CN103560139A - Image sensor packaging structure and packaging method thereof - Google Patents
Image sensor packaging structure and packaging method thereof Download PDFInfo
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- CN103560139A CN103560139A CN201310585564.1A CN201310585564A CN103560139A CN 103560139 A CN103560139 A CN 103560139A CN 201310585564 A CN201310585564 A CN 201310585564A CN 103560139 A CN103560139 A CN 103560139A
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Abstract
Disclosed are an image sensor packaging structure and a packaging method of the image sensor packaging structure. The packaging method comprises the steps of providing a first substrate, forming welding discs comprising a plurality of image sensing areas and a plurality of surrounding image sensing areas on the upper surface of the first substrate, providing a second substrate, forming a plurality of cavities in the second substrate, forming an adhesive tape film on the upper surface of the second substrate, conducting press fit on the lower surface of the second substrate and the upper surface of the first substrate to enable the image sensing areas to be located in the cavities, cutting and removing an adhesive tape film between adjacent cavities and the partial thickness of the second substrate, forming cavity walls of the surrounding image sensing areas and adhesive tape layers located in closed cavities in the top surfaces of the cavity walls, removing the remaining second substrate, arranged on the first substrate, between the cavities, exposing the surfaces of the welding discs, conducting segmentation on the first substrate to form single image sensor chips, and electrically connecting the welding discs on the image sensor chips with a circuit on a third substrate through wires. The method prevents the image sensing areas from being polluted or damaged.
Description
Technical field
The present invention relates to semiconductor packaging, particularly a kind of image sensor package and method for packing thereof.
Background technology
Image sensor is from object receiving optical signals and light signal is converted into the signal of telecommunication, the signal of telecommunication can be transmitted for further processing, such as digitlization, then in the memory device such as memory, CD or disk, store, or for showing on display etc.Image sensor is generally used for devices such as digital camera, video camera, scanner, facsimile machine.Image sensor generally includes charge coupled device (CCD) image sensor and CMOS image sensor (CIS, CMOS Image Sensor).Than CCD image sensor, CMOS image sensor has the advantages such as integrated level is high, power consumption is little, manufacturing cost is low.
Along with the size of image sensor is more and more less, weld pad number is on the increase, and weld pad spacing is more and more narrow, correspondingly, image sensor package is had higher requirement.
Encapsulation technology for image sensor dice has a variety of at present, chip on board (Chip on Board wherein, COB) encapsulation technology is because the properties of product of its encapsulation are reliable and stable, integrated level is high, small product size after encapsulation is little, and ease for use is strong, and product process flow is simple, the series of advantages such as cost is low of encapsulation are widely used a kind of in current image sensor dice encapsulation.
As shown in Figure 1, COB encapsulation is to adopt bonding agent or the method such as tape welding, wire bond, flip chip bonding automatically, image sensor dice 31 is directly mounted on circuit board 34, then realizes being electrically connected to of pad 32 in image sensor dice 31 and tie point on circuit board 34 by Wire Bonding Technology.Because image sensor dice 31 does not have protected device isolation in COB encapsulation process, therefore in the COB of image sensor dice encapsulation process, easily the video sensing district 33 of image sensor dice 31 is polluted or damaged.
Summary of the invention
The problem that the present invention solves is how to prevent that the chip in the encapsulation process of image sensor dice from polluting or damage, and improves the production efficiency of encapsulation.
For addressing the above problem, the invention provides a kind of method for packing of image sensor, comprising: first substrate is provided, and the upper surface of described first substrate is formed with some video sensings district and around the pad in described video sensing district; Second substrate is provided, in described second substrate, is formed with some cavitys; Upper surface at second substrate forms adhesive tape film, the opening of adhesive tape membrane closure cavity; The upper surface pressing ，Shi video sensing district of the lower surface of second substrate and first substrate is positioned to cavity; Adhesive tape film between cutting removal adjacent cavities and the second substrate of segment thickness, form around the cavity wall in described video sensing district and the adhesive tape layer that is positioned at cavity wall top surface enclosed cavity; Remove remaining second substrate material on the first substrate between cavity, expose the surface of pad; First substrate is cut apart, formed single image sensor dice; Pad in image sensor dice is electrically connected to by lead-in wire with the circuit on the 3rd substrate.
Optionally, the adhesive tape film between employing blade cuts removal adjacent cavities and the second substrate of segment thickness.
Optionally, the thickness that remains second substrate on the first substrate between described adjacent cavities is less than 20 microns.
Optionally, the material of described second substrate is resin.
Optionally, the material of described second substrate is glass, silicon or pottery.
Optionally, on described second substrate lower surface, be formed with adhesive layer, the upper surface of second substrate lower surface and first substrate is by adhesive layer pressing.
Optionally, the material of described adhesive layer is epoxide-resin glue, polyimides glue, benzocyclobutene glue or polybenzoxazoles glue.
Optionally, the process that forms cavity wall is: the adhesive layer of adhesive tape film, second substrate and segment thickness between adjacent cavities is removed in cutting, forms around the cavity wall in described video sensing district and the adhesive tape layer that is positioned at cavity wall top surface enclosed cavity; Etching is removed remaining adhesive layer on the first substrate between adjacent cavities, exposes the surface of pad.
Optionally, remove remaining second substrate material or adhesion-layer materials employing plasma dry degumming process on pad.
Optionally, described adhesive tape film is UV dispergation adhesive tape or pyrolysis glue adhesive tape.
Optionally, also comprise: on described adhesive tape film, form diaphragm; The second substrate of diaphragm, adhesive tape film and segment thickness between adjacent cavities is removed in cutting, forms cavity wall around described video sensing district, is positioned at the adhesive tape layer of cavity wall top surface enclosed cavity and is positioned at the protective layer on adhesive tape layer.
Optionally, the material of described diaphragm is photoresist.
Optionally, the formation technique of described diaphragm is spin coating proceeding, spraying coating process or film coating process.
The present invention also provides a kind of method for packing of image sensor, comprising: first substrate is provided, and the upper surface of described first substrate is formed with some video sensings district and around the pad in described video sensing district; Provide second substrate, by the upper surface pressing of second substrate lower surface and first substrate; The second substrate of segment thickness on pad is removed in cutting; Etching is removed remaining second substrate material on pad, exposes the surface of pad; First substrate is cut apart, formed single image sensor dice; Pad in image sensor dice is electrically connected to by lead-in wire with the circuit on the 3rd substrate.
Optionally, remove remaining second substrate material on pad and adopt plasma dry degumming process.
The present invention also provides a kind of encapsulating structure of image sensor, comprising: image sensor dice, has video sensing district and around the pad in described video sensing district on the upper surface of described image sensor dice; On the upper surface of the image sensor dice between cavity wall ， video sensing district and pad, cavity wall is around forming cavity in described video sensing district ， video sensing district; Adhesive tape layer, is positioned at the top surface of cavity wall, seals described cavity.The 3rd substrate, is formed with circuit on the 3rd substrate, the 3rd upper surface of substrate and the laminating of the lower surface of image sensor dice; Lead-in wire, is electrically connected to the pad in image sensor dice with the circuit on the 3rd substrate.
Optionally, the material of described cavity wall is resin.
Optionally, the material of described cavity wall is glass, silicon or pottery.
Optionally, between described cavity wall and first substrate, there is adhesive layer.
Optionally, the material of described adhesive layer is epoxide-resin glue, polyimides glue, benzocyclobutene glue or polybenzoxazoles glue.
Optionally, described adhesive tape layer is UV dispergation adhesive tape or pyrolysis glue adhesive tape.
Optionally, on described adhesive tape layer, also there is protective layer.
Optionally, the material of described protective layer is photoresist.
Compared with prior art, technical scheme of the present invention has the following advantages:
The method for packing of image sensor of the present invention, forms some video sensings district and around the pad in described video sensing district at the upper surface of first substrate; In described second substrate, be formed with some cavitys, at the upper surface formation adhesive tape film of second substrate; Then the upper surface pressing ，Shi video sensing district of the lower surface of second substrate and first substrate is positioned to top, video sensing district; Then the adhesive tape film between cutting removal adjacent cavities and the second substrate of segment thickness, form around the cavity wall in described video sensing district and the adhesive tape layer that is positioned at cavity wall top surface enclosed cavity; Remove remaining second substrate material on the first substrate between cavity, expose the surface of pad; First substrate is cut apart, formed single image sensor dice; Pad in image sensor dice is electrically connected to by lead-in wire with the circuit on the 3rd substrate.By forming cavity wall and adhesive tape layer, cavity wall and adhesive tape layer video sensing district is sealed, prevents that video sensing district is outside exposed, thereby in the encapsulation process of image sensor, the video sensing district that prevents image sensor is polluted or is damaged, and packaging efficiency improves.In addition, the mode by pressing, cutting forms cavity wall and adhesive tape layer, has prevented from adopting other formation technique to the damage in video sensing district and pollution.
Further, adopt blade cuts to remove the second substrate of described adhesive tape film and segment thickness, than dry method or wet-etching technology, employing blade cuts process efficiency is high, technique simple, it is little to pollute, and adopt blade cuts technique without forming mask layer, can prevent from forming mask layer and removing damage or the pollution in mask layer Shi Dui video sensing district, and blade cuts technique is low temperature process, can not produce damage because of the excess Temperature Er Dui video sensing district for the treatment of process.
Further, when the material of described second substrate is glass, silicon or pottery etc., on described second substrate lower surface, be formed with adhesive layer, by the upper surface of second substrate lower surface and first substrate by adhesive layer pressing.By forming adhesive layer, adhesive layer not only can have the effect of bonding first substrate and second substrate, and the second substrate between cutting removal cavity and the adhesive layer of segment thickness, form after cavity wall, adopt etching technics to remove on the first substrate between cavity remaining adhesive layer when exposing pad, because adhesive layer is not identical with the material of cavity wall, improved the etching selection ratio of adhesion-layer materials and cavity wall material, make the loss of cavity wall very little, thereby when etching second substrate forms cavity wall, make the thickness of the cavity wall that forms can be thinner, be conducive to improve the integrated level of the packaging forming.
Further, be also formed with protective layer on described adhesive tape layer, described protective layer can be when adopting plasma dry degumming process to remove on first substrate remaining second substrate material, and the adhesive tape layer on protection cavity can not sustain damage.
The damage in the video sensing district of image sensor package of the present invention or of reduced contamination, has improved stability and the reliability of packaging.
Accompanying drawing explanation
Fig. 1 is the structural representation of prior art image sensor package;
Fig. 2～Fig. 8 is the structural representation of the encapsulation process of one embodiment of the invention image sensor;
Fig. 9～Figure 12 is the structural representation of the encapsulation process of another embodiment of the present invention image sensor.
Embodiment
As background technology, say, prior art is when encapsulating image sensor dice, because the induction zone that affects of image sensor is completely exposed, very easily pollutes or damage, the reliability and stability that affect sensor-packaging structure that impact forms.
For this reason, the invention provides a kind of image sensor package and method for packing thereof, the method for packing of image sensor wherein, forms some video sensings district and around the pad in described video sensing district at the upper surface of first substrate; In described second substrate, be formed with some cavitys, at the upper surface formation adhesive tape film of second substrate; Then the upper surface pressing ，Shi video sensing district of the lower surface of second substrate and first substrate is positioned to top, video sensing district; Then the adhesive tape film between cutting removal adjacent cavities and the second substrate of segment thickness, form around the cavity wall in described video sensing district and the adhesive tape layer that is positioned at cavity wall top surface enclosed cavity; Remove remaining second substrate material on the first substrate between cavity, expose the surface of pad; First substrate is cut apart, formed single image sensor dice; Pad in image sensor dice is electrically connected to by lead-in wire with the circuit on the 3rd substrate.Cavity wall and adhesive tape layer video sensing district is sealed, prevents that video sensing district is outside exposed, thereby in the encapsulation process of image sensor, prevents that the video sensing district of image sensor from being polluted or damaging.In addition, the mode by pressing and cutting forms cavity wall and adhesive tape layer, has prevented from adopting other formation technique to the damage in video sensing district and pollution.
For above-mentioned purpose of the present invention, feature and advantage can more be become apparent, below in conjunction with accompanying drawing, specific embodiments of the invention are described in detail.When the embodiment of the present invention is described in detail in detail, for ease of explanation, schematic diagram can be disobeyed general ratio and be done local amplification, and described schematic diagram is example, and it should not limit the scope of the invention at this.The three-dimensional space that should comprise in addition, length, width and the degree of depth in actual fabrication.
Fig. 2～Fig. 8 is the structural representation of the encapsulation process of one embodiment of the invention image sensor.
First, please refer to Fig. 2 and Fig. 3, Fig. 3 be Fig. 2 along the cross-sectional view of line of cut AB direction, first substrate 100 is provided, the upper surface of described first substrate 100 is formed with some video sensings district 101 and around the pad 102 in described video sensing district 101.
Described first substrate 100 can be wafer, in this enforcement, described first substrate 100 comprises the some chip area 11 of ranks arrangement and Cutting Road regions 12 between chip area 11 of being, described chip area 11 is used to form image sensor dice, follow-up along Cutting Road region, 12 pairs of first substrates 100 cut several discrete crystal grain of formation, an image sensing chip of the corresponding formation of each crystal grain.
On the chip area 11 of described first substrate 100, there is video sensing district 101 and around the pad 102 in described video sensing district 101, described chip area 11 is also formed with the metal interconnect structure (not shown) of video sensing district 101 and pad 102 electrical connections, in described video sensing district 101, be formed with image sensor unit and the associated circuit being connected with image sensor unit, video sensing district 101 receives and converts to electrical signal by extraneous light, and described electrical signal is passed through to metal interconnect structure, the lead-in wire of pad and follow-up formation, send other circuit on the 3rd substrate to.
In the present embodiment, described video sensing district 101 is positioned at the centre position of chip area 11, and described pad 102 is positioned at the marginal position of chip area 11.In other embodiments, the position in described pad and video sensing district also can be adjusted flexibly according to cabling requirement.
In the present embodiment, the independent setting of pad 102 of different chip areas 11.In other embodiments, the pad in adjacent chips region is connected, and described pad is crossed over Cutting Road region, because can cut hold after encapsulation completes in Cutting Road region, cut the opening of pad in described leap Cutting Road region, therefore can not affect the electric property of any one image sensing chip.
Then, with reference to figure 4, provide second substrate 200, in described second substrate 200, be formed with some cavitys 201; Upper surface at second substrate 200 forms adhesive tape film 202, the opening of adhesive tape film 202 enclosed cavity 201 one end.
The material of described second substrate 200 is resin, such as PCB resin etc., can in second substrate 200, form by modes such as punching press or borings cavity 201, upper surface at second substrate 200 forms after adhesive tape film 202, by second substrate 200 and the direct pressing of first substrate, protection video sensing district can not sustain damage, follow-up by cutting and plasma dry degumming process expose pad, improved packaging efficiency, in addition, can remove by cutting technique and plasma dry degumming process part adhesive tape film and second substrate formation cavity wall and the adhesive tape layer of pad top, and expose bond pad surface, damage or pollution to pad and video sensing district while having avoided existing depositing operation and etching technics to form cavity and cavity wall.
In second substrate 200, form after cavity 201, upper surface at described second substrate 200 forms adhesive tape film 202, described adhesive tape film 202 is for the opening of enclosed cavity 201 one end, during follow-up second substrate 200 on cutting and etching pad, can prevent that video sensing district is exposed in external environment condition, prevent that video sensing district is contaminated or damage.
Described adhesive tape film 202 can be UV dispergation adhesive tape or pyrolysis glue adhesive tape or other suitable rubber belt materials, described adhesive tape film 202 is directly pasted the upper surface that is formed on second substrate 200, formation technique is simple, adhesive tape film 202 is at follow-up formation adhesive tape layer, the video sensing district that adhesive tape layer can well be protected image sensor in encapsulation process can contaminated or damage, after image sensor package forms, in follow-up assembling process, can very easily adhesive tape layer be removed by the light-struck mode of UV, while removing, Ye Buhuidui video sensing district produces damage or pollutes.
In other embodiments of the invention; can also on described adhesive tape film, form diaphragm; the follow-up second substrate of removing diaphragm, adhesive tape film and segment thickness between adjacent cavities by cutting technique; formation around the cavity wall in described video sensing district, be positioned at the adhesive tape layer of cavity wall top surface enclosed cavity and be positioned at the protective layer on adhesive tape layer; described protective layer can adopt plasma dry degumming process to remove remaining second substrate material on first substrate; while exposing pad surperficial, the adhesive tape layer on protection cavity can not sustain damage.
The material of described diaphragm can be photoresist, and the formation technique of diaphragm is spin coating proceeding, spraying coating process or film coating process, and the formation technique of diaphragm simply and not can cause damage to adhesive tape film.In other embodiments of the invention, described diaphragm can also and form technique for other suitable materials.
In the present embodiment, the interior formation cavity 201 of described second substrate 200, second substrate 200 upper surfaces form the adhesive tape film 202 of sealed cavities 201, follow-uply can form cavity wall and adhesive tape layer is isolated video sensing district with external environment condition.In other embodiments of the invention, described second substrate can not have cavity yet, follow-up directly by the upper surface pressing of second substrate lower surface and first substrate; Then, the second substrate of segment thickness on pad is removed in cutting; Then, adopt plasma dry degumming process etching to remove remaining second substrate material on pad, expose the surface of pad; Then, first substrate is cut apart, formed single image sensor dice; Then, the pad in image sensor dice is electrically connected to by lead-in wire with the circuit on the 3rd substrate.In cutting with remove damage or the pollution that second substrate material in the second substrate material Shi， video sensing district on the second pad also can prevent video sensing district.
Then, please refer to Fig. 5, the upper surface pressing ，Shi video sensing district 101 of the lower surface of second substrate 200 and first substrate 100 is positioned to cavity 201.
Because the material of second substrate 200 is resin, can directly second substrate 200 and first substrate 100 be carried out to pressing, form one.In other embodiments of the invention, also can adopt gluing process to form some glue-line at second substrate lower surface, then second substrate and first substrate are carried out to pressing by a glue-line, form one.
By by first substrate 100 and second substrate 200 pressings, make second substrate 200 cavities 201 be positioned at video sensing district 101 directly over, by second substrate 200 and adhesive tape Mo202Jiang video sensing district 101, sealed or isolated with external environment condition, other regions in the video sensing district 101 on first substrate 100 are covered by second substrate 200.
Then, please refer to Fig. 6, cutting is removed the adhesive tape film 202(in (or on pad 102 and Cutting Road region 12) between adjacent cavities 201 with reference to figure 5) and the second substrate 200 of segment thickness, formation is around the cavity wall 204 in described video sensing district 101 and the adhesive tape layer 203 that is positioned at cavity wall 204 top surface enclosed cavities 201.
Adopt blade cuts to remove the second substrate 200 of described adhesive tape film 202 and segment thickness, than dry method or wet-etching technology, employing blade cuts process efficiency is high, technique simple, it is little to pollute, without according to material selective etching gas to be etched or etching solution, and adopt blade cuts technique without forming mask layer, can prevent in the damage or the pollution that form mask layer and removal mask layer Shi Dui video sensing district 101.In the present embodiment, adopt the second substrate 200 of 31 pairs of adhesive tape films 202 of blade and segment thickness to cut.
In the present embodiment, after cutting completes, on first substrate 100(between adjacent cavities 201 or pad 102 and Cutting Road region 12) second substrate 200 materials of upper remainder thickness, prevent that the cutting of crossing in cutting process from causing damage to pad 102, follow-uply can remove the surface that remaining second substrate 200 materials on the first substrate 100 between adjacent cavities 201 expose pad 102 by plasma dry degumming process, with the technique that goes between, pad 102 is connected with the circuit on the 3rd substrate.
In the present embodiment, the thickness that remains second substrate 200 on the first substrate 100 between adjacent cavities 201 is less than 20 microns, has reduced the burden of follow-up plasma dry degumming process, to reduce the dry method etching to cavity wall 204 in process of removing photoresist.
Then, please refer to Fig. 7, etching is removed remaining second substrate 200 materials (with reference to figure 6) on the first substrate 100 between cavity 101, exposes the surface in the surface of pad 102 and the Cutting Road region 12 of first substrate 100.
Remaining second substrate 200 materials of etching adopt plasma dry degumming process, the gas that described plasma dry degumming process adopts is oxygen, oxygen forms plasma under the effect of radio-frequency power, and plasma carries out etching to remaining second substrate 200 materials on first substrate 100.Dry method is removed photoresist in process, and cavity wall 204 and adhesive tape layer 203 protection video sensing districts 101 can not sustain damage.
Finally, please refer to Fig. 8, by first substrate 100(with reference to figure 7) cut apart, form single image sensor dice 106; By the upper surface laminating of image sensor dice 106 lower surfaces and the 3rd substrate 300; Pad in image sensor dice 106 102 is electrically connected to by lead-in wire 301 with the circuit (not shown) on the 3rd substrate 300, thus the encapsulating structure 104 of formation image sensor.
Division process to first substrate 100, the process for pressing of first substrate 100 and the 3rd substrate 300, and the technique that Bonding forms lead-in wire 301 please refer to existing technique, do not repeat them here.
The image sensor package that the embodiment of the present invention also provides a kind of above-mentioned method for packing to form, please refer to Fig. 8, comprising:
On the upper surface of the image sensor dice 106 between cavity wall 204， video sensing district 101 and pad 102, cavity wall 204 is around forming cavity 201 in described video sensing district 101， video sensing district 101;
On the 3rd substrate 300, the three substrates 300, be formed with circuit (not shown), the lower surface laminating of the upper surface of the 3rd substrate 300 and image sensor dice 106;
Lead-in wire 301, is electrically connected to the pad in image sensor dice 106 102 with the circuit on the 3rd substrate 300.
Concrete, the material of described cavity wall 204 can be resin.Described adhesive tape layer 203 can be UV dispergation adhesive tape or pyrolysis glue adhesive tape or other suitable rubber belt materials.
On described adhesive tape layer 203, also have protective layer (not shown), the material of described protective layer is photoresist or other suitable materials.
Fig. 9～Figure 12 is the structural representation of the encapsulation process of another embodiment of the present invention image sensor, it should be noted that, in the present embodiment, the restriction such as the parameter of structure same with the above-mentioned embodiment and effect repeats no more in the present embodiment, specifically please refer to above-described embodiment.
First, please refer to Fig. 9, first substrate 100 is provided, the upper surface of described first substrate 100 is formed with some video sensings district 101 and around the pad 102 in described video sensing district 101; Second substrate 200 is provided, in described second substrate 200, is formed with some cavitys 201; Upper surface at second substrate 200 forms adhesive tape film 202, an end opening of adhesive tape film 202 enclosed cavities 201; On described second substrate 200 lower surfaces, be formed with adhesive layer 205; The upper surface of second substrate 200 lower surfaces and first substrate 100 is passed through to adhesive layer 205 pressings.
In the present embodiment, the material of described second substrate 200 is glass, silicon or pottery etc., by sandblasting or etching technics forms cavity 201 in second substrate 200.
In the present embodiment, by the lower surface at second substrate 200, form adhesive layer 205, by adhesive layer 205, second substrate 200 and first substrate pressing can be integrated, reduced the difficulty of technique.In other embodiments of the invention, also can, by techniques such as Direct Bonding or anode linkages, second substrate and first substrate be bonded together.
The material of described adhesive layer 205 can be epoxide-resin glue, polyimides glue, benzocyclobutene glue or polybenzoxazoles glue etc.In the present embodiment, the material of described adhesive layer 205 is epoxide-resin glue.By film coating process, seal adhesive process or plastic roll technique, on the lower surface of described second substrate 200, form adhesive layer 205, then adhesive layer 205 is carried out to exposure imaging, in adhesive layer 205, form the opening that exposes cavity 201.
The adhesive layer 205 of the present embodiment not only can have the effect of bonding first substrate 100 and second substrate 200, and follow-uply in cutting, remove second substrate 200 between cavity 201 and the adhesive layer 205 of segment thickness, form after cavity wall, remove on the first substrate 100 between cavity 201 remaining adhesive layer when exposing pad 102 adopting plasma dry degumming process, because adhesive layer 205 is not identical with the material of cavity wall, improved the etching selection ratio of adhesive layer 205 materials and cavity wall material, make the loss of cavity wall very little, thereby when etching second substrate forms cavity wall, make the thickness of the cavity wall that forms can be thinner, be conducive to improve the integrated level of the packaging forming.
In other embodiments of the invention; can also on described adhesive tape film, form diaphragm; the follow-up second substrate of removing diaphragm, adhesive tape film and segment thickness between adjacent cavities by cutting technique; formation around the cavity wall in described video sensing district, be positioned at the adhesive tape layer of cavity wall top surface enclosed cavity and be positioned at the protective layer on adhesive tape layer; described protective layer can be when adopting plasma dry degumming process to remove on first substrate remaining second substrate material, and the adhesive tape layer on protection cavity can not sustain damage.
The material of described diaphragm can be photoresist, and the formation technique of diaphragm is spin coating proceeding, spraying coating process or film coating process, and the formation technique of diaphragm simply and not can cause damage to adhesive tape film.In other embodiments of the invention, described diaphragm can also and form technique for other suitable materials.
Then, please refer to Figure 10, cutting is removed adhesive tape film 202(between adjacent cavities 201 with reference to figure 9), second substrate 200(is with reference to figure 9) and the adhesive layer 205 of segment thickness, formation is around the cavity wall 204 in described video sensing district 101 and the adhesive tape layer 203 that is positioned at cavity wall 204 top surface enclosed cavities 201.
The adhesive layer 205 that cuts described adhesive tape film 202, second substrate 200 and segment thickness adopts blade cuts technique, than dry method or wet-etching technology, employing blade cuts process efficiency is high, technique simple, it is little to pollute, and adopt blade cuts technique without forming mask layer, can prevent in the damage or the pollution that form mask layer and removal mask layer Shi Dui video sensing district 101.
In the present embodiment, after cutting completes, on first substrate 100(between adjacent cavities 201 or pad 102 and Cutting Road region 12) adhesive layer 205 materials of upper remainder thickness, prevent that the cutting of crossing in cutting process from causing damage to pad 102, follow-uply can remove remaining adhesive layer 205 materials on the first substrate 100 between adjacent cavities 201 by etching technics.
In the present embodiment, on the first substrate 100 between adjacent cavities 201, the thickness of remaining adhesive layer 205 is less than 20 microns.
Then, please refer to Figure 11, on the first substrate 100 between etching adjacent cavities 201, remaining adhesive layer 205(is with reference to Figure 10), expose the surface of pad 102.
The remaining adhesive layer 205 of etching adopts anisotropic plasma dry degumming process, the gas that described plasma dry degumming process adopts is oxygen, the dry method process of removing photoresist is less to the damage of adhesive tape layer 203 and pad 102, in addition because the material of adhesive layer 205 is not identical with the material of cavity wall 204, dry method is removed photoresist negligible to the etching of cavity wall 204 in process.
Finally, please refer to Figure 12, by first substrate 100(with reference to Figure 11) cut apart, form single image sensor dice 106; By the upper surface laminating of the lower surface of image sensor dice 106 and the 3rd substrate 300; Pad in image sensor dice 106 102 is electrically connected to by lead-in wire 301 with the circuit (not shown) on the 3rd substrate 300, forms the encapsulating structure 104 of image sensor.
The encapsulating structure of the image sensor that said method forms, please refer to Figure 12, and the encapsulating structure 104 of described image sensor, comprising:
On the upper surface of the image sensor dice 106 between cavity wall 204， video sensing district 101 and pad 102, cavity wall 204 is around forming cavity 201 in described video sensing district 101， video sensing district 101;
On the 3rd substrate 300, the three substrates 300, be formed with circuit (not shown), the lower surface laminating of the upper surface of the 3rd substrate 300 and image sensor dice 106;
Lead-in wire 301, is electrically connected to the pad in image sensor dice 106 102 with the circuit on the 3rd substrate 300.
Concrete, the material of described cavity wall 204 is glass, silicon or pottery.
The material of described adhesive layer 205 is epoxide-resin glue, polyimides glue, benzocyclobutene glue or polybenzoxazoles glue.The present embodiment, the material of described adhesive layer 205 is epoxide-resin glue.
Described adhesive tape layer 203 is UV dispergation adhesive tape or pyrolysis glue adhesive tape.In other embodiments of the invention, described adhesive tape layer can also adopt other suitable rubber belt materials.
On described adhesive tape layer 203, also have protective layer (not shown), the material of described protective layer is photoresist or other suitable materials.
To sum up, the image sensor package of the embodiment of the present invention and method for packing thereof, by forming cavity wall and adhesive tape layer, cavity wall and adhesive tape layer video sensing district is sealed, prevent that video sensing district is outside exposed, thereby in the encapsulation process of image sensor, prevent that video sensing district from being polluted or damaging.Pad is to come out by cutting and the mode of plasma dry degumming process, prevented from adopting other formation technique to the damage of pad and pollution, in addition, cavity wall and adhesive tape layer are that the mode by pressing and cutting forms, and have prevented from adopting other formation technique to the damage in video sensing district and pollution.
Although the present invention discloses as above, the present invention is not defined in this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, so protection scope of the present invention should be as the criterion with claim limited range.
Claims (23)
1. a method for packing for image sensor, is characterized in that, comprising:
First substrate is provided, and the upper surface of described first substrate is formed with some video sensings district and around the pad in described video sensing district;
Second substrate is provided, in described second substrate, is formed with some cavitys;
Upper surface at second substrate forms adhesive tape film, the opening of adhesive tape membrane closure cavity;
The upper surface pressing ，Shi video sensing district of the lower surface of second substrate and first substrate is positioned to cavity;
Adhesive tape film between cutting removal adjacent cavities and the second substrate of segment thickness, form around the cavity wall in described video sensing district and the adhesive tape layer that is positioned at cavity wall top surface enclosed cavity;
Remove remaining second substrate material on the first substrate between cavity, expose the surface of pad;
First substrate is cut apart, formed single image sensor dice;
Pad in image sensor dice is electrically connected to by lead-in wire with the circuit on the 3rd substrate.
2. the method for packing of image sensor as claimed in claim 1, is characterized in that, the adhesive tape film between employing blade cuts removal adjacent cavities and the second substrate of segment thickness.
3. the method for packing of image sensor as claimed in claim 1, is characterized in that, the thickness that remains second substrate on the first substrate between described adjacent cavities is less than 20 microns.
4. the method for packing of image sensor as claimed in claim 1, is characterized in that, the material of described second substrate is resin.
5. the method for packing of image sensor as claimed in claim 1, is characterized in that, the material of described second substrate is glass, silicon or pottery.
6. the method for packing of image sensor as claimed in claim 5, is characterized in that, on described second substrate lower surface, is formed with adhesive layer, and the upper surface of second substrate lower surface and first substrate is by adhesive layer pressing.
7. the method for packing of image sensor as claimed in claim 6, is characterized in that, the material of described adhesive layer is epoxide-resin glue, polyimides glue, benzocyclobutene glue or polybenzoxazoles glue.
8. the method for packing of image sensor as claimed in claim 6, it is characterized in that, the process that forms cavity wall is: the adhesive layer of adhesive tape film, second substrate and segment thickness between adjacent cavities is removed in cutting, forms around the cavity wall in described video sensing district and the adhesive tape layer that is positioned at cavity wall top surface enclosed cavity; Etching is removed remaining adhesive layer on the first substrate between adjacent cavities, exposes the surface of pad.
9. the method for packing of the image sensor as described in claim 1,4 or 8, is characterized in that, removes remaining second substrate material or adhesion-layer materials employing plasma dry degumming process on pad.
10. the method for packing of image sensor as claimed in claim 1, is characterized in that, described adhesive tape film is UV dispergation adhesive tape or pyrolysis glue adhesive tape.
The method for packing of 11. image sensors as claimed in claim 1, is characterized in that, also comprises: on described adhesive tape film, form diaphragm; The second substrate of diaphragm, adhesive tape film and segment thickness between adjacent cavities is removed in cutting, forms cavity wall around described video sensing district, is positioned at the adhesive tape layer of cavity wall top surface enclosed cavity and is positioned at the protective layer on adhesive tape layer.
The method for packing of 12. image sensors as claimed in claim 11, is characterized in that, the material of described diaphragm is photoresist.
The method for packing of 13. image sensors as claimed in claim 12, is characterized in that, the formation technique of described diaphragm is spin coating proceeding, spraying coating process or film coating process.
The method for packing of 14. 1 kinds of image sensors, is characterized in that, comprising:
First substrate is provided, and the upper surface of described first substrate is formed with some video sensings district and around the pad in described video sensing district;
Provide second substrate, by the upper surface pressing of second substrate lower surface and first substrate;
The second substrate of segment thickness on pad is removed in cutting;
Remove remaining second substrate material on pad, expose the surface of pad;
First substrate is cut apart, formed single image sensor dice;
Pad in image sensor dice is electrically connected to by lead-in wire with the circuit on the 3rd substrate.
The method for packing of 15. image sensors as claimed in claim 14, is characterized in that, removes remaining second substrate material on pad and adopts plasma dry degumming process.
The encapsulating structure of 16. 1 kinds of image sensors, is characterized in that, comprising:
Image sensor dice, has video sensing district and around the pad in described video sensing district on the upper surface of described image sensor dice;
On the upper surface of the image sensor dice between cavity wall ， video sensing district and pad, cavity wall is around forming cavity in described video sensing district ， video sensing district;
Adhesive tape layer, is positioned at the top surface of cavity wall, seals described cavity;
The 3rd substrate, is formed with circuit on the 3rd substrate, the 3rd upper surface of substrate and the laminating of the lower surface of image sensor dice;
Lead-in wire, is electrically connected to the upper pad of image sensor dice with the circuit on the 3rd substrate.
The encapsulating structure of 17. image sensors as claimed in claim 16, is characterized in that, the material of described cavity wall is resin.
The encapsulating structure of 18. image sensors as claimed in claim 16, is characterized in that, the material of described cavity wall is glass, silicon or pottery.
The encapsulating structure of 19. image sensors as claimed in claim 18, is characterized in that, between described cavity wall and first substrate, has adhesive layer.
The encapsulating structure of 20. image sensors as claimed in claim 19, is characterized in that, the material of described adhesive layer is epoxide-resin glue, polyimides glue, benzocyclobutene glue or polybenzoxazoles glue.
The encapsulating structure of 21. image sensors as claimed in claim 16, is characterized in that, described adhesive tape layer is UV dispergation adhesive tape or pyrolysis glue adhesive tape.
The encapsulating structure of 22. image sensors as claimed in claim 16, is characterized in that, also has protective layer on described adhesive tape layer.
The encapsulating structure of 23. image sensors as claimed in claim 22, is characterized in that, the material of described protective layer is photoresist.
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| CN201310585564.1A CN103560139B (en) | 2013-11-19 | 2013-11-19 | Image sensor package and method for packing thereof |
| US14/462,739 US9299735B2 (en) | 2013-11-19 | 2014-08-19 | Image sensor package structure and method |
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| CN201310585564.1A CN103560139B (en) | 2013-11-19 | 2013-11-19 | Image sensor package and method for packing thereof |
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