CN103577811B - Electronic device with fingerprint recognition module and manufacturing method of the electronic device - Google Patents
Electronic device with fingerprint recognition module and manufacturing method of the electronic device Download PDFInfo
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- CN103577811B CN103577811B CN201310572209.0A CN201310572209A CN103577811B CN 103577811 B CN103577811 B CN 103577811B CN 201310572209 A CN201310572209 A CN 201310572209A CN 103577811 B CN103577811 B CN 103577811B
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Abstract
The invention discloses an electronic device with a fingerprint recognition module and a manufacturing method of the electronic device. The electronic device comprises a first substrate and a second substrate, wherein the first substrate and the second substrate are oppositely arranged. The first substrate comprises a display area, a non-display area, a display module and the fingerprint recognition module, wherein the display module is arranged between the display area and the second substrate, and the fingerprint recognition module is arranged between the non-display area and the second substrate. The fingerprint recognition module comprises fingerprint recognition inductor arrays and touch induction terminal arrays, wherein the fingerprint recognition inductor arrays are arranged on the non-display area, the touch induction terminal arrays are arranged on the surface of the second substrate and correspond to the fingerprint recognition inductor arrays, and the fingerprint recognition inductor arrays and the touch induction terminal arrays are correspondingly communicated in a one-to-one mode. According to the electronic device and the manufacturing method, the fingerprint recognition function of the electronic device can be achieved without the requirement for punching.
Description
Technical field
A kind of the present invention relates to fingerprint identification technology field, more particularly, it relates to electronics with fingerprint identification module
Equipment and preparation method thereof.
Background technology
This part is it is intended that the embodiments of the present invention stated in claims provide background or context.Herein
Description may include the concept that can probe into, but the concept having contemplated that or having probed into before being not necessarily.Therefore, unless
This points out, otherwise the content described in this part is not existing skill for the description and claims of this application
Art, and not because including just recognizing to be prior art in this part.
Development with mobile communications network and application software abundant, mobile phone has become the development trend of mobile terminal.
Mobile phone is equipped with the operating system that abundant hardware interface can be open, has provided the user the powerful information processing of One function
Platform, therefore mobile phone are not only a call instrument, it is also possible that GPS device, high-definition camera, game machine,
Web entrance etc..More precisely, it or a palm PC being connected with the Internet.
Due to the above-mentioned functions of mobile phone, storage personal information, associated person information, photo, video therefore on mobile phone, or even
Also have sensitive information of some enterprises etc., be very common situation, and guarantee that above- mentioned information is most important safely, so mobile phone
Encryption Design become the important measures of one of current phone safe design.Fingerprint recognition cipher mode is with its security reliability
Height, becomes a kind of main implementation of mobile phone cipher design.
For making mobile phone have fingerprint identification function, prior art is to adopt LGA（Land Grid Array, grid array
Encapsulation）Encapsulation technology, fingerprint recognition chip of directly fitting on mobile phone backboard, then directly in the Home key of hand-set lid（Main
Menu key）Position punching exposes touch-control sensing region, so that described fingerprint recognition chip can carry out fingerprint detection.But for tactile
Control mobile phone, its cover plate is to touch cover-plate glass, and not punching in Home key position, is directly to carry out touch-control control by touch cover
's.Therefore, such as why not punch and realize the fingerprint identification function of mobile phone, be one of current phone design urgently to be resolved hurrily asking
Topic.
Content of the invention
For solving above-mentioned technical problem, the present invention provides a kind of electronic equipment with fingerprint identification module and its making side
Method, need not punch and can achieve the fingerprint identification function of electronic equipment.
For achieving the above object, the present invention provides following technical scheme：
A kind of electronic equipment with fingerprint identification module, this electronic equipment includes：
The first substrate being oppositely arranged and second substrate, described first substrate includes：Viewing area and non-display area；
Be arranged on the display module between described viewing area and described second substrate and be arranged on described non-display area with
Fingerprint identification module between described second substrate；
Wherein, described fingerprint identification module includes：It is arranged on the fingerprint Identification sensor array of described non-display area；Setting
In the described second substrate surface touch-control sensing array of terminals corresponding with described fingerprint Identification sensor array, described touch-control sense
Array of terminals is answered to correspond conducting with described fingerprint Identification sensor array.
Preferably, in above-mentioned electronic equipment, described display module includes：Pointing to described second by described first substrate
The tft array that sets gradually on orientation substrate, liquid crystal layer, color membrane substrates, wherein, described color membrane substrates include：Color filter film；
It is arranged on the 3rd substrate between described color filter film and described second substrate.
Preferably, in above-mentioned electronic equipment, described touch-control sensing array of terminals and described fingerprint Identification sensor array
Between setting anisotropic conductive material so that described touch-control sensing array of terminals and described fingerprint Identification sensor array one by one
Corresponding conducting.
Preferably, in above-mentioned electronic equipment, described anisotropic conductive material is elastomer connector.
Preferably, in above-mentioned electronic equipment, the decoding integrated circuit of described fingerprint identification module is arranged on described non-aobvious
Show area and deviate from the side of described display module positioned at described fingerprint identification module.
Preferably, in above-mentioned electronic equipment, the decoding integrated circuit of described fingerprint identification module is arranged on described second
Substrate surface and deviate from the side of described display module positioned at described fingerprint identification module.
Present invention also offers a kind of manufacture method of the electronic equipment with fingerprint identification module, described fingerprint recognition mould
Block includes fingerprint Identification sensor array and touch-control sensing array of terminals, and this manufacture method includes：
Form display module in the viewing area of first substrate, form fingerprint Identification sensor in the non-display area of first substrate
Array；
Form touch-control sensing array of terminals, described touch-control sensing in the second substrate position relative with described non-display area
Array of terminals is corresponding with described fingerprint Identification sensor array；
Described first substrate is fitted with described second substrate, described touch-control sensing array of terminals is passed with described fingerprint recognition
Sensor array corresponds conducting.
Preferably, in the above-mentioned methods, the described viewing area in first substrate forms display module, non-in first substrate
The fingerprint Identification sensor array that viewing area forms fingerprint identification module includes：
Tft array is set in described viewing area, meanwhile, forms described fingerprint Identification sensor battle array in described non-display area
Row；
Liquid crystal layer is arranged on described tft array；
Color membrane substrates are set on the liquid crystal layer, and described color membrane substrates include：3rd substrate and be arranged on described
Color filter film between three substrates and described liquid crystal layer.
Preferably, in the above-mentioned methods, before described first substrate is fitted with described second substrate, in described fingerprint
On identification sensor array, anisotropic conductive material is set, when described first substrate is fitted with described second substrate, passes through
Described anisotropic conductive material makes described touch-control sensing array of terminals correspond with described fingerprint Identification sensor array
Conducting.
Preferably, in the above-mentioned methods, also include：On described first substrate surface, decoding integrated circuit, described solution are set
Code IC is located at the non-display area of described first substrate and deviates from described display module positioned at described fingerprint identification module
Side.
Preferably, in the above-mentioned methods, also include：On described second substrate surface, decoding integrated circuit, described solution are set
Code IC deviates from the side of described display module positioned at described fingerprint identification module.
From technique scheme as can be seen that technical solution of the present invention provides a kind of electronics with fingerprint identification module
Equipment and preparation method thereof, the fingerprint Identification sensor array of fingerprint identification module and touch-control sensing array of terminals are collected respectively
Become on the first substrate and second substrate of electronic equipment, when carrying out touch control operation to second substrate, need not punch can be real
The fingerprint identification function of existing electronic equipment.And during the described described electronic equipment in making, described fingerprint Identification sensor array can
With the display module above described first substrate same processes flow process prepare, described touch-control sensing array of terminals can with described
Touch-control circuit on second substrate same processes flow process prepare, with respect to using finished product fingerprint recognition chip direct package in electricity
Production method in sub- equipment, reduces cost, provides production efficiency simultaneously.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Have technology description in required use accompanying drawing be briefly described it should be apparent that, drawings in the following description be only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, acceptable
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of electronic equipment provided in an embodiment of the present invention；
Fig. 2 is the structural formula schematic diagram of another kind electronic equipment provided in an embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation description is it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of not making creative work
Embodiment, broadly falls into the scope of protection of the invention.
Embodiment one
Present embodiments provide a kind of electronic equipment with fingerprint identification module, with reference to Fig. 1, described electronic equipment bag
Include：First substrate 1, second substrate 2, display module and fingerprint identification module.
Wherein, described first substrate 1 and second substrate 2 are oppositely arranged, and described display module and fingerprint identification module set
Put between described first substrate 1 and second substrate 2.Described first substrate 1 includes viewing area and non-display area.
Described fingerprint identification module includes：It is arranged on the fingerprint Identification sensor array 31 of described non-display area；It is arranged on
The described second substrate 2 surface touch-control sensing array of terminals 32 corresponding with described fingerprint Identification sensor array 31, described tactile
Control sensing array of terminals 32 is turned on described fingerprint Identification sensor array 31.Wherein, described fingerprint Identification sensor array 31
Including multiple TFT transistors.Described touch-control sensing array of terminals 32 includes multiple sense contact, described in described TFT transistor AND gate
Sense contact corresponds, and described touch-control sensing array of terminals 32 and described fingerprint Identification sensor array 31 turn on as described
The corresponding sense contact of TFT transistor AND gate turns on, and not corresponding TFT transistor AND gate sense contact is not turned on.
Described electronic equipment is by the fingerprint Identification sensor array 31 of fingerprint identification module and touch-control sensing array of terminals
2 on 32 first substrates 1 being integrated in electronic equipment respectively and second substrate, when touch control operation is carried out to second substrate 2, need not
Punching achieves that the fingerprint identification function of electronic equipment.And during the described described electronic equipment in making, described fingerprint recognition passes
Sensor array 31 can be prepared in same processes flow process with the display module of described first substrate 1 top, described touch-control sensing terminal
Array 32 can be prepared in same processes flow process with the touch-control circuit on described second substrate 2, knows with respect to using finished product fingerprint
Production method in electronic equipment for the other chip direct package, reduces cost, provides production efficiency simultaneously.
In the present embodiment, described display module can be liquid crystal indicator, and described liquid crystal indicator includes：Setting
Tft array 41 on described first substrate 1, is arranged on the liquid crystal layer 42 on described tft array 41, is arranged on described liquid crystal layer
Color filter film 43 on 42 and be arranged on the 3rd substrate 44 on described color filter film.
Wherein, described tft array 41 and described first substrate constitute TFT substrate, described color filter film 43 and described the
Three substrate 44 constitutes color membrane substrates.Described Liquid Crystal Module surrounding is sealed using fluid sealant 45.
The fingerprint Identification sensor array 31 of fingerprint identification module is TFT transistor arrangement, is integrated in first substrate 1
On can be prepared using the process flow of sample with the tft array 41 of liquid crystal indicator simultaneously, save the processing technology time and
Cost.
In the present embodiment, using being arranged on described fingerprint Identification sensor array 31 and touch-control sensing array of terminals 32
Between anisotropic conductive material 33 realize between described fingerprint Identification sensor array 31 and touch-control sensing array of terminals 32
Conducting.Described anisotropic conductive material 33 can be elastomer connector（Also known as zebra bar）.
As shown in figure 1, the decoding integrated circuit 51 of described fingerprint identification module can be arranged on the non-of described first substrate 1
Viewing area and deviate from the side of described display module positioned at described fingerprint identification module.Described decoding integrated circuit 51 passes through to set
The conducting wire put on described first substrate is turned on described fingerprint Identification sensor array 31, described decoding integrated circuit 51
Mainboard by flexible circuit board 52 and electronic equipment（Not shown in Fig. 1）Carry out signal transmission.With reference to Fig. 2, in the present embodiment
Other embodiment in, described decoding integrated circuit 51 and described flexible circuit board 52 can be arranged on described second substrate 2
Surface, and deviate from the side of described display module positioned at described fingerprint identification module.
Prior art, in order to have fingerprint identification function, needs directly whole fingerprint recognition chip to be directly fitted in electronics
On the base plate of equipment（First substrate）And it needs to cover plate（Second substrate）Punching, to expose touching of described fingerprint recognition chip
Control area.And punch position fixes, it is electronic equipment Home key position.
Electronic equipment described in the present embodiment is touch-controlled electronic devices, and described second substrate is the touch surface of described electronic equipment
Plate.Fingerprint identification module is integrated between first substrate and second substrate electronic equipment described in the present embodiment, directly with described
First substrate, as the touch-control sensing panel of described fingerprint identification module, need not punch.
And in the present embodiment, described fingerprint identification module installation site is not limited to the Home key position of electronic equipment,
The arbitrary region of the non-display area being not provided with display module can be arranged on, that is, fingerprint recognition region is not limited only to electronic equipment
Home key position.
Meanwhile, in the present embodiment, the fingerprint Identification sensor array of described fingerprint identification module and touch-control sensing end
Subarray can be integrated on described first substrate and second substrate respectively, increased integrated level, described fingerprint Identification sensor
Array can be in backboard（Including first substrate and integrated functional structure on the first substrate）Prepare in manufacturing process, institute simultaneously
Stating touch-control sensing array of terminals can be in contact panel（Including second substrate and be integrated in the functional structure on second substrate）System
Prepare during work simultaneously, individually need not be fitted again fingerprint recognition chip using single LGA package technique, improve making effect
Rate simultaneously reduces cost.
Embodiment two
Present embodiments provide a kind of manufacture method of the electronic equipment with fingerprint identification module, described fingerprint recognition mould
Block includes fingerprint Identification sensor array and touch-control sensing array of terminals.
When preparing described electronic equipment, need to form display module and fingerprint Identification sensor battle array on the first substrate
Row, form the touch-control sensing array of terminals corresponding with described fingerprint Identification sensor array on second substrate.Then, by institute
State first substrate to fit with described second substrate.Described touch-control sensing array of terminals and described fingerprint Identification sensor battle array after laminating
Row correspond conducting.
Form display module and fingerprint Identification sensor array on the first substrate to be formed and institute with second substrate
State fingerprint Identification sensor array two processes of corresponding touch-control sensing array of terminals can individually to carry out respectively, no priority
Point.
Described display module is formed at the viewing area of described first substrate, and described fingerprint Identification sensor array is formed at institute
State the non-display area of first substrate.The sensor construction that described fingerprint Identification sensor array is constituted for TFT transistor array, its
The electrode being located on described first substrate with described display module is prepared simultaneously.
As being liquid crystal indicator to described display module（The structure of described liquid crystal indicator and above-described embodiment phase
With）Electronic equipment, prepared by described first substrate liquid crystal indicator TFT electrode when, need in described first base
The viewing area of plate forms tft array, now, can form described fingerprint recognition sensing in the non-display area of described first substrate simultaneously
Device array.Because TFT electrode and described fingerprint Identification sensor array are TFT structure, can be made using TFT preparation technology simultaneously
Standby, that is, described fingerprint Identification sensor array need not be using the preparation of single process flow, increase process flow that need not be extra.
After described first substrate forms tft array and described fingerprint identification module, only need to set on described tft array
Put liquid crystal layer, color membrane substrates are set on the liquid crystal layer.Described color membrane substrates include：3rd substrate and be arranged on described
Color filter film between three substrates and described liquid crystal layer.
Form touch-control sensing array of terminals, described touch-control in the described second substrate position relative with described non-display area
Sensing array of terminals is corresponding with described fingerprint Identification sensor array.Described second substrate is the touch surface of described electronic equipment
Plate, including the touch control electrode realizing touch controllable function.Described touch-control sensing array of terminals is the touch-control electricity of described fingerprint identification module
Pole, so described touch-control sensing array of terminals can be prepared using same process with the touch control electrode of described second substrate simultaneously,
Technological process that need not be extra and process time.
Before above-mentioned first substrate and second substrate are fitted, need in described fingerprint Identification sensor array
Upper setting anisotropic conductive material, so that so that institute after carrying out fitting by above-mentioned first substrate and second substrate
State touch-control sensing array of terminals and correspond conducting with described fingerprint Identification sensor array.
Above-mentioned manufacture method also includes：On described first substrate or on second substrate, described fingerprint identification module is set
Decoding integrated circuit.
When described decoding integrated circuit is arranged on described first substrate, need formation on described first substrate described
After fingerprint Identification sensor array, decoding integrated circuit is set on described first substrate surface, described decoding integrated circuit is located at
The non-display area of described first substrate, and after described first substrate is fitted with described second substrate, described decoding integrated circuit
Deviate from the side of described display module positioned at described fingerprint identification module.
When described decoding integrated circuit is arranged on described second substrate, need to be formed touch-control on described second substrate
After sensing array of terminals, decoding integrated circuit is set on described second substrate surface, and described first substrate and described second base
After plate laminating, described decoding integrated circuit deviates from the side of described display module positioned at described fingerprint identification module.
It should be noted that the description of the inventive method embodiment and device embodiment emphasizes particularly on different fields a little, related, similar it
Place can mutually reference.The electronic equipment prepared by above-mentioned manufacture method is as shown in Figure 1 or 2.Electricity described in the embodiment of the present invention
Sub- equipment includes but is not limited to the electronic product such as mobile phone, panel computer.
By said method, manufacture method described in the present embodiment, the work of laminating fingerprint recognition chip that need not be extra
Skill, the fingerprint identification module with fingerprint recognition chip with identical function is integrated in described electronic equipment, and described fingerprint is known
The functional structure of other module can make the other structures preparation of described electronic equipment, improve make efficiency, reduce system
Make cost.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation are made a distinction with another entity or operation, and not necessarily require or imply these entities or deposit between operating
In any this actual relation or order.The verb " inclusion " that refers in application documents, "comprising" and its paradigmatic
Presence using those elements described in being not excluded for except application documents or the element in addition to step or step.Hat before element
Word "a" or "an" is not excluded for the presence of multiple this elements.
Although describe spirit and principles of the present invention by reference to some specific embodiments it should be appreciated that, this
Invention is not limited to disclosed specific embodiment, and the division to each side does not mean that the feature in these aspects can not yet
Combination to be benefited, this divide merely to statement convenience.It is contemplated that cover claims spirit and
In the range of included various modifications and equivalent arrangements.Scope of the following claims meets broadest explanation, thus comprising
All such modifications and equivalent structure and function.
Claims (11)
1. a kind of electronic equipment with fingerprint identification module is it is characterised in that include：
The first substrate being oppositely arranged and second substrate, described first substrate includes：Viewing area and non-display area；
Be arranged on the display module between described viewing area and described second substrate and be arranged on described non-display area with described
Fingerprint identification module between second substrate；
Wherein, described fingerprint identification module includes：It is arranged on the fingerprint Identification sensor array of described non-display area；It is arranged on institute
State the second substrate surface touch-control sensing array of terminals corresponding with described fingerprint Identification sensor array, described touch-control sensing end
Subarray corresponds conducting with described fingerprint Identification sensor array；
Described fingerprint Identification sensor array includes multiple TFT transistors, and described touch-control sensing array of terminals includes multiple sensings
Contact, sense contact described in described TFT transistor AND gate corresponds, the corresponding sense contact conducting of described TFT transistor AND gate.
2. electronic equipment according to claim 1 is it is characterised in that described display module includes：By described first base
Plate points to the tft array setting gradually on described second substrate direction, liquid crystal layer, color membrane substrates, wherein, described color membrane substrates bag
Include：Color filter film；It is arranged on the 3rd substrate between described color filter film and described second substrate.
3. electronic equipment according to claim 1 is it is characterised in that described touch-control sensing array of terminals is known with described fingerprint
Setting anisotropic conductive material between individual sensor array is so that described touch-control sensing array of terminals is passed with described fingerprint recognition
Sensor array corresponds conducting.
4. electronic equipment according to claim 3 is it is characterised in that described anisotropic conductive material connects for conductive rubber
Connect device.
5. electronic equipment according to claim 1 is it is characterised in that the decoding integrated circuit of described fingerprint identification module sets
Put the side deviating from described display module in described non-display area and positioned at described fingerprint identification module.
6. electronic equipment according to claim 1 is it is characterised in that the decoding integrated circuit of described fingerprint identification module sets
Put the side deviating from described display module on described second substrate surface and positioned at described fingerprint identification module.
7. a kind of manufacture method of the electronic equipment with fingerprint identification module is it is characterised in that described fingerprint identification module bag
Include fingerprint recognition inductor array and touch-control sensing array of terminals, described manufacture method includes：
Form display module in the viewing area of first substrate, form fingerprint recognition induction apparatuss battle array in the non-display area of first substrate
Row；
Form touch-control sensing array of terminals, described touch-control sensing terminal in the second substrate position relative with described non-display area
Array is corresponded with described fingerprint recognition inductor array；
Described first substrate is fitted with described second substrate, described touch-control sensing array of terminals and described fingerprint recognition induction apparatuss
Array corresponds conducting；
Wherein, described fingerprint Identification sensor array includes multiple TFT transistors, and described touch-control sensing array of terminals includes multiple
Sense contact, sense contact described in described TFT transistor AND gate corresponds, and the corresponding sense contact of described TFT transistor AND gate is led
Logical.
8. manufacture method according to claim 7 is it is characterised in that the described viewing area in first substrate forms display mould
Block, the fingerprint recognition inductor array forming fingerprint identification module in the non-display area of first substrate includes：
Tft array is set in described viewing area, meanwhile, forms described fingerprint recognition inductor array in described non-display area；
Liquid crystal layer is arranged on described tft array；
Color membrane substrates are set on the liquid crystal layer, and described color membrane substrates include：3rd substrate and be arranged on described 3rd base
Color filter film between plate and described liquid crystal layer.
9. manufacture method according to claim 7 it is characterised in that pasting described first substrate with described second substrate
Before conjunction, anisotropic conductive material is arranged on described fingerprint recognition inductor array, by described first substrate and described the
During two baseplate-laminatings, described touch-control sensing array of terminals and described fingerprint recognition sense are made by described anisotropic conductive material
Device array is answered to correspond conducting.
10. manufacture method according to claim 7 is it is characterised in that also include：On described first substrate surface, solution is set
Code IC, described decoding integrated circuit is located at the non-display area of described first substrate and is located at described fingerprint recognition mould
Block deviates from the side of described display module.
11. manufacture methods according to claim 7 are it is characterised in that also include：On described second substrate surface, solution is set
Code IC, described decoding integrated circuit deviates from the side of described display module positioned at described fingerprint identification module.
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| CN201310572209.0A CN103577811B (en) | 2013-11-15 | 2013-11-15 | Electronic device with fingerprint recognition module and manufacturing method of the electronic device |
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| CN201310572209.0A CN103577811B (en) | 2013-11-15 | 2013-11-15 | Electronic device with fingerprint recognition module and manufacturing method of the electronic device |
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| CN103577811B true CN103577811B (en) | 2017-02-15 |
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| CN104143092B (en) * | 2014-08-26 | 2017-11-21 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition detecting element and its application method, electronic installation |
| CN105786102A (en) * | 2014-12-26 | 2016-07-20 | 上海箩箕技术有限公司 | Mobile terminal with fingerprint recognition system |
| CN104794428B (en) * | 2015-03-06 | 2019-03-12 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and terminal device |
| CN104751129A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
| CN104751135A (en) * | 2015-03-06 | 2015-07-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device, touch screen and electronic equipment |
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| CN104700079A (en) * | 2015-03-06 | 2015-06-10 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition module and touch screen based on fingerprint recognition |
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