CN103582365A - Electronic circuit module - Google Patents
Electronic circuit module Download PDFInfo
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- CN103582365A CN103582365A CN201310285670.8A CN201310285670A CN103582365A CN 103582365 A CN103582365 A CN 103582365A CN 201310285670 A CN201310285670 A CN 201310285670A CN 103582365 A CN103582365 A CN 103582365A
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- top board
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- circuit module
- electronic circuit
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Abstract
The invention provides an electronic circuit module having a metal housing which is hard to be deformed due to external force. In the electronic circuit module (1) having a circuit board (20) carried with an electronic element and a case type metal casing having at least one open face, the metal casing (30) comprises a top plate (31), oppositely disposed with the circuit board (20), a plurality of side plates (32) which bend from the outer periphery of the top plate (31) and extend, and a plurality of assembling legs (33) which bend from the four corners of the top plate (31) and extend and are jointed with the circuit board (20). On the top plate (31), a gap step part (35) is disposed between the central part (31a) and the periphery. The gap step part (35) comprises a profile part (35c) which has a thickness equal to that of the top plate (31) and is partially improved with rigidity, and an opening part (35a) formed with the adjacent profile part (35c).
Description
Technical field
The present invention relates to have the electronic circuit module of metal-back, relate in particular to and there is the electronic circuit module being difficult to because of the metal-back of external force deformation.
Background technology
Electronic circuit module is the circuit board that has carried electronic devices and components, to consist of the electronic circuit module of high-frequency circuit etc.For example,, as being stored in portable set and using in wireless receiving and dispatching letter circuit module quilt.
This electronic circuit module is used metal-back in order to shield from outside electromagnetic wave.Thisly for shielding electromagnetic metal-back, be made as to cover more and be equipped on the electronic devices and components of circuit board, and be connected with the earth connection of circuit board.Shielding is from the electromagnetic while of outside, suppresses high-frequency noise that the circuit operation because of the electronic circuit modules such as high-frequency circuit self produces to external communication.
In recent years, the exploitation of the miniaturization of electronic devices and components and components and parts mounting technique has had progress, and the area that has carried the circuit board of electronic devices and components is able to miniaturization.Have and carried the miniaturization that the circuit board of electronic devices and components and the electronic circuit module of metal-back not only require board area, but also require short transverse also to realize miniaturization.
Fig. 6 is the cutaway view of electronic devices and components 101 described in expression patent documentation 2.Electronic devices and components 101 possess substrate 111, the vibrator 113 of installing in the one side side of this substrate 111, the control element 115 of installing in the another side side of substrate 111 and run through the electric conductor that substrate 111 is electrically connected to vibrator 113 and control element 115.In electronic devices and components 101, at the metal shell 118 covering vibrators 113 for one side side of this substrate 111, and be provided with the projection 119 for strengthening at the end face of this shell 118.
The installation object of shell 118 is, prevents that extraneous noise from invading vibrator 113 and from the unnecessary radiation of vibrator 113.This shell 118 hinders its vibration for fear of being out of shape also contact vibration device 113 because of external force to vibrator 113 sides, and this shell 118 is for being provided with the structure of the projection 119 for strengthening at the end face of shell 118.By the projection 119 that is provided for strengthening, this end face can significantly not be out of shape to vibrator 113 directions because of external force.
Patent documentation 1: TOHKEMY 2007-116104 communique
Patent documentation 2: Japanese kokai publication hei 10-28024 communique
But, in order to make electronic circuit module miniaturization, form the thickness of slab attenuation of the metallic plate of metal-back.In having used the electronic circuit module of thin metal-back, metal-back has been deformed into problem because of whereabouts or external force.When metal-back is out of shape, metal-back contact is sometimes equipped on the electronic devices and components of circuit board, can become the reason of electronic circuit fault.For this reason, the reinforcement of metal-back becomes important.
Projection etc. is set, when the board side of having carried electronic devices and components is out of shape metal-back and is given prominence to, must consider to avoid projection contact electronic devices and components.And, in manufacturing metal-back, when wanting by ironed metallic plate and forming projection as illustrated in fig. 6, form protruding stress and can make top board twisted.Therefore, in order only to thicken the thickness of slab of the part that is provided with projection 119 of Fig. 6, need to be on thin metallic plate welding projection or on thick metallic plate with the mode that leaves projection 119 skiving around.
Summary of the invention
The present invention solves above-mentioned problem, and object is, even if provide a kind of thickness of slab attenuation with the metallic plate that will be processed into metal-back to be also difficult to the electronic circuit module because of the metal-back of external force deformation.
The present invention is a kind of electronic circuit module, have and carried the circuit board of electronic devices and components and the box metal-back of at least one opening, this electronic circuit module is characterised in that, above-mentioned metal-back possess with foregoing circuit plate opposite the top board that configures, from the periphery bending of above-mentioned top board, also extend a plurality of side plates of setting and a plurality of assembling legs that four jiaos of bendings in the middle of the periphery of above-mentioned top board are also extended setting and engaged with foregoing circuit plate, on above-mentioned top board, between portion and periphery, be provided with in the central breach stage portion, above-mentioned breach stage portion has special-shaped portion and peristome, this abnormity portion is, to the thickness of slab direction of above-mentioned top board, exert pressure and be also partially enhanced the special-shaped portion of rigidity by the special-shaped thickness turning to below the thickness of slab that reaches above-mentioned top board, the peristome of this peristome for forming in abutting connection with this abnormity portion.
By forming said structure, even if can provide the thickness of slab attenuation with the metallic plate that makes to be processed into metal-back to be also difficult to the electronic circuit module of the metal-back that is out of shape because of external force.That is, special-shaped portion has played with the rigidity with generations such as general pressing mold processing and has promoted the effect that effect is identical, therefore has the function that improves rigidity.On the other hand, peristome becomes the destination that while exerting pressure, metallic atom moves from special-shaped portion, even if therefore have, forms the function that special-shaped portion also prevents from producing at metal-back machining deformation.In addition, the shape of special-shaped portion and peristome and size wait rigidity that the rigidity be appropriately set at thin metal-back has a metal-back thicker with thickness of slab size on an equal basis above.
Electronic circuit module of the present invention is characterised in that, above-mentioned breach stage portion is formed between the central portion and above-mentioned assembling leg of above-mentioned top board.By said structure, even if there is external force to be applied to central portion, also can prevent from acting on assembling leg because this external force makes excessive strength, and can stably maintain the engagement state of assembling leg and circuit board.Therefore,, even if the central portion of electronic circuit module of the present invention adsorbing metal shell when carrying problem can not occur yet, be therefore applicable to automatic Composition etc.
Electronic circuit module of the present invention is characterised in that, above-mentioned peristome is disposed at two places in central portion side and the above-mentioned assembling leg side of above-mentioned top board with respect to above-mentioned special-shaped portion.The breach stage portion being arranged on top board possesses peristome with respect to special-shaped portion at two places of the central portion side of top board and assembling leg side, therefore can in the situation that can not make top board twisted, to thickness of slab direction, exert pressure and form special-shaped portion, can suppress top board to central portion Direction distortion.And, by being enhanced the special-shaped portion of rigidity, suppress to be applied to the top board deflection that the external force of central portion causes, and the peristome in assembling leg side is cut off in order to prevent this external force from propagating into assembling leg side.Therefore, because dispose peristome in assembling leg side, so be assembled with the external force that is applied to top board central portion the situation that the peristome of leg side cuts off, do not compare yet, can further alleviate the deflection that the scolding tin of fixing assembling leg bears.
Electronic circuit module of the present invention is characterised in that, above-mentioned special-shaped portion consists of material compressed in the thickness of slab direction at above-mentioned top board.Because special-shaped portion is by exerting pressure and compressed material, so the strength of materials strengthens because of compressed, can further suppress metal-back distortion in thickness of slab direction.
Electronic circuit module of the present invention is characterised in that, above-mentioned metal-back is for shielding the electromagnetic wave to foregoing circuit plate.Because metal-back shielding electromagnetic wave, be suitable for carrying the electronic circuit module of high-frequency circuit, and can miniaturization and slimming.
The effect of invention
According to the present invention, the breach stage portion being provided with on the top board of metal-back has special-shaped portion and peristome, thereby this abnormity portion is applied in pressure and is turned to the thickness below the thickness of slab with above-mentioned top board and be partially enhanced rigidity by abnormity in the thickness of slab direction of above-mentioned top board, this peristome forms in abutting connection with this abnormity portion.Because special-shaped portion has played the rigidity producing with general pressing mold processing etc. and promoted the effect that effect is identical, there is the function that improves rigidity.Therefore on the other hand, peristome becomes the destination that while exerting pressure, metallic atom moves from special-shaped portion, even if having, forms special-shaped portion and also can prevent from, at metal-back, the twisted function of processing occurs.Therefore, even if can provide the thickness of slab attenuation with the metallic plate that makes to be processed into metal-back to be also difficult to the electronic circuit module because of the metal-back of external force deformation.
Accompanying drawing explanation
Fig. 1 is for representing the stereogram of the electronic circuit module of the 1st execution mode.
Fig. 2 is for seeing the vertical view of electronic circuit module from top board side.
The cutaway view that Fig. 3 A and Fig. 3 B are top board, Fig. 3 A is the pattern cutaway view with the A-A line cut-out of Fig. 2, Fig. 3 B is the pattern cutaway view with the B-B line cut-out of Fig. 2.
Fig. 4 A and Fig. 4 B are for representing the top board cutaway view of the 1st variation, and Fig. 4 A is the pattern cutaway view cutting off with Fig. 2 A-A line.Fig. 4 B is the pattern cutaway view with the B-B line cut-out of Fig. 2.
Fig. 5 is for representing the vertical view of the 2nd variation, is the vertical view of the electronic circuit module seen from top board side.
Fig. 6 is for representing the cutaway view of existing electronic devices and components.
Reference numeral
1 electronic circuit module;
10 electronic devices and components;
20 circuit boards;
30 metal-backs;
31 top boards;
31a central portion;
Tetra-jiaos of 31b;
32 side plates;
33 assembling legs;
35 breach stage portion;
35a, 35b peristome;
35c abnormity portion;
40 scolding tin
Embodiment
The 1st execution mode
Below by the electronic circuit module 1 of explanation the 1st execution mode.
Fig. 1 is for representing the stereogram of the electronic circuit module 1 of the 1st execution mode.Mode with covering board 20 has configured metal-back 30.Metal-back 30 possesses, the essentially identical top board 31 of planar dimension of size and rectangular circuit board 20, from the periphery bending of top board 31 and extend a plurality of side plates 32 of arranging and from four jiaos of 31b bendings of top board 31 peripheries and extend a plurality of assembling legs 33 that arrange.That is, metal-back 30 is the box shape of a face opening of circuit board 20 sides.
On circuit board 20, be formed with the not shown wiring being formed by electric conducting material, and not shown electronic devices and components are installed on this circuit board 20 and be connected with wiring.Wiring and electronic devices and components are covered by the metal-back 30 of box.The assembling leg 33 of metal-back 30 is engaged and is fixed on thus on circuit board 20 by scolding tin 40, and is electrically connected to ground connection wiring.By assembling leg 33, be connected with ground connection wiring, metal-back 30 has kept earth potential.
Metal-back 30 does not disturb not shown electronic devices and components in order to make with the inner face of the top board 31 of circuit board 20 opposite configurations, and the short transverse (Z1-Z2 direction) of side plate 32 and assembling leg 33 is made as to desired size.The height of electronic circuit module 1 is the total size of circuit board 20 height dimensions (substrate is thick) and metal-back 30 height dimensions.
When electronic circuit module 1 is small-sized, its overall dimension is 15mm * 10mm * 1.5mm left and right, and the metal-back 30 of use is for processing the metal sheet of thickness of slab 0.2mm left and right.Material as metallic plate 30 for example has electroplating steel plate.
As shown in Figure 1, top board 31 is provided with breach stage portion 35 between the 31a of portion and periphery in the central.Breach stage portion 35 has peristome 35a, the 35b of a part of opening.Breach stage portion 35 is configured in the central portion 31a of top board 31 and assembles between leg 33 and possess peristome 35a, 35b along this direction.
The region of being clamped by 2 place peristome 35a, 35b in breach stage portion 35 is, for with respect to the central portion 31a of top board 31 is had to rigidity with the direction that is connected of assembling leg 33, and by exerting pressure in the thickness of slab direction at top board 31, form the special-shaped 35c of portion of the thickness reaching below top board 31 thicknesss of slab.To describe the 35c of this abnormity portion below in detail.
The vertical view that Fig. 2 is the electronic circuit module 1 seen from top board 31 sides.Four jiaos of 31b of the top board 31 of the metal-back 30 of rectangular circuit board 20 coverings are being disposed to assembling leg 33.On top board 31,4 breach stage portion 35 are arranged between the central portion and assembling leg 33 of top board 31.And each breach stage portion 35 possesses peristome 35a, 35b, this peristome 35a, 35b are formed on two places of central portion 31a side and assembling leg 33 sides of top board 31 in abutting connection with the special-shaped 35c of portion.
Fig. 3 A cuts off the pattern cutaway view of top board 31 with the A-A line of Fig. 2.Fig. 3 B is the pattern cutaway view with the B-B line cut-out of Fig. 2.Peristome 35a is configured in the central portion 31a side of top board 31 with respect to the special-shaped 35c of portion, peristome 35b is configured in assembling leg 33 sides of top board 31 with respect to the special-shaped 35c of portion.As shown in Figure 3A and 3B, the thickness of slab of the central portion 31a of the thickness ratio top board 31 of the special-shaped 35c of portion is thin.The 35c of the abnormity portion material compressed by exerting pressure in the thickness of slab direction by top board 31 forms, thereby and the strength of materials strengthen and be partially enhanced rigidity.That is,, when having applied pressure in thickness of slab direction, the special-shaped 35c of portion is compressed into the thickness reaching below top board 31 thicknesss of slab and has partially been enhanced rigidity.The peristome 35a, the 35b that in abutting connection with special-shaped portion, form become the destination that while exerting pressure, metallic atom moves from the special-shaped 35c of portion.For this reason, thus can be formed in and in thickness of slab direction, exert pressure and by heteromorphosis, be partially enhanced the special-shaped 35c of portion of rigidity.
As shown in Fig. 3 A and Fig. 3 B, by peristome 35a, 35b are set, can form freely the shape of the special-shaped 35c of portion.Because the special-shaped 35c of portion has played the identical effect of rigidity reinforced effect producing with general pressing mold processing etc., so have the function that improves rigidity.Therefore on the other hand, peristome 35a, 35b become the destination that metallic atom moves from the special-shaped 35c of portion when exerting pressure, even if having, form the special-shaped 35c of portion and also can prevent from, at metal-back 30, the twisted function of processing occurs.The rigidity that the shape of the 35c of abnormity portion and peristome 35a, 35b and size etc. are appropriately set at thin metal-back 30 has the equal above size of rigidity of the metal-back thicker with thickness of slab 30.Electronic circuit module 1 is because have the special-shaped 35c of portion that has partially been enhanced rigidity, so can suppress metal-back 30 because of external force deformation.For example, with respect to pushing down the external force of the 31a of central portion shown in Fig. 1 in the direction at circuit board 20, can alleviate top board 31 deflections.Abnormity portion 35, for when exerting pressure the material being compressed in thickness of slab direction, strengthens by the compressed strength of materials that makes, so can further suppress distortion.Therefore, even if can access the thin electronic circuit module 1 being also difficult to because of the metal-back 30 of external force deformation of thickness of slab with the metallic plate that makes to be processed into metal-back 30.
As mentioned above, electronic circuit module 1 is located at top board 31 by breach stage portion 35 central portion 31a and assembling are comparatively desirable between leg 33.As shown in Figure 2, in the direction that disposes assembling leg 33, form the breach stage portion 35 with the special-shaped 35c of portion and peristome 35a, 35b, therefore can not make top board 31 in thickness of slab direction, exert pressure twistedly and form the special-shaped 35c of portion, can strengthen top board 31.By said structure, even if apply external force to central portion 31a, also can prevent from, because this external force is to the excessive power of assembling leg 33 effect, can stably maintaining the engagement state of assembling leg 33 and circuit board 20.Therefore,, even the central portion 31a of the top board 31 of adsorbing metal shell 30 can not have problems yet when electronic circuit module 1 is installed, be therefore applicable to automatic Composition etc.
In addition, the breach stage portion 35 of electronic circuit module 1 is possessing peristome 35a, 35b with respect to the special-shaped 35c of portion at two places of the central portion 31a of top board 31 side and assembling leg 33 sides.Because breach stage portion 35 is possessing peristome 35a, 35b with respect to the special-shaped 35c of portion at two places of the central portion 31a of top board 31 side and assembling leg 33 sides, so can not make top board 31 exert pressure twistedly, form the special-shaped 35c of portion in thickness of slab direction, can suppress top board 31 and be out of shape in the direction of central portion 31a.And the special-shaped 35c of portion that has been enhanced rigidity because being applied to top board 31 deflections that the external force of central portion 31a causes suppresses, thereby and is cut off and can not pass to assembling leg 33 sides by peristome 35b.Therefore,, because configured peristome 35b in assembling leg 33 sides, so the situation of not cut off by peristome 35b with the external force that is applied to central portion 31a is compared, can further alleviate the deflection that the fixing scolding tin 40 that assembles leg 33 bears.
As electronic circuit module 1, metal-back 30 is for shielding the electromagnetic wave to circuit board 20.Because the bending structure of metal-back 30, thus between side plate 32 and assembling leg 33, be provided with gap, but in this gap and peristome 35a, 35b less when a lot of than electromagnetic wavelength, metal-back 30 can shield electromagnetic wave effectively.Because metal-back 30 shielding electromagnetic waves, thus be suitable for carrying the electronic circuit module of high-frequency circuit, and can miniaturization, slimming.
Fig. 4 A and Fig. 4 B represent the 1st variation.Fig. 4 A cuts off the pattern cutaway view of top board 31 with the A-A line of Fig. 2.Fig. 4 B is the pattern cutaway view with the B-B line cut-out of Fig. 2.The 35c of abnormity portion has the section shape shown in Fig. 4 A and Fig. 4 B, and the thickness of slab of the thickness ratio top board 31 central portion 31a of the special-shaped 35c of portion is thin.The 35c of abnormity portion is configured as waveform and has partially been enhanced rigidity by exerting pressure in the thickness of slab direction at top board 31.Peristome 35a forms in the central portion 31a of top board 31 side with respect to the special-shaped 35c of portion, and peristome 35b forms in assembling leg 33 sides of top board 31 with respect to the special-shaped 35c of portion, therefore can not make top board 31 twisted.By peristome 35a, 35b are set, can form freely the shape of the special-shaped 35c of portion.In the 1st variation, formed the special-shaped 35c of portion that is configured as waveform by exerting pressure and has partially been enhanced rigidity in thickness of slab direction.
Fig. 5 represents the 2nd variation.The vertical view that Fig. 5 is the electronic circuit module 1 seen from top board 31 sides.In the 2nd variation, when 4 breach stage portion 35 are seen from the central portion 31a of top board 31, be arranged at the direction that disposes assembling leg 33, each breach stage portion 35 possesses peristome 35a with respect to the special-shaped 35c of portion in the central portion 31a of top board 31 side.By exerting pressure in thickness of slab direction, to the central portion 31a of top board 31, attenuation and rigidity are enhanced the thickness of slab of the special-shaped 35c of portion gradually.For example, can form the special-shaped 35c of portion that the shape of closing on peristome 35a forms waveform and has partially been enhanced rigidity.
In addition, breach stage portion 35 is not limited to present embodiment, also can be configured to have the rigidity of the special-shaped 35c of portion.That is, peristome 35a, 35b form the required size of the special-shaped 35c of portion for the thickness of slab direction at top board 31 is applied in pressure, and to try one's best little be comparatively desirable.The 35c of abnormity portion is comparatively desirable having in the direction of rigidity.From the central portion 31a of top board 31, towards periphery, the length of the special-shaped 35c of portion is longer, more can suppress top board 31 distortion.But because central portion 31a is smooth and not have opening be comparatively desirable with respect to the loading and unloading clamp of absorbent-type, so peristome 35a staggers from the center of central portion 31a, the configuration of 3mm left and right is comparatively desirable.As long as guarantee that diameter is the binding domain of 3mm-6mm left and right, just can use absorbent-type loading and unloading clamp out of questionly.
And breach stage portion 35 can not configure in the direction that four jiaos of 31b of top board 31 are connected with central portion 31a yet.Can be for example, assembling leg 33 configures in four jiaos of 31b directions, when breach stage portion 35 is seen from central portion 31a, in X1-X2 direction and Y1-Y2 direction, configures.Even upwards configure breach stage portion 35 the party, also can suppress distortion with respect to the direction with rigidity of the special-shaped 35c of portion.
Claims (5)
1. an electronic circuit module, has and has carried the circuit board of electronic devices and components and the box metal-back of at least one opening,
This electronic circuit module is characterised in that,
Above-mentioned metal-back possesses: the top board configuring, a plurality of assembling legs that also extend setting and engage with foregoing circuit plate from periphery bending a plurality of side plates that also extension arranges and four jiaos of bendings in the middle of above-mentioned top board periphery of above-mentioned top board oppositely with foregoing circuit plate
On above-mentioned top board, between portion and periphery, be provided with breach stage portion in the central,
Above-mentioned breach stage portion has special-shaped portion and peristome, above-mentioned special-shaped portion refers to, in the thickness of slab direction of above-mentioned top board, be applied in pressure and be also partially enhanced the special-shaped portion of rigidity by the special-shaped thickness reaching below above-mentioned top board thickness of slab that turns to, above-mentioned peristome refers to, the peristome forming in abutting connection with this abnormity portion.
2. electronic circuit module as claimed in claim 1, is characterized in that,
Above-mentioned breach stage portion is formed between the central portion and above-mentioned assembling leg of above-mentioned top board.
3. electronic circuit module as claimed in claim 1 or 2, is characterized in that,
Above-mentioned peristome is disposed at central portion side and this two place of above-mentioned assembling leg side at above-mentioned top board with respect to above-mentioned special-shaped portion.
4. electronic circuit module as claimed in claim 1, is characterized in that,
Above-mentioned special-shaped portion consists of material compressed in the thickness of slab direction at above-mentioned top board.
5. electronic circuit module as claimed in claim 1, is characterized in that,
Above-mentioned metal-back is for shielding the electromagnetic wave to foregoing circuit plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012164481A JP2014027036A (en) | 2012-07-25 | 2012-07-25 | Electronic circuit module |
| JP2012-164481 | 2012-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103582365A true CN103582365A (en) | 2014-02-12 |
Family
ID=50052940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310285670.8A Pending CN103582365A (en) | 2012-07-25 | 2013-07-09 | Electronic circuit module |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2014027036A (en) |
| CN (1) | CN103582365A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070297294A1 (en) * | 2003-09-02 | 2007-12-27 | The Swatch Group Management Services Ag | Watch With Metallic Case Including an Electronic Module for Storing Data, and Electronic Module for Such a Watch |
| CN101663928A (en) * | 2007-04-20 | 2010-03-03 | 日本电气株式会社 | Noise shielding case and shielding structure for electronic part |
-
2012
- 2012-07-25 JP JP2012164481A patent/JP2014027036A/en active Pending
-
2013
- 2013-07-09 CN CN201310285670.8A patent/CN103582365A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070297294A1 (en) * | 2003-09-02 | 2007-12-27 | The Swatch Group Management Services Ag | Watch With Metallic Case Including an Electronic Module for Storing Data, and Electronic Module for Such a Watch |
| CN101663928A (en) * | 2007-04-20 | 2010-03-03 | 日本电气株式会社 | Noise shielding case and shielding structure for electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014027036A (en) | 2014-02-06 |
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Effective date of abandoning: 20171013 |