CN103579770A - Metamaterial, manufacturing method and metamaterial antenna - Google Patents
Metamaterial, manufacturing method and metamaterial antenna Download PDFInfo
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- CN103579770A CN103579770A CN201210268630.8A CN201210268630A CN103579770A CN 103579770 A CN103579770 A CN 103579770A CN 201210268630 A CN201210268630 A CN 201210268630A CN 103579770 A CN103579770 A CN 103579770A
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- super material
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- thermosetting resin
- micro structure
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Abstract
The invention provides a metamaterial and a manufacturing method thereof. The metamaterial comprises an organic resin substrate and a plurality of metal microstructures attached to the organic resin substrate, a protective film further covers the surfaces of the metal microstructures, and the protective film is a thermosetting resin thin film. According to the metamaterial and the manufacturing method thereof, the protective film of the metamaterial is the thermosetting resin thin film, the protective film is little in loss, and thus the loss of a metamaterial antenna made of the metamaterial will not be enlarged to affect the performance of the metamaterial antenna due to the loss of the protective film. Further, the protective film cannot fall off easily in a severe outdoor environment, and thus the metamaterial antenna can be better protected.
Description
[technical field]
The present invention relates to super Material Field, more particularly, relate to a kind of method of super material and preparation, the super material antenna of preparation.
[background technology]
Super material be grow up nearly ten years electromagnetic wave is played to the material of modulating action.Super material be generally the metal micro structure by some be attached to there is certain mechanics, on electromagnetic substrate, these micro-structurals with specific pattern and material can produce modulating action to the electromagnetic wave of the special frequency channel through its body.
Common super material metal micro-structural major part obtains by etching at present; under water as aerial in the metal micro structure obtaining with copper-foil conducting electricity etching and oxygen effect, very easily there is oxide etch; therefore need to adopt special method to protect metal micro structure air-isolation and water.
The guard method of PCB industry silk-screen green oil is generally used in conventional guard method at present; the method technique is simple, ripe; but common product can only be under dry indoor environment, and under high temperature, high humidity, effect of sunlight, protective layer easily comes off and causes metal micro structure oxidized.
[summary of the invention]
Technical problem to be solved by this invention is: it is the super material of thermosetting resin membrane and the super material antenna of preparation that a kind of diaphragm is provided; this diaphragm loss is little; the loss that can not increase antenna affects its performance; and this diaphragm also difficult drop-off under severe outdoor environment, can better protect super material antenna.
The technical solution adopted for the present invention to solve the technical problems is: a kind of super material; comprise organic resin substrate and be attached to a plurality of metal micro structures on organic resin substrate; described metal micro structure surface is also covered with layer protecting film, and described diaphragm is thermosetting resin membrane.
A preparation method for super material, described preparation method comprises the following steps:
At organic resin substrate surface, process a plurality of metal micro structures;
After organic resin substrate with metal micro structure is impregnated in thermosetting resin glue, takes out and obtain preform;
Preform dry solidification is obtained to the super material with thermosetting resin membrane.
Describedly after being impregnated in thermosetting resin glue, the organic resin substrate with metal micro structure vacuumizes removal bubble.
By before described preform dry solidification, hang, remove the unnecessary thermosetting resin glue in metal micro structure surface.
Further improve, by regulating the viscosity of described thermosetting resin glue and/or the thickness of suspension time control diaphragm.
Described thermosetting resin glue comprises epoxy resin, acrylic resin, phenolic resins, polyurethane resin, organic siliconresin or polyimide resin.
Further improve, in order to reach dipping ability and the adhesion of described thermosetting resin glue and described organic resin substrate, according to dissimilar organic resin substrate, select corresponding thermosetting resin glue.
The plane with certain geometrical shape or the stereochemical structure of described metal micro structure for being formed by wire.
Described metal micro structure is attached on described organic resin substrate by etching, plating, brill quarter, photoetching, electronics is carved or ion is carved method.
A material antenna, prepared by the super material that described super material antenna is prepared by method described above.
Further improve, according to the operating frequency of super material antenna, select the thermosetting resin of differing dielectric constant and loss.
Beneficial effect of the present invention is: the diaphragm of the super material in the present invention is thermosetting resin membrane; this diaphragm loss is little; make the super material antenna of being prepared by super material of the present invention; can because of the loss of diaphragm, not increase the loss of this antenna and then affect its performance; and this diaphragm also difficult drop-off under severe outdoor environment, can better protect super material antenna.
[accompanying drawing explanation]
Fig. 1 is preparation method's flow chart of the present invention.
[embodiment]
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
A kind of super material, comprise organic resin substrate and be attached to a plurality of metal micro structures on organic resin substrate, metal micro structure surface is also covered with one deck thermosetting resin membrane, metal micro structure is the plane with certain geometrical shape or the stereochemical structure that wire, consist of, by etching, plating, brill quarter, photoetching, electronics is carved or ion quarter etc. method be attached on organic resin substrate.
A preparation method for super material, described preparation method comprises the following steps:
A, at organic resin substrate surface, process a plurality of metal micro structures, by etching, plating, brill quarter, photoetching, electronics is carved or ion quarter etc. method;
B, the organic resin substrate with metal micro structure is impregnated in thermosetting resin glue, and vacuumizes after removing blibbing and take out, hang and remove the unnecessary thermosetting resin glue in metal micro structure surface, obtain preform;
C, preform is carried out to dry solidification obtain the super material with thermosetting resin membrane.
Can be by regulating the viscosity of thermosetting resin glue and/or the thickness of suspension time control thermosetting resin membrane; In order to reach dipping ability and the adhesion of thermosetting resin glue and organic resin substrate, according to dissimilar organic resin substrate, select corresponding thermosetting resin glue (the similar principle that mixes), thermosetting resin glue comprises epoxy resin, acrylic resin, phenolic resins, polyurethane resin, organic siliconresin or polyimide resin etc.
Embodiment mono-
The bicomponent epoxy resin glue of viscosity 5000cps is placed in to container to stir, the organic resin of surface etching metal micro structure is impregnated in resin adhesive liquid, and vacuumize and keep removing for 1 minute surperficial bubble, rear taking-up is hung and the unnecessary resin adhesive liquid in surface was removed in 5 minutes, send in baking box and toast, under 80 degrees Celsius, toast 20 minutes, obtain the super material that there is epoxy resin thin film on surface.
Embodiment bis-
The acrylic resin glue of viscosity 1000cps is placed in to container to stir, the organic resin of surface etching metal micro structure is impregnated in resin adhesive liquid, and vacuumize and keep removing for 2 minutes surperficial bubble, rear taking-up is hung and the unnecessary resin adhesive liquid in surface was removed in 3 minutes, send in baking box and toast, under 60 degrees Celsius, toast 120 minutes, obtain the super material that there is acrylic resin film on surface.
Embodiment tri-
The cold curing bi-component organic silicon resin adhesive liquid of viscosity 12500cps is placed in to container to stir, the organic resin of surface etching metal micro structure is impregnated in resin adhesive liquid, and vacuumize and keep removing for 1 minute surperficial bubble, rear taking-up is hung and the unnecessary resin adhesive liquid in surface was removed in 8 minutes, send in baking box and toast, cold curing 24 hours, obtains the super material that there is organic siliconresin film on surface.
The diaphragm of the super material in the present embodiment is thermosetting resin membrane, this diaphragm loss is little, make the super material antenna of being prepared by the super material of the present embodiment, can because of the loss of diaphragm, not increase the loss of this antenna and then affect its performance, and this diaphragm also difficult drop-off under severe outdoor environment, can better protect super material antenna; Also can be according to the operating frequency of super material antenna, diaphragm can be selected the thermosetting resin of differing dielectric constant and loss, as on the super material product of high frequency, preferentially selects the thermosetting resin that dielectric constant is low, loss is little.
By reference to the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment is only schematic; rather than restrictive; those of ordinary skill in the art is under enlightenment of the present invention; not departing from the scope situation that aim of the present invention and claim protect, also can make a lot of forms, within these all belong to protection of the present invention.
Claims (8)
1. a super material, comprises organic resin substrate and is attached to a plurality of metal micro structures on organic resin substrate, and it is characterized in that, described metal micro structure surface is also covered with layer protecting film, and described diaphragm is thermosetting resin membrane.
2. a preparation method for super material, is characterized in that, described preparation method comprises the following steps: at organic resin substrate surface, process a plurality of metal micro structures;
After organic resin substrate with metal micro structure is impregnated in thermosetting resin glue, takes out and obtain preform;
Preform dry solidification is obtained to the super material with thermosetting resin membrane.
3. according to the super material preparation method of claim 2, it is characterized in that, describedly vacuumize removal bubble after the organic resin substrate with metal micro structure is impregnated in thermosetting resin glue.
4. super material preparation method according to claim 2, is characterized in that, by before described preform dry solidification, hangs, and removes the unnecessary thermosetting resin glue in metal micro structure surface.
5. according to the super material preparation method of claim 2, it is characterized in that, described thermosetting resin glue comprises epoxy resin, acrylic resin, phenolic resins, polyurethane resin, organic siliconresin or polyimide resin.
6. according to the super material preparation method of claim 2, it is characterized in that the plane with certain geometrical shape or the stereochemical structure of described metal micro structure for being formed by wire.
7. according to the super material preparation method of claim 6, it is characterized in that, described metal micro structure is attached on described organic resin substrate by etching, plating, brill quarter, photoetching, electronics is carved or ion is carved method.
8. a super material antenna, is characterized in that, prepared by the super material that described super material antenna is prepared by method described in claim 2 to 7 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210268630.8A CN103579770A (en) | 2012-07-31 | 2012-07-31 | Metamaterial, manufacturing method and metamaterial antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210268630.8A CN103579770A (en) | 2012-07-31 | 2012-07-31 | Metamaterial, manufacturing method and metamaterial antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103579770A true CN103579770A (en) | 2014-02-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210268630.8A Pending CN103579770A (en) | 2012-07-31 | 2012-07-31 | Metamaterial, manufacturing method and metamaterial antenna |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1031159A (en) * | 1987-07-30 | 1989-02-15 | 索尼公司 | Microwave antenna |
| US7525711B1 (en) * | 2005-08-31 | 2009-04-28 | The United States Of America As Represented By The Secretary Of The Navy | Actively tunable electromagnetic metamaterial |
| CN202231160U (en) * | 2011-05-20 | 2012-05-23 | 深圳光启高等理工研究院 | Antenna based on metamaterial |
-
2012
- 2012-07-31 CN CN201210268630.8A patent/CN103579770A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1031159A (en) * | 1987-07-30 | 1989-02-15 | 索尼公司 | Microwave antenna |
| US7525711B1 (en) * | 2005-08-31 | 2009-04-28 | The United States Of America As Represented By The Secretary Of The Navy | Actively tunable electromagnetic metamaterial |
| CN202231160U (en) * | 2011-05-20 | 2012-05-23 | 深圳光启高等理工研究院 | Antenna based on metamaterial |
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Application publication date: 20140212 |