CN103513509A - Mask plate and substrate as well as manufacturing method of substrate - Google Patents
Mask plate and substrate as well as manufacturing method of substrate Download PDFInfo
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- CN103513509A CN103513509A CN201310513861.5A CN201310513861A CN103513509A CN 103513509 A CN103513509 A CN 103513509A CN 201310513861 A CN201310513861 A CN 201310513861A CN 103513509 A CN103513509 A CN 103513509A
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Abstract
The invention provides a mask plate and a substrate as well as a manufacturing method of the substrate, relates to the technical field of display, and solves the problem that precise alignment can not be realized during mask plate alignment in the prior art. The mask plate comprises exposure patterns, wherein each exposure pattern comprises a first exposure pattern and a second exposure pattern; each first exposure pattern is used for forming a corresponding thin film pattern; each second exposure pattern is used for exposure alignment of the mask plate; the transparency of each second exposure pattern can be adjusted at least.
Description
Technical field
The present invention relates to display technique field, relate in particular to the method for making of a kind of mask plate, substrate and substrate.Background technology
Existing liquid crystal display, comprise array base palte, color membrane substrates and be encapsulated in array base palte and color membrane substrates between liquid crystal.Wherein, on array base palte and color membrane substrates, comprise multilayer thin film pattern, in manufacturing process, every thin film pattern forms by single exposure technique.
Concrete, take color membrane substrates as example, as shown in Figure 1, comprise transparency carrier 1, black matrix rete 2, colored film layer 3, flatness layer 4 and chock insulator matter layer 5.Color membrane substrates each rete in manufacturing process is through single exposure, to form respectively, owing to thering is position relationship between each rete, at ground floor rete, be after black matrix rete completes, the making of every skim layer all needs to carry out contraposition with ground floor rete.In prior art, by being specifically designed to the exposing patterns of contraposition in mask plate setting so that each rete is realized accurate contraposition.
Concrete, color membrane substrates in manufacturing process, first by the first mask plate on transparency carrier 1, form black matrix pattern and the first film reference pattern, wherein, the first mask plate is provided with the first benchmark exposing patterns, is used to form the first film reference pattern; Make in the process of colored film layer 3, by making the second contraposition exposing patterns and the first benchmark exposing patterns of the second mask plate carry out contraposition, on substrate, form colored film layer and the second film to bit patterns.But when making protective film 4; due to the second contraposition exposing patterns on the second mask plate; the contraposition exposing patterns of follow-up mask plate cannot directly carry out direct contraposition with the first benchmark exposing patterns of the first mask plate; but carry out contraposition by other mask plates, the aligning accuracy of each rete is poor like this.
Summary of the invention
Embodiments of the invention provide the method for making of a kind of mask plate, substrate and substrate, and described substrate forms by described mask plate, and utilize described mask plate to form the aligning accuracy that substrate can improve each rete on substrate.
For achieving the above object, embodiments of the invention adopt following technical scheme:
The embodiment of the present invention provides a kind of mask plate, comprise exposing patterns, wherein, described exposing patterns comprises the first exposing patterns and the second exposing patterns, wherein, described the first exposing patterns is used to form corresponding Thinfilm pattern, and described the second exposing patterns is for the exposure aligning of mask plate, and the light transmission of at least described the second exposing patterns is adjustable.
Optionally, the light transmission of described the first exposing patterns is adjustable.
Optionally, described mask plate also comprises: the first electrode, the second electrode and be arranged on electrochromic material layer between described the first electrode and the second electrode, be used to form the adjustable exposing patterns of light transmission.
Optionally, between electrochromic material layer and the first electrode and the second electrode, dielectric substrate and ion storage are set respectively.
Optionally, described the second exposing patterns printing opacity or light tight.
Optionally, the live width of described the second exposing patterns is less than the resolution of exposure machine.
Optionally, the pattern lines of described the second exposing patterns is hollow structure or is broached-tooth design.
The embodiment of the present invention provides a kind of substrate, comprise substrate and be arranged at least one layer film pattern on described substrate, and at least one layer film pattern on described substrate is that the arbitrary described mask plate exposure providing by the embodiment of the present invention forms.
The embodiment of the present invention provides a kind of formation method of substrate, comprising:
Mask plate and substrate are carried out to contraposition;
The second exposing patterns that mask plate is set is printing opacity;
Utilize mask plate on substrate, to form the first film pattern corresponding with mask plate the first exposing patterns;
Wherein, arbitrary described mask plate that described mask plate provides for the embodiment of the present invention.
Optionally, before mask plate and substrate are carried out to contraposition, described method also comprises: on substrate, form the second Thinfilm pattern and to bit patterns;
Describedly mask plate and substrate are carried out to contraposition be specially: will on the second exposing patterns on mask plate and substrate, bit patterns be carried out to contraposition.
A kind of mask plate that the embodiment of the present invention provides, the method for making of substrate and substrate, described mask plate comprises exposing patterns, wherein, described exposing patterns comprises the first exposing patterns and the second exposing patterns, wherein, described the first exposing patterns is used to form corresponding Thinfilm pattern, described the second exposing patterns is for the exposure aligning of mask plate, and the light transmission of at least described the second exposing patterns is adjustable, when utilizing described mask board to explosure, at the second exposing patterns that utilizes mask plate, carry out after contraposition completes, the second exposing patterns of described mask plate is set to printing opacity, on substrate, do not form the Thinfilm pattern corresponding with the second exposing patterns of the second mask, be conducive to other mask plates and carry out accurate contraposition.
Accompanying drawing explanation
Fig. 1 is the structural representation of color membrane substrates of the prior art;
The schematic diagram of a kind of mask plate that Fig. 2 provides for the embodiment of the present invention;
The method for making schematic diagram of a kind of substrate that Fig. 3 provides for the embodiment of the present invention;
The method for making schematic diagram of the another kind of substrate that Fig. 4 provides for the embodiment of the present invention;
The method for making schematic diagram of the color membrane substrates shown in formation Fig. 1 that Fig. 5 provides for the embodiment of the present invention;
Reference numeral:
1-transparency carrier; The black matrix rete of 2-; 3-colored film layer; 4-flatness layer; 5-chock insulator matter layer; 10-the first exposing patterns; 20-the second exposing patterns; 100-mask plate.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.
It should be noted that, existing composition technique generally forms by mask plate the Thinfilm pattern needing, its concrete technology comprises: gluing on film, utilize mask plate to expose to described photoresist, the photoresist erosion that recycling developer solution is removed need is fallen, etch away again the film portion that does not cover photoresist, finally by remaining photoresist lift off.Wherein, according to the difference of described photoresist, the Thinfilm pattern that described mask plate forms on described substrate is identical or relative.Concrete, when described photoresist is positive photoresist, the photoresist corresponding to light tight district of described mask plate retains completely, and the photoresist that described transmission region is corresponding is completely removed, i.e. the light tight district of the corresponding mask plate of Thinfilm pattern.If described photoresist is negative photoresist, the photoresist corresponding to full photic zone of described mask plate retains completely, and photoresist corresponding to described light tight district is completely removed, i.e. the photic zone of the corresponding mask plate of Thinfilm pattern.And the described photoresist of take in the embodiment of the present invention is elaborated as positive photoresist as example.The mask plate setting of negative photoresist is contrary with positive photoresist, does not here just repeat.
As shown in Figure 2, the embodiment of the present invention provides a kind of mask plate 100, comprise exposing patterns, wherein, described exposing patterns comprises the first exposing patterns 10 and the second exposing patterns 20, and wherein, described the first exposing patterns 10 is used to form corresponding Thinfilm pattern, described the second exposing patterns 20 is for the exposure aligning of mask plate, and the light transmission of at least described the second exposing patterns 20 is adjustable.
It should be noted that, as shown in Figure 2, described the second exposing patterns 20 can comprise a plurality of patterns, when carrying out contraposition with described the second exposing patterns, is conducive to carry out accurate contraposition.The light transmission of described the second exposing patterns is adjustable, and described the second exposing patterns can be complete printing opacity, completely light tight or part printing opacity etc.A kind of mask plate that the embodiment of the present invention provides, the light transmission of the second exposing patterns of described mask plate is adjustable, described the second Thinfilm pattern can be set when needed for completely light tight, it is complete printing opacity that described the second Thinfilm pattern can also be set, and it is part printing opacity that described the second Thinfilm pattern can also be set.Take described photoresist as positive photoresist is example,, when described the second Thinfilm pattern is complete when light tight, on substrate, form the pattern corresponding with the second exposing patterns; When described the second Thinfilm pattern is complete printing opacity, on substrate, do not form the pattern corresponding with the second exposing patterns.It should be noted that, when described the second Thinfilm pattern being set being part printing opacity, described mask plate can be half gray scale or half gray level mask plate, and now mask plate the second Thinfilm pattern can not form corresponding Thinfilm pattern on substrate.
Wherein, the light transmission of described at least described the second exposing patterns is adjustable, and described mask can be fixing non-adjustable of the light transmission of described the first exposing patterns, and only the light transmission of described the second exposing patterns is adjustable; The light transmission that can also be described the first exposing patterns and described the second exposing patterns is all adjustable.And adjustable or non-adjustable when the light transmission of the first exposing patterns, its concrete pattern need to arrange as the case may be.
Concrete, utilize mask that the embodiment of the present invention provides to carry out mask exactitude position and will enumerate in the back a specific embodiment and be elaborated.
Optionally, the light transmission of described the first exposing patterns is adjustable.The light transmission that is the exposing patterns on described mask plate is all adjustable.
Optionally, described mask plate also comprises: the first electrode, the second electrode and be arranged on electrochromic material layer between described the first electrode and the second electrode, be used to form the adjustable exposing patterns of light transmission.Concrete, electrochromic material layer forms exposing patterns, when with described electrochromism pattern over against the first electrode pattern and the second electrode pattern apply voltage simultaneously, when electrochromic layer has electric current to pass through, electrochromism pattern injects or extraction electric charge receiving and losing electrons, the color of electrochromic material changes, and the light transmission of the exposing patterns that electrochromic material layer forms changes.
Further, described mask plate can also arrange respectively dielectric substrate and ion storage between electrochromic material layer and the first electrode and the second electrode.Wherein, dielectric substrate is comprised of special conductive material, as solid electrolyte material; Ion storage plays and stores corresponding gegenion when electrochromic material generation redox reaction, the effect that keeps whole system charge balance, ion storage can be also electrochromic material a kind of and that one deck electrochromic material discoloration is contrary above, can play like this color addition or complementary effect.As: what electrochromic material layer adopted is anodic oxidation off-color material, and ion storage can adopt cathodic reduction off-color material.
It should be noted that, electrochromic material has bistable performance, and it shows after still image, as long as displaying contents does not change, just can power consumption, and reach energy-conservation object.
Optionally, described the second exposing patterns printing opacity or light tight.Concrete, mask plate is before exposing during contraposition, and the second exposing patterns is light tight.After contraposition completes, by the first electrode and the second electrode making alive, the color of electrochromic material layer is become transparent, i.e. printing opacity completely.
Optionally, the live width of described the second exposing patterns is less than the resolution of exposure machine.When the live width of the second exposing patterns on mask plate is less than the resolution of exposure machine, while exposing can there is diffraction in light, on substrate, can not form corresponding Thinfilm pattern.
Optionally, the pattern lines of described the second exposing patterns is hollow structure or is broached-tooth design.The pattern lines of the second exposing patterns is hollow structure or for broached-tooth design, diffraction can occur light when exposure, can not form corresponding Thinfilm pattern on substrate.Certainly, the pattern lines of the second exposing patterns can also be carried out to other setting so that light generation diffraction does not form corresponding Thinfilm pattern on substrate.
The embodiment of the present invention provides a kind of substrate, comprise substrate and be arranged at least one layer film pattern on described substrate, and at least one layer film pattern on described substrate is that the arbitrary described mask plate exposure providing by the embodiment of the present invention forms.
It should be noted that, described substrate comprises substrate and is arranged at least one layer film pattern on described substrate, being that described substrate can only comprise substrate and be arranged on the thin film pattern on described substrate, can also be to comprise substrate and be arranged on the multilayer thin film pattern on described substrate.Arbitrary described mask plate exposure that at least one layer film pattern on described substrate provides by the embodiment of the present invention forms, it can be described thin film pattern, also can be to take other Thinfilm patterns that described ground floor Thinfilm pattern is benchmark, the arbitrary described mask plate exposure providing by the embodiment of the present invention forms.And the arbitrary described mask plate exposure providing by the embodiment of the present invention when described ground floor Thinfilm pattern forms, also can on substrate, form corresponding to mask plate the second exposing patterns bit patterns.Described substrate can array base palte, color membrane substrates or other any substrates with membrane structure.Wherein, described substrate can be transparency carrier etc.
The embodiment of the present invention provides a kind of formation method of substrate, as shown in Figure 3, comprising:
Step 101, mask plate and substrate are carried out to contraposition.
Wherein, described mask plate can be on substrate, to form ground floor Thinfilm pattern, can be also other Thinfilm patterns that form on substrate after ground floor film.
Step 102, the second exposing patterns that mask plate is set are printing opacity.
The second exposing patterns is set to printing opacity, and the second exposing patterns can not form corresponding Thinfilm pattern on substrate.
Step 103, utilize mask plate on substrate, to form the first film pattern corresponding with mask plate the first exposing patterns.
To base board to explosure, on substrate, only form the first film pattern corresponding with mask plate the first exposing patterns.
The first film pattern that described the first exposing patterns is corresponding is by exposure needs the Thinfilm pattern forming.
Optionally, as shown in Figure 4, before mask plate and substrate are carried out to contraposition, described method also comprises:
Step 104, on substrate, form the second Thinfilm pattern and to bit patterns.
Describedly mask plate and substrate are carried out to contraposition be specially: will on the second exposing patterns on mask plate and substrate, bit patterns be carried out to contraposition.It should be noted that described the second Thinfilm pattern and can be the ground floor Thinfilm pattern forming to bit patterns on substrate.The described film that bit patterns is used for forming below carries out contraposition with it.The mask plate that forms the second Thinfilm pattern and can utilize the embodiment of the present invention to provide to bit patterns on substrate, also can utilize mask plate of the prior art.But when the mask plate that utilizes the embodiment of the present invention to provide forms the ground floor Thinfilm pattern on substrate, the second exposing patterns that described mask plate is set is light tight, to form the contraposition Thinfilm pattern corresponding with the second exposing patterns on substrate.To on the second exposing patterns on mask plate and substrate, bit patterns be carried out to contraposition with respect to utilizing the second mask plate and the second exposing patterns of the first mask plate carries out contraposition, its aligning accuracy is more accurate.
It should be noted that, comprise multilayer film on substrate, ground floor film and other films all can adopt said method to make.
As shown in Figure 5, the method for making of the color membrane substrates in accompanying drawing 1 of take is below example, and wherein following mask plate is the mask plate that the embodiment of the present invention provides:
Step 201, utilize the first mask plate on transparency carrier, to form black matrix rete and to bit patterns.
Concrete, the first mask plate can be that the mask plate that the embodiment of the present invention provides can be also mask plate of the prior art.The embodiment of the present invention all be take mask plate that described mask plate provides as the embodiment of the present invention and is elaborated as example.The first exposing patterns correspondence on the first mask plate forms the black matrix on substrate, the corresponding formation bit patterns of the second exposing patterns on the first mask plate.Wherein contraposition Thinfilm pattern is mainly used in forming colored film layer and flatness layer and the first film pattern on transparency carrier and carries out contraposition.
The second exposing patterns of step 202, the first mask plate is set to complete printing opacity.
Concrete, can be at the first electrode and the second electrode making alive, electrochromic material is become completely transparent.On transparency carrier, do not form like this Thinfilm pattern corresponding with the second exposing patterns of the first mask plate.
Step 203, the contraposition Thinfilm pattern forming on the second exposing patterns on the second mask plate and transparency carrier is carried out to contraposition.
The second exposing patterns of step 204, the second mask plate is set to complete printing opacity.
Concrete, the second exposing patterns of the second mask plate is set to complete printing opacity can be with reference to above-mentioned steps 202.On transparency carrier, do not form like this Thinfilm pattern corresponding with the second exposing patterns of the second mask plate.
Step 205, utilize the second mask plate on transparency carrier, to form colored film layer.
Wherein, described colored film layer is the Thinfilm pattern corresponding with the first exposing patterns on the second mask plate.
Step 206, the contraposition Thinfilm pattern forming on the second exposing patterns on the 3rd mask plate and transparency carrier is carried out to contraposition.
The second exposing patterns of step 207, the 3rd mask plate is set to complete printing opacity.
Concrete, the second exposing patterns of the 3rd mask plate is set to complete printing opacity can be with reference to above-mentioned steps 202.On transparency carrier, do not form like this Thinfilm pattern corresponding with the second exposing patterns of the 3rd mask plate.
Step 208, utilize the 3rd mask plate on transparency carrier, to form flatness layer.
Wherein said flatness layer is the Thinfilm pattern corresponding with the first exposing patterns on the 3rd mask plate.
It should be noted that, above-described embodiment only be take and substrate is carried out to three exposures on transparency carrier, is formed three-layer thin-film pattern as example, when forming multilayer thin film pattern on substrate, the method for making of its lowermost layer and top film pattern can adopt identical mask plate with prior art, also can utilize the mask that the embodiment of the present invention provides to form.The mask plate that the making of other Thinfilm patterns between the substrate bottom and top layer adopts the embodiment of the present invention to provide, it can adopt the method to set up identical with the second mask plate in above-described embodiment on substrate, to form corresponding Thinfilm pattern.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of described claim.
Claims (10)
1. a mask plate, comprise exposing patterns, it is characterized in that, described exposing patterns comprises the first exposing patterns and the second exposing patterns, wherein, described the first exposing patterns is used to form corresponding Thinfilm pattern, and described the second exposing patterns is for the exposure aligning of mask plate, and the light transmission of at least described the second exposing patterns is adjustable.
2. mask plate according to claim 1, is characterized in that, the light transmission of described the first exposing patterns is adjustable.
3. mask plate according to claim 1 and 2, it is characterized in that, described mask plate also comprises: the first electrode, the second electrode and be arranged on electrochromic material layer between described the first electrode and the second electrode, be used to form the adjustable exposing patterns of light transmission.
4. mask plate according to claim 3, is characterized in that, between electrochromic material layer and the first electrode and the second electrode, dielectric substrate and ion storage is set respectively.
5. mask plate according to claim 1, is characterized in that, described the second exposing patterns printing opacity or light tight.
6. mask plate according to claim 1, is characterized in that, the live width of described the second exposing patterns is less than the resolution of exposure machine.
7. mask plate according to claim 1, is characterized in that, the pattern lines of described the second exposing patterns is hollow structure or is broached-tooth design.
8. a substrate, is characterized in that, comprise substrate and be arranged at least one layer film pattern on described substrate, and at least one layer film pattern on described substrate is to form by the mask plate exposure described in claim 1-7 any one.
9. a formation method for substrate, is characterized in that, comprising:
Mask plate and substrate are carried out to contraposition;
The second exposing patterns that mask plate is set is printing opacity;
Utilize mask plate on substrate, to form the first film pattern corresponding with mask plate the first exposing patterns;
Wherein, described mask plate is the mask plate described in claim 1-7 any one.
10. formation method according to claim 9, is characterized in that, before mask plate and substrate are carried out to contraposition, described method also comprises: on substrate, form the second Thinfilm pattern and to bit patterns;
Describedly mask plate and substrate are carried out to contraposition be specially: will on the second exposing patterns on mask plate and substrate, bit patterns be carried out to contraposition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310513861.5A CN103513509B (en) | 2013-10-25 | 2013-10-25 | The method for making of a kind of mask plate, substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310513861.5A CN103513509B (en) | 2013-10-25 | 2013-10-25 | The method for making of a kind of mask plate, substrate |
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| CN103513509A true CN103513509A (en) | 2014-01-15 |
| CN103513509B CN103513509B (en) | 2016-03-02 |
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| CN201310513861.5A Expired - Fee Related CN103513509B (en) | 2013-10-25 | 2013-10-25 | The method for making of a kind of mask plate, substrate |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105632423A (en) * | 2016-03-31 | 2016-06-01 | 京东方科技集团股份有限公司 | Backlight module and driving method thereof, and display device |
| WO2017121157A1 (en) * | 2016-01-11 | 2017-07-20 | 京东方科技集团股份有限公司 | Mask plate and manufacturing method therefor, and use thereof in manufacturing process of display substrate |
| CN108628053A (en) * | 2018-05-09 | 2018-10-09 | 深圳市华星光电技术有限公司 | UV mask plates and preparation method thereof |
| JP2019164383A (en) * | 2019-06-19 | 2019-09-26 | Hoya株式会社 | Method for manufacturing photomask, photomask and method for manufacturing display device |
| CN111552148A (en) * | 2020-05-20 | 2020-08-18 | Tcl华星光电技术有限公司 | Light shield structure |
| CN114675507A (en) * | 2022-04-11 | 2022-06-28 | 西湖大学 | Lithographic apparatus and lithographic system |
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| CN103513509B (en) | 2016-03-02 |
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