CN103594442A - Chip - Google Patents
Chip Download PDFInfo
- Publication number
- CN103594442A CN103594442A CN201210291838.1A CN201210291838A CN103594442A CN 103594442 A CN103594442 A CN 103594442A CN 201210291838 A CN201210291838 A CN 201210291838A CN 103594442 A CN103594442 A CN 103594442A
- Authority
- CN
- China
- Prior art keywords
- chip
- pin
- braces
- pins
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
A chip comprises a body, several connection sheets which are made of metal and form in the body and several pins which are made of metal. The connection sheets are connected to a logic circuit in the body. The pins are connected to the connection sheets respectively. When one pin of the chip is damaged, a new pin can be replaced and is connected to the corresponding connection sheet so that a service life of the chip is prolonged.
Description
Technical field
The present invention relates to a kind of chip.
Background technology
The insulating body of chip forms some pins of being made by conductor (as metal), if there is a pin accidentally to damage, chip just can not have been used.
Summary of the invention
In view of more than, be necessary to provide a kind of can be because a pin damage the whole chip of scrapping.
, comprising a body, take shape in some metal brace and some metal pins of this body, these braces are connected in this intrinsic logical circuit, and these pins are connected to these braces.
When a pin of this chip damages, a replaceable new pin is connected to corresponding brace, has extended the useful life of chip.
Accompanying drawing explanation
Fig. 1 is the stereogram of the preferred embodiments of chip of the present invention.
Primary clustering symbol description
| Body | 10 |
| Brace | 11 |
| Pin | 12 |
| Logical circuit | 13 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Please refer to Fig. 1, the preferred embodiments of chip of the present invention comprises a body 10, takes shape in some metal brace 11 and some metal pins 12 of body 10 both sides.These braces 11 are connected in the logical circuit 13 in body 10.These pins 12 are welded in respectively these braces 11.
The pin 12 of this chip is welded in brace 11, has larger connection area, compares traditional chip, and the pin 12 of this chip is frangibility not.When having a pin 12 to damage, can be by the new pin 12 of burn-oning after the solder fusing of this pin 12, so just can be because a pin 12 damages and whole chip rejection.
Claims (4)
1. a chip, comprises a body, takes shape in the pin that brace that some conductors of this body make and some conductors are made, and these braces are connected in this intrinsic logical circuit, and these pins are connected to these braces.
2. chip as claimed in claim 1, is characterized in that: these pins are welded in respectively these braces.
3. chip as claimed in claim 1, is characterized in that: these braces take shape in the both sides of this body.
4. chip as claimed in claim 1, is characterized in that: these braces and pin are made of metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210291838.1A CN103594442A (en) | 2012-08-16 | 2012-08-16 | Chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210291838.1A CN103594442A (en) | 2012-08-16 | 2012-08-16 | Chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103594442A true CN103594442A (en) | 2014-02-19 |
Family
ID=50084521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210291838.1A Pending CN103594442A (en) | 2012-08-16 | 2012-08-16 | Chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103594442A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104362137A (en) * | 2014-10-11 | 2015-02-18 | 东莞市柏尔电子科技有限公司 | High-heat-dissipativity diode |
| CN112649680A (en) * | 2020-12-25 | 2021-04-13 | 北京无线电计量测试研究所 | Dynamic phase noise test fixture for crystal oscillator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001069680A2 (en) * | 2000-03-13 | 2001-09-20 | Legacy Electronics, Inc. | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| CN101009261A (en) * | 2007-01-25 | 2007-08-01 | 华为技术有限公司 | Method of the encapsulation vertical surface-mount module and base sheet, horse and vertical surface-mount module |
-
2012
- 2012-08-16 CN CN201210291838.1A patent/CN103594442A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001069680A2 (en) * | 2000-03-13 | 2001-09-20 | Legacy Electronics, Inc. | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| CN101009261A (en) * | 2007-01-25 | 2007-08-01 | 华为技术有限公司 | Method of the encapsulation vertical surface-mount module and base sheet, horse and vertical surface-mount module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104362137A (en) * | 2014-10-11 | 2015-02-18 | 东莞市柏尔电子科技有限公司 | High-heat-dissipativity diode |
| CN112649680A (en) * | 2020-12-25 | 2021-04-13 | 北京无线电计量测试研究所 | Dynamic phase noise test fixture for crystal oscillator |
| CN112649680B (en) * | 2020-12-25 | 2023-03-21 | 北京无线电计量测试研究所 | Dynamic phase noise test fixture for crystal oscillator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140219 |