CN103540973A - Electrogilding liquid for heat sinks of chips and circuit boards and use method - Google Patents
Electrogilding liquid for heat sinks of chips and circuit boards and use method Download PDFInfo
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- CN103540973A CN103540973A CN201310437961.4A CN201310437961A CN103540973A CN 103540973 A CN103540973 A CN 103540973A CN 201310437961 A CN201310437961 A CN 201310437961A CN 103540973 A CN103540973 A CN 103540973A
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- electrogilding
- gold
- heat sink
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- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention provides a formula for preparing a copper heat sink electrogilding liquid for chip welding and heat dissipation. The formula of the electrogilding liquid is composed of 25 g/L of chloroauric acid, 160 g/L of sodium sulfite, 94 g/L of potassium citrate, 100 g/L of potassium chloride, 40 g/L of EDTA-2Na (Ethylene Diamine Tetraacetic Acid Disodium), 35 g/L of dipotassium phosphate, 2 ml/L of glycerin, 0.1 g/L of 1,4-butanediol, anode pure gold and the balance of water. The application method comprises the following steps of electroplating a nickel layer of 3-5 microns on the surface of a copper block to prevent mutual diffusion of copper and gold, and then electroplating gold on the surface of nickel, wherein the anode is a pure gold bar or gold wire; and further carrying out electrogilding for 120-150 S under the conditions of the PH value of about 9, the temperature of 45 DEG C and the current density of 0.18 A/DM2. The heat sink electroplated by using the formula of the electrogilding liquid has the advantages of even and smooth coating surface, good binding force, no blister and no shedding, and is capable of completely meeting the heat sink surface electrogilding treatment requirements of chip welding and heat dissipation.
Description
Technical field
The present invention relates to field of metal surface treatment technology, particularly a kind of electrogilding liquid of the copper heat sink for chip and wiring board heat radiation needs.
Background technology
Plating is a kind of metal cladding process of required form that deposits on plating piece surface with electrochemical method.Its principle is in containing the saline solution of wanting metallizing, take plated matrix metal as negative electrode, by electrolytic action, the positively charged ion of wanting metallizing in plating solution is deposited in base metal surface, forms coating.
Gold stable chemical nature, has low resistance, high heat conduction, the feature such as anti-oxidant.Electrogilding liquid of the present invention can, at manufactured copper billet electroplating gold on surface, be made copper billet can supply the heat sink of chips welding and heat radiation.
Summary of the invention
The object of this invention is to provide a kind of for chip and the heat sink electrogilding liquid of wiring board, for the manufacture of can be for the copper heat sink electrogilding liquid formula of chips welding and heat radiation.
Object of the present invention is realized by technical scheme below, and electrogilding liquid formula is composed as follows:
Hydrochloro-auric acid 25g/L,
S-WAT 160 g/L,
Tripotassium Citrate 94 g/L,
Repone K 100 g/L,
EDTA-2Na 40 g/L，
Dipotassium hydrogen phosphate 35 g/L,
Glycerine 2ml/L,
Isosorbide-5-Nitrae butyleneglycol 0.1 g/L,
All the other are water.
Advantage of the present invention is: this electroplate liquid formulation is simple, adopt that this plating solution formula electroplates out heat sink have coating surface even, smooth, without bubbling, without the advantage such as coming off.
Embodiment
While using following plating solution formula gold-plated, negative electrode is that copper billet is (first at the nickel dam of copper billet electroplating surface 3-5um, to prevent copper and golden mutual diffusion, then at nickel surface electrogilding), anode, for depositing gold bar or spun gold, is about 9 at pH value, temperature is 45 ℃, current density 0.18 A/dm
2lower electrogilding 120-150S.
Electrogilding liquid formula is composed as follows:
Hydrochloro-auric acid 25g/L,
S-WAT 160 g/L,
Tripotassium Citrate 94 g/L,
Repone K 100 g/L,
EDTA-2Na 40 g/L，
Dipotassium hydrogen phosphate 35 g/L,
Glycerine 2ml/L,
Isosorbide-5-Nitrae butyleneglycol 0.1 g/L,
All the other are water.
According to above gold plating liquid formula, electroplate, result on copper billet plated surface gold, and Gold plated Layer is golden yellow, bright.After completing, to test it coating, to check this coating whether to meet the demands.Electrogilding layer has been done to following detection:
1) with blade, on sample, draw the grid of 1mm * 1mm, 700 power microscopes are observed, and boundary is peeling not;
2) sample is warming up to 370 ℃ of insulation 1min through chip mounter, 700 power microscopes are observed, not peeling, not bubbling;
3) sample is placed on to 450 ℃, 30min on warm table, manual observation is variable color not, and 700 times, microscope is observed not peeling, bubbling not, but have slightly variable color;
4) at the In layer of the about 5um of Gold plated Layer surface evaporation, reflow soldering, welding post-etching falls In layer, and microscopic examination scolder and heat sink welding situation, amplify 700 times and do not observe cavity.
By above-mentioned electroplate liquid formulation, on copper billet surface, realized Gold plated Layer, the bonding force of coating is good, can satisfy the demand.For the problem that may occur in process exploitation process and terms of settlement, gather as follows:
Claims (2)
1. for chip and the heat sink electrogilding liquid of wiring board, it is characterized in that: described electrogilding liquid formula is composed as follows:
Hydrochloro-auric acid 25g/L,
S-WAT 160 g/L,
Tripotassium Citrate 94 g/L,
Repone K 100 g/L,
EDTA-2Na 40 g/L，
Dipotassium hydrogen phosphate 35 g/L,
Glycerine 2ml/L,
Isosorbide-5-Nitrae butyleneglycol 0.1 g/L,
Anode proof gold
All the other are water.
2. one kind as claimed in claim 1 for the using method of chip and the heat sink electrogilding liquid of wiring board, it is characterized in that: while using following plating solution formula gold-plated, negative electrode is copper billet, first at the nickel dam of copper billet electroplating surface 3-5um, to prevent copper and golden mutual diffusion, then at nickel surface electrogilding, anode is for depositing gold bar or spun gold, at pH value, be about 9, temperature is 45 ℃, current density 0.18 A/dm
2lower electrogilding 120-150S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310437961.4A CN103540973A (en) | 2013-09-24 | 2013-09-24 | Electrogilding liquid for heat sinks of chips and circuit boards and use method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310437961.4A CN103540973A (en) | 2013-09-24 | 2013-09-24 | Electrogilding liquid for heat sinks of chips and circuit boards and use method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103540973A true CN103540973A (en) | 2014-01-29 |
Family
ID=49964807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310437961.4A Pending CN103540973A (en) | 2013-09-24 | 2013-09-24 | Electrogilding liquid for heat sinks of chips and circuit boards and use method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103540973A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104480519A (en) * | 2014-11-21 | 2015-04-01 | 广州明铨机械设备有限公司 | Vertical continuous PCB nickel or gold plating equipment |
| CN111364074B (en) * | 2020-02-21 | 2021-06-25 | 厦门大学 | Preparation method of composite coordination low-concentration monovalent gold cyanide-free gold-plating electroplating solution |
| CN114232038A (en) * | 2022-02-25 | 2022-03-25 | 深圳市创智成功科技有限公司 | Cyanide-free electrogilding formula applied to wafer-level packaging and electrogilding process thereof |
Citations (7)
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| GB1325352A (en) * | 1969-08-08 | 1973-08-01 | Sel Rex Corp | Electrodeposition of gold and gold alloys |
| US4048023A (en) * | 1976-06-09 | 1977-09-13 | Oxy Metal Industries Corporation | Electrodeposition of gold-palladium alloys |
| US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
| CN1497070A (en) * | 2002-09-30 | 2004-05-19 | 新光电气工业株式会社 | Noncyanide electrolytic solution for gold plating |
| CN1506494A (en) * | 2002-12-10 | 2004-06-23 | �ض���ѧ��ʽ���� | Non-electrolytic goldplating liquid |
| CN1802451A (en) * | 2003-06-05 | 2006-07-12 | 株式会社日矿材料 | Electroless gold plating solution |
| CN102851712A (en) * | 2012-09-27 | 2013-01-02 | 苏州兴瑞贵金属材料有限公司 | Preparation method for auric potassium citrate for gold plating |
-
2013
- 2013-09-24 CN CN201310437961.4A patent/CN103540973A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1325352A (en) * | 1969-08-08 | 1973-08-01 | Sel Rex Corp | Electrodeposition of gold and gold alloys |
| US4048023A (en) * | 1976-06-09 | 1977-09-13 | Oxy Metal Industries Corporation | Electrodeposition of gold-palladium alloys |
| US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
| CN1497070A (en) * | 2002-09-30 | 2004-05-19 | 新光电气工业株式会社 | Noncyanide electrolytic solution for gold plating |
| CN1506494A (en) * | 2002-12-10 | 2004-06-23 | �ض���ѧ��ʽ���� | Non-electrolytic goldplating liquid |
| CN1802451A (en) * | 2003-06-05 | 2006-07-12 | 株式会社日矿材料 | Electroless gold plating solution |
| CN102851712A (en) * | 2012-09-27 | 2013-01-02 | 苏州兴瑞贵金属材料有限公司 | Preparation method for auric potassium citrate for gold plating |
Non-Patent Citations (3)
| Title |
|---|
| 吴水清: "镀金溶液中的添加剂", 《电镀与精饰》, vol. 14, no. 6, 30 November 1992 (1992-11-30), pages 20 - 22 * |
| 孙建军: "无氰电镀的历史及研究现状", 《2010中国电子制造技术论坛论文集》, 1 December 2010 (2010-12-01) * |
| 陈全寿: "再谈亚硫酸盐镀金", 《表面技术》, vol. 27, no. 1, 31 December 1998 (1998-12-31), pages 46 - 48 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104480519A (en) * | 2014-11-21 | 2015-04-01 | 广州明铨机械设备有限公司 | Vertical continuous PCB nickel or gold plating equipment |
| CN111364074B (en) * | 2020-02-21 | 2021-06-25 | 厦门大学 | Preparation method of composite coordination low-concentration monovalent gold cyanide-free gold-plating electroplating solution |
| CN114232038A (en) * | 2022-02-25 | 2022-03-25 | 深圳市创智成功科技有限公司 | Cyanide-free electrogilding formula applied to wafer-level packaging and electrogilding process thereof |
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Application publication date: 20140129 |