CN103531546A - Module structure with pierced substrate on chip - Google Patents
Module structure with pierced substrate on chip Download PDFInfo
- Publication number
- CN103531546A CN103531546A CN201210236200.8A CN201210236200A CN103531546A CN 103531546 A CN103531546 A CN 103531546A CN 201210236200 A CN201210236200 A CN 201210236200A CN 103531546 A CN103531546 A CN 103531546A
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- Prior art keywords
- substrate
- chip
- hollow out
- modular structure
- sees
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
The invention discloses a module structure with a pierced substrate on a chip. The module structure comprises a first substrate, a chip, a second substrate, a transparent substrate and a lens rack, wherein the chip is arranged on the first substrate and provided with a first contact pad and a sensing area; the second substrate is arranged on the first substrate and the chip and provided with a groove structure, a perforated structure and a second contact pad, the chip is arranged on the groove structure, the first contact pad is electrically connected with a second contact pad through a welding wire, the first contact pad and the sensing area are bared on the perforated structure; the transparent substrate is arranged on the second substrate and is approximately aligned to the sensing area; and the lens rack is arranged on the second substrate, and a lens is arranged above the lens rack and approximately aligned to the transparent substrate and the sensing area.
Description
Technical field
The present invention relates to a kind of semiconductor assembly structure, particularly a kind of lens mount and image sensor integrated is to reduce the modular structure of hollow out substrate on the chip of size of components.
Background technology
Semiconductor technology is fast-developing, and in traditional flip chip structure, tin nodule number group is formed at the surface of crystal grain, sees through the pattern that traditional tin cream is wanted with formation by tin ball cover screen making.Encapsulation function comprises heat radiation, signal transmission, power distribution, protection etc., when chip more complicated, traditional encapsulation as leaded package, soft encapsulation, rigidity encapsulation, cannot meet the demand of high density small-size chips.Wafer level packaging is senior encapsulation technology, and its crystal grain of mat lies on wafer to be manufactured and test, and then mat cutting and separated for assembling in surface mount production line.Because Wafer level packaging utilizes whole wafer as target, but not utilize one chip or crystal grain, therefore, before carrying out separable programming, encapsulation and test complete all.In addition, wafer-level packaging is advanced techniques so, so the program that routing engages, crystal grain sticks together and fill bottom can be omitted.Mat utilizes Wafer level packaging, and the end-results size that can reduce cost and manufacturing time and wafer-level packaging can be equivalent to grain size, so technology can meet the microminiaturized demand of electronic installation.
Now the Flip Chip system for camera module carries out the processing procedure of tie lines projection (stud bump) on full wafer wafer with routing device, by tie lines projection, replaces tin ball.
By Electronic Encapsulating Technology, CMOS field-effect transistor (CMOS) image sensor dice system is made among CMOS image sensor module.This module is applied in various electronic products, and the required encapsulation specification demands of CMOS image sensor module depends on the characteristic of this product.The tendency of especially nearest CMOS image sensor module, high electrical performance power, miniaturization, high density, low-power consumption, multi-functional, high speed signal is processed and reliability etc., is the characteristic feature of the miniaturization of electronic product.
In contrast to general CMOS chip, CMOS image sensor physical environment is in the past feasible, so may be by contaminating impurity; When its size is not considered to important, the encapsulation of leadless chip carrier LCC kenel can be used.Yet, in nearest market trend, require the feature of thinning and simplification, for example camera cell phone, intelligent mobile phone, chip on board (chip-on-board:COB), chip-on-film (chip-on-film:COF) or chip size packages (CSP) etc., be also used at large.
In current composite packing structure, though can reduce the height of modular structure, the machinery equipment of chip package is too expensive and its volume production speed (Unit Per Hour) is excessively slow.Therefore, its investment needs huge funds, and yield is low and wayward.
According to the shortcoming of above known techniques, the present invention proposes the modular structure of hollow out substrate on a kind of brand-new chip, without newly-increased cost of investment, and can obtain preferably process rate.
Summary of the invention
In view of above-mentioned shortcoming, an object of the present invention is to provide the modular structure of hollow out substrate on a kind of chip, has the modular structure height of less (thin).
Another object of the present invention is to provide hollow out substrate module structure on the chip of an integration lens mount and image sensor, to promote yield, reliability and to reduce modular structure size.
Still a further object of the present invention is to provide hollow out substrate module structure on have good thermal efficiency (thermal performance), the with low cost and easy chip of processing procedure.
For achieving the above object, the present invention by the following technical solutions:
A modular structure for hollow out substrate on chip, comprising: a first substrate; One chip, is disposed on first substrate, has one first contact pad and a sensing region; One second substrate, be disposed on first substrate and chip, there is groove structure, the first perforation structure, the second perforation structure and the second contact pad, its chips is placed in groove structure, the first contact pad sees through a sealing wire and is electrically connected the second contact pad, the first contact pad is exposed to the first perforation structure, and sensing region is exposed to the second perforation structure; And a lens mount, being disposed on second substrate, lens are positioned at the top of lens mount and aim at transparency carrier and sensing region.
Above-mentioned modular structure also comprises that at least one passive component or driving component are disposed on this first substrate and/or second substrate.First substrate sees through a conductive layer and is attached on second substrate, to be electrically connected each other.The material of second substrate comprises epoxide resin type FR5 or FR4 (glass-fiber-fabric epoxy resin), bismaleimides-triazine resin (BT), printed circuit board (PCB), glass, silicon or pottery.In addition, first substrate is a printed circuit board (PCB) or flexible printed wiring board, has a wire on first substrate.Chip sees through an adhesion layer and is attached on first substrate.Lens mount sees through an adhesion layer and is attached on second substrate.
The above be illustrate object of the present invention, reach this object technological means, with and the advantage that produces etc.And the present invention can and follow from the narration of following preferred embodiment accompanying drawing formula and claim reader is had a clear understanding of.
Accompanying drawing explanation
Said modules, and this creation further feature and advantage, by read execution mode content and graphic after, will be more obvious:
Fig. 1 is the schematic cross-section of composite packing structure.
Fig. 2 is the schematic cross-section of the composite packing structure of another example.
Fig. 3 is according to the sectional view of the modular structure of hollow out substrate on the chip of integration lens mount of the present invention and image sensor.
Fig. 4 is the sectional view of the modular structure of hollow out substrate on the chip of integration lens mount according to another embodiment of the present invention and image sensor.
Fig. 5 is the top view of the substrate of embodiments of the invention.
Primary clustering symbol description
100 composite packing structure 101,201 lens 102,202 transparency carrier 103 holder parts
104,204 lens mount 105,206 chip 106,211 substrate 107 passive components
108 conductive layer 109 printed circuit board (PCB)s 110,210a conductive layer 111 heat dissipating layers
On 200 chips 204 of hollow out substrate, 204b adhesion layer 204c, 204d contact pad 204e adhesion layer (glue) pattern
Modular structure
205 sealing wire 206a sensing region 207,208 driving components or by 209 hollow out substrates
Moving assembly
210 adhesion layers (glue) pattern 220a, 220b, 220c opening 230 welding regions
Region
Embodiment
The present invention is by cooperation embodiment and graphic being specified in down of enclosing.Should the person of understanding be that in the present invention, all embodiment are only the use of illustration, not in order to restriction.Therefore the embodiment in literary composition, the present invention also can be widely used in other embodiment.And the present invention is not limited to any embodiment, should be with the claim of enclosing and equivalent fields thereof and determine.
The modular structure of hollow out substrate on a kind of chip (pierced substrate on chip module structure), this structure can utilize the processing procedure of chip direct package (chip-on-board:COB) to complete.Chip direct package is a kind of mode of integrated antenna package, and it is that chip is directly attached on circuit board or substrate, can effectively the packaging and testing step of chip be transferred to circuit board assembling and carry out afterwards.
Fig. 1 is the sectional view of composite packing structure.As shown in Figure 1, wherein composite packing structure 100 comprises substrate 106, chip 105, passive component 107, lens mount 104, lens 101 and transparency carrier 102.Substrate 106 has formation groove structure in the inner with receiving chip 105 and conductive layer 108.Chip 105 is formed under substrate 106 with conductive layer 108, the electric contact mat that wherein conductive layer 108 is electrically connected on substrate 106 and chip 105.Lens mount 104 comprises a holder part 103, for fixed lens 101.At least one passive component 107 can form on (adhering to) substrate 106 in lens mount 104.Lens 101 are formed at the top of lens mount 104.In addition, transparency carrier 102, is optionally disposed in lens mount 104, and between lens 101 and chip 105.Lens mount 104 can utilize an adhesion layer to be attached on substrate 106.
Fig. 2 shows the sectional view of the composite packing structure of another example.As shown in Figure 2, in the present example, composite packing structure also comprises a printed circuit board (PCB) 109 (having wire on it to be electrically connected other electronic unit), conductive layer 110 and heat dissipating layer 111.Between chip 105 and printed circuit board (PCB) 109, there is a heat dissipating layer 111 to be beneficial to heat radiation.First substrate 106 sees through a conductive layer 110 and is attached on second substrate 109, to be electrically connected each other.
Fig. 3 shows according to the sectional view of the modular structure of hollow out substrate on the chip of integration lens mount of the present invention and image sensor.As shown in Figure 3, wherein the modular structure of transparency carrier on chip 200 integrated lens mounts and image sensor and become a modular structure with photosensitization, and it can be applied to the camera module of mobile phone.Wherein the modular structure 200 of transparency carrier on chip comprises hollow out substrate 209 and substrate 211, chip 206, driving component or passive component 207 and 208, lens mount 203, lens 201 and transparency carrier 202.
For an embodiment, substrate 209 has formation groove structure in the inner, to receive or to hold within chip 206 and driving component or passive component 208 be disposed at this groove structure, having with perforation structure sensing (initiatively) region 206a and the contact pad 204d that open area (open area) 220a, 220b, 220c be beneficial to chip 206 can be out exposed, as shown in Figure 5.The position of perforate (mouth) and quantity are only for signal is not in order to limit the present invention.The size of substrate 209 is large compared with the size of chip.For example, above-mentioned perforation structure ( open area 220a, 220b, 220c) can be formed among substrate 209 by processing procedures such as punching or borings.Above-mentioned open area 220a, 220b and 220c aim at respectively sensing region 206a, contact pad (I/O pad) 204d.In addition, on substrate 209, form a contact pad 204c.Based on thering is groove structure in substrate 209, therefore there is more space can hold electronic building brick, to be disposed in modular structure.
Wherein sealing wire 205 is electrically connected contact pad 204c on substrates 209 and the contact pad 204d on chip 206.Wherein contact pad 204c system is formed on the welding region (wire bonding area) 230 on substrate 209.Transparency carrier 202 is formed on substrate 209.One adhesion layer 204b is formed on substrate 209, and transparency carrier 202 is to be attached on substrate 209 by adhesion layer 204b.Transparency carrier 202 is for example a glass substrate or the formed substrate of other transparent material, is formed on substrate 209 with covering sensing region 206a, the gap (pothole) between result generation transparency carrier 202 and sensing region 206a.Transparency carrier 202 covers the sensing region 206a of image sensing chip 206, can reduce particle pollution with Lifting Modules block structured yield.Transparency carrier 202 can be identical with sensing region 206a area occupied or slightly larger than it.In addition, at least one passive component 207 can optionally form on (adhering to) substrate 209 in lens mount.
Transparency carrier (glass substrate) 202 can be circular or square kenel.Transparency carrier (glass substrate) 202 can optionally be coated with the use that infrared coating is usingd as filtering, for example, be infrared filter, for filtering the light wave of a certain wave band of scioptics 201.
As shown in Figure 4, another embodiment that shows the modular structure of hollow out substrate on chip of the present invention.In the present embodiment, substrate 209 is to be attached on chip 206 surfaces.In the present embodiment, between substrate 209 and chip 206 surfaces, be to stick each other through adhesion layer (glue) pattern 204e.Chip 206 also forms (adhering to) on substrate 211 simultaneously; That is substrate 209 is attached on substrate 211 together with conductive layer 210 with chip 206.Similar the 3rd figure of other structure, so detailed description omission.
In one embodiment of this invention, substrate 209 is a printed circuit board (PCB), its material can be organic substrate, for example, have the epoxide resin type FR5 of default perforate or FR4 (glass-fiber-fabric epoxy resin), bismaleimides-triazine resin (BT Bismaleimide Triazine).In addition, glass, pottery and silicon can also be as the materials of substrate 209.
Advantage of the present invention comprises: the modular structure height with less (thin), there is more space and can hold assembly, utilize at present easily and more cheap sealing wire processing procedure good thermal efficiency, with low cost and processing procedure is simple and easy, easily make multi-chip package.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (14)
1. a modular structure for hollow out substrate on chip, is characterized in that comprising:
One first substrate;
One chip, is disposed on first substrate, has one first contact pad and a sensing region;
One second substrate, be disposed on this first substrate and chip, there is groove structure, the first perforation structure, the second perforation structure and the second contact pad, its chips is placed in groove structure, this first contact pad sees through a sealing wire and is electrically connected the second contact pad, this first contact pad is exposed to the first perforation structure, and sensing region is exposed to the second perforation structure; And
One lens mount, is disposed on second substrate, and lens are positioned at the top of lens mount and aim at sensing region.
2. the modular structure of hollow out substrate on chip as claimed in claim 1, characterized by further comprising at least one assembly, be disposed on first substrate or second substrate or first substrate and second substrate on the two, this assembly is a passive component or a driving component.
3. the modular structure of hollow out substrate on chip as claimed in claim 1, is characterized in that described first substrate sees through a conductive layer and is attached on second substrate.
4. the modular structure of hollow out substrate on chip as claimed in claim 1, it is characterized in that described first substrate is a printed circuit board (PCB) or a flexible printed wiring board, second substrate is a printed circuit board (PCB), the material of second substrate comprises glass-fiber-fabric epoxy resin, bismaleimides-triazine resin, glass, silicon or pottery, wherein on printed circuit board (PCB) or flexible printed wiring board, has its wire separately.
5. the modular structure of hollow out substrate on chip as claimed in claim 1, is characterized in that described chip sees through a conductive layer or non-conductive adhesion layer is attached on first substrate.
6. the modular structure of hollow out substrate on chip as claimed in claim 1, is characterized in that described second substrate sees through an adhesion layer and is attached on chip.
7. the modular structure of hollow out substrate on chip as claimed in claim 1, is characterized in that described lens mount sees through an adhesion layer and is attached on second substrate.
8. the modular structure of hollow out substrate on chip as claimed in claim 1, characterized by further comprising a transparency carrier, is disposed on second substrate and chip, aims at sensing region.
9. the modular structure of hollow out substrate on chip as claimed in claim 8, characterized by further comprising at least one assembly, be disposed on first substrate or second substrate or first substrate and second substrate on the two, this assembly is a passive component or a driving component.
10. the modular structure of hollow out substrate on chip as claimed in claim 8, is characterized in that described first substrate sees through a conductive layer and is attached on second substrate.
The modular structure of hollow out substrate on 11. chips as claimed in claim 8, it is characterized in that described first substrate is a printed circuit board (PCB) or a flexible printed wiring board, this second substrate is a printed circuit board (PCB), the material of this second substrate comprises glass-fiber-fabric epoxy resin, bismaleimides-triazine resin, glass, silicon or pottery, wherein this printed circuit board (PCB) or this flexible printed wiring board on there is its wire separately.
The modular structure of hollow out substrate on 12. chips as claimed in claim 8, is characterized in that described chip sees through a conductive layer or non-conductive adhesion layer is attached on first substrate.
The modular structure of hollow out substrate on 13. chips as claimed in claim 8, is characterized in that described second substrate sees through an adhesion layer and is attached on chip.
The modular structure of hollow out substrate on 14. chips as claimed in claim 8, is characterized in that described lens mount sees through an adhesion layer and is attached on second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210236200.8A CN103531546B (en) | 2012-07-06 | 2012-07-06 | Module structure with pierced substrate on chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210236200.8A CN103531546B (en) | 2012-07-06 | 2012-07-06 | Module structure with pierced substrate on chip |
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| Publication Number | Publication Date |
|---|---|
| CN103531546A true CN103531546A (en) | 2014-01-22 |
| CN103531546B CN103531546B (en) | 2017-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210236200.8A Active CN103531546B (en) | 2012-07-06 | 2012-07-06 | Module structure with pierced substrate on chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742253A (en) * | 2014-12-10 | 2016-07-06 | 旭景科技股份有限公司 | Printed circuit board assembly with image sensor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1433081A (en) * | 2002-01-18 | 2003-07-30 | 胜开科技股份有限公司 | Image sensor and its packaging method |
| US20050258502A1 (en) * | 2004-05-20 | 2005-11-24 | Yung-Cheol Kong | Chip package, image sensor module including chip package, and manufacturing method thereof |
| TW200744374A (en) * | 2006-05-24 | 2007-12-01 | Advanced Semiconductor Eng | Detachable image sensor module and portable electronic apparatus applying the same |
| CN101620303A (en) * | 2008-06-30 | 2010-01-06 | 鸿富锦精密工业（深圳）有限公司 | Camera module |
-
2012
- 2012-07-06 CN CN201210236200.8A patent/CN103531546B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1433081A (en) * | 2002-01-18 | 2003-07-30 | 胜开科技股份有限公司 | Image sensor and its packaging method |
| US20050258502A1 (en) * | 2004-05-20 | 2005-11-24 | Yung-Cheol Kong | Chip package, image sensor module including chip package, and manufacturing method thereof |
| TW200744374A (en) * | 2006-05-24 | 2007-12-01 | Advanced Semiconductor Eng | Detachable image sensor module and portable electronic apparatus applying the same |
| CN101620303A (en) * | 2008-06-30 | 2010-01-06 | 鸿富锦精密工业（深圳）有限公司 | Camera module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742253A (en) * | 2014-12-10 | 2016-07-06 | 旭景科技股份有限公司 | Printed circuit board assembly with image sensor |
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| CN103531546B (en) | 2017-02-22 |
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