CN103506940A - Chemical mechanical polishing wafer loader - Google Patents
Chemical mechanical polishing wafer loader Download PDFInfo
- Publication number
- CN103506940A CN103506940A CN201310442865.9A CN201310442865A CN103506940A CN 103506940 A CN103506940 A CN 103506940A CN 201310442865 A CN201310442865 A CN 201310442865A CN 103506940 A CN103506940 A CN 103506940A
- Authority
- CN
- China
- Prior art keywords
- hole
- current collecting
- back pressure
- ring
- collecting plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Abstract
Provided is a chemical mechanical polishing wafer loader. An upper spherical bearing, a lower spherical bearing, an upper cross coupling, a lower cross coupling, a supporting pillar fixed on a flow collecting disc, an installation ring in sliding connection with the supporting pillar and a guide hole positioned in an upper cover are adopted to form a universal joint structure, and a wafer is driven to automatically perform universal deflection; an outer supporting screw positioned on a clamping ring, a limiting hole positioned on a retaining ring and forming a matching pair with the outer supporting screw and an air bag form a retaining ring movement limiting mechanism, so that the service life of the retaining ring is prolonged, and the retaining ring is reasonable in replacement cycle and easy to replace; the retaining ring, the clamping ring and an adjusting gasket form a depth fine-adjustment mechanism of a wafer storage plane groove, and the adjusting gasket is replaced to keep the depth of a wafer installing groove within the specialized range. The upper cover and the flow collecting disc are of process hole structures while the edge effect is improved, so that back pressure fluid in zone control for wafers is distributed in a balanced mode, the action area is large, and pipes are convenient to install. The chemical mechanical polishing wafer loader is large in structural design size and can meet the large-diameter wafer polishing requirements.
Description
Technical field
The present invention relates to a kind of burnishing device, particularly relate to a kind of chemically mechanical polishing wafer carrying device.
Background technology
Chemically mechanical polishing (CMP) is that chemical solution corrosion is carried out the technology of polishing in conjunction with mechanical particle grinding to semi-conducting material or other materials, and it is widely used in integrated circuit (IC) manufacturing industry.The wafer (or chip) on high accuracy, ultra-smooth not damaged surface is obtained by chemical-mechanical polisher.Chemical-mechanical polisher mainly comprises buff spindle, wafer carrying device, polishing block, polishing pad, polishing fluid pipeline.Wafer carrying device is the core component of equipment.On wafer carrying device is fixed on below buff spindle, polishing pad sticks to above polishing block, and polished wafer is between wafer carrying device and polishing pad.Buff spindle connects the downforce that wafer carrying device carries out lifting, rotation and controls wafer carrying device.On buff spindle and wafer carrying device, there is the fluid circuit of many (vacuum, air pressure, deionized waters).Wafer carrying device or vacuum suction wafer, or clamp wafer.When wafer is held, fluid can be pressed in wafer the back pressure (hydraulic coupling that wafer rear is applied is called back pressure) of the different pressures on polishing pad by the subregional generation of wafer carrying device, to increase the grinding force of polishing wafer face and polishing pad, buff spindle drives the relative polishing block of wafer carrying device to do reverse rotation each other, also on Plane of rotation, does the beat of certain angle in the time of the rotation of wafer carrying device.Wafer carrying device is rotated in the process that adds beat simultaneously, and polishing fluid pipeline is transported to polishing fluid on polishing pad, thereby reaches the polishing object of wafer under mechanical grinding and chemical solution corrosion double action.At present, mainly there is following problem in wafer carrying device:
1) downforce of buff spindle; The revolving force of wafer carrying device, polishing block; The flatness of polishing pad, back pressure and the comprehensive polishing force producing of the hydraulic coupling spraying through polishing pad finally all act on the polished surface of wafer, and this comprehensive polishing force should be identical substantially everywhere on polishing wafer face, otherwise fragment accident very easily occurs.For guaranteeing the rotation of wafer carrying device and swing, carry out in situation simultaneously, polishing force is basic identical everywhere on wafer, wafer carrying device is usually designed to two parts, upper part is connected with buff spindle, lower part both connected and rotated with buff spindle with upper part, centered by buff spindle axis, experience again comprehensive polish pressure variation and relatively go up the universal beat that plane is partly done any direction under certain angle, basically identical to adjust polishing force each point on polishing wafer face.The two-part connection of wafer carrying device is design challenges.The structure that existing wafer carrying device two parts connect is gasbag-type substantially, and shortcoming is more.
2) current, it is increasing that diameter wafer develops, and because wafer carrying device rotational line speed is inconsistent, if only wafer is applied to single back pressure, the polishing clearance of zones of different can produce difference, causes polishing wafer face pattern lofty.For avoiding the problems referred to above, it is to avoid the lofty basic fundamental of wafer face shape that different polishing area are adopted to different back pressures, but current fluid circuit complex structural designs of wafer back pressure being carried out to Region control is installed difficulty.
3) " edge effect " can cause crystal round fringes place to have certain region to be difficult to reach sub-micron rank precision, reduce wafer yield rate and chip output.The mode that at present all adopts retaining ring to be pressed on the polishing pad of polishing block to wafer carrying device reduces " edge effect ".Retaining ring wear extent just must be changed after reaching certain value.The structure division above of tradition retaining ring adopts stainless steel, below wearing part adopt PEEK/PPS plastics to form.To the replacing of traditional retaining ring adopt or work certain hour or polishing the method for a certain amount of wafer carry out, in order to prevent " edge effect ", retaining ring, often by advance, frequently change, causes service life short.PEEK/PPS material price is high, and replacing too early can cause waste, and frequent replacing more can affect the normal operation of equipment, reduces production capacity and benefit.
Summary of the invention
The object of the invention is to provide under a kind of wafer carrying device when partial rotation and beat are carried out simultaneously, experience comprehensive polish pressure and change, the universal beat ability that lower part drives the relative polishing pad of wafer automatically to produce is strong; The fluid circuit that the different polishing area of wafer is applied to gas with various back pressure is rational in infrastructure, and easy for installation and back pressure region active area is large, isostasy; The retaining ring replacement cycle is reasonable, long service life; The wafer mounting groove degree of depth capable of regulating forming between retaining ring and wafer mounting disc.
The object of the invention is to realize.Chemically mechanical polishing wafer carrying device of the present invention comprises the some fluid pressure lines that are connected between the upper cover that is connected on buff spindle and buff spindle and upper cover, also comprise installing ring, current collecting plates, holding ring, retaining ring, swelling gasbag, wafer mounting disc, notacoria and the back pressure fluid circuit being connected with current collecting plates by buff spindle, upper cover, the lower surface of the notacoria that wherein, the outstanding wafer mounting disc of the lower plane of retaining ring is pasted forms wafer and deposits planar slot.Chemically mechanical polishing wafer carrying device of the present invention is characterised in that: an annular upper spherical bearing is installed below described upper cover, an annular lower peripheral surface bearing is installed above current collecting plates, the inside diameter surface of upper spherical bearing is withheld and on the external diameter surface of lower peripheral surface bearing, is become work matching pair, the lower surface center stationary fit of described upper cover connects the upper Oldham's coupling that a flexible material is made, the upper surface center stationary fit of current collecting plates connects the lower Oldham's coupling that a flexible material is made, upper Oldham's coupling and lower Oldham's coupling are flexible structure and are connected by screw, the lower surface outer rim of described upper cover is fixedly connected with annular installing ring, installing ring is provided with some pilot holes symmetrically together with upper cover is along the circumferential direction uniform, a restraint Zhu top is all slidably connected in described each pilot hole, the lower thread of restraint post is fixedly connected on the upper surface of current collecting plates, described upper spherical bearing, lower peripheral surface bearing, upper Oldham's coupling, lower Oldham's coupling, the installing ring that is fixed on restraint post on current collecting plates and is slidably connected with restraint post and the pilot hole above covering form universal joint swinging structure,
Described current collecting plates is fixedly connected with holding ring by screw, described wafer mounting disc is in holding ring centre bore, and be overlapped on the step of the lower edge in holding ring centre bore by the boss of top edge, the step of holding ring and current collecting plates clamp connecting wafer mounting disc jointly, the outer surface bottom of described holding ring is thin neck shape along circumference, on thin neck body, be socketed slidably retaining ring, the thin neck body outer surface of holding ring is circumferentially laid with some screw holes symmetrically, in each screw hole all screw thread bury underground connect a second order axle shape by thickness outer support screw dimerous, in described retaining ring, corresponding each outer support screw is laid with the strip spacing hole that some above-below directions are offered one by one, the stationary fit that the end face at described outer support screw butt end step place and described retaining ring are swollen support shape in the internal face of spacing hole edge is connected, the venturi portion of outer support screw is in the spacing hole of described retaining ring, be slidably connected with spacing hole, outer support screw on described holding ring, the spacing hole that becomes work matching pair with outer support screw in retaining ring and air bag form the mobile position-limit mechanism of retaining ring, described retaining ring is provided with adjustment pad between the upper plane of air bag outside and the lower plane of holding ring, described retaining ring, holding ring and adjustment pad form the degree of depth micro-adjusting mechanism that wafer is deposited planar slot.
Chemically mechanical polishing wafer carrying device of the present invention, wherein said upper cover, upper spherical bearing, installing ring forms top assembly, described current collecting plates, lower peripheral surface bearing, wafer mounting disc, holding ring, retaining ring, adjust pad and notacoria, restraint post forms lower component, described top assembly and lower component have the swing spatial domain of a lower component between installing ring and current collecting plates, the lower plane of described lower component by the relative top of restraint post assembly has a track that swings up and down that is subject to comprehensive polish pressure to change centered by the buff spindle axis any direction in 360 ° of planes.
Chemically mechanical polishing wafer carrying device of the present invention, in the swing spatial domain of wherein said top assembly and lower component, be provided with Si Tiao subregion and control the fluid circuit of back pressure hydraulic coupling, described current collecting plates lower surface is provided with four annular grooves with central point successively by diameter, correspondingly respectively in four annular grooves be provided with four sealing rings, the through hole that the upper surface of described chip mounting slot is provided with a plane groove and some circle distribution and is communicated with plane groove, the plane groove laminating of described four sealing rings and chip mounting slot, plane groove is cut apart to the I back pressure chamber that formation is sealed each other, II back pressure chamber, III back pressure chamber, IV back pressure chamber, four back pressure chambers are communicated with by the through hole of the chip mounting slot through hole corresponding with notacoria respectively,
The Wu Ge aperture that the Yu Qi lower surface, Wu Ge aperture that upper cover upper surface is radially-arranged and buff spindle fluid circuit is communicated with arranges is communicated with, the upper fixedly barb joint 33 in aperture 19 ', the upper fixedly barb joint 34 in aperture 20 ', the upper fixedly barb joint 35 in aperture 21 ', the upper fixedly barb joint 37 in upper fixedly barb joint 36， aperture 23 ', aperture 22 ';
It is respectively 24,27,28 and four 90 ° uniform through hole 25 and four 90 ° uniform through holes 26 that are on the same diameter of outer shroud that are on the same diameter of interior ring of through hole of one that current collecting plates is provided with, through hole 24 lower surface outlets are communicated with IV back pressure chamber, through hole 27 lower surface outlets are communicated with III back pressure chamber, four through hole 25 lower surface outlets are communicated with II back pressure chamber, four through hole 26 lower surface outlets are communicated with I back pressure chamber, the connecting hose of the interior grafting air bag of through hole 28.On current collecting plates upper surface: fixing barb joint 29 on through hole 24, on four through holes 25, fix respectively separately a joint linking together by flexible pipe 30, on four through holes 26, fix respectively separately a joint linking together by flexible pipe 31, on through hole 27, fixedly there is the connecting hose of air bag in barb joint 32， aperture 28;
Chemically mechanical polishing wafer carrying device difference from prior art of the present invention be chemically mechanical polishing wafer carrying device of the present invention adopt upper spherical bearing, lower peripheral surface bearing, upper Oldham's coupling, lower Oldham's coupling, be fixed on support column on current collecting plates and the installing ring that is slidably connected with support column and on the pilot hole that covers form gimbal structure, the universal beat ability that lower part drives wafer automatically to produce is strong.The mobile position-limit mechanism that the spacing hole that becomes work matching pair with outer support screw in outer support screw on holding ring, retaining ring and air bag form retaining ring makes that retaining ring extends service life, the replacement cycle is reasonable, changes easily.Retaining ring, holding ring and adjustment pad form the degree of depth micro-adjusting mechanism that wafer is deposited planar slot, change and adjust pad, make the wafer mounting groove degree of depth in prescribed limit.The present invention is when improving " edge effect ", and upper cover, current collecting plates adopt the method for offering fabrication hole to make the fluid distribution of wafer back pressure subregion control more reasonable, and pipeline is easy for installation and back pressure region active area large, isostasy.Structural design size of the present invention is large, can meet diameter wafers polishing requirement.
Below in conjunction with accompanying drawing, chemically mechanical polishing wafer carrying device of the present invention is described further.
Accompanying drawing explanation
Fig. 1 is the overall construction drawing of chemically mechanical polishing wafer carrying device of the present invention.
Fig. 2 is upper-part (install spherical bearing, conceal installing ring and the restraint post) structural representation of chemically mechanical polishing wafer carrying device.
Fig. 3 is lower member (lower peripheral surface the bearing has been installed) structural representation of chemically mechanical polishing wafer carrying device.
Fig. 4 is the mobile position-limit mechanism structural representation of the pressure control of chemically mechanical polishing wafer carrying Qi subregion and retaining ring.
Fig. 5 is the superstructure schematic diagram of chemically mechanical polishing wafer carrying device.
Fig. 6 is chemically mechanical polishing wafer carrying device structural member fabrication hole schematic diagram.
Fig. 7 is the current collecting plates structural representation of chemically mechanical polishing wafer carrying device.
Fig. 8 is current collecting plates lower surface schematic diagram.
Fig. 9 is the wafer mounting disc structural representation of chemically mechanical polishing wafer carrying device.
Figure 10 is the mobile position-limit mechanism structural representation of the retaining ring of chemically mechanical polishing wafer carrying device.
The specific embodiment
The present invention is the improvement to prior art.
As shown in Figure 1, chemically mechanical polishing wafer carrying device of the present invention comprises the some fluid pressure lines that are connected between the upper cover 1 that is connected on buff spindle and buff spindle and upper cover 1, also comprise installing ring 2, current collecting plates 3, holding ring 4, retaining ring 5, swelling gasbag 10, wafer mounting disc 11, notacoria 12 and the back pressure fluid circuit 8 being connected with current collecting plates 3 by buff spindle, upper cover 1, the lower surface of the notacoria 12 that wherein, the outstanding wafer mounting disc 11 of the lower plane of retaining ring 5 is pasted forms wafer and deposits planar slot 18.An annular upper spherical bearing 6 is installed below the upper cover 1 of chemically mechanical polishing wafer carrying device of the present invention, an annular lower peripheral surface bearing 7 is installed above current collecting plates 3.The inside diameter surface of upper spherical bearing 6 is withheld and on the external diameter surface of lower peripheral surface bearing 7, is become work matching pair.The lower surface center stationary fit of upper cover 1 is fixedly connected with the upper Oldham's coupling 38 that a flexible material is made, the upper surface center stationary fit of current collecting plates 3 is fixedly connected with the lower Oldham's coupling 39 that a flexible material is made, upper Oldham's coupling 38 and lower Oldham's coupling 39 are flexible structure and are connected by screw, form Oldham's coupling and be used for transferring power, realize wafer carrying device upper-part and drive lower member rotation.The lower surface outer rim of upper cover 1 is fixedly connected with annular installing ring 2, installing ring 2 is provided with some pilot holes symmetrically together with upper cover 1 is along the circumferential direction uniform, the restraint Zhu40 top that is all slidably connected in each pilot hole, the lower thread of restraint post 40 is fixedly connected on the upper surface of current collecting plates 3.Upper spherical bearing 6, lower peripheral surface bearing 7, upper Oldham's coupling 38, lower Oldham's coupling 39, the installing ring 2 and the formation of the pilot hole on the upper cover 1 universal joint swinging structure that are fixed on the restraint post 40 on current collecting plates 3 and are slidably connected with restraint post 40.
As shown in Fig. 1, Fig. 4, Figure 10, current collecting plates 3 is fixedly connected with holding ring 4 by screw.Wafer mounting disc 11 is in holding ring 4 centre bores, and is overlapped on the step of the lower edge in holding ring 4 centre bores by the boss of top edge, the step of holding ring 4 and the common clamping connecting wafer of current collecting plates 3 mounting disc 11.The outer surface bottom of holding ring 4 is thin neck shape along circumference, on thin neck body, is socketed slidably retaining ring 5.The thin neck body outer surface of holding ring 4 is circumferentially laid with some screw holes symmetrically, in each screw hole all screw thread bury underground connect a second order axle shape by thickness outer support screw 14 dimerous.In retaining ring 5, corresponding each outer support screw 14 is laid with the strip spacing hole that some above-below directions are offered one by one, the stationary fit that the end face at outer support screw 14 butt end step places and retaining ring 5 are swollen support shape in the internal face of spacing hole edge is connected, the venturi portion of outer support screw 14 is in the spacing hole of described retaining ring 5, is slidably connected with spacing hole.In outer support screw 14 on holding ring 4, retaining ring 5 and spacing holes 14 one-tenth work matching pairs of outer support screw and air bag 10 form the mobile position-limit mechanism of retaining rings 5.Retaining ring 5 is provided with between the upper plane of air bag 10 outsides and the lower plane of holding ring 4 adjusts pad 13.Retaining ring 5, holding ring 4 and adjustment pad 13 form the degree of depth micro-adjusting mechanism that wafers are deposited planar slot 18.The end face of retaining ring 5 is projected on wafer and polishing pad contact-making surface, makes wafer directly contact with polishing pad during chemically mechanical polishing.During polishing wafer, air bag 10 passes into compressed air, makes retaining ring 5 support screw 14 outward along retaining ring and moves downward ，Shi lower surface and contact with polishing pad, and then reduce " edge effect " of wafer.Adjust pad 13 in order to finely tune the height of the planar slot 18 of storing wafer.After retaining ring 5 is worn and torn, planar slot 18 degree of depth shoal.For guaranteeing planar slot 18 degree of depth height up to specification, increase the compressed air pressure of swelling gasbag 10, retaining ring 5 is moved downward again and further contact with polishing pad.Retaining ring 5 can not unconfinedly be worn and torn, when retaining ring 5 should be changed retaining ring 5 when stuck by outer support screw 14 is spacing, to prevent " edge effect ".
As Figure 1 and Figure 4, upper cover 1, upper spherical bearing 6, installing ring 2 form top assembly, and current collecting plates 3, lower peripheral surface bearing 7, wafer mounting disc 11, holding ring 4, retaining ring 5, adjustment pad 13 and notacoria 12, restraint post 40 form lower component.Top assembly and lower component have the swing spatial domain 15 of a lower component between installing ring 2 and current collecting plates 3.The lower plane of lower component by restraint post 40 relative top assemblies has a track that swings up and down that is subject to comprehensive polish pressure to change centered by the buff spindle axis any direction in 360 ° of planes.When wafer carrying device is positioned at free state, restraint post 40 is in installing ring 2 pilot holes, realize connection and the interlock of upper and lower two parts of wafer carrying device, now the swing spatial domain between the assembly of wafer carrying device upper and lower part 15 increases, and upper and lower spherical bearing contact area reduces; When wafer carrying device compresses polishing pad, supporting screw 40 moves upward along the pilot hole of installing ring 2, and now restraint Zhu40 top and upper cover 1 are still gapped, and limits lower component and can only in the angle allowing, do universal swing.
As shown in Fig. 1, Fig. 4, Fig. 8, in the swing spatial domain 15 of top assembly and lower component, be provided with the fluid circuit 8 that back pressure hydraulic coupling is controlled in Si Tiao subregion.Current collecting plates 3 lower surfaces are provided with four annular groove 16-1,16-2,16-3,16-4 with central point successively by diameter, corresponding four sealing ring 9-1,9-2,9-3, the 9-4 of being provided with respectively in four annular groove 16-1,16-2,16-3,16-4.The through hole (referring to Fig. 9) that chip mounting slot 11 upper surface is provided with a plane groove and some circle distribution and is communicated with plane groove.The plane groove laminating of four sealing ring 9-1,9-2,9-3,9-4 and chip mounting slots 11, cuts apart by plane groove I back pressure chamber 17-1, II back pressure chamber 17-2, III back pressure chamber 17-3, the IV back pressure chamber 17-4 that formation is sealed each other.Four back pressure chamber 17-1,17-2,17-3,17-4 are communicated with by the through hole of chip mounting slot 11 through hole corresponding with notacoria 12 respectively,
As shown in Fig. 2, Fig. 5, Fig. 6, the Wu Ge aperture 19 ', 20 ', 21 ', 22 ', 23 ' that the Wu Ge aperture 19,20,21,22 that upper cover 1 upper surface is radially-arranged and buff spindle fluid circuit is communicated with, 23Yu Qi lower surface arrange is communicated with.The upper fixedly barb joint 37 in upper fixedly barb joint 36， aperture 23 ', upper fixedly barb joint 35， aperture 22 ', upper fixedly barb joint 34， aperture 21 ', upper fixedly barb joint 33， aperture 20 ', aperture 19 '.
As shown in Fig. 3, Fig. 7, Fig. 8, it is respectively 24,27,28 and four 90 ° uniform through hole 25 and four 90 ° uniform through holes 26 that are on the same diameter of outer shroud that are on the same diameter of interior ring of through hole of one that current collecting plates 3 is provided with.Through hole 24 lower surface outlets are communicated with IV back pressure chamber 17-4, through hole 27 lower surface outlets 27 ' are communicated with III back pressure chamber 17-3, four through hole 25 lower surface outlets are communicated with II back pressure chamber 17-2, four through hole 26 lower surface outlets are communicated with I back pressure chamber 17-1, the connecting hose of the interior grafting air bag 10 of through hole 28.On current collecting plates 3 upper surfaces, fixing barb joint 29 on through hole 24, on four through holes 25, fix respectively separately a joint linking together by flexible pipe 30, on four through holes 26, fix respectively separately a joint linking together by flexible pipe 31, on through hole 27, fixedly there is the connecting hose of air bag 10 in barb joint 32， aperture 28.
As shown in Figure 1, Figure 2, Figure 3 shows, the barb joint 29 on the through hole 24 of current collecting plates 3 connects and composes the fluid circuit 8 of IV back pressure chamber 17-4 by the barb joint 37 on the aperture 23 ' of flexible pipe and upper cover 1; Barb joint 32 on the through hole 27 of current collecting plates 3 connects and composes the fluid circuit 8 of III back pressure chamber 17-3 by the barb joint 34 on the aperture 20 ' of flexible pipe and upper cover 1; Joint 30 on the through hole 25 of current collecting plates 3 connects and composes the fluid circuit 8 of II back pressure chamber 17-2 by the barb joint 36 on the aperture 22 ' of flexible pipe and upper cover 1; Joint 31 on the through hole 26 of current collecting plates 3 connects and composes the fluid circuit 8 of I back pressure chamber 17-1 by the barb joint 35 on the aperture 21 ' of flexible pipe and upper cover 1; Barb joint 33 on the aperture 19 ' of the flexible pipe of air bag 10 and upper cover 1 connects and composes the fluid circuit 8 of air bag 10.Crystal circle center's region polishing clearance is low, applies larger back pressure, and fringe region polishing clearance is high, apply less back pressure, above-mentioned design, by applying different back pressures to zones of different, make wafer zones of different clearance consistent, greatly improve the face form quality amount of chemically mechanical polishing wafer.
In the embodiment of the present invention, upper Oldham's coupling 38 and lower Oldham's coupling 39 also can adopt metal material to make.If upper Oldham's coupling 38 and lower Oldham's coupling 39 need to leave with the groove of installation place a certain amount of gap while adopting metal material.
The invention is not restricted to wafer back pressure 4 Region control of embodiment, utilize the technical program can expand or reduce back pressure control area.In the present invention, the hydraulic pressure oilhole on upper cover 1, current collecting plates 3 adopts the method for offering fabrication hole to make fluid distribution more reasonable, more easily realizes wafer back pressure subregion and controls.
Above-described embodiment is described the preferred embodiment of the present invention; not scope of the present invention is limited; design under the prerequisite of spirit not departing from the present invention; various distortion and improvement that those of ordinary skills make technical scheme of the present invention, all should fall in the definite protection domain of the claims in the present invention book.
Claims (3)
1. a chemically mechanical polishing wafer carrying device, comprise the some fluid pressure lines that are connected between the upper cover (1) that is connected on buff spindle and buff spindle and upper cover (1), also comprise installing ring (2), current collecting plates (3), holding ring (4), retaining ring (5), swelling gasbag (10), wafer mounting disc (11), notacoria (12) and pass through buff spindle, the back pressure fluid circuit (8) that upper cover (1) is connected with current collecting plates (3), wherein, the lower surface of the notacoria (12) that the outstanding wafer mounting disc (11) of lower plane of retaining ring (5) is pasted forms wafer and deposits planar slot (18), chemically mechanical polishing wafer carrying device of the present invention is characterised in that: an annular upper spherical bearing (6) is installed below described upper cover (1), an annular lower peripheral surface bearing (7) is installed above current collecting plates (3), the inside diameter surface of upper spherical bearing (6) is withheld and on the external diameter surface of lower peripheral surface bearing (7), is become work matching pair, the lower surface center stationary fit of described upper cover (1) connects the upper Oldham's coupling (38) that a flexible material is made, the upper surface center stationary fit of current collecting plates (3) connects the lower Oldham's coupling (39) that a flexible material is made, upper Oldham's coupling (38) and lower Oldham's coupling (39) are flexible structure and are connected by screw, the lower surface outer rim of described upper cover (1) is fixedly connected with annular installing ring (2), installing ring (2) is provided with some pilot holes symmetrically together with upper cover (1) is along the circumferential direction uniform, the top of a restraint post (40) is all slidably connected in described each pilot hole, the lower thread of restraint post (40) is fixedly connected on the upper surface of current collecting plates (3), described upper spherical bearing (6), lower peripheral surface bearing (7), upper Oldham's coupling (38), lower Oldham's coupling (39), be fixed on the restraint post (40) on current collecting plates (3) and form universal joint swinging structure with installing ring (2) and the pilot hole on upper cover (1) that restraint post (40) is slidably connected,
Described current collecting plates (3) is fixedly connected with holding ring (4) by screw, described wafer mounting disc (11) is in holding ring (4) centre bore, and be overlapped on the step of the lower edge in holding ring (4) centre bore by the boss of top edge, the step of holding ring (4) and current collecting plates (3) clamp connecting wafer mounting disc (11) jointly, the outer surface bottom of described holding ring (4) is thin neck shape along circumference, on thin neck body, be socketed slidably retaining ring (5), the thin neck body outer surface of holding ring (4) is circumferentially laid with some screw holes symmetrically, in each screw hole all screw thread bury underground connect a second order axle shape by thickness outer support screw dimerous (14), in described retaining ring (5), corresponding each outer support screw (14) is laid with the strip spacing hole that some above-below directions are offered one by one, the stationary fit that the end face at described outer support screw (14) butt end step place and described retaining ring (5) are swollen support shape in the internal face of spacing hole edge is connected, the venturi portion of outer support screw (14) is in the spacing hole of described retaining ring (5), be slidably connected with spacing hole, outer support screw (14) on described holding ring (4), the spacing hole that becomes work matching pair with outer support screw (14) in retaining ring (5) and air bag (10) form the mobile position-limit mechanism of retaining ring (5), described retaining ring (5) is provided with between the upper plane of air bag (10) outside and the lower plane of holding ring (4) adjusts pad (13), described retaining ring (5), holding ring (4) and adjustment pad (13) form the degree of depth micro-adjusting mechanism that wafer is deposited planar slot (18).
2. chemically mechanical polishing wafer carrying device according to claim 1, it is characterized in that: described upper cover (1), upper spherical bearing (6), installing ring (2) forms top assembly, described current collecting plates (3), lower peripheral surface bearing (7), wafer mounting disc (11), holding ring (4), retaining ring (5), adjust pad (13) and notacoria (12), restraint post (40) forms lower component, described top assembly and lower component have the swing spatial domain (15) of a lower component between installing ring (2) and current collecting plates (3), described lower component by restraint post (40) relatively the lower plane of top assembly there is a track that swings up and down that is subject to comprehensive polish pressure to change centered by the buff spindle axis any direction in 360 ° of planes.
3. according to chemically mechanical polishing wafer carrying device described in claim 1 or 2, it is characterized in that: in the swing spatial domain (15) of described top assembly and lower component, be provided with the fluid circuit (8) that back pressure hydraulic coupling is controlled in Si Tiao subregion, described current collecting plates (3) lower surface is provided with four annular groove (16-1 with central point successively by diameter, 16-2, 16-3, 16-4), four annular groove (16-1, 16-2, 16-3, correspondingly respectively 16-4) be provided with four sealing ring (9-1, 9-2, 9-3, 9-4), the through hole that the upper surface of described chip mounting slot (11) is provided with a plane groove and some circle distribution and is communicated with plane groove, described four sealing ring (9-1, 9-2, 9-3, 9-4) fit with the plane groove of chip mounting slot (11), plane groove is cut apart to the I back pressure chamber (17-1) that formation is sealed each other, II back pressure chamber (17-2), III back pressure chamber (17-3), IV back pressure chamber (17-4), four back pressure chamber (17-1, 17-2, 17-3, 17-4) by the through hole of chip mounting slot (11) through hole corresponding with notacoria (12), be communicated with respectively,
The Wu Ge aperture (19 ', 20 ', 21 ', 22 ', 23 ') that the Yu Qi lower surface, Wu Ge aperture (19,20,21,22,23) that described upper cover (1) upper surface is radially-arranged and buff spindle fluid circuit is communicated with arranges is communicated with, the upper fixedly barb joint (33) in aperture (19 '), the upper fixedly barb joint (34) in aperture (20 '), the upper fixedly barb joint (35) in aperture (21 '), the upper fixedly barb joint (36) in aperture (22 '), the upper fixedly barb joint (37) in aperture (23 ');
It is respectively the through hole (24 of that described current collecting plates (3) is provided with, 27, 28) and four 90 ° uniform through hole (25) and four the 90 ° uniform through holes (26) that are on the same diameter of outer shroud that are on the same diameter of interior ring, the outlet of through hole (24) lower surface is communicated with IV back pressure chamber (17-4), through hole (27) lower surface outlet (27 ') is communicated with III back pressure chamber (17-3), the lower surface outlet of four through holes (25) is communicated with II back pressure chamber (17-2), the lower surface outlet of four through holes (26) is communicated with I back pressure chamber (17-1), the connecting hose of the interior grafting air bag of through hole (28) (10), on current collecting plates (3) upper surface, the upper fixedly barb joint (29) of through hole (24), on four through holes (25), fix respectively separately a joint linking together by flexible pipe (30), on four through holes (26), fix respectively separately a joint linking together by flexible pipe (31), the upper fixedly barb joint (32) of through hole (27), the connecting hose in aperture (28) with air bag (10),
Barb joint (29) on the through hole (24) of described current collecting plates (3) connects and composes the fluid circuit (8) of IV back pressure chamber (17-4) by the barb joint (37) on the aperture (23 ') of flexible pipe and upper cover (1), barb joint (32) on the through hole (27) of described current collecting plates (3) connects and composes the fluid circuit (8) of III back pressure chamber (17-3) by the barb joint (34) on the aperture (20 ') of flexible pipe and upper cover (1), joint (30) on the through hole (25) of described current collecting plates (3) connects and composes the fluid circuit (8) of II back pressure chamber (17-2) by the barb joint (36) on the aperture (22 ') of flexible pipe and upper cover (1), joint (31) on the through hole (26) of described current collecting plates (3) connects and composes the fluid circuit (8) of I back pressure chamber (17-1) by the barb joint (35) on the aperture (21 ') of flexible pipe and upper cover (1), barb joint (33) on the aperture (19 ') of the flexible pipe of air bag (10) and upper cover (1) connects and composes the fluid circuit (8) of air bag (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310442865.9A CN103506940B (en) | 2013-09-26 | 2013-09-26 | Chemically mechanical polishing wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310442865.9A CN103506940B (en) | 2013-09-26 | 2013-09-26 | Chemically mechanical polishing wafer carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103506940A true CN103506940A (en) | 2014-01-15 |
| CN103506940B CN103506940B (en) | 2017-01-04 |
Family
ID=49890648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310442865.9A Active CN103506940B (en) | 2013-09-26 | 2013-09-26 | Chemically mechanical polishing wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103506940B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405802A (en) * | 2015-11-30 | 2016-03-16 | 浙江大学 | Wet etching protection clamp free of damage to wafer |
| CN111451928A (en) * | 2020-05-15 | 2020-07-28 | 中国科学院微电子研究所 | Polishing head and polishing device |
| RU202078U1 (en) * | 2020-09-28 | 2021-01-29 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" | SEMICONDUCTOR PLATE ADAPTER |
| CN113829233A (en) * | 2021-08-21 | 2021-12-24 | 浙江晶盛机电股份有限公司 | Polishing carrier |
| CN113910102A (en) * | 2021-11-02 | 2022-01-11 | 华海清科股份有限公司 | Bearing head for chemical mechanical polishing |
| CN116038552A (en) * | 2023-02-10 | 2023-05-02 | 北京晶亦精微科技股份有限公司 | Polishing head, substrate polishing device and polishing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1228367A (en) * | 1997-12-04 | 1999-09-15 | 日本电气株式会社 | Wafer polishing apparatus and polishing method |
| CN1515027A (en) * | 2001-08-03 | 2004-07-21 | ���Ͽع�����˾ | Wafer holding ring for chemical and mechanical polisher |
| EP1894675A1 (en) * | 2006-09-01 | 2008-03-05 | Fujikoshi Machinery Corp. | Double face polishing apparatus |
| CN101850538A (en) * | 2009-04-01 | 2010-10-06 | 日月光半导体制造股份有限公司 | Support jig of wafer and method for grinding, transferring and cutting wafer |
| CN103252707A (en) * | 2013-05-07 | 2013-08-21 | 上海华力微电子有限公司 | Bearing device and method for carrying out wafer transferring by means of device |
-
2013
- 2013-09-26 CN CN201310442865.9A patent/CN103506940B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1228367A (en) * | 1997-12-04 | 1999-09-15 | 日本电气株式会社 | Wafer polishing apparatus and polishing method |
| CN1515027A (en) * | 2001-08-03 | 2004-07-21 | ���Ͽع�����˾ | Wafer holding ring for chemical and mechanical polisher |
| EP1894675A1 (en) * | 2006-09-01 | 2008-03-05 | Fujikoshi Machinery Corp. | Double face polishing apparatus |
| CN101850538A (en) * | 2009-04-01 | 2010-10-06 | 日月光半导体制造股份有限公司 | Support jig of wafer and method for grinding, transferring and cutting wafer |
| CN103252707A (en) * | 2013-05-07 | 2013-08-21 | 上海华力微电子有限公司 | Bearing device and method for carrying out wafer transferring by means of device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405802A (en) * | 2015-11-30 | 2016-03-16 | 浙江大学 | Wet etching protection clamp free of damage to wafer |
| CN111451928A (en) * | 2020-05-15 | 2020-07-28 | 中国科学院微电子研究所 | Polishing head and polishing device |
| RU202078U1 (en) * | 2020-09-28 | 2021-01-29 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" | SEMICONDUCTOR PLATE ADAPTER |
| CN113829233A (en) * | 2021-08-21 | 2021-12-24 | 浙江晶盛机电股份有限公司 | Polishing carrier |
| CN113910102A (en) * | 2021-11-02 | 2022-01-11 | 华海清科股份有限公司 | Bearing head for chemical mechanical polishing |
| CN116038552A (en) * | 2023-02-10 | 2023-05-02 | 北京晶亦精微科技股份有限公司 | Polishing head, substrate polishing device and polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103506940B (en) | 2017-01-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103506940A (en) | Chemical mechanical polishing wafer loader | |
| KR100737879B1 (en) | Method of manufacturing semiconductor wafer | |
| CN103737444B (en) | A kind of universal floating polishing process | |
| US10220486B2 (en) | Disc containing copper for sapphire polishing, and method for preparing discs containing copper facing each other | |
| CN205310026U (en) | Double -side grinding machine | |
| CN106312796A (en) | Planarization machining device and single-face and double-face planarization machining system | |
| CN201856158U (en) | Wafer polishing locating ring and chemical mechanical polishing device | |
| US20240123567A1 (en) | Double-sided polishing method for optical lens | |
| KR20020081291A (en) | Grinding pin for grinding machines comprising resin bonded selections of rough grit and fine grit | |
| KR20030039606A (en) | Apparatus and method for conditioning a polishing pad used in a chemical-mechanical polishing system | |
| CN110076703A (en) | A kind of hydraulic grinding wheel of magnetic fluid and its controllable type polishing processing method | |
| CN105345646A (en) | Tool for running-in machining of ball body and valve seat of ball valve | |
| CN106312797A (en) | Polishing assembly for adjusting pressure intensity distribution in edge area of optical element | |
| CN206689907U (en) | A kind of fixture of solid-liquid two-phase flow polishing helical gear | |
| CN106736875B (en) | A kind of processing method of sapphire dome | |
| CN105014523B (en) | A kind of comprehensive milling tool of metal seal ball valve | |
| CN105189045A (en) | Workpiece polishing device | |
| CN108655878A (en) | Three-eccentric-butterfly-valve valve base sealing surface grinding | |
| CN106466796A (en) | A kind of manufacture method of 3D sapphire panel and sapphire panel | |
| CN205021390U (en) | All -round milling tool of metal seal ball valve | |
| CN208276656U (en) | A kind of burnishing device of cylindrical mirror arc surface | |
| CN1814407B (en) | Method and device for grinding large-size workpiece | |
| CN103252712B (en) | Wafer polishing magnetic loading clamping device | |
| CN206732788U (en) | A kind of sheet material grinder | |
| CN203426856U (en) | Polishing pad arranging device and polishing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |