CN105338772A - Front shell component and metal front shell structure of electronic equipment - Google Patents
Front shell component and metal front shell structure of electronic equipment Download PDFInfo
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- CN105338772A CN105338772A CN201510827648.0A CN201510827648A CN105338772A CN 105338772 A CN105338772 A CN 105338772A CN 201510827648 A CN201510827648 A CN 201510827648A CN 105338772 A CN105338772 A CN 105338772A
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Abstract
The invention relates to a front shell component and metal front shell structure of electronic equipment. The front shell component and the metal front shell structure can replace electromagnetic shields in the electronic equipment and conduce to reducing the thickness of the electronic equipment. The front shell component comprises the metal front shell structure and a metal sheet, wherein a plurality of through holes corresponding to devices to be shielded on a printed circuit board in the electronic equipment one to one are formed in the metal front shell structure; the metal sheet closes the ends, far away from the printed circuit board, of the plurality of through holes, so that the metal sheet and the plurality of through holes form a plurality of corresponding groove structures; the metal sheet is also electrically connected to the metal front shell structure; and the forming position and dimension of each through hole are matched with the corresponding device to be shielded, so that when the metal front shell structure and the printed circuit board are assembled in the electronic equipment in a mutual fitting manner, the groove structure corresponding to each through hole can contain the corresponding device to be shielded and keeps a preset interval from the contained device to be shielded.
Description
Technical field
The disclosure relates to technical field of electronic equipment, particularly relates to front shell assemblies and the metal front structure of electronic equipment.
Background technology
In the related, need to wait for that shielding device adds corresponding electro-magnetic shielding cover to the CPU in electronic equipment, radio frequency chip, to make it meet electromagnetic radiation requirement, guarantee the normal operation of electronic equipment.
But, because metallic shield needs the outer surface covering device to be shielded, when causing being assembled to electronic equipment internal, the thickness of electronic equipment can be caused to increase, run counter to the lightening growth requirement of electronic equipment.
Summary of the invention
The disclosure provides a kind of front shell assemblies and metal front structure of electronic equipment, to solve the deficiency in correlation technique.
According to the first aspect of disclosure embodiment, a kind of front shell assemblies of electronic equipment is provided, the printed circuit board (PCB) adjacent to described front shell assemblies is provided with in described electronic equipment, and the one side near described front shell assemblies on described printed circuit board (PCB) is provided with some devices to be shielded, described front shell assemblies comprises:
Metal front structure, described metal front structure offers and described device to be shielded some through holes one to one;
Sheet metal, described sheet metal closes the one end away from described printed circuit board (PCB) on described some through holes, makes described sheet metal form corresponding some groove structures with described some through holes; Wherein, described sheet metal is also electrically connected to described metal front structure;
Wherein, offer position and the dimensions of each through hole are all matched with corresponding device to be shielded, when making described metal front structure and described printed circuit board (PCB) be assembled to described electronic equipment bonded to each otherly, the groove structure that each through hole is corresponding all can hold corresponding device to be shielded, and and keeps predetermined interval between the device to be shielded be received.
Optionally, described front shell assemblies comprises and described some through holes some described sheet metals one to one, and each sheet metal closes the one end away from described printed circuit board (PCB) on corresponding through hole respectively, to form corresponding groove structure.
Optionally, each sheet metal is embedded in corresponding through hole respectively, and the one side away from described printed circuit board (PCB) in the lateral surface of this sheet metal and described metal front structure is in same plane.
Optionally, described sheet metal is connected in the one side away from described printed circuit board (PCB) in described metal front structure, to cover described some through holes and to close the one end away from described printed circuit board (PCB) on described some through holes.
Optionally, described metal front structure also offers some damping slots, for the damping material inserting the elastic damping that can provide between described metal front structure and described printed circuit board (PCB).
Optionally, described damping material comprises: conductive glue or conductive double sided adhesive tape.
According to the second aspect of disclosure embodiment, a kind of metal front structure of electronic equipment is provided, the printed circuit board (PCB) adjacent to described metal front structure is provided with in described electronic equipment, and the one side near described metal front structure on described printed circuit board (PCB) is provided with some devices to be shielded, described metal front structure offers and described device to be shielded some grooves one to one, and offer position and the dimensions of each groove are all matched with corresponding device to be shielded, when making described metal front structure and described printed circuit board (PCB) be assembled to described electronic equipment bonded to each otherly, each groove all can hold corresponding device to be shielded, and and keep predetermined interval between the device to be shielded be received.
Optionally, described metal front structure also offers some damping slots, for the damping material inserting the elastic damping that can provide between described metal front structure and described printed circuit board (PCB).
Optionally, described damping material comprises: conductive glue or conductive double sided adhesive tape.
According to the third aspect of disclosure embodiment, a kind of electronic equipment is provided, comprises:
The front shell assemblies of the electronic equipment according to any one of above-described embodiment;
Or, the metal front structure according to any one of above-described embodiment.
The technical scheme that embodiment of the present disclosure provides can comprise following beneficial effect:
From above-described embodiment, the disclosure by offering groove in the metal front structure of electronic equipment, or offer through hole and close into groove structure, the electromagnetic armouring structure being embedded in metal front inside configuration can be formed, not only can realize the electro-magnetic screen function treating shielding device, and the electro-magnetic shielding cover in correlation technique can be avoided to cause increasing the thickness of electronic equipment, can also by device to be shielded being contained in corresponding groove or groove structure, the thickness of further reduction electronic equipment, thus the lightening growth requirement meeting electronic equipment.
Should be understood that, it is only exemplary and explanatory that above general description and details hereinafter describe, and can not limit the disclosure.
Accompanying drawing explanation
Accompanying drawing to be herein merged in specification and to form the part of this specification, shows and meets embodiment of the present disclosure, and is used from specification one and explains principle of the present disclosure.
Fig. 1 is the cutaway view of the electronic equipment in correlation technique.
Fig. 2 A is a kind of metal front structure of electronic equipment and the perspective view of printed circuit board (PCB) that illustrate according to one of exemplary embodiment.
Fig. 2 B is the cutaway view of a kind of electronic equipment illustrated according to one of exemplary embodiment.
Fig. 3 A is the cutaway view of a kind of electronic equipment according to two of an exemplary embodiment.
Fig. 3 B is the cutaway view of the another kind of electronic equipment according to two of an exemplary embodiment.
Fig. 4 is the cutaway view of a kind of electronic equipment according to three of an exemplary embodiment.
Fig. 5 A is the perspective view of a kind of electronic equipment according to four of an exemplary embodiment.
Fig. 5 B is the cutaway view of a kind of electronic equipment according to four of an exemplary embodiment.
Embodiment
Here will be described exemplary embodiment in detail, its sample table shows in the accompanying drawings.When description below relates to accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawing represents same or analogous key element.Execution mode described in following exemplary embodiment does not represent all execution modes consistent with the disclosure.On the contrary, they only with as in appended claims describe in detail, the example of apparatus and method that aspects more of the present disclosure are consistent.
Fig. 1 is the cutaway view of the electronic equipment in correlation technique, as shown in Figure 1, comprises printed circuit board (PCB) 1 in electronic equipment, this printed circuit board (PCB) 1 is provided with device 2 to be shielded, such as CPU, radio frequency chip etc.So, if do not consider electromagnetic shielding problem, from the outer wall of printed circuit board (PCB) 1 to the thickness D=d1+d2+d4 between the outer wall of the metal front structure 4 of electronic equipment, wherein d1 be the thickness of printed circuit board (PCB) 1, the d2 thickness that is device 2 to be shielded, the d4 thickness that is metal front structure 4.
But, the electromagnetic shielding problem of electronic equipment be can not ignore, thus must at each device 2 outer setting electro-magnetic shielding cover 3 to be shielded, and can not directly contact between electro-magnetic shielding cover 3 with device 2 to be shielded, keep between the sidewall of such as electro-magnetic shielding cover 3 and the sidewall of device to be shielded 2 keeping interval a2 between the roof of interval a1, electro-magnetic shielding cover 3 and the top of device to be shielded 2, to meet electromagnetic radiation requirement; Correspondingly, from the outer wall of printed circuit board (PCB) 1 to the near thickness d 3 and interval a2 that add this electro-magnetic shielding cover 3 of reducing of thickness D between the outer wall of the metal front structure 4 of electronic equipment, D=d1+d2+d3+d4+a2 is reached.
Visible, in order to solve the electromagnetic shielding problem of electronic equipment, the electro-magnetic shielding cover 3 added in correlation technique will increase the thickness of electronic equipment further, runs counter to the lightening development trend of electronic equipment, is unfavorable for the experience of user.
Therefore, the disclosure is by improving the metal front structure 4 of electronic equipment, to solve the above-mentioned technical problem existed in correlation technique.Be described in detail below by embodiment:
Embodiment one
Fig. 2 A is a kind of metal front structure of electronic equipment and the perspective view of printed circuit board (PCB) that illustrate according to one of exemplary embodiment, as shown in Figure 2 A, be provided with the printed circuit board (PCB) 1 adjacent to metal front structure 4 in electronic equipment, and the one side near this metal front structure 4 on this printed circuit board (PCB) 1 is provided with some devices to be shielded 2 (such as device 2A to be shielded and device 2B to be shielded); Wherein:
This metal front structure 4 offers with device 2 to be shielded one to one some groove 5 (such as correspond to the groove 5A of device 2A to be shielded, and correspond to the groove 5B of device 2B to be shielded), and offer position and the dimensions of each groove 5 are all matched with corresponding device to be shielded 2, when making this metal front structure 4 be assembled to electronic equipment with this printed circuit board (PCB) 1, each groove 5 all can hold corresponding device to be shielded 2 bonded to each otherly.
Simultaneously, the cutaway view of this electronic equipment shown in composition graphs 2B, for groove 5A and corresponding device 2A to be shielded, the then dimensions of this groove 5A and mating and can comprise between device 2A to be shielded: the length of groove 5A, width and the degree of depth should be greater than the length of device 2A to be shielded respectively, width and height, make the sidewall of this groove 5A and bottom all and predetermined interval can be kept between the sidewall of this device 2A to be shielded and top, gap length between the sidewall of such as groove 5A and the sidewall of device 2A to be shielded is a1, gap length between the bottom of groove 5A and the top of device 2A to be shielded is a2, wherein a1, a2 is all not less than preset length (this preset length is guarantee to reach the minimum range of electromagnetic radiation requirement).Certainly, between other grooves 5 and device to be shielded 2 (such as groove 5B and device 2B to be shielded), similar matching relationship can be there is equally, repeat no more herein.
From above-described embodiment, the disclosure is by being contained in metal front structure 4 in the corresponding groove 5 offered by device 2 to be shielded, make the thickness d 3 not only not needing to increase the electro-magnetic shielding cover 3 shown in Fig. 1, but also can the thickness d 2 of device 2 to be shielded and interval a2 be contained in the thickness d 4 of this metal front structure 4, the thickness D between the outer wall from the outer wall of printed circuit board (PCB) 1 to the metal front structure 4 of electronic equipment is made to decrease the thickness d 2 of this device 2 to be shielded, i.e. D=d1+d4.Therefore, above-described embodiment can either meet the electromagnetic shielding demand of electronic equipment, can reduce again the thickness of electronic equipment, thus farthest achieves the lightening of electronic equipment.
It should be noted that:
Due to the finite thickness of metal front structure 4, and the part device 2 to be shielded on printed circuit board (PCB) 1 may have comparatively heavy thickness, thus causes the base plate thickness of groove 5 very little, may increase the difficulty of processing of metal front structure 4.Therefore, based on same mentality of designing, the disclosure further provides following embodiment, while the difficulty of processing reducing metal front structure 4, contradiction between the electromagnetic shielding demand existed in solution correlation technique and electronic equipment thickness reduce, realizes the technique effect identical or close with above-described embodiment one.
Embodiment two
Fig. 3 A is the cutaway view of a kind of electronic equipment according to two of an exemplary embodiment, and as shown in Figure 3A, this embodiment provides a kind of front shell assemblies of electronic equipment, and this front shell assemblies comprises:
Metal front structure 4, this metal front structure 4 offers and device 2 (such as device 2A to be shielded and device 2B to be shielded etc.) to be shielded some through holes 5 ' (such as through hole 5 ' A and through hole 5 ' B etc.) one to one;
Sheet metal 6, this sheet metal 6 closes the one end away from the printed circuit board (PCB) 1 in electronic equipment on this some through hole 5 ', makes this sheet metal 6 and this some through hole 5 ' form corresponding some groove structures (not indicating in figure); Wherein, this sheet metal 6 is also electrically connected to this metal front structure 4;
Wherein, offer position and the dimensions of each through hole 5 ' are all matched with corresponding device to be shielded 2, when making metal front structure 4 and printed circuit board (PCB) 1 be assembled to electronic equipment bonded to each otherly, the groove structure that each through hole 5 ' is corresponding all can hold corresponding device to be shielded 2, and and keeps predetermined interval between the device to be shielded 2 be received.
In this embodiment, groove structure acts on identical with the groove 5 in above-described embodiment one, all can treat shielding device 2 on the one hand to carry out holding and surrounding, and and between device to be shielded 2, keep predetermined interval (between the sidewall of such as through hole 5 ' and the sidewall of device to be shielded 2, to be spaced apart a1, a2 is spaced apart) between the bottom (being equivalent to the bottom of groove structure) of sheet metal 6 and the top of device to be shielded 2, to realize electro-magnetic screen function, on the other hand by device 2 to be shielded is contained in groove structure inside, the thickness d 2 of device 2 to be shielded is made to be contained in the thickness d 4 of metal front structure 4, contribute to the complete machine thickness reducing electronic equipment.
In the embodiment two shown in Fig. 3 A, sheet metal 6 is connected in the one side (being bonded to metal front structure 4 as by conductive glue or conductive double sided adhesive tape) away from printed circuit board (PCB) 1 in metal front structure 4, to cover some through holes 5 ' and to close the one end away from printed circuit board (PCB) 1 on this some through hole 5 ', thus form corresponding some groove structures.Correspondingly, because this sheet metal 6 is covered in outside metal front structure 4, thus add the thickness d 5 of this sheet metal 6, i.e. D=d1+d4+d5 from the outer wall of printed circuit board (PCB) 1 to the thickness D between the outer wall of the metal front structure 4 of electronic equipment.
But, should be understood that:
(1) when adopting the electro-magnetic shielding cover 3 shown in Fig. 1 in correlation technique, because electro-magnetic shielding cover 3 needs to keep certain interval between device to be shielded 2, and this electro-magnetic shielding cover 3 needs direct contacting metal front casing structure 4, thus in order to avoid electro-magnetic shielding cover 3 is subject to the extruding of other structures such as metal front structure 4 grade and stress and deformation, the thickness of this electro-magnetic shielding cover 3 can not be very little, and the thickness adopted in such as correlation technique is 0.4mm; But, this sheet metal 6 needs can carry out closing to through hole 5 ', and the inevitable requirement do not existed on thickness, thus the thickness of sheet metal 6 can be little as much as possible, such as 0.1mm can be only, the thickness of the electro-magnetic shielding cover 3 adopted in correlation technique, thus contributes to the complete machine thickness reducing electronic equipment equally.
(2) known by comparison diagram 2B and Fig. 3 A: in the embodiment one shown in Fig. 2 B, the base plate thickness of groove 5 is contained in the thickness d 4 of this metal front structure 4; And in the embodiment two shown in Fig. 3 A, the base plate of the groove structure that through hole 5 ' is corresponding and sheet metal 6 itself, be not contained in the thickness d 4 of metal front structure 4.
Therefore, when the embodiment one shown in Fig. 2 B can meet the height requirement of gap a2, can cut down to d4 ' (not indicating in figure) by the thickness d 4 of metal front structure 4 in the embodiment two shown in Fig. 3 A, the thickness of such as this part equals the base plate thickness X (not indicating in figure) of the groove 5 in Fig. 2 B illustrated embodiment one; So, thickness D in the embodiment two shown in Fig. 3 A can be revised as: D=d1+d4 '+d5, as long as then the thickness d 5 of sheet metal is not more than above-mentioned base plate thickness X, then the complete machine thickness of embodiment two would not exceed the complete machine thickness of embodiment one, even may reduce further.
Certainly, be covered in outside metal front structure 4 for by sheet metal 6, to cover and to close the technical scheme of respective through hole 5 ', structure shown in Fig. 3 A is only wherein a kind of implementation, in fact can also realize by other means.
Such as Fig. 3 B is the cutaway view of the another kind of electronic equipment according to two of an exemplary embodiment, and as shown in Figure 3 B, the disclosure further provides a kind of front shell assemblies of electronic equipment; Known by comparison diagram 3A and Fig. 3 B: in the embodiment two shown in Fig. 3 A, sheet metal 6 is a complete structure, only needs a sheet metal 6, can cover and all through holes 5 ' on closed metal front casing structure 4; And in the embodiment three shown in Fig. 3 B, by have employed with through hole 5 ' one to one some sheet metal 6 (such as correspond to the sheet metal 6A of through hole 5 ' A, and correspond to the sheet metal 6B of through hole 5 ' B), this some sheet metal 6 covers and closes corresponding through hole 5 ' respectively, to realize holding and electromagnetic shielding the thickness of corresponding device 2 to be shielded.
Embodiment three
Fig. 4 is the cutaway view of a kind of electronic equipment according to three of an exemplary embodiment, as shown in Figure 4, when front shell assemblies comprises and some through holes 5 ' (such as through hole 5 ' A and through hole 5 ' B etc.) some sheet metals 6 (such as sheet metal 6A and sheet metal 6B etc.) one to one, and each sheet metal 6 closes the one end away from printed circuit board (PCB) 1 on corresponding through hole 5 ' respectively, during to form corresponding groove structure, each sheet metal 6 can be embedded in corresponding through hole 5 ' respectively, and the one side away from printed circuit board (PCB) 1 in the lateral surface of this sheet metal 6 and metal front structure 4 is in same plane.
Therefore, the present embodiment, by embedding in through hole 5 ' by some sheet metals 6, can reach the structure similar with the embodiment one shown in Fig. 2 B; But, compared to the structure shown in embodiment one, sheet metal 6 in embodiment three obtains for processing separately, and obvious difficulty of processing, much smaller than directly offering groove 5 in metal front structure 4, contributes to reducing difficulty of processing, reduces processing cost, promotes working (machining) efficiency.
In addition, in technical scheme of the present disclosure, such as on the basis of above-described embodiment one to embodiment three, as indicated by figures 5 a-5b, some damping slots 7 can be offered in metal front structure 4 and (in figure, only exemplify a damping slot 7; Wherein, some damping slots 7 can one_to_one corresponding in some devices 2 to be shielded, or also only can correspond to part device 2 to be shielded), for the damping material inserting the elastic damping that can provide between metal front structure 4 and printed circuit board (PCB) 1.For example, this damping material can comprise: conductive glue or conductive double sided adhesive tape.
In the present embodiment, as indicated by figures 5 a-5b, damping slot 7 can be arranged at groove 5 peripheral; Certainly, only illustrate with the structure of the above embodiments one herein, when adopting the structure of embodiment two or embodiment three, this damping slot 7 can be arranged at through hole 5 ' peripheral.
In the present embodiment, by using damping material, making to be close between metal front structure 4 and printed circuit board (PCB) 1 when arranging, can cushioning effect be provided, avoid " very stiff and demanding " and easily cause damage.Meanwhile, owing to being inserted in damping slot 7 by damping material, make the interpolation of this damping material, the complete machine thickness of electronic equipment can not be increased.
Those skilled in the art, at consideration specification and after putting into practice disclosed herein disclosing, will easily expect other embodiment of the present disclosure.The application is intended to contain any modification of the present disclosure, purposes or adaptations, and these modification, purposes or adaptations are followed general principle of the present disclosure and comprised the undocumented common practise in the art of the disclosure or conventional techniques means.Specification and embodiment are only regarded as exemplary, and true scope of the present disclosure and spirit are pointed out by claim below.
Should be understood that, the disclosure is not limited to precision architecture described above and illustrated in the accompanying drawings, and can carry out various amendment and change not departing from its scope.The scope of the present disclosure is only limited by appended claim.
Claims (10)
1. the front shell assemblies of an electronic equipment, the printed circuit board (PCB) adjacent to described front shell assemblies is provided with in described electronic equipment, and the one side near described front shell assemblies on described printed circuit board (PCB) is provided with some devices to be shielded, it is characterized in that, described front shell assemblies comprises:
Metal front structure, described metal front structure offers and described device to be shielded some through holes one to one;
Sheet metal, described sheet metal closes the one end away from described printed circuit board (PCB) on described some through holes, makes described sheet metal form corresponding some groove structures with described some through holes; Wherein, described sheet metal is also electrically connected to described metal front structure;
Wherein, offer position and the dimensions of each through hole are all matched with corresponding device to be shielded, when making described metal front structure and described printed circuit board (PCB) be assembled to described electronic equipment bonded to each otherly, the groove structure that each through hole is corresponding all can hold corresponding device to be shielded, and and keeps predetermined interval between the device to be shielded be received.
2. front shell assemblies according to claim 1, it is characterized in that, described front shell assemblies comprises and described some through holes some described sheet metals one to one, and each sheet metal closes the one end away from described printed circuit board (PCB) on corresponding through hole respectively, to form corresponding groove structure.
3. front shell assemblies according to claim 2, is characterized in that, each sheet metal is embedded in corresponding through hole respectively, and the one side away from described printed circuit board (PCB) in the lateral surface of this sheet metal and described metal front structure is in same plane.
4. front shell assemblies according to claim 1, it is characterized in that, described sheet metal is connected in the one side away from described printed circuit board (PCB) in described metal front structure, to cover described some through holes and to close the one end away from described printed circuit board (PCB) on described some through holes.
5. front shell assemblies according to claim 1, is characterized in that, described metal front structure also offers some damping slots, for the damping material inserting the elastic damping that can provide between described metal front structure and described printed circuit board (PCB).
6. metal front structure according to claim 5, is characterized in that, described damping material comprises: conductive glue or conductive double sided adhesive tape.
7. the metal front structure of an electronic equipment, the printed circuit board (PCB) adjacent to described metal front structure is provided with in described electronic equipment, and the one side near described metal front structure on described printed circuit board (PCB) is provided with some devices to be shielded, it is characterized in that, described metal front structure offers and described device to be shielded some grooves one to one, and offer position and the dimensions of each groove are all matched with corresponding device to be shielded, when making described metal front structure and described printed circuit board (PCB) be assembled to described electronic equipment bonded to each otherly, each groove all can hold corresponding device to be shielded, and and keep predetermined interval between the device to be shielded be received.
8. metal front structure according to claim 7, is characterized in that, described metal front structure also offers some damping slots, for the damping material inserting the elastic damping that can provide between described metal front structure and described printed circuit board (PCB).
9. metal front structure according to claim 8, is characterized in that, described damping material comprises: conductive glue or conductive double sided adhesive tape.
10. an electronic equipment, is characterized in that, comprising:
The front shell assemblies of the electronic equipment according to any one of claim 1-6;
Or, metal front structure as claimed in any one of claims 7-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510827648.0A CN105338772A (en) | 2015-11-24 | 2015-11-24 | Front shell component and metal front shell structure of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510827648.0A CN105338772A (en) | 2015-11-24 | 2015-11-24 | Front shell component and metal front shell structure of electronic equipment |
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| CN105338772A true CN105338772A (en) | 2016-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510827648.0A Pending CN105338772A (en) | 2015-11-24 | 2015-11-24 | Front shell component and metal front shell structure of electronic equipment |
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| CN107396556A (en) * | 2016-05-16 | 2017-11-24 | 北京小米移动软件有限公司 | Terminal shell and preparation method thereof, terminal device |
| CN111107737A (en) * | 2018-10-29 | 2020-05-05 | 北京小米移动软件有限公司 | Shield case structure and electronic device |
| CN113226002A (en) * | 2017-07-31 | 2021-08-06 | 荣耀终端有限公司 | Shielding case and terminal |
| CN114980523A (en) * | 2016-08-19 | 2022-08-30 | 奈科斯特金技术私人有限公司 | Method for manufacturing printed circuit board |
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| CN203251564U (en) * | 2013-05-09 | 2013-10-23 | 翁金柱 | Electronic device protection casing |
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| CN111107737B (en) * | 2018-10-29 | 2022-02-15 | 北京小米移动软件有限公司 | Shield case structure and electronic device |
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Application publication date: 20160217 |
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