CN103574386A - Light-emitting diode backlight module - Google Patents
Light-emitting diode backlight module Download PDFInfo
- Publication number
- CN103574386A CN103574386A CN201210254584.6A CN201210254584A CN103574386A CN 103574386 A CN103574386 A CN 103574386A CN 201210254584 A CN201210254584 A CN 201210254584A CN 103574386 A CN103574386 A CN 103574386A
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- light
- backlight module
- substrate
- emitting diode
- led
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Abstract
A light-emitting diode backlight module comprises a back plate and a plurality of light-emitting diodes arranged on the back plate. Each light-emitting diode comprises a substrate, a first electrode and a second electrode which are arranged on the substrate, a light-emitting diode grain electrically connected with the first electrode and the second electrode and arranged on the substrate and a packaging layer. The packaging layer directly clings to the surface of the light-emitting diode grain and the surface of the substrate. The thickness is smaller than or equal to 2mum. Due to the fact that the light-emitting diodes do not have reflection cup structures, the packaging layer directly clings to the surface of the light-emitting diode grain and the surface of the substrate, the thickness is smaller than or equal to 2mum, the thickness of the light-emitting diode backlight module is reduced, and the light-emitting diode backlight module can be thinner.
Description
Technical field
The present invention relates to a kind of LED backlight module.
Background technology
Because liquid crystal display has the advantages such as light, thin, power consumption is little, be widely used in the modernization information equipments such as notebook, mobile phone, personal digital assistant.Because liquid crystal itself does not have the characteristics of luminescence, therefore need to provide backlight module to realize Presentation Function for it.
Generally common backlight module comprises a backboard and is located at the some light emitting diodes on this backboard, and this backboard is tabular, and light emitting diode is array-like and is fixed on this backboard.For single light emitting diode wherein, can be provided with reflector structure, light-emitting diode chip for backlight unit is set in reflector and fills fluorescence coating, the light fluorescence excitation layer that light-emitting diode chip for backlight unit sends produces white light.But such structure easily causes backlight module thickness larger, thereby cannot meet the slimming requirement of liquid crystal display.
Summary of the invention
In view of this, be necessary to provide a kind of LED backlight module of slimming.
A module, comprises backboard and is arranged on a plurality of light emitting diodes on this backboard.Each light emitting diode comprises substrate, be arranged on the first electrode and the second electrode on this substrate, be arranged on this substrate and the LED crystal particle and the encapsulated layer that are electrically connected to the first electrode and the second electrode.Encapsulated layer is directly attached to the surface of LED crystal particle and the surface of substrate, and its thickness is less than or equal to 2 μ m.
In each light emitting diode of above-mentioned LED backlight module, do not there is reflector structure, encapsulated layer is to be directly attached to the surface of LED crystal particle and the surface of substrate, thickness is less than or equal to 2 μ m, thereby reduced the thickness of described LED backlight module, can realize the slimming of described LED backlight module.
Accompanying drawing explanation
Fig. 1 is the top view of the LED backlight module in embodiment of the present invention.
Fig. 2 is the light emitting diode sectional view in the LED backlight module in Fig. 1.
Main element symbol description
| LED backlight module | 100 |
| Backboard | 10 |
| Light emitting diode | 20 |
| |
21 |
| The |
22 |
| The |
23 |
| |
24 |
| Encapsulated |
25 |
| |
211 |
| |
212 |
| |
213 |
The following specific embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Refer to Fig. 1, a kind of LED backlight module 100 that embodiment of the present invention provides comprises a backboard 10, is arranged on a plurality of light emitting diodes 20 on this backboard 10.
Described backboard 10 is rectangular, and described a plurality of light emitting diodes 20 comprise red light-emitting diode, green light LED and blue light-emitting diode, and this Tricolor LED is interlaced and be array-like and be fixed on this backboard 10, and mixed light forms white light.Space D between described light emitting diode 20 is less than the length of light emitting diode 20 own, to improve the resolution of display unit.Described backboard 10 is preferably made with thermally conductive materials, as metal or pottery etc., so that distribute the heat that light emitting diode 20 produces.
Refer to Fig. 2, described each light emitting diode 20 comprises substrate 21, the first electrode 22, the second electrode 23, LED crystal particle 24 and encapsulated layer 25.
Described substrate 21 comprises end face 211, the bottom surface 212 relative with this end face 211 and the side 213 that connects end face 211 and bottom surface 212.Described the first electrode 22 and the second electrode 23 spaces, and one end is arranged on the end face 211 of substrate 21, and the other end is extended on the bottom surface 212 of substrate 21 by the side 213 of substrate 21.LED crystal particle 24 chip packages, on the end face of substrate 21, are electrically connected to the first electrode 22 and the second electrode 23.Encapsulated layer 25 is attached to the surface of LED crystal particle 24 and the surface of substrate 21 in vacuum abutted mode, and its thickness is less than or equal to 2 μ m.In the present embodiment, the transparent material that described encapsulated layer 25 is high heat conduction, such as being silicon rubber or epoxy resin etc., and the refractive index of encapsulated layer 25 is less than the refractive index of LED crystal particle 24, to increase the light extraction yield of LED crystal particle 24.
In use, described a plurality of light emitting diode 20 mixed lights produce white light, for liquid crystal display provides light source.Each light emitting diode 20 does not have reflector structure, encapsulated layer 25 is to be directly attached to the surface of LED crystal particle 24 and the surface of substrate 21, thickness is less than or equal to 2 μ m, thereby reduced the thickness of described LED backlight module 100, can realize the slimming of described LED backlight module 100.In addition, due to the thinner thickness of encapsulated layer 25, the heat that LED crystal particle 24 produces can directly be delivered to outside by this encapsulated layer 25, has improved the radiating efficiency of described LED backlight module 100.And because the space D between described light emitting diode 20 is less than the length of light emitting diode 20 own, thereby can also improve the resolution of display unit.
Compared to prior art, in each light emitting diode of LED backlight module of the present invention, do not there is reflector structure, encapsulated layer is to be directly attached to the surface of LED crystal particle and the surface of substrate, thickness is less than or equal to 2 μ m, thereby reduced the thickness of described LED backlight module, can realize the slimming of described LED backlight module.
Be understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change and distortion all should belong to the protection domain of the claims in the present invention.
Claims (8)
1. a LED backlight module, comprise backboard and be arranged on a plurality of light emitting diodes on this backboard, each light emitting diode comprises substrate, be arranged on the first electrode and the second electrode on this substrate, be arranged on this substrate and the LED crystal particle and the encapsulated layer that are electrically connected to the first electrode and the second electrode, it is characterized in that: encapsulated layer is directly attached to the surface of LED crystal particle and the surface of substrate, its thickness is less than or equal to 2 μ m.
2. LED backlight module as claimed in claim 1, is characterized in that: described encapsulated layer is to be attached to the surface of LED crystal particle and the surface of substrate in vacuum abutted mode.
3. LED backlight module as claimed in claim 1, is characterized in that: described encapsulated layer is the transparent material of the high heat conduction of silicon rubber or epoxy resin.
4. LED backlight module as claimed in claim 1, is characterized in that: the refractive index of described encapsulated layer is less than the refractive index of LED crystal particle, to increase the light extraction yield of LED crystal particle.
5. LED backlight module as claimed in claim 1, it is characterized in that: described a plurality of light emitting diodes comprise red light-emitting diode, green light LED and blue light-emitting diode, this Tricolor LED is interlaced and be array-like and be fixed on this backboard, and mixed light forms white light.
6. LED backlight module as claimed in claim 5, is characterized in that: the spacing between described light emitting diode is less than the length of light emitting diode itself, to improve the resolution of display unit.
7. LED backlight module as claimed in claim 1, is characterized in that: described backboard selects metal or ceramic material to make.
8. LED backlight module as claimed in claim 1, is characterized in that: described the first electrode and the second electrode space, and one end is arranged on the end face of substrate, and the other end is extended on the bottom surface of substrate by the side of substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210254584.6A CN103574386A (en) | 2012-07-23 | 2012-07-23 | Light-emitting diode backlight module |
| TW101129297A TW201405215A (en) | 2012-07-23 | 2012-08-14 | Backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210254584.6A CN103574386A (en) | 2012-07-23 | 2012-07-23 | Light-emitting diode backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103574386A true CN103574386A (en) | 2014-02-12 |
Family
ID=50046776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210254584.6A Pending CN103574386A (en) | 2012-07-23 | 2012-07-23 | Light-emitting diode backlight module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103574386A (en) |
| TW (1) | TW201405215A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110456572A (en) * | 2019-08-28 | 2019-11-15 | 合肥京东方光电科技有限公司 | A kind of lamp plate and preparation method thereof, backlight module and liquid crystal display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118340A (en) * | 2006-07-06 | 2008-02-06 | 亿光电子工业股份有限公司 | Configuring matrix device of primitive colours LED |
| CN101165515A (en) * | 2006-10-18 | 2008-04-23 | 财团法人工业技术研究院 | Light conductive board and the backlight module possessing same |
| CN101324305A (en) * | 2007-06-15 | 2008-12-17 | 统宝光电股份有限公司 | Light-emitting diode arrays and methods of manufacture |
| TW200923903A (en) * | 2007-11-16 | 2009-06-01 | Acer Inc | Liquid crystal display with LED backlight unit and light correcting unit |
| US20090179207A1 (en) * | 2008-01-11 | 2009-07-16 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
| CN201314475Y (en) * | 2008-11-11 | 2009-09-23 | 康佳集团股份有限公司 | LED array of LED backlight module |
-
2012
- 2012-07-23 CN CN201210254584.6A patent/CN103574386A/en active Pending
- 2012-08-14 TW TW101129297A patent/TW201405215A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118340A (en) * | 2006-07-06 | 2008-02-06 | 亿光电子工业股份有限公司 | Configuring matrix device of primitive colours LED |
| CN101165515A (en) * | 2006-10-18 | 2008-04-23 | 财团法人工业技术研究院 | Light conductive board and the backlight module possessing same |
| CN101324305A (en) * | 2007-06-15 | 2008-12-17 | 统宝光电股份有限公司 | Light-emitting diode arrays and methods of manufacture |
| TW200923903A (en) * | 2007-11-16 | 2009-06-01 | Acer Inc | Liquid crystal display with LED backlight unit and light correcting unit |
| US20090179207A1 (en) * | 2008-01-11 | 2009-07-16 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
| CN201314475Y (en) * | 2008-11-11 | 2009-09-23 | 康佳集团股份有限公司 | LED array of LED backlight module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110456572A (en) * | 2019-08-28 | 2019-11-15 | 合肥京东方光电科技有限公司 | A kind of lamp plate and preparation method thereof, backlight module and liquid crystal display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201405215A (en) | 2014-02-01 |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140212 |