CN103533479A - Piezoceramic bone-conduction oscillator mounting structure in bone-conduction Bluetooth headset - Google Patents
Piezoceramic bone-conduction oscillator mounting structure in bone-conduction Bluetooth headset Download PDFInfo
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- CN103533479A CN103533479A CN201310520471.0A CN201310520471A CN103533479A CN 103533479 A CN103533479 A CN 103533479A CN 201310520471 A CN201310520471 A CN 201310520471A CN 103533479 A CN103533479 A CN 103533479A
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- bone
- earphone
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- conduction
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Abstract
The invention provides a piezoceramic bone-conduction oscillator mounting structure in a bone-conduction Bluetooth headset. One side of a piezoceramic oscillator is fixed on a battery or PCB printed circuit board of the Bluetooth headset, the other side is covered with a soft cushion layer, a soft rubber mat layer is added in the middle, a rectangular hole is designed in the headset case cover, and the soft cushion protrudes out of the headset case cover through the rectangular hole and contacts directly with a human skull. The piezoceramic bone-conduction oscillator mounting structure is convenient to mount, small in occupied area and good in oscillation transmission effect, and can improve the oscillation sensitivity of the oscillator, reduce sound leakage of the bone-conduction oscillator and improve the low frequency effect.
Description
Technical field
The invention belongs to the application of piezoelectric ceramic bone conduction technology in bluetooth earphone, be specifically related to the mounting structure of a kind of piezoelectric ceramic bone conduction oscillator in bone conduction bluetooth earphone.
Background technology
Bluetooth earphone adopts bone conduction technology just in a large number.And use piezoelectric ceramic vibrator as the bone conduction speaker of bone conduction bluetooth earphone, than using traditional electromagnetic type oscillator to there is more advantage.As simple in structure, thin thickness, lightweight etc., up to now and find no relevant bibliographical information.
Summary of the invention
The object of this invention is to provide the mounting structure of a kind of piezoelectric ceramic bone conduction oscillator in bone conduction bluetooth earphone, have easy for installationly, take up room little, can improve oscillator vibration sensitivity, and improve the advantages such as low-frequency effect.
Technical scheme of the present invention is: the mounting structure of piezoelectric ceramic bone conduction oscillator in bone conduction bluetooth earphone, at the bottom of comprising earphone lid and Earphone box, it is characterized in that piezoelectric ceramic vibrator is flattened on bluetooth earphone lid inner side, in lid inner side, pasting piezoelectric ceramic vibrator Position Design has three hollow out finedraws, finally will at the bottom of earphone lid and Earphone box, fix.
Another technical scheme of the present invention is: the mounting structure of piezoelectric ceramic bone conduction oscillator in bone conduction bluetooth earphone, at the bottom of comprising earphone lid and Earphone box, it is characterized in that piezoelectric ceramic vibrator is simultaneously fixed on bluetooth earphone battery or pcb board, another side covers one deck flexible glue pad, in the middle of battery and piezoelectric ceramic vibrator, add again one deck flexible glue pad, Earphone box covers face and is designed with an oblong aperture, piezoelectric ceramic vibrator protrudes from outside earphone lid by oblong aperture, directly contact with human skull, finally will at the bottom of earphone lid and Earphone box, fix.
The present invention is easy for installation, takes up room little, can improve oscillator vibration sensitivity, reduces the acoustical leakage of bone conduction oscillator, and improves low-frequency effect and vibration transmission effect is good.
Accompanying drawing explanation
Fig. 1 piezoelectric ceramic vibrator is flattened on mounting structure figure inside bluetooth earphone lid.
Fig. 2 piezoelectric ceramic vibrator protrudes from the outer mounting structure vertical view of bluetooth earphone lid.
Fig. 3 piezoelectric ceramic vibrator protrudes from the outer mounting structure cutaway view of bluetooth earphone lid.
Embodiment
The present invention has two kinds of execution modes, and Fig. 1 is a kind of embodiment, and Fig. 2 and Fig. 3 are another kind of embodiment.
As shown in Figure 1: piezoelectric ceramic vibrator 1 is flattened on bluetooth earphone lid 2 inner sides, lid 2 outer surfaces and human skull are close to.Can paste piezoelectric ceramic vibrator 1 position at lid 2, design three hollow out finedraws 6, can allow piezoelectric ceramic vibrator 1 amplitude of fluctuation larger.This structure is easy for installation, takes up room little, can improve oscillator vibration sensitivity, and improves low-frequency effect.
As shown in Figure 2 and Figure 3: in bluetooth earphone lid 2 inner sides, piezoelectric ceramic vibrator 1 one side is fixed on bluetooth earphone battery 4 or pcb board, another side covers one deck flexible glue pad 5, centre adds one deck flexible glue pad 5 again, earphone lid 2 is designed with an oblong aperture above, piezoelectric ceramic vibrator 1 protrudes from outside earphone lid 2 by oblong aperture, directly contacts with human skull, finally loads onto at the bottom of Earphone box 3.This structural vibration transmission effect is good, also can reduce the acoustical leakage of bone conduction oscillator.
It should be noted that: the foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, although the present invention is had been described in detail with reference to previous embodiment, for a person skilled in the art, its technical scheme that still can record previous embodiment is modified, or part technical characterictic is wherein replaced on an equal basis.
Within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (2)
1. the mounting structure of piezoelectric ceramic bone conduction oscillator in bone conduction bluetooth earphone, comprise (3) at the bottom of earphone lid (2) and Earphone box, it is characterized in that piezoelectric ceramic vibrator (1) is flattened on bluetooth earphone lid (2) inner side, in lid inner side, pasting piezoelectric ceramic vibrator (1) Position Design has three hollow out finedraws (6), finally that (3) at the bottom of earphone lid (2) and Earphone box are fixing.
2. the mounting structure of piezoelectric ceramic bone conduction oscillator as claimed in claim 1 in bone conduction bluetooth earphone, it is characterized in that piezoelectric ceramic vibrator (1) one side is fixed on bluetooth earphone battery (4) or pcb board, another side covers one deck flexible glue pad (5), battery (4) and the middle one deck flexible glue pad (5) that adds again of piezoelectric ceramic vibrator (1), earphone lid (2) is designed with an oblong aperture above, piezoelectric ceramic vibrator (1) protrudes from outside earphone lid (2) by oblong aperture, directly contact with human skull, finally that (3) at the bottom of earphone lid (2) and Earphone box are fixing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310520471.0A CN103533479A (en) | 2013-10-28 | 2013-10-28 | Piezoceramic bone-conduction oscillator mounting structure in bone-conduction Bluetooth headset |
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CN201310520471.0A CN103533479A (en) | 2013-10-28 | 2013-10-28 | Piezoceramic bone-conduction oscillator mounting structure in bone-conduction Bluetooth headset |
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CN103533479A true CN103533479A (en) | 2014-01-22 |
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CN201310520471.0A Pending CN103533479A (en) | 2013-10-28 | 2013-10-28 | Piezoceramic bone-conduction oscillator mounting structure in bone-conduction Bluetooth headset |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109547897A (en) * | 2018-11-30 | 2019-03-29 | 歌尔科技有限公司 | A kind of method, apparatus, system and the wireless headset box of wireless headset connection |
CN111866657A (en) * | 2020-08-31 | 2020-10-30 | 惠州市品能新能源有限公司 | Production method of universal bone conduction Bluetooth headset |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030012395A1 (en) * | 2000-12-27 | 2003-01-16 | Mikio Fukuda | Bone conduction speaker |
CN1627864A (en) * | 2003-12-12 | 2005-06-15 | Nec东金株式会社 | Acoustic vibration generating element |
CN2814848Y (en) * | 2005-08-17 | 2006-09-06 | 陈奚平 | Bone-conduction microphone and receiver assembly |
CN1957238A (en) * | 2004-05-18 | 2007-05-02 | 星电株式会社 | Vibration sesor |
CN202135308U (en) * | 2011-07-01 | 2012-02-01 | 宁波凯普电子有限公司 | Bone conduction microphone of piezoelectric type |
CN203537547U (en) * | 2013-10-28 | 2014-04-09 | 西安康弘新材料科技有限公司 | Installation structure of piezoelectric ceramic bone conduction oscillator of bone conduction bluetooth earphone |
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2013
- 2013-10-28 CN CN201310520471.0A patent/CN103533479A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030012395A1 (en) * | 2000-12-27 | 2003-01-16 | Mikio Fukuda | Bone conduction speaker |
CN1627864A (en) * | 2003-12-12 | 2005-06-15 | Nec东金株式会社 | Acoustic vibration generating element |
CN1957238A (en) * | 2004-05-18 | 2007-05-02 | 星电株式会社 | Vibration sesor |
CN2814848Y (en) * | 2005-08-17 | 2006-09-06 | 陈奚平 | Bone-conduction microphone and receiver assembly |
CN202135308U (en) * | 2011-07-01 | 2012-02-01 | 宁波凯普电子有限公司 | Bone conduction microphone of piezoelectric type |
CN203537547U (en) * | 2013-10-28 | 2014-04-09 | 西安康弘新材料科技有限公司 | Installation structure of piezoelectric ceramic bone conduction oscillator of bone conduction bluetooth earphone |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109547897A (en) * | 2018-11-30 | 2019-03-29 | 歌尔科技有限公司 | A kind of method, apparatus, system and the wireless headset box of wireless headset connection |
CN109547897B (en) * | 2018-11-30 | 2021-07-09 | 歌尔科技有限公司 | Wireless earphone connection method, device and system and wireless earphone box |
CN111866657A (en) * | 2020-08-31 | 2020-10-30 | 惠州市品能新能源有限公司 | Production method of universal bone conduction Bluetooth headset |
CN111866657B (en) * | 2020-08-31 | 2023-08-29 | 惠州市品能新能源有限公司 | Production method of universal bone conduction Bluetooth headset |
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Application publication date: 20140122 |