CN103518033B - Downhole tool - Google Patents
Downhole tool Download PDFInfo
- Publication number
- CN103518033B CN103518033B CN201280021005.1A CN201280021005A CN103518033B CN 103518033 B CN103518033 B CN 103518033B CN 201280021005 A CN201280021005 A CN 201280021005A CN 103518033 B CN103518033 B CN 103518033B
- Authority
- CN
- China
- Prior art keywords
- unit
- tool
- downhole tool
- downhole
- hot component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011469 building brick Substances 0.000 claims abstract description 26
- 238000009413 insulation Methods 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 15
- 238000010521 absorption reaction Methods 0.000 claims description 10
- 230000004927 fusion Effects 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 208000031481 Pathologic Constriction Diseases 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- -1 hydrogen compound Chemical class 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000289 melt material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 210000001215 vagina Anatomy 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH DRILLING; MINING
- E21B—EARTH DRILLING, e.g. DEEP DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
- E21B47/017—Protecting measuring instruments
Abstract
The present invention relates to a kind of downhole tool, including tool housing and the electronic building brick with the electronic module being positioned in housing, wherein electronic building brick also includes electrically connecting with electronic module and being arranged on the multiple transistor units on hot component hot linked with housing, wherein electronic module and hot component heat insulation.Additionally, the present invention relates to include hawser, tool tubular column and the downhole system of the downhole tool according to the present invention.
Description
Technical field
The present invention relates to a kind of downhole tool including electronic building brick, described electronic building brick includes for well
The transistor unit of lower instrument.
Background technology
The down-hole electronics being used in the control system for producing hydrocarbon fluid in producing well
Equipment includes electronic power supply and the parts in use producing big calorimetric, such as transistor.Current to carbon
The control of the downhole tool in hydrogen compound well and the requirement more accurately of monitoring have resulted in and need electric power
That asks dramatically increases, and this generates and must go to heat extraction amount with the problem maintaining reasonable operating temperatures.Heat
Removal depend on heat to the transmission of housing, but due to the temperature raised when underground work, instrument
Electronic unit generally with housing heat insulation, to protect electronic unit from the impact of the temperature of rising.
Therefore, heat generating component (such as transistor) is possible overheated or causes other parts overheated.Additionally,
Transistor can suffer from so-called thermal runaway/thermal breakdown, and thermal runaway refers to that transistor starts heating and (rises
Temperature), thus distribute increasing heat because temperature raises, and then make problem upgrade, this enters one
Step adds other electronic unit of protection transistor and adjacent transistors element makes it not rise high-temperature
Demand.
Summary of the invention
It is an object of the invention to completely or partially to overcome the disadvantages mentioned above of state of the art and not
Foot.More specific, it is an object to provide the electronic building brick improved, this electronic building brick has
Subsurface environment operates at elevated ambient temperatures and does not use active cooling (such as liquid cooling)
Ability, active cooling represent for underground equipment a series of other and generally the severeest skill
Art problem.
The above-mentioned purpose that will become apparent from the description below and other purposes several, advantage and spy
Property together, is realized by the scheme utilizing downhole tool according to the present invention, and wherein downhole tool includes:
-tool housing, and
-electronic building brick, including:
-the electronic module that is positioned in housing,
Wherein electronic building brick also includes electrically connecting and be arranged on heat hot linked with housing with electronic module
Multiple transistor units on component, wherein electronic module and hot component heat insulation.
Additionally, the present invention relates to a kind of downhole tool, including:
-tool housing, and
-electronic building brick, including:
-the electronic module that is positioned in housing,
Wherein electronic building brick also includes electrically connecting with electronic module and be arranged on and is directly connected to housing
Multiple transistor units on hot component.
In one embodiment, described hot component can be the solid projections of housing.
Additionally, electronic module can be with hot component heat insulation.
It addition, electronic module can be connected to housing, transistor can be connected to hot component.
In another embodiment, housing could be for the heat sink of the plurality of transistor unit
(heat sink, heat sink).
In another embodiment, the kit including the downhole tool of electronic building brick could be for institute
State the heat sink of multiple transistor unit.
Additionally, hot component can also include the room accommodating heat absorption material, this heat absorption material has
There is the critical fusing point puncturing temperature less than the plurality of transistor unit, for inhaling for higher than heat
The temperature of the fusing point receiving material provides extra latent heat of fusion automatic anti-fault protection.
Additionally, the plurality of transistor unit can by multiple insulating components with described hot component electricity absolutely
Edge but thermally coupled.
It addition, hot component can include accommodating active cooling element (such as vapor compression refrigeration element,
Magnetic cooling element, evaporation cooling element or thermoelectric cooling element) room.
A kind of downhole tool with electronic building brick according to the present invention, it is also possible to include one or more
For the operating unit of logging instrument, such as thermal probe, image generation unit, measuring unit (such as flow velocity
Measuring unit), positioning unit (such as casing collar locator (CCL)) or similar operating unit.
It addition, can also include that pump or cleaning are single according to the downhole tool with electronic building brick of the present invention
Unit.
The invention still further relates to downhole system, including:
-hawser (wireline, wirerope, logging cable),
-tool tubular column, and
-according to the downhole tool of the present invention.
Accompanying drawing explanation
It is more fully described the present invention and multiple advantage thereof below with reference to the accompanying drawings, illustrates for example purpose
Some non-limiting embodiments, wherein
Fig. 1 shows the profile of electronic building brick,
Fig. 2 is the perspective view of hot component and electronic module,
Fig. 3 is the perspective view of electronic module, and some part is illustrated significantly for the purpose of illustration,
Fig. 4 is the schematic diagram of tool tubular column, and
Fig. 5 is the profile of electronic building brick.
All accompanying drawing is high-level schematic and is not necessarily drawn to, and they illustrate only as this is described
Bright those required parts, other parts are omitted or are only implied.
Detailed description of the invention
Fig. 1 shows the electronic building brick 1 being used in downhole tool 100.The tool housing 2 of hollow wraps
Include electronic module 3 and multiple transistor unit 4.Transistor unit 4 be arranged on hot component 5 for
The heat produced by transistor unit 4 is directly distributed to tool housing 2 and/or distributes further to bag
Include the kit 6 of the downhole tool 100 of electronic building brick 1.In certain embodiments, electronic module 3
Being arranged on hot component 5, as it is shown in figure 1, in other embodiments, described electronic module is arranged on
It is on the hot component 5 of a part of tool housing 2, as shown in Figure 5.Electronic module 3 can pass through
The erecting device (assembling device, supporting arrangement) 8 with specific thermal conductivity is installed, described particular thermal
Conductance is designed to meet the specific heat request of the particular electronic component 9 being included in electronic module 3.
If in order to be dispersed and high to the requirement of thermal conductivity from electronic module 3 by heat, then selecting high heat conductance
Material for erecting device 8.On the other hand, if the requirement to thermal conductivity is low, then can select
Heat insulator.Generally, the main heat during transistor unit is electronic building brick produces electronic unit.
But, other heat produces electronic unit can also be thermally isolated and be arranged on institute with described electronic module
State and electrically connect with described electronic module on hot component.
Fig. 2 shows the closely enlarged perspective of hot component 5.As it can be seen, hot component 5 is permissible
Having the end member 5a of circle, to adapt to be arranged in the downhole tool 100 of cylindricality, cylindricality is to use
Most typical shape in downhole tool.
Fig. 3 shows the perspective view of electronic building brick 1.The most all downhole tool 100 is fitted into post
In shape housing so as in the wellbore underground work time the specific space requirement of optimization.In order to make heat from
Hot component 5 distributes optimization, and described hot component can include the end structure with good thermal conductivity performance
Part 5a so that with tool housing 2(as shown in Figure 3) when directly contacting, heat effectively dissipates
To shown in described tool housing and/or kit 6(Fig. 1 and 4).Additionally, end member 5a
The attachment arrangement 11(such as spiral shell for being fixed in tool housing 2 by electronic building brick 1 can be included
Stricture of vagina).
Fig. 4 shows by tool tubular column 12, hawser 13, multiple kit 6 and includes electronic building brick
The downhole system 200 of downhole tool 100 composition of 1.Tool tubular column 12 can pass through downhole tractor
Drive part 14 be pushed in pit shaft 15 and pass through hawser 13 and be pulled.
Owing to flowing through the electric current of transistor, produce used heat in the transistor.If transistor is overheated, then
Transistor needs cooled, or may be damaged by heat in the worst case.Hot component 5 passes through will
Heat is communicated off transistor unit 4 and helps heat radiation.
The use of hot component 5 makes downhole tool can enter to have and be not disposed on than transistor and housing
The well of the ambient temperature of high 25 degree (the highest 50 degree) time directly on the hot component 5 of contact
Or pit shaft 15.When operation in subsurface environment, make the electronic building brick including that there is transistor unit 4
Tool tubular column 12 can to operate at elevated temperatures be important.In the earth's crust, (such as magma is attached
Local temperature change closely), may cause the breaking-up of electronic component (such as transistor).Therefore,
The resistant to elevated temperatures ability strengthened is the most valuable in downhole operations.Additionally, underground equipment has
Common problem be that the closely and closely surrounding objects due to space requirement, these all can
Cause being difficult in operation disperse heat.
Hot grease can be utilized to obtain good thermal conductivity between transistor unit 4 and hot component 5.
Except hot grease or replacement hot grease ground, transistor can be clamping again towards the surface of hot component 5
To guarantee good thermo-contact and thereby, it is ensured that good thermal conductivity.
Hot component 5 can be advantageously made up of the material (such as metal, such as aluminum) of high heat conductance.
But, also it is electric conductor due to metal, if so transistor directly contacts with hot component, then crystal
Pipe may make line short through hot component 5, causes transistor damage.Therefore, transistor unit 4 He
Hot component 5 is typically by insulating component 7(as shown in Figure 1) separate, this insulating component must be phase
The electric conductor the most excessively poor to good heat conductor, such as aluminium oxide.
As it is shown in figure 1, hot component 5 can include the room 10 accommodating heat absorption material, this heat is inhaled
Receive material and there is the critical fusing point puncturing temperature less than multiple transistors, for for higher than described heat
The temperature of the fusing point of amount absorbing material provides extra latent heat of fusion automatic anti-fault protection.There is receiving
The room 10 of heat absorption material ensure that when the temperature of hot component 5 exceedes the fusing of this heat absorption material
During temperature, this heat absorption material by this extra heat with the latent heat of fusion or so-called melting capacity
Form absorbs, in order to by melt material without rising high-temperature further, be thus provided that hot component
The temperature limiting of 5, until described heat absorption material is completely melt.Transistor unit 4 and electronic die
Block 3 is electrically connected by electric wire 16.
Alternatively, room 10 can accommodate active cooling element (active cooling element).
Active cooling element can be by known cooling system (such as vapour compression refrigeration, magnetic cooling, steaming
Feel cold but, thermoelectric-cooled or other cooling technology) provide.The passive type cooling being positioned in described room is first
Part (passive cooling element) and the combination of active cooling element can be used for preventing electricity
The temperature of the electronic component in sub-component exceedes critical temperature.
By providing passive type to cool down or active cooling in hot component, it can be ensured that described electronics group
Automatic anti-fault operation (fail safe operation) of part.It addition, be used in described electronic building brick
Electronic unit due to the temperature that raises, the loss that causes is eliminated.
Depend on various parameter (such as available power, free space, required cooling capacity etc.), special
Fixed active cooling element is likely to be of advantage, if such as thermoelectric-cooled space is very limited
And if electric power can be used, this is common situation in underground equipment.
As it is shown in figure 5, hot component 5 is the solid projections 41 of tool housing 2.Fig. 5 shows attachment
To the hot component 5 of described housing, but the most described hot component can be the indivisible of described housing
A part, this can improve conduction of heat but really challenge the structure of described housing.
Fig. 5 is it also shows that electronic module 3 is attached to tool housing 2 and transistor unit 4 is attached to heat
Component 5, thus enhance the pyrolysis coupling (heat decoupling) of electronic module 3 and transistor unit.
Fig. 2 shows the closely enlarged perspective of hot component 5.As it can be seen, hot component 5 is permissible
There is the end member 5a of circle to adapt to be arranged on cylindricality (for the most typically shape of downhole tool)
In downhole tool.
Hot component 5 can be made by high thermal conductivity material (the most preferably metal, the most preferably aluminum)
Become.
Hot component 5 also serves as heat sink/heat sink, to absorb superfluous heat, is not only and is passed by heat
Pass and leave transistor unit 4.Housing uses as heat sink, in this heat sink and pit shaft 15 or
Around in sleeve pipe under cased hole completion situation, well fluids interacts.
Transistor unit 4 needs heat stability, because the operating point of transistor junction (similar diode)
Temperature influence.If it is true that be designed without considering for this, this may cause thermal runaway and equipment
Damage.
In this application, being directly connected to be considered as the connection between solid component.Even if two realities
Connection between heart component can be reinforced by liquid heat oils and fats etc., but this connection is still considered as
It is directly connected to.
Although the present invention has been described above about described in the preferred embodiments of the present invention, to this area skill
Art personnel it is clear that can realize multiple amendment wants without deviating from the present invention, such as appended right
Ask restriction.
Claims (15)
1. a downhole tool (100), including:
-tool housing (2), and
-electronic building brick (1), including:
-the electronic module (3) that is positioned in described tool housing,
Wherein, described electronic building brick also includes electrically connecting and being arranged on described electronic module with described
Multiple transistor units (4) on the hot linked hot component of tool housing (5), wherein, described electricity
Submodule and described hot component heat insulation.
Downhole tool the most according to claim 1, it is characterised in that described hot component is described
The solid projections (41) of tool housing.
Downhole tool the most according to claim 2, it is characterised in that described electronic module connects
To described tool housing, the plurality of transistor unit is connected to described hot component.
Downhole tool the most according to any one of claim 1 to 3, it is characterised in that described
Tool housing is the heat sink for the plurality of transistor unit.
Downhole tool the most according to any one of claim 1 to 3, it is characterised in that include
The kit (6) of the downhole tool of described electronic building brick is the suction for the plurality of transistor unit
Thermal part.
Downhole tool the most according to any one of claim 1 to 3, it is characterised in that described
Hot component also includes the room (10) accommodating heat absorption material, and described heat absorption material has and is less than
The critical fusing point puncturing temperature of the plurality of transistor unit, for for higher than described heat absorption
The temperature of the fusing point of material provides extra latent heat of fusion automatic anti-fault protection.
Downhole tool the most according to any one of claim 1 to 3, it is characterised in that described
Hot component also includes the room (10) accommodating active cooling element.
Downhole tool the most according to any one of claim 1 to 3, it is characterised in that described
Multiple transistor units are by multiple insulating components (7) and described hot component electric insulation but thermally coupled.
Downhole tool the most according to any one of claim 1 to 3, also includes one or more
Operating unit (40), the one or more operating unit is logging instrument, image generation unit, survey
Amount unit or positioning unit.
Downhole tool the most according to any one of claim 1 to 3, also includes pump or cleaning
Unit.
11. downhole tools according to claim 7, it is characterised in that this active cooling unit
Part is vapor compression refrigeration element, magnetic cooling element, evaporation cooling element or thermoelectric cooling element.
12. downhole tools according to claim 9, it is characterised in that described logging instrument is for visiting
Pin.
13. downhole tools according to claim 9, it is characterised in that described measuring unit is
Flow-speed measurement unit.
14. downhole tools according to claim 9, it is characterised in that described positioning unit is
Casing collar locator (CCL).
15. 1 kinds of downhole systems (200), including:
-hawser (13),
-tool tubular column (12), and
-according to the downhole tool (100) according to any one of claim 1 to 14.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11164293.0 | 2011-04-29 | ||
| EP11164293A EP2518265A1 (en) | 2011-04-29 | 2011-04-29 | Downhole tool |
| PCT/EP2012/057803 WO2012146733A1 (en) | 2011-04-29 | 2012-04-27 | Downhole tool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103518033A CN103518033A (en) | 2014-01-15 |
| CN103518033B true CN103518033B (en) | 2016-08-17 |
Family
ID=44359706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280021005.1A Expired - Fee Related CN103518033B (en) | 2011-04-29 | 2012-04-27 | Downhole tool |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9416650B2 (en) |
| EP (2) | EP2518265A1 (en) |
| CN (1) | CN103518033B (en) |
| AU (1) | AU2012247464B2 (en) |
| BR (1) | BR112013027480A2 (en) |
| CA (1) | CA2834479A1 (en) |
| MX (1) | MX340851B (en) |
| RU (1) | RU2013152079A (en) |
| WO (1) | WO2012146733A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2607620A1 (en) * | 2011-12-22 | 2013-06-26 | Services Pétroliers Schlumberger | Thermal buffering of downhole equipment with phase change material |
| US10605052B2 (en) | 2015-11-19 | 2020-03-31 | Halliburton Energy Services, Inc. | Thermal management system for downhole tools |
| US11306578B2 (en) * | 2018-04-16 | 2022-04-19 | Baker Hughes, A Ge Company, Llc | Thermal barrier for downhole flasked electronics |
| US20190316442A1 (en) * | 2018-04-16 | 2019-10-17 | Baker Hughes, A Ge Company, Llc | Thermal barrier for downhole flasked electronics |
| CN109577948A (en) * | 2018-12-05 | 2019-04-05 | 西安石油大学 | A kind of temperature management system and method for the temperature-sensing element (device) of downhole tool |
| CN109618530B (en) * | 2018-12-05 | 2020-04-07 | 西安石油大学 | Cooling system of heating electronic equipment of downhole tool |
| CN109346450A (en) * | 2018-12-05 | 2019-02-15 | 西安石油大学 | It is a kind of for cooling down the device and method of the semiconductor devices of downhole tool |
| CN114687733B (en) * | 2022-06-01 | 2022-08-23 | 西安石油大学 | Sound wave logging integrated receiving acoustic system structure with cooling module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4407136A (en) * | 1982-03-29 | 1983-10-04 | Halliburton Company | Downhole tool cooling system |
| CN101066010A (en) * | 2004-11-16 | 2007-10-31 | 哈里伯顿能源服务公司 | Cooling apparatus,systems,and methods |
| US7440283B1 (en) * | 2007-07-13 | 2008-10-21 | Baker Hughes Incorporated | Thermal isolation devices and methods for heat sensitive downhole components |
| CN101328800A (en) * | 2007-03-14 | 2008-12-24 | 普拉德研究及开发股份有限公司 | Cooling systems for downhole tools |
| CN101328801A (en) * | 2007-06-21 | 2008-12-24 | 普拉德研究及开发股份有限公司 | Apparatus and methods to dissipate heat in a downhole tool |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5878824A (en) * | 1996-11-27 | 1999-03-09 | Digital Control Incorporated | Boring tool or other device including thermal protection for an electronic component assembly and method |
| US7124596B2 (en) * | 2001-01-08 | 2006-10-24 | Baker Hughes Incorporated | Downhole sorption cooling and heating in wireline logging and monitoring while drilling |
| US7246940B2 (en) * | 2003-06-24 | 2007-07-24 | Halliburton Energy Services, Inc. | Method and apparatus for managing the temperature of thermal components |
| US7301223B2 (en) * | 2003-11-18 | 2007-11-27 | Halliburton Energy Services, Inc. | High temperature electronic devices |
| US7793712B2 (en) * | 2006-08-24 | 2010-09-14 | Schlumberger Technology Corporation | Downhole tool |
| US8826984B2 (en) * | 2009-07-17 | 2014-09-09 | Baker Hughes Incorporated | Method and apparatus of heat dissipaters for electronic components in downhole tools |
| RU2406282C1 (en) | 2010-02-02 | 2010-12-10 | Открытое акционерное общество "Научно-производственный комплекс "ЭЛАРА" имени Г.А. Ильенко" (ОАО "ЭЛАРА") | Electronic unit with heat removal and shielding |
-
2011
- 2011-04-29 EP EP11164293A patent/EP2518265A1/en not_active Withdrawn
-
2012
- 2012-04-27 AU AU2012247464A patent/AU2012247464B2/en not_active Ceased
- 2012-04-27 EP EP12721209.0A patent/EP2702246A1/en not_active Withdrawn
- 2012-04-27 WO PCT/EP2012/057803 patent/WO2012146733A1/en active Application Filing
- 2012-04-27 RU RU2013152079/03A patent/RU2013152079A/en unknown
- 2012-04-27 BR BR112013027480A patent/BR112013027480A2/en not_active IP Right Cessation
- 2012-04-27 CN CN201280021005.1A patent/CN103518033B/en not_active Expired - Fee Related
- 2012-04-27 MX MX2013012442A patent/MX340851B/en active IP Right Grant
- 2012-04-27 US US14/114,611 patent/US9416650B2/en not_active Expired - Fee Related
- 2012-04-27 CA CA2834479A patent/CA2834479A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4407136A (en) * | 1982-03-29 | 1983-10-04 | Halliburton Company | Downhole tool cooling system |
| CN101066010A (en) * | 2004-11-16 | 2007-10-31 | 哈里伯顿能源服务公司 | Cooling apparatus,systems,and methods |
| CN101328800A (en) * | 2007-03-14 | 2008-12-24 | 普拉德研究及开发股份有限公司 | Cooling systems for downhole tools |
| CN101328801A (en) * | 2007-06-21 | 2008-12-24 | 普拉德研究及开发股份有限公司 | Apparatus and methods to dissipate heat in a downhole tool |
| US7440283B1 (en) * | 2007-07-13 | 2008-10-21 | Baker Hughes Incorporated | Thermal isolation devices and methods for heat sensitive downhole components |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2702246A1 (en) | 2014-03-05 |
| AU2012247464B2 (en) | 2015-06-11 |
| MX2013012442A (en) | 2013-12-02 |
| EP2518265A1 (en) | 2012-10-31 |
| US9416650B2 (en) | 2016-08-16 |
| WO2012146733A1 (en) | 2012-11-01 |
| BR112013027480A2 (en) | 2017-01-10 |
| US20140076531A1 (en) | 2014-03-20 |
| CN103518033A (en) | 2014-01-15 |
| MX340851B (en) | 2016-07-28 |
| RU2013152079A (en) | 2015-06-10 |
| AU2012247464A1 (en) | 2013-05-02 |
| CA2834479A1 (en) | 2012-11-01 |
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