring to Fig. 1, the compound flexible substrate that the present invention proposes, has following structure:
Compound flexible substrate comprises the first flexible substrate and the second flexible substrate, and described the first flexible substrate and the second flexible substrate combine by electroconductive binder; Wherein, the first flexible substrate is one side flexible substrate, and it comprises the first base material 100, covers the first conductive pattern 101 and first registration holes 105 on the first base material 100 surfaces;
The second flexible substrate is double-faced flexible substrate, it comprises the second base material 200, cover respectively the second conductive pattern 201 and the 3rd conductive pattern 202 on the first base material 200 two sides, wherein, the second conductive pattern 201 surfaces do not cover insulating barrier, the 3rd conductive pattern 202 surface coverage have insulating barrier 203, and the second registration holes 205;
Wherein, the second registration holes 205 alignment of the first registration holes 105 of the first flexible substrate and the second flexible substrate, the first conductive pattern 101 of described the first flexible substrate is bonded together by electroconductive binder 300 and the second conductive pattern 201 of described the second flexible substrate;
Wherein, described the first base material 100 and the second base material 200 are formed by mylar, for example polyimides, polyimides acid imide or polyethylene naphthalenedicarboxylate formaldehyde;
Wherein, described insulating barrier 203 is insulating resin.
The manufacture method of introducing the compound flexible substrate of the present invention's proposition below, described method in turn includes the following steps:
(1) electroconductive binder 300 is printed on the first flexible substrate by silk screen printing;
(2) electroconductive binder 300 is printed on the second flexible substrate by silk screen printing;
(3) by the contraposition of the first registration holes 105 and the second registration holes 205, by the first flexible substrate and the alignment of the second flexible substrate;
(4) the first flexible substrate and the second flexible substrate is bonding;
(5) by the first flexible substrate after bonding and the heating of the second flexible substrate, thereby electroconductive binder 300 is solidified.
Wherein, the heating-up temperature of step (5) is 100-150 degree Celsius, and be 0.5-1 hour heating time.
The compound flexible substrate that the present invention proposes, the first flexible substrate is directly connected by electroconductive binder 300 with the second flexible substrate, so without by connector, the first flexible substrate being connected to the second flexible substrate, thereby can simplify the structure that the first flexible substrate is connected to the second flexible substrate.
So far the present invention has been done to detailed explanation, but the embodiment of description above the preferred embodiments of the present invention just only, it is not intended to limit the present invention.Those skilled in the art can make any modification to the present invention, and protection scope of the present invention is limited to the appended claims.
Claims (3)
1. a compound flexible substrate, has following structure:
Compound flexible substrate comprises the first flexible substrate and the second flexible substrate, and described the first flexible substrate and the second flexible substrate combine by electroconductive binder.
2. compound flexible substrate as claimed in claim 1, is characterized in that:
Wherein, the first flexible substrate is one side flexible substrate, and it comprises the first base material, covers the first conductive pattern and first registration holes on the first base material surface; The second flexible substrate is double-faced flexible substrate, it comprises the second base material, cover respectively the second conductive pattern and the 3rd conductive pattern on the first base material two sides, wherein, the second conductive pattern surface does not cover insulating barrier, the 3rd conductive pattern surface coverage has insulating barrier, and the second registration holes;
Wherein, the second registration holes alignment of the first registration holes of the first flexible substrate and the second flexible substrate, the first conductive pattern of described the first flexible substrate is bonded together by the second conductive pattern of electroconductive binder and described the second flexible substrate.
3. compound flexible substrate as claimed in claim 2, is characterized in that:
Wherein, described the first and second base material are formed by mylar, for example polyimides, polyimides acid imide or polyethylene naphthalenedicarboxylate formaldehyde;
Electroconductive binder is comprised of conductive particle, binder resin, curing agent and lytic agent; Described conductive particle is nano-level conducting particle, and conductive particle is for example silver, nickel or copper, and particle diameter is 100-200 nanometer; Described binder resin is for example mylar, epoxy resin or polyimide resin; When mylar is used as binder resin, isocyanate compound is as curing agent; When epoxy resin is used as binder resin, amines or imidazolium compounds are as curing agent; Lytic agent is for example cellulose solvent, acetic acid butyl, cellosolve acetate, or butyl carbitol acetate;
Wherein, described insulating barrier is insulating resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310520489.0A CN103596363A (en) | 2013-10-26 | 2013-10-26 | Composite flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310520489.0A CN103596363A (en) | 2013-10-26 | 2013-10-26 | Composite flexible substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103596363A true CN103596363A (en) | 2014-02-19 |
Family
ID=50086289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310520489.0A Pending CN103596363A (en) | 2013-10-26 | 2013-10-26 | Composite flexible substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103596363A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060033213A1 (en) * | 2004-08-16 | 2006-02-16 | Telephus Inc. | Multilayered anisotropic conductive adhesive for fine pitch |
| CN1791299A (en) * | 2004-12-17 | 2006-06-21 | 台朔光电股份有限公司 | Flexible rigid printed circuit board for display |
| CN101688099A (en) * | 2007-08-08 | 2010-03-31 | 日立化成工业株式会社 | Adhesive composition, film-like adhesive, and connection structure for circuit member |
-
2013
- 2013-10-26 CN CN201310520489.0A patent/CN103596363A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060033213A1 (en) * | 2004-08-16 | 2006-02-16 | Telephus Inc. | Multilayered anisotropic conductive adhesive for fine pitch |
| CN1791299A (en) * | 2004-12-17 | 2006-06-21 | 台朔光电股份有限公司 | Flexible rigid printed circuit board for display |
| CN101688099A (en) * | 2007-08-08 | 2010-03-31 | 日立化成工业株式会社 | Adhesive composition, film-like adhesive, and connection structure for circuit member |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140219 |