CN103531715A - Flexible photoelectric device substrate, flexible photoelectric device and preparation method - Google Patents
Flexible photoelectric device substrate, flexible photoelectric device and preparation method Download PDFInfo
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- CN103531715A CN103531715A CN201310099161.6A CN201310099161A CN103531715A CN 103531715 A CN103531715 A CN 103531715A CN 201310099161 A CN201310099161 A CN 201310099161A CN 103531715 A CN103531715 A CN 103531715A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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Abstract
The invention discloses a flexible photoelectric device substrate, a flexible photoelectric device and a preparation method. The flexible photoelectric device substrate comprises a glass baseplate and a metal thin film which is used for buffering expansion amount difference between a macromolecule thin film and the glass baseplate so that the macromolecule thin film can be prevented from falling off from the glass baseplate. The metal thin film is arranged on the edge area of the surface of the glass baseplate. The metal thin film is enclosed on the surface of the glass baseplate so that a panel forming area used for processing the flexible photoelectric device is formed. The flexible photoelectric device substrate is used for preparing the flexible photoelectric device. With application of the flexible photoelectric device substrate, the macromolecule thin film can be prevented from falling off from the glass baseplate. The flexible photoelectric device substrate provided by the invention is applicable to preparation of an OLED, OLED lighting, electronic paper display, a touch screen and other non-display technologies.
Description
Technical field
The present invention relates to flexible photoelectric device preparation field, relate in particular to a kind of flexible photoelectric device substrate, flexible photoelectric device and preparation method.
Background technology
Organic luminescent device (hereinafter to be referred as OLED) is mainly used in the screen of 5 inches of following small size smart mobile phones at present, is just challenging 10 inches of above large size panels simultaneously.So far the maximum OLED screen that the mankind make reaches more than 50 inches, as: 56 inches of OLED TV of Samsung, LG 55 inches and Sony, Panasonic.But in large scale display screen field, LCD(liquid crystal display) be the product of current main flow, because LCD outclass OLED aspect cost performance, make OLED be difficult to come into the market.And flexible demonstration is one of main direction of OLED and LCD product differentiation.OLED is active luminescent device, and thickness of detector is generally less than 0.2 μ m, therefore, as long as select the substrate of suitable material and thickness, just can produce ultra-thin flexible photoelectric device.
The manufacture method of active-matrix mode the earliest (AM:Active Matrix) flexible photoelectric device is: plastic substrate is adhered on carrier by adhesive, on plastic substrate, make device, after element manufacturing completes, separated plastic substrate and carrier, obtain flexible photoelectric device.Adopt the shortcoming that has in this way following three aspects:: 1. in manufacturing process, contraposition is difficult; 2. there is cull phenomenon after separated with carrier in plastic substrate; 3.TFT-array(liquid crystal layer) engineering is temperature limited, directly causes the mobility of TFT (Thin Film Transistor (TFT)) device less.
In order to overcome the above problems, a kind of high temperature-resistant polymer film (as: PI(polyimides) is researched and developed in this area), and develop the technique that adopts the method applying to form macromolecule membrane on glass substrate.The method that adopts fire resistant polymer film to make flexible photoelectric device at present is mainly classified as two large classes, a kind of is as shown in Figure 1, applied separating layer 20 (DBL:Debonding Layer), by the method for cutting, make macromolecule membrane 30 separated with glass substrate 10, obtain flexible photoelectric device.Another kind method is as shown in Figure 2, on glass substrate 10, deposit sacrifice layer 32(sacrifice layer is formed by a-Si, metal oxide or metal alloy), on sacrifice layer 32, apply macromolecule membrane 30, on macromolecule membrane layer 30, make device, after element manufacturing completes, the chemical bond rupture that makes 32 of macromolecule membrane 30 and sacrifice layers by Ear Mucosa Treated by He Ne Laser Irradiation, makes macromolecule membrane 30 from glass substrate 10 separation, obtains flexible photoelectric device.
By above method, can on the less product line of glass substrate size, make flexible photoelectric device, but due to macromolecule membrane (> 15ppm/ ℃) and glass substrate (3ppm/ ℃) between thermal coefficient of expansion differ larger, in TFT-array manufacture process through variations in temperature repeatedly, there is projection, the phenomenon especially coming off at substrate surrounding generation macromolecule membrane in polymeric membrane.And substrate repeatedly contacts with the liquid soup such as the various acid (as: nitric acid, acetic acid, phosphoric acid etc.) of pure water, developer solution, etching series, stripper (60～70 ℃), dilution in TFT-array engineering process, be difficult to guarantee that macromolecule membrane adheres on glass substrate closely all the time in whole engineering process.Once breach occurs in somewhere, macromolecule membrane will start to peel off from glass substrate from indentation, there, and before TFT-array engineering finishes, macromolecule membrane is likely peeled off completely from glass substrate, is therefore difficult to produce in batches.This phenomenon more easily occurs on large-sized glass substrate, and even more serious.Due to above reason, although industry is goed deep into and studied widely flexible display technologies, also in volume production, succeed.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of flexible photoelectric device substrate, flexible photoelectric device and preparation method, described flexible photoelectric device substrate is for the preparation of flexible photoelectric device, adopt described flexible photoelectric device substrate can in preparation process, prevent that macromolecule membrane from coming off from flexible photoelectric device substrate, be intended to solve macromolecule membrane in the preparation process of existing flexible photoelectric device and easily from glass substrate, peel off and cause producing failed problem.
Technical scheme of the present invention is as follows:
A kind of flexible photoelectric device substrate, described flexible photoelectric device substrate is for the preparation of flexible photoelectric device, in preparing flexible photoelectric device process, on flexible photoelectric device substrate, can form one deck macromolecule membrane, wherein, described flexible photoelectric device substrate comprises glass substrate and for cushioning the poor metallic film of swell increment between macromolecule membrane and glass substrate, to prevent that macromolecule membrane from coming off from glass substrate; Described metallic film is arranged at the fringe region of described glass baseplate surface, and described metallic film encloses the panel formation district that is formed for processing described flexible photoelectric device at described glass baseplate surface.
Described flexible photoelectric device substrate, wherein, described metallic film is that employing thermal coefficient of expansion is 5 * 10
-6~ 20 * 10
-6the metal material of mm/ ℃ forms.
Described flexible photoelectric device substrate, wherein, described metal material is copper, chromium, molybdenum, tungsten or albronze.
Described flexible photoelectric device substrate, wherein, described panel forms in district and comprises that a plurality of unit panels for the preparation of single flexible photoelectric device form district and a plurality of unit panel forms the non-panel bond regions forming between district; On described non-panel bond regions, be provided with for alleviating the poor metallic film of swell increment between macromolecule membrane and glass substrate.
Described flexible photoelectric device substrate, wherein, the thickness of described metallic film is 100 ~ 500nm.
Described flexible photoelectric device substrate, wherein, the surface deposition of described glass substrate forms one deck sacrifice layer; Described sacrifice layer is arranged between described glass substrate and metallic film.
A preparation method for flexible photoelectric device substrate as above, wherein, comprises the following steps:
Select metal material between thermal coefficient of expansion Jie and macromolecule membrane and glass substrate, adopt described metal material sputter layer of metal layer on described glass substrate, through photoresist coating, exposure, development, etching, the fringe region of described glass baseplate surface forms layer of metal film.
The preparation method of described glass substrate, wherein, before sputter layer of metal layer, further comprising the steps of on described glass substrate:
On described glass substrate, deposit forms sacrifice layer.
A preparation method for flexible photoelectric device, wherein, the preparation of described flexible photoelectric device comprises the preparation process of flexible photoelectric device substrate, described flexible photoelectric device substrate adopts preparation method's preparation of flexible photoelectric device substrate as above.
, wherein, described flexible photoelectric device adopts flexible photoelectric device substrate as above.
Beneficial effect: a kind of new flexible photoelectric device substrate provided by the present invention, for the preparation of flexible photoelectric device, can effectively prevent that macromolecule membrane from coming off from described flexible photoelectric device substrate.The inventive method is not only suitable for the preparation of large scale flexible photoelectric device, is also applicable to make a plurality of flexible photoelectric devices on large scale flexible photoelectric device substrate.The flexible photoelectric device substrate that the present invention proposes, except being applicable to the display preparation of OLED, also can be applicable in OLED illumination, Electronic Paper demonstration, touch-screen and other non-display technology.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that available technology adopting patterning method is prepared flexible photoelectric device.
Fig. 2 is the schematic diagram that available technology adopting laser irradiation is prepared flexible photoelectric device.
Fig. 3 is in the preparation method of flexible photoelectric device of the present invention, forms the planar structure schematic diagram after metal film on glass substrate.
Fig. 4 is the planar structure schematic diagram that a plurality of metal films and unit panel form district's complementation on large scale flexible photoelectric device substrate.
Fig. 5 is in the preparation method of flexible photoelectric device of the present invention, forms the sectional view after metal film and separating layer on glass substrate.
Fig. 6 is in the preparation method of flexible photoelectric device of the present invention, forms the sectional view after macromolecule membrane layer on flexible photoelectric device substrate.
Fig. 7 is in the preparation method of flexible photoelectric device of the present invention, the sectional view after encapsulation.
Fig. 8 is in the preparation method of flexible photoelectric device of the present invention, by flexible base, board cutting and with the sectional view of separation layer.
Fig. 9 be in another embodiment of the present invention by the macromolecule membrane layer sectional view separated with sedimentary deposit.
Embodiment
The invention provides a kind of flexible photoelectric device substrate, flexible photoelectric device and preparation method, for making object of the present invention, technical scheme and effect clearer, clear and definite, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The present invention is in the process of characteristic between research macromolecular material and various metallic surface, confirm by experiment between some metal materials and macromolecule membrane, to there is good adhesiveness, thereby proposed a kind of flexible photoelectric device and made flexible photoelectric device substrate of use and preparation method thereof, described flexible photoelectric device substrate is not only suitable for the preparation of large scale flexible photoelectric device, is also applicable to make a plurality of flexible photoelectric devices on large-sized flexible photoelectric device substrate.
Particularly, the present invention is by glass substrate or sputter layer of metal layer on the glass substrate of deposit sacrifice layer (as: a-Si, metal oxide or metal alloy), through photoresist coating, exposure, development, etching process, in glass baseplate surface surrounding, form the metal film that a layer thickness is 100 ~ 500nm, obtain described flexible photoelectric device substrate, then at described flexible photoelectric device substrate coating organic polymer solution, through drying, form after macromolecule membrane, form luminous electron device (as: OLED) thereon.Because the coefficient of expansion between macromolecule membrane and metal film differs less, and adhesion strength is strong, and formed macromolecule membrane can not be stripped from the process of preparation TFT technique, thereby can guarantee successfully to complete the preparation of flexible photoelectric device.After all engineerings finish, adopt original method (cutting or Ear Mucosa Treated by He Ne Laser Irradiation) that flexible photoelectric device is peeled off from carrier.In the method, after flexible photoelectric device is peeled off, flexible photoelectric device substrate is put into organic solvent, remove macromolecule membrane, former sputter has the flexible photoelectric device substrate of metal (or alloy) still can reuse.
Therefore, a kind of flexible photoelectric device substrate is provided in the present invention, described flexible photoelectric device substrate is for the preparation of flexible photoelectric device, as shown in Figure 3, described flexible photoelectric device substrate comprises glass substrate 1 and for cushioning the poor metallic film 11 of swell increment between macromolecule membrane and glass substrate, prevents that macromolecule membrane from coming off from glass substrate; Described metallic film is arranged at the fringe region on described glass substrate 1 surface, and described metallic film encloses the panel formation district 111 that is formed for processing described flexible photoelectric device on described glass substrate 1 surface.As another embodiment, described flexible photoelectric device substrate also comprises one deck sacrifice layer, described sacrifice layer is arranged between described glass substrate and described metallic film, is on the surface of described sacrifice layer, to have formed for processing the panel of described flexible photoelectric device to form district.Like this, described metallic film is poor for cushioning between macromolecule membrane and glass substrate swell increment exactly, prevents that macromolecule membrane from coming off from sacrifice layer.
Wherein, described metallic film is to adopt the metal material between its thermal coefficient of expansion Jie and macromolecule membrane and glass substrate to form, and the thermal coefficient of expansion of described metal material is 5 * 10
-6~ 20 * 10
-6mm/ ℃ (20 ℃).Described metal material can be copper, chromium, molybdenum, tungsten or albronze etc.
While making flexible photoelectric device on large-sized flexible photoelectric device substrate, due to the panel of glass substrate 1 form the interior meeting in region 111 include a plurality of unit panels for the preparation of single flexible photoelectric device form district and and a plurality of unit panel form the non-Display panel district forming between district, therefore, the coefficient of expansion between the macromolecule membrane in non-Display panel district and lower floor's contact layer (glass substrate or sacrifice layer) is poor larger, on glass substrate 1, macromolecule membrane can produce projection, and subsequent device technique and device property are exerted an influence.In order to address the above problem, can be formed for alleviating the poor metal film of swell increment between macromolecule membrane and glass substrate in the non-Display panel district on described glass substrate or sacrifice layer, the region that metal material forms forms district with unit panel and becomes complementary, formed metal film pattern can as shown in Figure 4, can be alleviated the damage of the macromolecule membrane being caused by coefficient of expansion difference so effectively.For easy, in Fig. 4, only draw 4 unit panels and form districts, for multiple unit panel more, form the situation in district, the like.Therefore, also provide a kind of flexible optoelectronic display in the present invention, described flexible optoelectronic display adopts flexible photoelectric device substrate provided by the present invention as display base plate.
In the present invention, also provide the preparation method of described flexible photoelectric device substrate: select metal material between thermal coefficient of expansion Jie and macromolecule membrane and glass substrate, adopt described metal material vacuum sputtering layer of metal layer on described glass substrate, through photoresist coating, exposure, development, etching, the fringe region of described glass baseplate surface forms the metallic film of one deck.As another embodiment, before sputter layer of metal layer, further comprising the steps of on described glass substrate: on glass substrate, deposit forms sacrifice layer.
In the present invention, also provide the application of described flexible photoelectric device substrate, the preparation by described glass substrate for flexible photoelectric device and luminescent device.Further, the concrete preparation method of described flexible photoelectric device substrate when for the preparation of flexible photoelectric device is also provided in the present invention, the preparation of described flexible photoelectric device comprises the preparation process of flexible photoelectric device substrate, and described flexible photoelectric device substrate adopts preparation method's preparation of flexible photoelectric device substrate as above.
Particularly, the preparation method of flexible photoelectric device substrate of the present invention, specifically comprises the following steps:
On glass substrate 1, be formed for the auxiliary fixedly metal film 11 of macromolecule membrane, it is flexible photoelectric device substrate of the present invention, as shown in Figure 3, described metal film 11 is arranged in the fringe region of described glass substrate 1, and described metallic film 11 encloses the panel formation district 111 that is formed for processing described flexible photoelectric device on described glass substrate 1 surface;
At described panel, form the interior formation separating layer in district 111 (DBL) 2, as shown in Figure 5;
In one side at glass substrate 1 with metal film 11, be coated with organic polymer liquid medicine, form smooth macromolecule membrane layer 3, as shown in Figure 6;
On described macromolecule membrane layer 3, process electronic device 4, as shown in Figure 7;
Encapsulation, as shown in Figure 7, wherein this encapsulation process is on the surface of electronic device 4 and macromolecule membrane layer 3 around thereof, to be stained with a flexible package film 5 for preventing that device from contacting with air; Described flexible package film 5 can be a flexible package lid or other encapsulating material (as package adhesive tape);
On flexible package film 5, along the big or small edge cuts of flexible photoelectric device, as shown in Figure 8, by described macromolecule membrane layer 3(, be the flexible base, board of flexible photoelectric device) peel off with described glass substrate 1, whole flexible photoelectric device is come off, form flexible photoelectric device.
Finally, by putting into organic solvent with the flexible photoelectric device substrate of residue macromolecule membrane layer 3, remove macromolecule membrane, former sputter has the flexible photoelectric device substrate of metal film still can reuse.
The preparation method of another kind of flexible photoelectric device is also provided in the present invention, as shown in Figure 9, specifically comprises the following steps:
On glass substrate 1, deposit forms sacrifice layer 22;
On sacrifice layer 22, be formed for the auxiliary fixedly metal film 11 of macromolecule membrane, it is flexible photoelectric device substrate of the present invention, described metal film 11 is arranged in the fringe region of described sacrifice layer 22, described metal film 11 is annular, and the panel that is formed for processing flexibility photoelectric device device in the metal film 11 of described annular forms district;
In one side at glass substrate 1 with metal film 11, be coated with organic polymer liquid medicine, form smooth macromolecule membrane layer 23;
On described macromolecule membrane layer 23, process electronic device 24;
Encapsulation, wherein this encapsulation process is on the surface of electronic device 24 and macromolecule membrane layer 23 around thereof, to be stained with a flexible package film 25 for preventing that device from contacting with air;
Described glass substrate 1 is carried out to Ear Mucosa Treated by He Ne Laser Irradiation, is the flexible base, board of flexible photoelectric device by described macromolecule membrane layer 23() and described flexible photoelectric device substrate desquamation, whole flexible photoelectric device is come off, form flexible photoelectric device.
The material that the inventive method is used and technique are continued to use the existing material and technology of current TFT-array production line completely, therefore need not additionally increase equipment and material category, and technique are simple, control easily.The preparation method of the flexible photoelectric device that the present invention proposes, shows preparation except being applicable to OLED, also can be applicable in the manufacturing process of OLED lighting apparatus, and in TFT, Electronic Paper demonstration, touch-screen and other non-display technology.
The method proposing in the present invention, material therefor and technique are continued to use the existing material and technology of current TFT-array production line completely, technique is simple, control easily, but also can realize on large scale flexible photoelectric device substrate, make flexible device, sputter simultaneously has the flexible photoelectric device substrate of metallic film to reuse.
Should be understood that, application of the present invention is not limited to above-mentioned giving an example, and for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (10)
1. a flexible photoelectric device substrate, described flexible photoelectric device substrate is for the preparation of flexible photoelectric device, in preparing flexible photoelectric device process, on flexible photoelectric device substrate, can form one deck macromolecule membrane, it is characterized in that, described flexible photoelectric device substrate comprises glass substrate and for cushioning the poor metallic film of swell increment between macromolecule membrane and glass substrate, to prevent that macromolecule membrane from coming off from glass substrate; Described metallic film is arranged at the fringe region of described glass baseplate surface, and described metallic film encloses the panel formation district that is formed for processing described flexible photoelectric device at described glass baseplate surface.
2. flexible photoelectric device substrate according to claim 1, is characterized in that, described metallic film is that employing thermal coefficient of expansion is 5 * 10
-6~ 20 * 10
-6the metal material of mm/ ℃ forms.
3. flexible photoelectric device substrate according to claim 2, is characterized in that, described metal material is copper, chromium, molybdenum, tungsten or albronze.
4. flexible photoelectric device substrate according to claim 1, is characterized in that, described panel forms in district and comprises that a plurality of unit panels for the preparation of single flexible photoelectric device form district and a plurality of unit panel forms the non-panel bond regions forming between district; On described non-panel bond regions, be provided with for alleviating the poor metallic film of swell increment between macromolecule membrane and glass substrate.
5. flexible photoelectric device substrate according to claim 1, is characterized in that, the thickness of described metallic film is 100 ~ 500nm.
6. according to the arbitrary described flexible photoelectric device substrate of claim 1 ~ 5, it is characterized in that, the surface deposition of described glass substrate forms one deck sacrifice layer; Described sacrifice layer is arranged between described glass substrate and metallic film.
7. a preparation method for flexible photoelectric device substrate as claimed in claim 1, is characterized in that, comprises the following steps:
Select metal material between thermal coefficient of expansion Jie and macromolecule membrane and glass substrate, adopt described metal material sputter layer of metal layer on described glass substrate, through photoresist coating, exposure, development, etching, the fringe region of described glass baseplate surface forms layer of metal film.
8. the preparation method of glass substrate according to claim 7, is characterized in that, before sputter layer of metal layer, further comprising the steps of on described glass substrate:
On described glass substrate, deposit forms sacrifice layer.
9. the preparation method of a flexible photoelectric device, it is characterized in that, the preparation of described flexible photoelectric device comprises the preparation process of flexible photoelectric device substrate, and described flexible photoelectric device substrate adopts preparation method's preparation of flexible photoelectric device substrate as claimed in claim 7.
10. a flexible photoelectric device, is characterized in that, described flexible photoelectric device adopts flexible photoelectric device substrate as claimed in claim 1.
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| WO2016026208A1 (en) * | 2014-08-21 | 2016-02-25 | 京东方科技集团股份有限公司 | Manufacturing method of flexible display and flexible display |
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| CN105932079B (en) * | 2016-07-08 | 2017-09-29 | 天津三安光电有限公司 | Flexible multijunction solar cell and preparation method thereof |
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