CN101009261A - Method of the encapsulation vertical surface-mount module and base sheet, horse and vertical surface-mount module - Google Patents
Method of the encapsulation vertical surface-mount module and base sheet, horse and vertical surface-mount module Download PDFInfo
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- CN101009261A CN101009261A CN 200710026516 CN200710026516A CN101009261A CN 101009261 A CN101009261 A CN 101009261A CN 200710026516 CN200710026516 CN 200710026516 CN 200710026516 A CN200710026516 A CN 200710026516A CN 101009261 A CN101009261 A CN 101009261A
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- pin
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- intercell connector
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Abstract
The invention discloses a method and base chip, feet rack, vertical sticking module of the encapsulated vertical sticking module. Said method includes: a weld plate which is corresponding with a input or output is inserted into said feet rack, and the weld plate of the base chip is aligned to feet; the weld plate of the base chip and feet are welded together; after the welding, the connection bar is eliminated to realize the separation of feet, every feet is corresponding with one input/output of said base chip; at last, assimilating cap is mounted. Under the condition of changeless size of module with this method, the number of I/O of feet of said module is increased to improve the circuit integration degree effectively.
Description
Technical field
The present invention relates to art of printed circuit boards, relate in particular to a kind of method of encapsulation vertical surface-mount module and substrate, pin frame, vertical surface-mount module.
Background technology
Module is the integrated package of designing according to the principle of optimized circuit and system configuration that comprises multiple device.The building block technique of broad sense can be understood as different components and parts encapsulation are integrated in a technology on the separate unit body.It is actually a little printed circuit-board assembly, and (Printed Circuit Board Assembly PCBA), itself needs assembling, and then carries out the secondary assembling.Can be divided into vertically and horizontal according to the form of module secondary encapsulation, the module of employing vertical surface-mount can effectively be utilized the three dimensions of veneer.
At present, vertical surface-mount module be single-column type, promptly at a substrate two sides printing figures, add device, make pad on the module two sides, and finish with the pin welding that is shaped in advance, install the metal cap of drawing for the chip mounter vacuum slot at last additional.Fig. 1 is vertical single-row surface-mount module profile and pin frame thereof, many before the assembling to the intercell connector connection of pin by two ends, I/O connects and the pin of supporting role has left and right sides both wings to lay respectively at the both sides of module though rise, but the both wings of pair of pins are connected as a single entity, and pair of pins can only provide the connection of an I/O mouth after assembling was finished.
Along with the development of electronic product microminiaturization, the circuit level on the module is also more and more higher, and required I/O (I/O) number is also more and more.And that vertical single-row surface-mount module packing forms can be used for deriving the number of pins of I/O mouth is less, if will increase the I/O number of circuit, then must increase the size of substrate, thereby increase floor space, has limited the development of modular circuit high integration; (Printed Circuit Board, PCB) layout/wiring space influence the raising of PCB density and the microminiaturization of product and use a plurality of single-row vertical surface-mount modules to need to take a large amount of printed circuit board (PCB)s.
Summary of the invention
The embodiment of the invention provides a kind of method of encapsulation vertical surface-mount module and substrate, pin frame, vertical surface-mount module.The method of the encapsulation vertical surface-mount module that provides according to the embodiment of the invention and substrate, pin frame, vertical surface-mount module under the constant situation of substrate or module size, can increase the I/O number of module, improve circuit level.
In order to solve the problems of the technologies described above, the embodiment of the invention has proposed a kind of substrate, bottom in the bigger two sides of the surface area of this substrate is provided with a plurality of pads, and the position of the pad of described two sides is symmetrically distributed, wherein, a described pad connects one and inputs or outputs mouth, constitutes vertical biserial surface-mount type substrate.
Correspondingly, the embodiment of the invention also provides a kind of pin frame, this pin frame links together a plurality of pins by intercell connector, described pin comprises welded post and pin bottom, wherein, the welded post of erectting is used for welding with vertical biserial surface-mount type base chip, and the pin bottom of accumbency is used for welding with veneer.
Wherein, the both sides of intercell connector are connected with this pin removably in the corner of described pin, and the position of the pin of described intercell connector both sides is symmetrically distributed, spacing between pin equates with spacing between the on-chip pad of described vertical biserial surface-mount type, and at least one end of intercell connector extends one section from the position that is connected with the pin that is positioned at end.
Correspondingly, the embodiment of the invention also provides a kind of vertical surface-mount module, comprise vertical biserial surface-mount type substrate, be positioned at the absorption cap and the pin that block substrate at this substrate top, the welded post of described pin is welded on the pad of described substrate two sides, and the position of the pin of described two sides is symmetrically distributed, and one of the corresponding described substrate of a described pin inputs or outputs mouth.
Correspondingly, the embodiment of the invention also provides a kind of method that encapsulates above-mentioned vertical surface-mount module, and this method comprises:
The corresponding substrate that inputs or outputs mouth of a pad is inserted described pin frame, and described base chip is aligned mutually with the position of pin;
Described base chip and pin are welded together;
After welding is finished, intercell connector is removed, realize that pin separates;
At last, install the absorption cap additional.
In sum, a kind of substrate that the embodiment of the invention provides, the two sides of this substrate has a plurality of pads respectively, and described pad can corresponding I/O mouth, under the constant situation of sizes of substrate, has improved circuit level like this;
A kind of pin frame of the embodiment of the invention, this pin frame is by a plurality of pins of ining succession side by side in the both sides of intercell connector, and intercell connector is connected by V_cut slot type or stamp cellular type with pin, and at least one end of intercell connector stretches out, and after this is convenient to finish with substrate welds, removes intercell connector, the realization pin separates, thereby make the corresponding different I/O mouth of different pins, increased I/O mouth number effectively, improved circuit level;
In a kind of vertical surface-mount module of the embodiment of the invention, an I/O mouth of the corresponding described substrate of a described pin under the situation that does not increase module size, has increased I/O mouth number effectively, has improved circuit level;
The embodiment of the invention provides in a kind of method that encapsulates above-mentioned vertical surface-mount module, after the welding of pin and substrate pad is finished, removing intercell connector makes pin be separated from each other, thereby make independently pin to I/O mouth independently, improve circuit level effectively, correspondingly can improve the welding packaging efficiency.
Description of drawings
Fig. 1 is existing vertical single-row surface-mount module and pin frame;
Fig. 2 is the structural representation of the specific embodiment of a kind of substrate provided by the invention;
Fig. 3 is the structural representation of first specific embodiment of a kind of pin frame provided by the invention;
Fig. 4 is the schematic diagram of reverse side of the bottom surface of pin frame shown in Figure 3;
Fig. 5 is the structural representation of second specific embodiment of a kind of pin frame provided by the invention;
Fig. 6 is the reverse side schematic diagram of the bottom surface of pin frame shown in Figure 5;
Fig. 7 is the structural representation of the specific embodiment of a kind of vertical surface-mount module provided by the invention;
Fig. 8 is the flow chart of the method embodiment of a kind of encapsulation vertical surface-mount module provided by the invention.
Embodiment
The technical scheme of the method for a kind of encapsulation vertical surface-mount module that the embodiment of the invention provides and substrate, pin frame and vertical surface-mount module, it is corresponding I/O mouth of a pad with substrate, and the pin frame of intercell connector structure in the middle of correspondingly in the process of encapsulation vertical surface-mount module, will utilizing, encapsulate the back and removed intercell connector, pin is separated, thereby make the single pad of the corresponding substrate of single pin, corresponding single I/O mouth, thus realized vertical biserial surface-mount module.
Further set forth the concrete technical scheme of the embodiment of the invention below in conjunction with accompanying drawing.
With reference to figure 2, be the structural representation of the specific embodiment of a kind of substrate provided by the invention.Be provided with a plurality of pads 22 in the bottom of the bigger side of the surface area of substrate 21 as shown in Figure 2, correspondingly, also be provided with a plurality of pads as shown in Figure 2 in the bottom of the bigger another side of the surface area of substrate 21, and the position of the pad of described two sides is symmetrically distributed, a described pad connects an I/O port, constitutes vertical biserial surface-mount type substrate.
For substrate 21 is assembled into a circuit module, the embodiment of the invention also provides a kind of pin frame, with reference to figure 3, is the first specific embodiment structural representation of a kind of pin frame provided by the invention; This pin frame links together a plurality of L type pins 32 by intercell connector 31, and the welded post 321 of the setting of described pin is used for welding with vertical biserial surface-mount type base chip, and the pin bottom 322 of the accumbency of described pin is used for welding with veneer.
Wherein, the both sides of intercell connector 31 are connected with this L type pin removably in the corner of a series of L type pins 32, and the position of the L type pin of intercell connector 31 both sides is symmetrically distributed, spacing between L type pin equates with spacing between the on-chip pad of described vertical biserial surface-mount type, and intercell connector 31 has an end at least from the position that is connected with the pin that is positioned at end, extend one section, be convenient to after described pin and described substrate welds finish, clamp this extended one section intercell connector and remove whole intercell connector, realize that pin separates.
Wherein, described detachable connection is that the V_cut slot type connects, that is: intercell connector 31 is connected as a single entity with the pin bottom 322 of a series of L type pins 32, as shown in Figure 4, pin bottom 322 forms the inclined-plane with the junction of intercell connector 31, and the inclined-plane of both sides forms V-type groove shape, so that after having welded, clamp extended one section intercell connector, tear intercell connector 31 off, realize that pin separates along the junction of described pin bottom and intercell connector.
With reference to figure 5, be the structural representation of second specific embodiment of a kind of pin frame provided by the invention; This pin frame links together a plurality of L type pins 32 by intercell connector 31, and the welded post 321 of the setting of described pin is used for welding with vertical biserial surface-mount type base chip, and the pin bottom 322 of the accumbency of described pin is used for welding with veneer.
Wherein, the both sides of intercell connector 31 are connected with this L type pin removably in the corner of a series of L type pins 32, and the position of the L type pin of intercell connector 31 both sides is symmetrically distributed, spacing between L type pin equates with spacing between the on-chip pad of described vertical biserial surface-mount type, and at least one end of intercell connector 31 is from the position that is connected with the pin that is positioned at end, extend one section, so that after described pin and described substrate welds finish, clamp this extended one section intercell connector and remove whole intercell connector, realize that pin separates.
Wherein, described detachable connection is that the stamp cellular type connects, that is: intercell connector 31 is connected as a single entity with the pin bottom 322 of L type pin 32, and the junction 51 of intercell connector 31 and pin bottom 322 offers the aperture of at least one, so that after having welded, clamp extended one section intercell connector, tear intercell connector 31 off, realize that pin separates along described aperture.
Fig. 6 is the reverse side schematic diagram of the bottom surface of pin frame shown in Figure 5; According to this figure as can be known, intercell connector 31 is connected as a single entity with the pin bottom 322 of L type pin, and there is the aperture of a row stamp cellular type at 51 places, junction of intercell connector 31 and pin bottom 322.
Last mask body has been set forth substrate and pin frame, below in conjunction with Fig. 7, and the concrete technical scheme of setting forth the specific embodiment of the vertical surface-mount module that is packaged into by above-mentioned substrate and pin frame.
Fig. 7 is the structural representation of the specific embodiment of a kind of vertical surface-mount module provided by the invention; The absorption of blocking this substrate that comprise vertical biserial surface-mount type substrate 21, is positioned at substrate 21 tops emits 71 and a series of L type pin 32, the welded post of described pin 32 is welded on the pad of substrate 21 two sides, and the position of the pin of described substrate two sides is symmetrically distributed, wherein, one of L type pin 32 corresponding substrates 21 inputs or outputs mouth.
Introduce the basic structure of a kind of vertical surface-mount module of the embodiment of the invention above, further introduced the technical scheme of the method for packing of this module below.
With reference to figure 8, be the flow chart of the method embodiment of a kind of encapsulation vertical surface-mount module provided by the invention, this method may further comprise the steps:
Step S801 inserts described pin frame with the corresponding substrate that inputs or outputs mouth of a pad, and this base chip is aligned mutually with the position of pin;
Step S802 welds together described base chip and pin;
Step S803 after welding is finished, removes intercell connector, realizes that pin separates, and makes one of the corresponding described substrate of a pin to input or output mouth;
Step S804, last, install the absorption cap additional.
By the foregoing description as can be known, in a kind of substrate that the embodiment of the invention provides, the two sides of this substrate has a plurality of pads respectively, and described pad can corresponding I/O mouth, under the constant situation of sizes of substrate, has improved circuit level like this;
In a kind of pin frame of the embodiment of the invention, this pin frame is by a plurality of pins of ining succession side by side in the both sides of intercell connector, and intercell connector is connected by V_cut slot type or stamp cellular type with pin, and at least one end of intercell connector stretches out, after this is convenient to finish with substrate welds, remove intercell connector, realize that pin separates, thereby make the corresponding different I/O mouth of different pins, increased I/O mouth number effectively;
In a kind of vertical surface-mount module of the embodiment of the invention, an I/O mouth of the corresponding described substrate of a described pin under the situation that does not increase module size, has increased I/O mouth number effectively, has improved circuit level;
Encapsulate in the method for above-mentioned vertical surface-mount module the embodiment of the invention a kind of, after the welding of pin and substrate pad is finished, removing intercell connector makes pin be separated from each other, thereby make independently independently I/O mouth of pin correspondence, improve circuit level effectively, correspondingly can improve the welding packaging efficiency.
The above is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (6)
1, a kind of circuit substrate, it is characterized in that, be provided with a plurality of pads, and the position of the pad of described two sides is symmetrically distributed in the bottom of the bigger two sides of the surface area of this substrate, a described pad connects one and inputs or outputs mouth, constitutes vertical biserial surface-mount type substrate.
2, a kind of pin frame, it is characterized in that, this pin frame links together a plurality of pins by intercell connector, described pin comprises welded post and pin bottom, the both sides of described intercell connector are connected with this pin removably in the corner of described pin, and the position of the pin of described intercell connector both sides is symmetrically distributed, spacing between pin equates with spacing between the on-chip pad of described vertical biserial surface-mount type, and at least one end of intercell connector extends one section from the position that is connected with the pin that is positioned at end.
3, pin frame as claimed in claim 2 is characterized in that, described detachable connection is that the V_cut slot type connects.
4, pin frame as claimed in claim 2 is characterized in that, described detachable connection is that the stamp cellular type connects.
5, a kind of vertical surface-mount module, it is characterized in that, this vertical surface-mount module comprises vertical biserial surface-mount type substrate, is positioned at the absorption cap, the pin that block substrate at this substrate top, the welded post of described pin is welded on the pad of described substrate two sides, and the position of the pin of described two sides is symmetrically distributed, and one of the corresponding described substrate of a described pin inputs or outputs mouth.
6, a kind of method of encapsulation vertical surface-mount module is characterized in that, this method comprises:
The corresponding substrate that inputs or outputs mouth of a pad is inserted described pin frame, and the position of this base chip with the welded post of pin aligned mutually;
The welded post of described base chip and pin is welded together;
After welding is finished, intercell connector is removed, realize that pin separates;
Install the absorption cap additional.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100265163A CN100557795C (en) | 2007-01-25 | 2007-01-25 | The method of encapsulation vertical surface-mount module and pin frame, vertical surface-mount module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100265163A CN100557795C (en) | 2007-01-25 | 2007-01-25 | The method of encapsulation vertical surface-mount module and pin frame, vertical surface-mount module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101009261A true CN101009261A (en) | 2007-08-01 |
| CN100557795C CN100557795C (en) | 2009-11-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100265163A Expired - Fee Related CN100557795C (en) | 2007-01-25 | 2007-01-25 | The method of encapsulation vertical surface-mount module and pin frame, vertical surface-mount module |
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| CN (1) | CN100557795C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290698A (en) * | 2011-07-20 | 2011-12-21 | 聚信科技有限公司 | Vertical soldering system and method for mounting vertical surface-mounted module |
| CN103594442A (en) * | 2012-08-16 | 2014-02-19 | 鸿富锦精密工业（深圳）有限公司 | Chip |
| CN103658320A (en) * | 2012-09-06 | 2014-03-26 | 上海航天控制工程研究所 | Semi-automatic forming technology and device of multi-pin surface mount device |
| CN103943581A (en) * | 2013-01-23 | 2014-07-23 | 中兴通讯股份有限公司 | Power device packaging structure and packaging method |
-
2007
- 2007-01-25 CN CNB2007100265163A patent/CN100557795C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290698A (en) * | 2011-07-20 | 2011-12-21 | 聚信科技有限公司 | Vertical soldering system and method for mounting vertical surface-mounted module |
| CN103594442A (en) * | 2012-08-16 | 2014-02-19 | 鸿富锦精密工业（深圳）有限公司 | Chip |
| CN103658320A (en) * | 2012-09-06 | 2014-03-26 | 上海航天控制工程研究所 | Semi-automatic forming technology and device of multi-pin surface mount device |
| CN103658320B (en) * | 2012-09-06 | 2017-02-08 | 上海航天控制工程研究所 | Semi-automatic forming technology and device of multi-pin surface mount device |
| CN103943581A (en) * | 2013-01-23 | 2014-07-23 | 中兴通讯股份有限公司 | Power device packaging structure and packaging method |
| CN103943581B (en) * | 2013-01-23 | 2017-07-07 | 中兴通讯股份有限公司 | Power device packaging structure and method for packing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100557795C (en) | 2009-11-04 |
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Owner name: LIU DI Free format text: FORMER OWNER: HUAWEI TECHNOLOGY CO., LTD. Effective date: 20141106 |
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Free format text: CORRECT: ADDRESS; FROM: 518129 SHENZHEN, GUANGDONG PROVINCE TO: 518052 SHENZHEN, GUANGDONG PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20141106 Address after: 518052, Guangdong, Shenzhen province Nanshan District Nanshan digital cultural industry base, east block, room 407-408 Patentee after: Liu Di Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: Huawei Technologies Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091104 Termination date: 20180125 |