CN103579470A - Light emitting diode lead frame structure and manufacturing method thereof - Google Patents
Light emitting diode lead frame structure and manufacturing method thereof Download PDFInfo
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- CN103579470A CN103579470A CN201210250689.4A CN201210250689A CN103579470A CN 103579470 A CN103579470 A CN 103579470A CN 201210250689 A CN201210250689 A CN 201210250689A CN 103579470 A CN103579470 A CN 103579470A
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- conductor area
- steathily
- conducting wire
- wire frame
- hole
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000000084 colloidal system Substances 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims description 57
- 238000000034 method Methods 0.000 claims description 24
- 238000009413 insulation Methods 0.000 claims description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 4
- 239000004568 cement Substances 0.000 description 6
- -1 polyethylene Polymers 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
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- 229920005989 resin Polymers 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
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- 238000011161 development Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Disclosed are a light emitting diode lead frame structure and a manufacturing method thereof. The light emitting diode lead frame structure comprises a metal substrate and insulating colloids. The metal substrate is provided with a plurality of lead regions, and two material stealing holes are respectively formed on two opposite sides of each lead region. Multiple insulating colloids are formed in the lead regions.
Description
Technical field
The invention relates to a kind of conducting wire frame structure and manufacture method, and particularly relevant for the manufacture method of a kind of LED conducting wire frame structure and LED conducting wire frame.
Background technology
In recent years due to industrial and commercial flourishing, social progress, the product relatively providing also mainly for convenient, certain, economical and practical be purport, therefore, the product of current exploitation is also than in the past more progressive, and contributed social.
Light-emitting diode (English: Light-Emitting Diode, abbreviation LED) [1] is the luminous semi-conductor electricity sub-element of a kind of energy.This electronic component occurred as far back as 1962, can only send in early days the ruddiness of low luminosity, developed afterwards other monochromatic versions, and the light that can send has even to this day spreaded all over visible ray, infrared ray and ultraviolet ray, and luminosity is also brought up to suitable luminosity.And purposes is also by the beginning as indicator light, display panel etc.; Along with the appearance of white light emitting diode, continuous being gradually developed to is used as illumination.
LED can only be toward a direction conducting (energising), be called forward bias (forward bias), when electric current flows through, electronics overlaps within it with hole and sends monochromatic light, this is electroluminescent effect, and the wavelength of light, color are relevant with the element impurity of deliberately infiltration with its semiconductor material kind adopting.Have advantages of that efficiency is high, the life-span is long, not cracky, reaction speed is fast, reliability is high etc., and conventional light source is too late.
Yet in the manufacture process of known LED lead frame, as shown in Figure 1, finished product is when blanking, colloid 110 easily has rent 112(, oblique line place).So caused qualification rate decline, production capacity is difficult to promote.
As can be seen here,, obviously still there is inconvenience and defect, and need to be further improved in above-mentioned existing manufacture.In order to address the above problem, association area is there's no one who doesn't or isn't sought solution painstakingly, but have no for a long time applicable mode always, by development, is completed.Therefore, how to prevent that the situation that colloid breaks from occurring, real one of the current important research and development problem that belongs to, also becomes current association area and needs improved target badly.
Summary of the invention
Therefore, an object of the present invention is that a kind of manufacture method and LED conducting wire frame structure of LED conducting wire frame are being provided, to prevent that the situation that colloid breaks from occurring.
According to one embodiment of the invention, a kind of manufacture method of LED conducting wire frame, comprises the following step: a metal substrate is provided; On metal substrate, form a plurality of conductor area, and expect steathily hole in the relative both sides formation two of each conductor area; In each conductor area, form an insulation colloid; When to each conductor area punching press, from relative two side direction two of each conductor area, expect that steathily hole pushes, each conductor area is departed from, to obtain a plurality of LED conducting wire frames from metal substrate.
In manufacture method, above-mentioned insulation colloid can be thermoplasticity colloid or thermosetting colloid.
In manufacture method, above-mentioned insulation colloid is to be formed in each conductor area with injection molding method.
In manufacture method, hole is expected in the two relative other formation two of the first side of each above-mentioned conductor area steathily, and two the second relative side sides of each conductor area form two perforates, and the length of the first side of each conductor area is greater than the length of the second side.
In manufacture method, above-mentioned each expects that Kong Weiyi strip expects hole steathily steathily, and strip expects that the length in hole is more than or equal to the length of the first side of each conductor area steathily.
According to another embodiment of the present invention, a kind of LED conducting wire frame structure comprises a metal substrate and a plurality of insulation colloid.Metal substrate has a plurality of conductor area, and the relative both sides of each conductor area form two and expect steathily hole.A plurality of insulating cement bodily forms are formed in these conductor area.
In LED conducting wire frame structure, above-mentioned insulation colloid is thermoplasticity colloid or thermosetting colloid.
In LED conducting wire frame structure, above-mentioned insulation colloid is to be formed in each conductor area with injection molding method.
In LED conducting wire frame structure, hole is expected in the two relative other formation two of the first side of each above-mentioned conductor area steathily, and two the second relative side sides of each conductor area form two perforates, and the length of the first side of each conductor area is greater than the length of the second side.
In LED conducting wire frame structure, above-mentioned each expects that Kong Weiyi strip expects hole steathily steathily, and strip expects that the length in hole is more than or equal to the length of the first side of each conductor area steathily.
In sum, technical scheme of the present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, can reach suitable technological progress, and there is the extensive value in industry, it at least has following advantages:
1. when to conductor area punching press, from the hole of expecting steathily of the relative two side direction both sides of conductor area, push, to prevent that insulating cement body from breaking, and each conductor area is departed from naturally from metal substrate, to obtain a plurality of finished products (that is, LED conducting wire frame); And
2. increase qualification rate, improve production capacity.
To above-mentioned explanation be explained in detail with execution mode below, and technical scheme of the present invention is provided further and explained.
Accompanying drawing explanation
For above and other object of the present invention, feature, advantage and embodiment can be become apparent, appended the description of the drawings is as follows:
Fig. 1 means the colloid of the known LED lead frame situation of breaking;
Fig. 2 is the flow chart according to the manufacture method of a kind of LED conducting wire frame of one embodiment of the invention; And
Fig. 3 is a kind of LED conducting wire frame structure according to one embodiment of the invention floor map before blanking; And
Fig. 4 is a kind of LED conducting wire frame structure according to another embodiment of the present invention floor map after blanking.
[main element symbol description]
Embodiment
In order to make narration of the present invention more detailed and complete, can be with reference to appended accompanying drawing and the various embodiment of the following stated, in accompanying drawing, identical number represents same or analogous element.On the other hand, well-known element and step are not described in embodiment, to avoid that the present invention is caused to unnecessary restriction.
In execution mode and claims, unless in interior literary composition, for article, be particularly limited to some extent, " one " can make a general reference single one or more with " being somebody's turn to do ".
" approximately " used herein, " approximately " or " roughly " are to modify any quantity that can slight variations, but this slight variations can't change its essence.In execution mode, unless otherwise noted, represent that the error range of the numerical value of being modified with " approximately ", " approximately " or " roughly " is generally to allow in 20 percent, be preferably in 10, be in 5 percent more preferably.
Technical scheme of the present invention is a kind of manufacture method of LED conducting wire frame, and it can be applicable to industry manufacture, or is used in widely relevant sport technique segment.It is worth mentioning that, the manufacture method of the technical program can prevent that the situation that colloid breaks from occurring.Below collocation Fig. 2～Fig. 4 is illustrated to the embodiment of this manufacture method.
Fig. 2 is the flow chart according to the manufacture method 200 of a kind of LED conducting wire frame of one embodiment of the invention.As shown in Figure 2, manufacture method 200 comprises step 210～240(and should be appreciated that, mentioned step, except chatting especially bright its order person, all can adjust its front and back order according to actual needs in the present embodiment, even can carry out simultaneously or partly simultaneously).
First, in step 210, provide a metal substrate; In step 220, on metal substrate, form a plurality of conductor area, and expect steathily hole in the relative both sides formation two of each conductor area; In step 230, in each conductor area, form an insulation colloid; In step 240, when to each conductor area punching press, from relative two side direction two of each conductor area, expect that steathily hole pushes, to prevent that insulating cement body from breaking, and each conductor area is departed from, to obtain a plurality of finished products (that is, LED conducting wire frame) from metal substrate.
For above-mentioned steps 210～230 is done further to set forth, please refer to Fig. 3, Fig. 3 is a kind of LED conducting wire frame structure 300 according to one embodiment of the invention floor map before blanking.As shown in Figure 3, LED conducting wire frame structure 300 comprises metal substrate 310 and a plurality of insulation colloids 320.Structurally, metal substrate 310 has a plurality of conductor area 312, and the relative both sides of each conductor area 312 form two and expect steathily hole 330.A plurality of insulation colloids 320 are formed in these conductor area 312.
Particularly, hole 330 is expected in the two relative other formation two of the first side 313 of conductor area 312 steathily, and two the second relative side 314 sides of each conductor area 312 form two perforates 340, and wherein the length of the first side 313 is the length that is greater than the second side 314.
In Fig. 3, each expects that hole 330 is that a strip is expected hole steathily steathily, and strip expects that the length in hole is approximately more than or equal to the length of the first side of each conductor area steathily.Whereby, when blanking, strip expects that there are enough geometric distortions in hole steathily, to prevent that insulating cement body 320 from breaking.
In implementation, insulation colloid 320 is to be formed in each conductor area 312 with injection molding method.In an embodiment, insulation colloid 320 can be thermoplasticity colloid, thermoplasticity colloid can be via heating and melting curing molding repeatedly.For instance, thermoplastic cement style is as can be polyethylene (PE), polypropylene (PP), polystyrene (PS), ABS resin, polyvinyl chloride (PVC), acryl resin, Merlon (PC), fluorine-type resin or other suitable material or above-mentioned derivative or above-mentioned combination.
Or in another embodiment, insulation colloid 320 can be thermosetting colloid, thermosetting colloid is to become solid state after being heated to uniform temperature, even if continue heating, also cannot change its state.For instance, thermosetting cement style is as can be fluosite, urea resin, epoxy resin, silicone grease, melamine or other suitable material or above-mentioned derivative or above-mentioned combination.
On the other hand, for above-mentioned steps 240 is done further to set forth, please refer to Fig. 4, Fig. 4 is a kind of LED conducting wire frame structure 300 according to one embodiment of the invention floor map after blanking.As shown in Figure 4, when to conductor area (being illustrated in Fig. 3) punching press, from the relative both sides 313 of conductor area to two, expect that steathily hole 330 pushes, by expecting steathily hole 330 stress deformations, the colloid 320 that prevented from insulating breaks, and increases whereby qualification rate, improves production capacity.And conductor area after metal substrate 310 departs from, can be used as a plurality of LED conducting wire frames together with non-cracked insulation colloid.LED conducting wire frame can be used to carry light-emitting diode and is electrically connected, and this is for having and conventionally know the knowledgeable institute known techniques in this technical field, and protection range that non-the present invention wants, and in this, no longer describes in detail.
Although the present invention discloses as above with execution mode; so it is not in order to limit the present invention; anyly be familiar with this skill person; without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, so the scope that protection scope of the present invention ought define depending on appending claims is as the criterion.
Claims (10)
1. a manufacture method for LED conducting wire frame, is characterized in that, comprises the following step:
One metal substrate is provided;
On this metal substrate, form a plurality of conductor area, and expect steathily hole in the relative both sides formation two of each conductor area;
In each this conductor area, form an insulation colloid; And
When to each this conductor area punching press, from relative two side direction of each this conductor area, this two expects that hole pushes steathily, each this conductor area is departed from, to obtain a plurality of LED conducting wire frames from this metal substrate.
2. the manufacture method of LED conducting wire frame according to claim 1, is characterized in that, this insulation colloid is thermoplasticity colloid or thermosetting colloid.
3. the manufacture method of LED conducting wire frame according to claim 1, is characterized in that, this insulation colloid is to be formed in each this conductor area with injection molding method.
4. the manufacture method of LED conducting wire frame according to claim 1, it is characterized in that, two relative the first sides of each this conductor area are other to be formed this and two expects steathily hole, two the second relative side sides of each this conductor area form two perforates, and the length of this of each this conductor area the first side is greater than the length of this second side.
5. the manufacture method of LED conducting wire frame according to claim 4, is characterized in that, each this expect that steathily Kong Weiyi strip expects hole steathily, this strip expects that the length in hole is more than or equal to the length of this first side of each this conductor area steathily.
6. a LED conducting wire frame structure, is characterized in that, comprises:
One metal substrate, has a plurality of conductor area, and the relative both sides of each conductor area form two and expect steathily hole;
A plurality of insulation colloids, are formed in described a plurality of conductor area.
7. LED conducting wire frame structure according to claim 6, is characterized in that, this insulation colloid is thermoplasticity colloid or thermosetting colloid.
8. LED conducting wire frame structure according to claim 6, is characterized in that, this insulation colloid is to be formed in each this conductor area with injection molding method.
9. LED conducting wire frame structure according to claim 6, it is characterized in that, two relative the first sides of each this conductor area are other to be formed this and two expects steathily hole, two the second relative side sides of each this conductor area form two perforates, and the length of this of each this conductor area the first side is greater than the length of this second side.
10. LED conducting wire frame structure according to claim 9, is characterized in that, each this expect that steathily Kong Weiyi strip expects hole steathily, this strip expects that the length in hole is more than or equal to the length of this first side of each this conductor area steathily.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210250689.4A CN103579470A (en) | 2012-07-19 | 2012-07-19 | Light emitting diode lead frame structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210250689.4A CN103579470A (en) | 2012-07-19 | 2012-07-19 | Light emitting diode lead frame structure and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN103579470A true CN103579470A (en) | 2014-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210250689.4A Pending CN103579470A (en) | 2012-07-19 | 2012-07-19 | Light emitting diode lead frame structure and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9954151B2 (en) | 2015-11-30 | 2018-04-24 | Nichia Corporation | Package, package intermediate body, light emitting device, method for manufacturing same |
| US10079332B2 (en) | 2015-12-09 | 2018-09-18 | Nichia Corporation | Package manufacturing method, light emitting device manufacturing method, package, and light emitting device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6756658B1 (en) * | 2001-04-06 | 2004-06-29 | Amkor Technology, Inc. | Making two lead surface mounting high power microleadframe semiconductor packages |
| TWM337849U (en) * | 2008-03-11 | 2008-08-01 | Jentech Prec Ind Co Ltd | Lead frame |
| US20120025361A1 (en) * | 2010-07-27 | 2012-02-02 | Kenichi Ito | Semiconductor device, lead frame assembly, and method for fabricating the same |
| CN202797084U (en) * | 2012-07-19 | 2013-03-13 | 特新光电科技股份有限公司 | Lead frame structure of light emitting diode |
-
2012
- 2012-07-19 CN CN201210250689.4A patent/CN103579470A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6756658B1 (en) * | 2001-04-06 | 2004-06-29 | Amkor Technology, Inc. | Making two lead surface mounting high power microleadframe semiconductor packages |
| TWM337849U (en) * | 2008-03-11 | 2008-08-01 | Jentech Prec Ind Co Ltd | Lead frame |
| US20120025361A1 (en) * | 2010-07-27 | 2012-02-02 | Kenichi Ito | Semiconductor device, lead frame assembly, and method for fabricating the same |
| CN202797084U (en) * | 2012-07-19 | 2013-03-13 | 特新光电科技股份有限公司 | Lead frame structure of light emitting diode |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9954151B2 (en) | 2015-11-30 | 2018-04-24 | Nichia Corporation | Package, package intermediate body, light emitting device, method for manufacturing same |
| US10580947B2 (en) | 2015-11-30 | 2020-03-03 | Nichia Corporation | Package and package intermediate body |
| US10079332B2 (en) | 2015-12-09 | 2018-09-18 | Nichia Corporation | Package manufacturing method, light emitting device manufacturing method, package, and light emitting device |
| US10490705B2 (en) | 2015-12-09 | 2019-11-26 | Nichia Corporation | Package and light emitting device |
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Application publication date: 20140212 |