CN103594383B - Auxiliary installation tool for head cover of IGBT module - Google Patents
Auxiliary installation tool for head cover of IGBT module Download PDFInfo
- Publication number
- CN103594383B CN103594383B CN201310594417.0A CN201310594417A CN103594383B CN 103594383 B CN103594383 B CN 103594383B CN 201310594417 A CN201310594417 A CN 201310594417A CN 103594383 B CN103594383 B CN 103594383B
- Authority
- CN
- China
- Prior art keywords
- base plate
- igbt module
- crossbeam
- columns
- cross beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention relates to semiconductor device packaging technique field, disclose a kind of auxiliary installation tool for head cover of IGBT module, including base plate, vertically it is located at two groups of columns on described base plate and is respectively arranged on the first crossbeam on described column and second cross beam, described two groups of columns and base plate surround accommodation space, described first crossbeam be arranged in parallel with second cross beam and parallel with base plate, every first crossbeam is provided with at least two wing nut, the top of described wing nut connects second cross beam, drives second cross beam to move up and down along column by the turn of wing nut.This aid is simple to operate, can reduce time loss at work, it is to avoid changes the top cover of IGBT module because there is excessive gap, reduces unnecessary waste.
Description
Technical field
The present invention relates to semiconductor device packaging technique field, particularly relate to a kind of instrument carrying out when installing for IGBT module top cover and assisting.
Background technology
Insulated gate bipolar transistor (InsulatedGateBipolarTransistor, in full it is called for short IGBT) there is altofrequency, high voltage, big electric current, the performance characteristics that especially easily turns on and off, it it is the most representational product of the Power Electronic Technique third time revolution generally acknowledged in the world, so far having evolved to for the 6th generation, commercialization had evolved to for the 5th generation.At present, IGBT is widely used in all trades and professions of national economy.
IGBT module is mainly used in major loop inverter and all inverter circuits of converter, namely in DC/AC conversion.The novel power transistor being representative with IGBT module now is high-frequency power electronic circuit and the core switching components and parts controlling system, now being widely used to the fields such as electric locomotive, high voltage power transmission and transforming, electric automobile, servo controller, UPS, Switching Power Supply, power of chopping, market prospect is very good.
The semicon industry of China is for encapsulation the growing up gradually of IGBT module, but for the encapsulation of high-power IGBT module, only minority enterprise in the field of business knows core technology.The top cover of IGBT module and shell are outermost protections, and the level of its installation directly decides the service life of module, and the encapsulation for IGBT module seems extremely important.
At present, top cover shell mounting technique semiconductor applications at home about high-power IGBT modules such as 6500V still belongs to the blank stage, even if there is this technology in the manufacturer that part has the ability to be packaged, but also all as the trade secret of this enterprise, without disclosed data that can be for reference.
During IGBT module encapsulation, owing to indivedual top covers are likely to producing or producing miniature deformation in transportation, cause top cover after mounting and between shell gap excessive, the problem that ultimately forms Lou glue.Owing in normally producing, top cover deformation quantity in a pre-installation is smaller, it is impossible to the naked eye directly find out, so whether the gap only just can found out after mounting between top cover and shell is beyond the scope designed.The excessive touchstone making IGBT module finally not reach this operation in gap after top cover solidification, it is difficult to carry out follow-up work.
Summary of the invention
In view of this, it is an object of the invention to provide a kind of instrument carrying out when installing for IGBT module top cover and assisting, during in order to overcome IGBT module to encapsulate, top cover miniature deformation causes that top cover and housing slot are excessive causes leakage glue, it is impossible to the problem reaching touchstone.
For achieving the above object, the present invention provides following technical scheme:
The auxiliary installation tool for head cover of IGBT module of the present invention, including base plate, vertically it is located at two groups of columns on described base plate and is respectively arranged on the first crossbeam on described column and second cross beam, described two groups of columns and base plate surround accommodation space, described first crossbeam be arranged in parallel with second cross beam and parallel with base plate, every first crossbeam is provided with at least two wing nut, the top of described wing nut connects second cross beam, drives second cross beam to move up and down along column by the turn of wing nut.
Preferably, every described first crossbeam is provided with two wing nuts.
In technique scheme, described parallel being located on described base plate of two groups of columns.
In technique scheme, the first crossbeam on described two groups of columns and base plate are equidistantly positioned.
In technique scheme, described base plate is provided with multiple locating dowel.
Preferably, described base plate is provided with six locating dowels.
In technique scheme, two groups of described columns and base plate junction are provided with active connection part, and what described column can be overall is turned out along this active connection part launching.
The auxiliary installation tool for head cover of IGBT module of present invention design, by the external force certain to IGBT module top cover, is expressed to gauged distance by produced gap, is finally reached the touchstone of this operation after solidification;This aid is simple to operate, can reduce time loss at work, it is to avoid changes the top cover of IGBT module because there is excessive gap, reduces unnecessary waste.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in the embodiment of the present invention, below the accompanying drawing used required during embodiment is described is briefly described, apparently, accompanying drawing for the present invention in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation front view of the auxiliary installation tool for head cover of IGBT module of the present invention;
Fig. 2 is the structural representation left view of the auxiliary installation tool for head cover of IGBT module of the present invention;
Fig. 3 is the structural representation top view of the auxiliary installation tool for head cover of IGBT module of the present invention;
Fig. 4 is the structural representation front view after the auxiliary installation tool for head cover of IGBT module clamping IGBT module of the present invention;
Fig. 5 is the structural representation left view after the auxiliary installation tool for head cover of IGBT module clamping IGBT module of the present invention;
Fig. 6 is the structural representation top view after the auxiliary installation tool for head cover of IGBT module clamping IGBT module of the present invention;
Fig. 7 is the structure change schematic diagram of the auxiliary installation tool for head cover of IGBT module handling IGBT module of the present invention.
Detailed description of the invention
The invention discloses a kind of auxiliary installation tool for head cover of IGBT module, including base plate, vertically it is located at two groups of columns on described base plate and is respectively arranged on the first crossbeam on described column and second cross beam, described two groups of columns and base plate surround accommodation space, described first crossbeam be arranged in parallel with second cross beam and parallel with base plate, every first crossbeam is provided with at least two wing nut, the top of described wing nut connects second cross beam, drives second cross beam to move up and down along column by the turn of wing nut.
Preferably, every described first crossbeam is provided with two wing nuts.
In technique scheme, described parallel being located on described base plate of two groups of columns.
In technique scheme, the first crossbeam on described two groups of columns and base plate are equidistantly positioned.
In technique scheme, described base plate is provided with multiple locating dowel.
Preferably, described base plate is provided with six locating dowels.
In technique scheme, two groups of described columns and base plate junction are provided with active connection part, and what described column can be overall is turned out along this active connection part launching.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is described in detail, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the premise not making creative work, broadly fall into the scope of protection of the invention.
As shown in FIG. 1 to 3, the auxiliary installation tool for head cover of IGBT module of the present invention, including base plate 1, vertically it is located on base plate 1 two groups of columns 2 and the first crossbeam 3 being respectively arranged on column 2 and second cross beam 4, what two groups of columns 2 were parallel is located on base plate 1, two groups of columns 2 and base plate 1 surround accommodation space, in order to place and to clamp IGBT module, first crossbeam 3 on two groups of columns 2 can be equidistantly positioned with base plate 1, the distance different from base plate 1 can also be arranged to, concrete to determine according to the dome shape of IGBT module to be packaged, if the dome shape of IGBT module to be packaged is plane, then the first crossbeam 3 on two groups of columns 2 is equidistantly positioned with base plate 1;If the dome shape of IGBT module to be packaged has difference in height, first crossbeam 3 on two groups of columns 2 answers different distance to arrange with base plate 1, first crossbeam 3 be arranged in parallel with second cross beam 4 and parallel with base plate 1, every first crossbeam 3 is provided with two wing nuts 5, the top of wing nut 5 connects second cross beam 4, second cross beam 4 is driven to move up and down along column 2 by the turn of wing nut 5, base plate 1 is provided with multiple locating dowel 6, it is possible to positioned and fixing IGBT module by multiple locating dowels 6 of base plate 1 frock.
As shown in Fig. 4~Fig. 6, the auxiliary installation tool for head cover of IGBT module of present invention design is that six locating dowels 6 by base plate 1 frock position and fixing IGBT module, special solid glue is used to spread upon top cover or the shell edge of IGBT module, the height of second cross beam 4 is regulated by wing nut 5 and first crossbeam 3, the part (part of top cover deformation is mainly in Chang Bian position, both sides) of top cover deformation is extruded to the height designed with second cross beam 4, after waiting glue curing, top cover and shell are integrally forming, final realization reduces gap between the top cover and the shell that increase because of deformation.
As shown in Figure 7, two groups of columns 2 are provided with active connection part (not shown) with base plate 1 junction, column 2 can be overall be turned out along this active connection part launch, it is turned out the column 2 accommodation space to open two groups of columns 2 and base plate 1 surrounds respectively along active connection part during use, pending IGBT module is put into wherein, again two groups of columns 2 are rotated back to initial position, it is acted upon with reference to the process described in Fig. 4~Fig. 6, after glue curing, top cover and shell are integrally forming, the column 2 accommodation space to open two groups of columns 2 and base plate 1 surrounds again it is turned out respectively along active connection part, take out the IGBT module handled well, owing to column 2 has been arranged to rotate along axle, pick and place IGBT module and want enhanced convenience and efficient than Fig. 4~Fig. 6.
The auxiliary installation tool for head cover of IGBT module of the present invention may be used for the auxiliary when top cover of the IGBT module to first encapsulation and outer shell integrated gluing cure package, it is also possible to as to a kind of solution occurring after encapsulation that the relatively large IGBT module in gap is remedied.
In sum, the auxiliary installation tool for head cover of IGBT module of present invention design, by the external force certain to IGBT module top cover, produced gap is expressed to gauged distance, after solidification, is finally reached the touchstone of this operation;This aid is simple to operate, can reduce time loss at work, it is to avoid changes the top cover of IGBT module because there is excessive gap, reduces unnecessary waste.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when without departing substantially from the spirit of the present invention or basic feature, it is possible to realize the present invention in other specific forms.Therefore, no matter from which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the invention rather than described above limits, it is intended that all changes in the implication of the equivalency dropping on claim and scope included in the present invention.
In addition, it is to be understood that, although this specification is been described by according to embodiment, but not each embodiment only comprises an independent technical scheme, this narrating mode of description is only for clarity sake, description should be made as a whole by those skilled in the art, and the technical scheme in each embodiment through appropriately combined, can also form other embodiments that it will be appreciated by those skilled in the art that.
Claims (6)
1. an auxiliary installation tool for head cover of IGBT module, it is characterised in that:
Including base plate (1), vertically it is located at two groups of columns (2) on described base plate (1) and the first crossbeam (3) being respectively arranged on described column (2) and second cross beam (4), described two groups of columns (2) and base plate (1) surround accommodation space, described first crossbeam (3) be arranged in parallel with second cross beam (4) and parallel with base plate (1), every first crossbeam (3) is provided with at least two wing nut (5), the top of described wing nut (5) connects second cross beam (4), second cross beam (4) is driven to move up and down along column (2) by the turn of wing nut (5);Described base plate (1) is provided with multiple locating dowel (6).
2. auxiliary installation tool for head cover of IGBT module according to claim 1, it is characterised in that: described every first crossbeam (3) is provided with two wing nuts (5).
3. auxiliary installation tool for head cover of IGBT module according to claim 1, it is characterised in that: described parallel being located on described base plate (1) of two groups of columns (2).
4. auxiliary installation tool for head cover of IGBT module according to claim 1, it is characterised in that: the first crossbeam (3) on described two groups of columns (2) and base plate (1) are equidistantly positioned.
5. auxiliary installation tool for head cover of IGBT module according to claim 1, it is characterised in that: described base plate (1) is provided with six locating dowels (6).
6. auxiliary installation tool for head cover of IGBT module according to claim 1, it is characterized in that: two groups of described columns (2) and base plate (1) junction are provided with active connection part, what described column (2) can be overall is turned out along this active connection part launching.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310594417.0A CN103594383B (en) | 2013-11-21 | 2013-11-21 | Auxiliary installation tool for head cover of IGBT module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310594417.0A CN103594383B (en) | 2013-11-21 | 2013-11-21 | Auxiliary installation tool for head cover of IGBT module |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103594383A CN103594383A (en) | 2014-02-19 |
CN103594383B true CN103594383B (en) | 2016-06-29 |
Family
ID=50084472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310594417.0A Active CN103594383B (en) | 2013-11-21 | 2013-11-21 | Auxiliary installation tool for head cover of IGBT module |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103594383B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111890342B (en) * | 2020-07-28 | 2021-11-23 | 智汇轩田智能系统(杭州)有限公司 | Full-automatic robot assembly device of IGBT module upper cover |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4301565A (en) * | 1980-03-19 | 1981-11-24 | Irwin Weinbaum | Method and system for the removal and replacement of a bridge |
SU1144975A1 (en) * | 1983-07-18 | 1985-03-15 | Усть-Каменогорский Строительно-Дорожный Институт | Arrangement for hoisting heavy-weight structure |
CN2106698U (en) * | 1991-03-22 | 1992-06-10 | 西安交通大学 | Aero-sack type plybamboo blank preforming press |
CN200992522Y (en) * | 2006-12-28 | 2007-12-19 | 金晶(集团)有限公司 | Glass transverse-breaking auxiliary device |
CN202123106U (en) * | 2011-05-18 | 2012-01-25 | 合肥市百胜科技发展股份有限公司 | Stand of rolling mill |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6957463B2 (en) * | 2004-01-15 | 2005-10-25 | Falwell Robert L | Adjustable support device |
-
2013
- 2013-11-21 CN CN201310594417.0A patent/CN103594383B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4301565A (en) * | 1980-03-19 | 1981-11-24 | Irwin Weinbaum | Method and system for the removal and replacement of a bridge |
SU1144975A1 (en) * | 1983-07-18 | 1985-03-15 | Усть-Каменогорский Строительно-Дорожный Институт | Arrangement for hoisting heavy-weight structure |
CN2106698U (en) * | 1991-03-22 | 1992-06-10 | 西安交通大学 | Aero-sack type plybamboo blank preforming press |
CN200992522Y (en) * | 2006-12-28 | 2007-12-19 | 金晶(集团)有限公司 | Glass transverse-breaking auxiliary device |
CN202123106U (en) * | 2011-05-18 | 2012-01-25 | 合肥市百胜科技发展股份有限公司 | Stand of rolling mill |
Also Published As
Publication number | Publication date |
---|---|
CN103594383A (en) | 2014-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5637944B2 (en) | Power semiconductor module | |
CN103078471B (en) | Power module and current converter | |
US10121732B2 (en) | Semiconductor device and electric power conversion device having relay terminal directly fixed to an insulating film of base plate | |
US20140252410A1 (en) | Module and Assembly with Dual DC-Links for Three-Level NPC Applications | |
CN101630677B (en) | High-frequency quick-recovery diode | |
JP2013106503A (en) | Power conversion apparatus | |
JP2010016947A (en) | Power module of power conversion apparatus | |
CN102739069B (en) | Power semiconductor module and power electronic device applying same | |
KR20150058015A (en) | Semiconductor device and method for manufacturing same | |
KR20170039431A (en) | Soldering Interface Cooling type Invertor and Hybrid Vehicle thereby | |
US20180254228A1 (en) | Semiconductor power module and power conversion apparatus | |
CN103594383B (en) | Auxiliary installation tool for head cover of IGBT module | |
US20150229206A1 (en) | Electrical power converter | |
CN208241587U (en) | Highly integrated intelligent power module and electrical equipment | |
CN203859959U (en) | Whole machine structure with heat radiator and intelligent power semiconductor module integrated | |
WO2022018868A1 (en) | Semiconductor device, power conversion device, moving body, and semiconductor device manufacturing method | |
JP6362959B2 (en) | Power conversion circuit, manufacturing method thereof, and power conditioner | |
KR20140040406A (en) | Power module package | |
CN103325712A (en) | IGBT module packaging welding auxiliary device and system | |
CN202712173U (en) | Parallel-type IGBT module | |
JP2017005808A (en) | Power conversion device | |
WO2012171342A1 (en) | Ac-dc switch power supply and power triode thereof | |
JP2014127582A (en) | Semiconductor module | |
CN103681560B (en) | A kind of grooving type IGBT module base plate and IGBT module | |
CN219350228U (en) | Semiconductor integrated circuit packaging structure with high heat dissipation and power supply module thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710016 No. 15 Wenjingbei Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee after: Xi'an Zhongche Yongji Electric Co. Ltd. Address before: 710016 No. 15 Wenjingbei Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee before: Xi'an Yongdian Electric Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder |