CN103524148A - Preparation method of surface metallized ceramic - Google Patents
Preparation method of surface metallized ceramic Download PDFInfo
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Abstract
The invention discloses surface metallized ceramic as well as a preparation method thereof. The method comprises the following steps: dipping a metallized treatment face of ceramic into aluminum or aluminum alloy melt, wherein the metallized treatment face moves relative to the melt, so that the aluminum or aluminum alloy melt wets the metallized treatment face of the ceramic; and then, moving the metallized treatment face of the ceramic out of the melt for freely cooling an aluminum or aluminum alloy liquid film attached to the surface to obtain the ceramic connected with the aluminum or aluminum alloy thin film on the surface. Compared with the prior art, no amorphous oxide impurities are available on the interface between the ceramic and the aluminum or aluminum alloy thin film, and grains of aluminum or aluminum alloy and ceramic grains directly grow together. The thin film formed is compact in internal tissue and free from oxide impurities. The aluminum or aluminum alloy thin film formed is several microns to dozens of microns in thickness, and the thin film is firm and not easy to fall. Experiments show that the chessboard partitioning and peeling strength of the aluminum or aluminum alloy thin film and the ceramic is greater than or equal to 4.1N/cm. The preparation method disclosed by the invention has a wide application prospect in the field of surface metallization of ceramic.
Description
The application is dividing an application that application number is 200910083280.6, the applying date is on April 30th, 2009, invention and created name is " a kind of surface metallised ceramic and manufacture method thereof ".
Technical field
The present invention relates to a kind of surface metallised ceramic and manufacture method thereof.
Background technology
Pottery has good heat conduction and insulating property, is a kind of good packaged material.During use, generally need to carry out surface metalation processing to pottery, to make circuit or welding electronic component.Traditional method for surface metallation has Precious Metal sintering process, Mo-Mn method, DBC method and active metal brazing method.Wherein Precious Metal sintering process is that noble metal powder is added to binding agent etc. again as silver powder and glass powder mix, and is mixed with slurry, is coated in ceramic surface, then at 900 ℃ of left and right sintering, forms surperficial layer of precious metal; Mo-Mn method is that molybdenum powder and oxidation manganese powder are hybridly prepared into slurry, is coated in ceramic surface, then at 1500 ℃ of sintering, forms surface metal molybdenum layer; DBC method is by the no-oxygen copper plate after oxygen-bearing copper or surface oxidation and ceramic plate lamination, then in inert atmosphere, is heated to 1070 ℃ of left and right, on copper material surface, forms Cu-Cu
2o eutectic liquation, utilizes this liquation as scolder, pottery and copper material to be linked together; Active metal brazing method is that silver, copper, titanium valve etc. are mixed with to slurry, is coated in ceramic surface, and the copper material that then superposes, is heated to 850 ℃ of left and right in a vacuum, makes the fusing of silver-copper-titanium braze, and pottery and copper coin are brazed together.The metal level that Precious Metal sintering process and Mo-Mn method form is thinner, is mainly used in the light current device package such as CPU; And DBC method and active metal brazing method can form thicker copper conductive layer, be mainly used in power electronic devices, as the encapsulation of IGBT module.
Aluminium is a kind of good electro-conductive material, is widely used in integrated circuit wiring.In addition, the yield strength of aluminium is lower, can reduce the thermal stresses of surface metallised ceramic intralamellar part by aluminium instead of copper, improves its thermal shock resistance.But because the chemical property of aluminium is very active, the equilibrium partial pressure of itself and oxygen is less than 10 in the temperature range below 1000 ℃
-40pa, even if at present obtainable high vacuum also cannot stop aluminum oxidation.Be subject to the impact of the primary oxide film in aluminium surface, aluminium and ceramic wettability are poor; The interface of linker pottery and aluminium exists amorphous oxide inclusion of aluminium, produce a large amount of macroscopic views and do not connect defect, large [the X.S.Ning of mechanical property change of linker, T.Okamoto, Y.Miyamoto, A.Koreeda, K.Suganuma, and S.Goda, Bond strength and interfacial structure of silicon nitride joints brazed with aluminium-silicon and aluminium-magnesium alloys, Journal of Materials Science, 26 volumes (1991) 2050-2054 page; E.Saiz; A.P.Tomsia; K.Sugamuma, Wetting and strength issues at Al/ α-alumina interfaces, J.European Ceramic Society 23 (2003) 2787-2796], affect its practical application.In order to eliminate the impact of aluminium surface film oxide, the human hairs such as Ning Xiaoshan understand interface non-oxidation method of attachment [X.S.Ning, C.Nagata, M.Sakuraba, T.Tanaka, K.Suganuma, M.Kimura; Chinese Patent No.68064, US Patent No.5965193, Korean Patent No.201887, Jpn Patent No.2918191, DE69529185T2, EU0676800B1].The feature of the method is that ceramic plate is inserted in aluminum melt and moved to remove the oxide film on aluminium surface, and ceramic surface is soaked by aluminum melt, and then the method by casting is connected on aluminum melt casting on ceramic plate.Adopt the method can realize pottery and be connected with the high-performance of aluminium, with the pottery that this method is produced, cover aluminium base and there is excellent thermal shock resistance [X.S.Ning, M.Kimura, M.Sakuraba, C.Nagata, Jpn Patent No.3430348; US Patent No.6183875], for the encapsulation of Hybrid Vehicle IGBT module.But aforesaid method also exists defect, preparing film, particularly thickness, to be less than the film of 0.1mm more difficult.This is because the method is used casting mold, and casting mold must choose with aluminium do not react, non-wetted material, if casting mold gap is too small, aluminium liquid cannot enter casting mold, so can not produce film.
Summary of the invention
As everyone knows, mobile can drive the liquid motion of periphery.Theoretical according to the non-slippage momentum transfer in interface, between the thickness (δ) of the fluid that the object moving drags (momentum boundary layer) and the viscosity (η) of speed of relative movement (V) and fluid, there is following relationship [D.R.Poirier and G.H.Geiger in fluid, " Transport Transport Phenomena in Material Processing ", TMS, (1994): P62-67]:
The density that wherein ρ is fluid, L is the characteristic length of solid in direction of motion.
Fig. 1 is the force analysis schematic diagram of the liquid film of mobile and surface adhesion while departing from fluid surface.The viscosity of supposing liquid is enough large, regards liquid film as an integral body, and the reactive force that liquid film is subject to has: the bonding force at liquid and object interface; The gravity of liquid film self; Suffered surface tension when liquid film departs from fluid surface.If the translational speed of object changes, liquid film also can be subject to the effect of the mass force of acceleration generation.Obviously, gravity, surface tension and mass force all hinder liquid film with object of which movement, only have the bonding force at liquid and object interface to be greater than their sums, and object just can drag liquid film and move together.Therefore, adopt the method for dipping to form liquid film at solid surface, its key is to have enough large bonding force between liquid film and solid, guarantees that interface does not produce slippage.Once just there will be snowslide phenomenon otherwise there is slippage, liquid film all come off.
Due to the size of interface binding power and the bonding state of liquid and solid interface closely related, and the character of the bonding state at interface and the character of liquid, solid surface, temperature, liquid and solid duration of contact etc. are relevant; The surface tension liquid body composition of liquid, the impact of ambiance; And the weight of liquid film is also because the kind difference of liquid has very big-difference, therefore cannot predict and whether can form specific liquid film on particular solid surface.
Contriver is through large quantity research, discovery is immersed ceramic metalized face in aluminum or aluminum alloy liquation and is moved, make the fully wetting ceramic metalized face of aluminum or aluminum alloy liquation, and then it is shifted out to aluminum or aluminum alloy liquation lentamente, cooling, can form one deck firmly aluminum or aluminum alloy film that bonds at ceramic surface, thereby complete the present invention.That is:
One of object of the present invention is to provide the pottery that a kind of surface is connected with aluminum or aluminum alloy film.
Described aluminum or aluminum alloy film solidifies and forms by sticking to the continuous liquid film of aluminum or aluminum alloy on pottery, and its thickness is between several microns～tens of microns.
The linkage interface of described pottery and aluminum or aluminum alloy film does not exist the non-crystal oxide from aluminium surface native oxide to be mingled with, and aluminum or aluminum alloy crystal grain is together with ceramic crystalline grain direct growth.
Described aluminum or aluminum alloy film and ceramic chessboard are cut apart stripping strength and are greater than 4.1N/cm.
Another object of the present invention is to provide a kind of method that makes ceramic surface connect aluminum or aluminum alloy film.
The method that makes ceramic surface connect aluminum or aluminum alloy film provided by the present invention, comprise following operation steps: ceramic metalized face is immersed in aluminum or aluminum alloy liquation, and make its relative liquation motion so that the wetting ceramic metalized face of aluminum or aluminum alloy liquation, and then ceramic metalized face is shifted out to liquation, make aluminium or uncommitted ground of the aluminium alloy liquid film natural condensation of its surface adhesion, obtain surface and be connected with several microns～tens of micron thickness, fine and close aluminium or the pottery of aluminum alloy films.
Wherein, describedly ceramic metalized face is immersed to method in aluminum melt or molten aluminium alloy specifically can be described pottery is moved vertically upward from filling the container bottom of described aluminum or aluminum alloy liquation inserts liquation inside.
Described pottery can be oxide ceramics, nitride ceramics or carbide ceramics.
Described operation is preferably in vacuum or inert gas atmosphere to be carried out.
The pottery that the surface that aforesaid method obtains connects aluminum or aluminum alloy film also belongs to protection scope of the present invention.Described surface connects the pottery of aluminum or aluminum alloy film, and its pottery does not have non-crystal oxide with the linkage interface of aluminum or aluminum alloy.
Compared with prior art, the present invention can provide the pottery of the aluminum or aluminum alloy film that surface adhesion has several microns～tens of micron thickness.This film is to be formed by the continuous aluminum or aluminum alloy liquid film natural coagulation that evenly sticks to ceramic surface, and inside does not have the microdefects such as oxide film is mingled with, pore, therefore has the good physical and mechanical properties that fine aluminium possesses.Figure 3 shows that to adopt pottery is immersed to the high resolution transmission electron microscope image of interface of linker of alumina-ceramic prepared by method mobile in aluminium liquid and aluminium and the electron diffraction spot of each microcell.Therefrom can find out, this interface does not have common soldering interface non-crystal oxide ubiquitous, that be derived from the primary oxide film in aluminium surface to be mingled with that [relevant common method for brazing interfacial oxide is mingled with can be referring to following document: X.S.Ning, K.Suganuma, M.Morita and T.Okamoto, Interfacial reaction between silicon nitride and aluminium, Philosophical Magazine letter, 55 volumes, (1987), 93-96 page; E.Saiz; A.P.Tomsia; K.Sugamuma, Wetting and strength issues at Al/ α-alumina interfaces, Journal of European Ceramic Society, 23 volumes (2003) 2787-2796 page], illustrate that the present invention has removed the primary oxide film on aluminium surface effectively.From this figure, it can also be seen that, aluminium and aluminum oxide react, coherent interface layer ((104) crystal face of alumina layer and (104) face coherence of original alumina-ceramic crystal grain that interface generates have been formed, (110) (111) face half coherence of face and aluminium), together with aluminium is grown on atomic scale with pottery.Theoretical Calculation shows: the coherent interface of aluminum oxide and aluminium has lower interfacial free energy and very high bonding force [W.Zhang; J.R.Smith; Nonsoichiometric Interfaces and Al
2o
3adhension with Al and Ag, Physical Review Letters, 85 volumes (2000) 3225-3228 page].These results of study show, adopt method of the present invention, can prevent generation of interfaces oxide inclusion, make aluminum or aluminum alloy film be grown directly upon ceramic surface, therefore firm difficult drop-off.The inventive method is simple to operate, time saving and energy saving, simple and practical.Therefore, the inventive method has broad application prospects in ceramic surface metallization field.
Accompanying drawing explanation
Fig. 1 is the applied external force schematic diagram that the liquid film of Solid Surface Adhesion is subject to.
Fig. 2 is the structural representation of ceramic surface metallization device.
Fig. 3 is the high resolution transmission electron microscope image microzone electron diffraction spot in the linkage interface region of alumina-ceramic and aluminium.
Embodiment
Inventive embodiments commercial-purity aluminium used, Al-20%Si aluminum silicon alloy, pure magnesium and all stupaliths all obtain from commercial channels.Al-20%Si alloy, pure magnesium, fine aluminium fusing that aluminium alloy adopts commercial sources to obtain are formulated.
The ceramic surface metallization apparatus structure using in part embodiment of the present invention is as shown in Figure 2:
This device is comprised of body of heater 1, bell 2, plumbago crucible 3, metallic resistance silk heating member 4, graphite guide rail 5, nitrogen inlet 6; Plumbago crucible is located in body of heater, and heating member is located at plumbago crucible surrounding; On plumbago crucible bottom, bottom of furnace body and bell, be equipped with the opening matching with guide rail, three openings are coaxial; Guide rail is arranged between plumbago crucible, body of heater and bell by opening, and is fixedly connected with them; Guide rail is two parallel plates, and its inside is provided with the groove passing through for ceramic plate, and the position that is positioned at crucible inside at it is provided with window 8, so that the aluminium alloy solution 9 in crucible contacts with the ceramic plate 7 in guide rail; In order to prevent graphite oxidation burning, body of heater and bell junction silica gel sealing, pass into nitrogen protection in stove.
The guide rail of beneath window and the gap between ceramic plate are 0.1mm, and this gap can guarantee that pottery moves freely in guide rail, and aluminium liquid can not flow out.Guide rail and the gap between ceramic plate of window top are 1.3mm, can guarantee that like this aluminium liquid of ceramic plate surface adhesion does not contact with guide surface, can solidify by naturally cooling.
Embodiment 1, adopt above-mentioned ceramic surface metallization device, fine aluminium (99.9%) is put into plumbago crucible, by alumina ceramic plate (long 137mm, wide 35mm, thick 0.64mm, Guangdong section of Tsing-Hua University produces, aluminum oxide purity is greater than 95%) be inserted through in the graphite guide rail of crucible, then (nitrogen flow rate is 20 liters/min) heating in nitrogen atmosphere, melts aluminium and is warmed up to 730 ℃.Another piece alumina ceramic plate is inserted to guide rail from the guide rail entrance of device bottom with the speed of 68.5mm/min, and the ceramic plate that promotes to insert in advance in guide rail moves vertically upward with same speed.In moving process, ceramic plate contacts with the aluminum melt in crucible by the window on guide rail, then with together with the aluminum melt of surface adhesion from guide rail top, releases, cooling, respectively forms the fine and close aluminium film that thickness is about 6 microns on the two sides of ceramic plate.Metallurgical analysis shows, aluminium film inside does not have the defects such as oxide inclusion and pore.
With blade, aluminium film is cut into the checkerboard square of 1mm * 1mm.With mightiness belt (Minnesota Mining and Manufacturing Company produces, and cohesive force is greater than 4.1N/cm), be crimped on this checkerboard aluminium film, then tear fast, measure the cohesive strength of aluminium film.
3 repetitions are established in experiment, and result shows, the expulsion rate of aluminium film is 0, and aluminium film sticks on alumina ceramic plate securely.
Adopt adhesive tape described in embodiment 1 to tear the firm degree of method test aluminium film.3 repetition are established in experiment, and result shows, aluminium film expulsion rate is 0, and demonstration aluminium film sticks on alumina ceramic plate securely.
Embodiment 6, except ceramic plate adopts outside silicon nitride ceramic plate (normal pressure-sintered, silicon nitride content is greater than 92%), other condition is all identical with embodiment 4.Test result shows, aluminium film mean thickness is 9 microns, and aluminium film expulsion rate is 0, shows that aluminium film sticks on silicon nitride ceramic plate securely.3 repetitions are established in experiment, come to the same thing.
Embodiment 7, except ceramic plate adopts silicon carbide ceramics plate (reaction sintering, carborundum content is greater than 90%) in addition, other condition is identical with embodiment 4.Test result shows, aluminium film mean thickness is 10 microns, and aluminium film expulsion rate is 0, shows that aluminium film sticks on silicon carbide ceramics plate securely.3 repetitions are established in experiment, come to the same thing.
Embodiment 8, except fine aluminium being changed into Al-8wt%Si alloy, all the other are all identical with embodiment 1.By this method, on ceramic plate, form mean thickness and be the aluminium alloy film of 8 microns, through the test of adhesive tape method, aluminium alloy film expulsion rate is 0, shows that aluminium alloy film sticks on alumina-ceramic securely.3 repetitions are established in experiment, come to the same thing.
Embodiment 9, except nitrogen flow being reduced to 15 liters/min, other is all identical with embodiment 8.By this method, at ceramic plate surface formation mean thickness, be the aluminium alloy film of 7 microns, its adhesive tape test expulsion rate is 0.3 repetitions are established in experiment, come to the same thing.
Embodiment 10, except melt temperature being brought up to 780 ℃, other is all identical with embodiment 9.The aluminium film that has formed like this 6 microns of mean thicknesss on ceramic plate, its adhesive tape test expulsion rate is 0.3 repetitions are established in experiment, come to the same thing.
Embodiment 11, except aluminium being changed into Al-12wt% aluminum silicon alloy, all the other are identical with embodiment 1.By this method, at alumina-ceramic surface formation mean thickness, be the aluminium alloy layer of 5 microns, its adhesive tape test expulsion rate is 0, shows that aluminium alloy layer sticks on alumina-ceramic securely.3 repetitions are established in experiment, come to the same thing.
Embodiment 12, except melt temperature being reduced to 680 ℃, all the other are identical with embodiment 11.By this method, on alumina-ceramic surface, form the aluminium alloy layer of 6 microns of mean thicknesss, its adhesive tape test expulsion rate is 0.3 repetitions are established in experiment, come to the same thing.
Embodiment 13, except fine aluminium being changed into Al-2wt%Si alloy, all the other are all identical with embodiment 1.By this method, on ceramic plate, form mean thickness and be the aluminium alloy film of 8 microns, through the test of adhesive tape method, aluminium alloy film expulsion rate is 0, shows that aluminium alloy film sticks on alumina-ceramic securely.3 repetitions are established in experiment, come to the same thing.
Embodiment 14, except fine aluminium being changed into Al-1wt%Si alloy, all the other are all identical with embodiment 1.By this method, on ceramic plate, form mean thickness and be the aluminium alloy film of 17 microns, through the test of adhesive tape method, aluminium alloy film expulsion rate is 0, shows that aluminium alloy film sticks on alumina-ceramic securely.3 repetitions are established in experiment, come to the same thing.
Embodiment 15, except temperature temperature is reduced to 680 ℃, all the other are all identical with embodiment 14.By this method, on ceramic plate, form mean thickness and be the aluminium alloy film of 51 microns, through the test of adhesive tape method, aluminium alloy film expulsion rate is 0, shows that aluminium alloy film sticks on alumina-ceramic securely.3 repetitions are established in experiment, come to the same thing.
Embodiment 16, except aluminium being changed into Al-12wt%Si-1wt%Mg alsimag, all the other are identical with embodiment 12.By this method, on alumina-ceramic surface, form the aluminium alloy layer of 5 microns of mean thicknesss.3 repetitions are established in experiment, come to the same thing.
Embodiment 17, except nitrogen flow being reduced to half (10 liters/min), all the other are identical with embodiment 16.By this method, on alumina-ceramic surface, form the aluminium alloy layer of 5 microns of thickness, there is slight oxidation on its surface.3 repetitions are established in experiment, come to the same thing.
Embodiment 18, except melt temperature being brought up to 730 ℃, all the other are identical with embodiment 17.By this method, at ceramic surface formation mean thickness, be the aluminium alloy film of 6 microns, there is slight oxidation on its surface.3 repetitions are established in experiment, come to the same thing.
Embodiment 19, except melt temperature being brought up to 780 ℃, all the other are identical with embodiment 17.By this method, at ceramic surface formation mean thickness, be the aluminium alloy film of 4 microns, there is slight oxidation on its surface.3 repetitions are established in experiment, come to the same thing.
Embodiment 20, except melt temperature being reduced to 630 ℃, all the other are identical with embodiment 17.By this method, at ceramic surface formation thickness, be the aluminium alloy film of 5 microns, there is slight oxidation on its surface.3 repetitions are established in experiment, come to the same thing.
Control group experiment is as follows:
Comparative example 1, in atmosphere, the alumina ceramic plate after heating is slowly inserted in the aluminum melt that is heated to 680 ℃, then the speed with 68.5mm/min slowly proposes, and aluminium liquid is failed to adhere in ceramic plate surface.3 repetitions are established in experiment, come to the same thing.Explanation is under oxide film existence, and aluminium liquid can not be wetting with pottery, and ceramic surface can not adhere to aluminium liquid.
Comparative example 2, in atmosphere, the alumina ceramic plate after heating is inserted in the aluminum melt be heated to 680 ℃ and stirred, then with the speed of 27mm/min, slowly mention.By this method, can on ceramic plate, adhere to aluminium film in part, aluminium film surface oxidation is serious.This aluminium film part can tear with hand simply, shows that it fails to be closely connected with ceramic plate.Through the test of adhesive tape method, aluminium alloy film expulsion rate is 34%.3 repetitions are established in experiment, and result is basic identical, and expulsion rate is respectively 34%, 27%, 45%.Illustrate if can not effectively all remove the primary oxide film on aluminium surface, remaining oxide film also can cause detrimentally affect to the connection of pottery and aluminium.
Claims (5)
1. manufacture the ceramic method that surface is connected with aluminum or aluminum alloy film for one kind, comprise following operation steps: ceramic metalized face is immersed in aluminum or aluminum alloy liquation, and make its relative liquation motion so that the wetting ceramic metalized face of described aluminum or aluminum alloy liquation, again ceramic metalized face is shifted out to liquation, make aluminium or the aluminium alloy liquid film of surface adhesion freely cooling, obtain the pottery that surface is connected with aluminum or aluminum alloy film.
2. method according to claim 1, is characterized in that: the described method that ceramic metalized face is immersed in aluminum or aluminum alloy liquation is that described pottery is moved vertically upward from filling the container bottom of described aluminum or aluminum alloy liquation inserts liquation inside.
3. method according to claim 1, is characterized in that: described pottery is oxide ceramics, nitride ceramics or carbide ceramics.
4. according to arbitrary described method in claim 1-3, it is characterized in that: described in operate in vacuum or inert gas atmosphere and carry out.
5. the surface that in claim 1-4, arbitrary described method obtains connects the pottery of aluminum or aluminum alloy film, it is characterized in that: described pottery and described aluminum or aluminum alloy film interface do not have amorphous oxide inclusion of aluminium.
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| CN200910083280.6A CN101538171B (en) | 2009-04-30 | 2009-04-30 | Surface metallised ceramic and manufacturing method thereof |
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| EP2426097A4 (en) | 2009-04-30 | 2012-11-28 | Univ Tsinghua | Method for metallizing ceramic surface and method for connecting ceramic with aluminum |
| CN102452844B (en) * | 2010-10-30 | 2013-10-02 | 比亚迪股份有限公司 | Aluminum nitride aluminum-coated base plate and preparation method thereof |
| US10150184B2 (en) | 2015-10-21 | 2018-12-11 | Siemens Energy, Inc. | Method of forming a cladding layer having an integral channel |
| CN105418132A (en) * | 2016-01-07 | 2016-03-23 | 上海电机学院 | Method for adopting aluminum or aluminum alloy to directly braze aluminum nitride ceramics |
| CN107611104A (en) * | 2017-07-27 | 2018-01-19 | 比亚迪股份有限公司 | A kind of heat dissipation element and preparation method thereof and IGBT modules |
| CN109400206A (en) * | 2018-11-12 | 2019-03-01 | 苏州工业园区职业技术学院 | A kind of method of ceramic surface metallization |
| CN111302834B (en) * | 2020-04-15 | 2020-10-23 | 湖南省美程陶瓷科技有限公司 | Microwave magnetron insulating ceramic ring |
| CN114310997A (en) * | 2021-12-24 | 2022-04-12 | 宁波江丰电子材料股份有限公司 | Clamping device for ultra-high purity aluminum casting and clamping method thereof |
| CN115029653A (en) * | 2022-06-15 | 2022-09-09 | 宁波建锡新材料有限公司 | Preparation method, preparation device and application of aluminum-coated tungsten ball for ball mill |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0386458A1 (en) * | 1989-03-04 | 1990-09-12 | Oerlikon-Contraves AG | Method for producing thin-film circuits with tin structures |
| CN1118382A (en) * | 1994-04-11 | 1996-03-13 | 同和矿业株式会社 | Process for producing metal-bonded-ceramic material or components, metal-bonded-ceramic material or components produced by that method, and electronic circuit substrates fabricated from said material |
| JPH08115847A (en) * | 1994-10-13 | 1996-05-07 | Murata Mfg Co Ltd | Metal film for transfer and manufacture of ceramic laminated electronic component |
| CN1502463A (en) * | 2002-11-20 | 2004-06-09 | 同和矿业株式会社 | Metal/ceramic adhered products |
-
2009
- 2009-04-30 CN CN201310481491.1A patent/CN103524148B/en not_active Expired - Fee Related
- 2009-04-30 CN CN200910083280.6A patent/CN101538171B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0386458A1 (en) * | 1989-03-04 | 1990-09-12 | Oerlikon-Contraves AG | Method for producing thin-film circuits with tin structures |
| CN1118382A (en) * | 1994-04-11 | 1996-03-13 | 同和矿业株式会社 | Process for producing metal-bonded-ceramic material or components, metal-bonded-ceramic material or components produced by that method, and electronic circuit substrates fabricated from said material |
| JPH08115847A (en) * | 1994-10-13 | 1996-05-07 | Murata Mfg Co Ltd | Metal film for transfer and manufacture of ceramic laminated electronic component |
| CN1502463A (en) * | 2002-11-20 | 2004-06-09 | 同和矿业株式会社 | Metal/ceramic adhered products |
Non-Patent Citations (1)
| Title |
|---|
| 彭榕等: "铝/氮化铝电子陶瓷基板的制备及性能的研究", 《无机材料学报》 * |
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| CN101538171A (en) | 2009-09-23 |
| CN103524148B (en) | 2015-10-28 |
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