CN116038552A - Polishing head, substrate polishing device and polishing method - Google Patents
Polishing head, substrate polishing device and polishing method Download PDFInfo
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- CN116038552A CN116038552A CN202310152463.9A CN202310152463A CN116038552A CN 116038552 A CN116038552 A CN 116038552A CN 202310152463 A CN202310152463 A CN 202310152463A CN 116038552 A CN116038552 A CN 116038552A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a polishing head, a substrate polishing device and a polishing method, wherein the polishing head comprises: a body; the adsorption holding assembly is fixedly arranged at the bottom center of the body and used for adsorbing the substrate and pressing the substrate on the polishing surface; and the edge force application assembly is arranged on the outer peripheral side of the adsorption and holding assembly and is positioned below the body, and the bottom wall of the edge force application assembly is suitable for being pressed on the peripheral area of the substrate so as to adjust the polishing pressure applied to the edge area of the substrate. According to the invention, the control of the grinding quantity of the edge of the substrate can be adjusted by arranging the edge force application component; and meanwhile, the adsorption and maintenance assembly is also arranged, and the grinding amount of the middle part of the substrate can be adjusted by adjusting the air pressure value in each ventilation groove and each closed adsorption cavity communicated with the ventilation grooves, so that the uniformity and consistency of the surface of the substrate are improved, and the aim of high planarization is fulfilled.
Description
Technical Field
The invention relates to the technical field of chemical mechanical polishing, in particular to a polishing head, a substrate polishing device and a polishing method.
Background
Integrated circuit fabrication processes generally refer to the deposition of conductive, semiconductive, insulating layers on a particular substrate, such as a silicon-based substrate, in a process sequence. During the manufacturing process, chemical mechanical polishing (Chemical Mechanical Planarization, CMP) is an ultra-precise surface processing technique for global planarization, and CMP equipment is mainly used for global planarization of micro-rough surfaces of substrates after a film deposition process. Chemical mechanical polishing typically adsorbs a substrate to the bottom surface of a polishing head, the surface of the substrate having a deposition layer being pressed against the upper surface of a polishing pad, the polishing head being driven by a drive assembly to rotate in the same direction as the polishing pad and to impart a downward load to the substrate; meanwhile, the grinding liquid is supplied to the upper surface of the grinding pad through the conveying system and distributed between the substrate and the polishing pad, so that the substrate finishes the chemical mechanical polishing of the substrate under the combined action of chemistry and machinery.
As semiconductor substrate diameters increase and chip critical feature sizes shrink, high planarity, uniformity, consistency of substrate surfaces and wear on substrate edges are increasingly critical in Chemical Mechanical Polishing (CMP) processes. The CMP polishing head in the prior art generally adopts a multi-chamber regional flexible film, a plurality of chambers of the flexible film are integrally formed, the structure is complex, the processing and manufacturing cost is high, the traditional flexible film is suitable for a structural function transfer loading and unloading substrate, the relative position of the substrate cannot be fixed, the uniformity difference in the process is large, certain difference exists in the transfer loading and unloading process, and the transfer failure risk is caused. The flexible membrane is usually arranged on the retaining ring in a matched manner through the outer peripheral wall of the flexible membrane, so that a flexible membrane and retaining ring matched mounting structure is formed, and the flexible membrane and the retaining ring are high-cost consumable materials, so that the maintenance period is short, and the maintenance cost is high. In addition, because the edge area only depends on indirect transmission between flexible diaphragm air bags to the substrate grinding down pressure, the area adjustment controllability is poor, the application feedback timeliness is poor, the edge pressure control effect is poor, and the phenomenon of uneven polishing of the edge of the substrate can occur.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to overcome the defects of the multi-chamber regional flexible film for the CMP polishing head in the prior art, such as complex structure, high processing and manufacturing cost, poor regional adjustment controllability, poor application feedback timeliness, poor edge pressure control effect, possibility of uneven polishing of the edge of the substrate and the like caused by the fact that the edge region only depends on indirect transmission between flexible diaphragm air bags for the polishing down force of the substrate.
To this end, in a first aspect, embodiments of the present invention provide a polishing head comprising:
a body;
the adsorption holding assembly is fixedly arranged at the bottom center of the body and used for adsorbing the substrate and pressing the substrate on the polishing surface;
and the edge force application assembly is arranged on the outer peripheral side of the adsorption and holding assembly and is positioned below the body, and the bottom wall of the edge force application assembly is suitable for being pressed on the peripheral area of the substrate so as to adjust the polishing pressure applied to the edge area of the substrate.
Optionally, the adsorption holding assembly includes:
the pressing disc is fixedly arranged on the bottom wall of the body and used for pressing the substrate;
the vacuum adsorption structure comprises an air vent groove arranged on the bottom wall of the pressing disc and a sealing ring arranged on the outer peripheral side of the air vent groove, and the air vent groove is suitable for being communicated with the vacuumizing device;
when the pressing disc is pressed on the substrate, the sealing ring is in sealing contact with the substrate, so that a closed adsorption cavity communicated with the ventilation groove is formed between the pressing disc and the substrate.
Optionally, the vacuum adsorption structure comprises a plurality of groups of ventilation grooves which are arranged at intervals along the radial direction of the pressing disc;
each group of ventilation grooves at least corresponds to one sealing ring, and the sealing rings are annular and are arranged on the periphery side of the corresponding ventilation groove along the radial interval of the pressing disc.
Optionally, the ventilation groove is an annular groove formed in the bottom wall of the pressing disc; the annular ventilation grooves are coaxially arranged with the pressing disc, and are arranged along the radial direction of the pressing disc, and the ventilation grooves are sequentially nested from inside to outside and are distributed at intervals.
Optionally, each set of the vent grooves includes an annular vent groove, and each vent groove corresponds to an annular sealing ring;
the sealing rings and the ventilation grooves are coaxially arranged, and the outer diameter sizes of the sealing rings are gradually increased along the radial direction of the pressing disc;
two sealing rings positioned at the inner side and the outer side of the ventilation groove are matched with the bottom wall of the pressing plate and the adsorbed substrate to form the closed adsorption cavity.
Optionally, the edge force application assembly includes:
the ring body is sequentially provided with a first soft film chamber and a second soft film chamber along the force application direction, wherein the first soft film chamber and the second soft film chamber are mutually independent, and the bottom of the second soft film chamber is provided with an action surface suitable for pressing the substrate;
and one end of the force application structure is positioned in the first soft film chamber, the other end of the force application structure extends downwards to a position close to the acting surface of the second soft film chamber, and the force application structure is suitable for downwards moving to apply force to the acting surface of the second soft film chamber when the air pressure in the first soft film chamber is increased so as to press the edge area of the substrate.
Optionally, the force application structure includes:
the support piece is arranged in the first soft film chamber and is suitable for moving and applying force to the second soft film chamber when the pressure in the first soft film chamber changes;
the pressurizing piece is arranged in the second soft film chamber, one end of the pressurizing piece is fixedly installed and connected with the supporting piece, the other end of the pressurizing piece extends to an action surface close to the second soft film chamber, and the pressurizing piece can move in the second soft film chamber when being stressed so as to press the action surface of the second soft film chamber.
Optionally, one end of the pressurizing piece, which is close to the acting surface of the second soft film chamber, is shaped into a plane.
Optionally, the edge force application assembly further comprises:
and the limiting piece is coated on the outer peripheral wall of the first soft film chamber and is suitable for limiting the first soft film chamber to radially deform under the action of gas pressure.
The beneficial effects are that:
1. the embodiment of the invention is provided with the edge force application component, and the control of the grinding quantity of the edge of the substrate can be regulated by regulating the gas pressure in the first soft film cavity; meanwhile, the adsorption and maintenance assembly is further arranged, and the grinding amount of the middle position of the substrate can be adjusted by adjusting the air pressure value in each ventilation groove and each closed adsorption cavity communicated with the ventilation grooves, so that the uniformity and consistency of the surface of the substrate are improved, and the purpose of high planarization is achieved.
2. According to the embodiment of the invention, the bottom of the pressing disc is provided with the plurality of ventilation grooves and the plurality of sealing rings matched with the ventilation grooves, so that a plurality of groups of vacuum adsorption structures distributed at intervals along the radial direction of the pressing disc are formed, the substrate can be stably adsorbed, the substrate is prevented from being displaced relative to the pressing disc in the grinding process, the adsorption is firmer, a retaining ring is not required to be arranged, the problems that the substrate is subjected to technology of dynamic self-adaptive pressing of the flexible film, the relative position of the substrate cannot be fixed, the technology uniformity is low, and the substrate is easy to discard after the technology are solved. Meanwhile, the vacuum adsorption structure in the embodiment is composed of the ventilation groove and the annular sealing ring, and is simple in structure and low in processing and maintenance cost.
In addition, the embodiment forms a plurality of closed adsorption cavities which are communicated with a plurality of ventilation grooves in a one-to-one correspondence manner, in the grinding and polishing process, the adsorption force or pressing force of each closed adsorption cavity on the position of each radial region of the substrate can be adjusted by controlling the air pressure value in each ventilation groove and each closed adsorption cavity communicated with the ventilation grooves, when a certain adsorption cavity is positive pressure, the radial region corresponding to the closed cavity on the substrate can be pressed, and when a certain adsorption cavity is negative pressure, the radial region corresponding to the closed cavity on the substrate can be adsorbed. By reducing the adsorption force of a certain closed adsorption cavity or increasing the positive pressure pressing force, the adsorbed substrate is more fully grinded at the position corresponding to the closed adsorption cavity; similarly, the grinding amount of the substrate at the position corresponding to the closed adsorption cavity is reduced by increasing the adsorption force of the closed adsorption cavity or reducing the positive pressure pressing force, so that the control of the grinding amount of the substrate at the middle position in the substrate grinding process can be effectively solved, the uniformity and consistency of the substrate surface are improved, and the purpose of high planarization is achieved.
3. In the embodiment of the invention, when the substrate is ground, the force application structure is matched with the second soft film chamber to press the edge of the substrate, so that the bottom surface of the second soft film chamber is in full contact with the substrate, and the grinding is more uniform; and the lower pressure generated by the hard force application structure is faster than the lower pressure generated by vacuum pressure contact, has no hysteresis and high timeliness, and ensures that the substrate is polished more flatly.
4. In the embodiment of the invention, one end of the pressurizing piece, which is close to the acting surface of the second soft film chamber, is molded into a plane. The planar setting has increased the action face area of contact of pressure piece and second soft membrane cavity for the vertical deformation of first soft membrane cavity produced down pressure transfer to the pressure piece on, even dispersion effect on the base plate, prevent to concentrate on a bit and make the base plate take place the damage because of down pressure.
5. In the embodiment of the invention, the limiting piece effectively limits the radial deformation of the first soft film chamber, so that the first soft film chamber generates constant longitudinal deformation under the action of pressure, the longitudinal deformation generates uniform downward pressure, and the uniform downward pressure is effectively transmitted to the pressurizing piece through the limiting piece, thereby further improving the timeliness of force transmission, realizing the effective pressing of the edge of the substrate and ensuring the uniformity of pressing.
In a second aspect, an embodiment of the present invention further provides a substrate polishing apparatus including the polishing head according to any one of the preceding embodiments.
The beneficial effects are that:
the substrate polishing device provided by the invention comprises the polishing head, wherein the technical advantages and effects achieved by the substrate polishing device also comprise the technical advantages and effects achieved by the polishing head, and the technical advantages and effects are not repeated here.
In a third aspect, an embodiment of the present invention further provides a polishing method performed using the polishing head according to any one of the above embodiments, including the steps of:
mounting a polishing head on a substrate polishing apparatus;
pressing the substrate on the polishing surface by using an adsorption and holding assembly on the polishing head, and adjusting the polishing amount at the position of the central area of the substrate by adjusting the adsorption force or the pressing force of the adsorption and holding assembly to the position of the central area of the substrate in the polishing process; the grinding amount of the edge area of the substrate is adjusted by adjusting the pressing force of the edge force application assembly on the substrate.
The beneficial effects are that:
the polishing head in the foregoing embodiment is adopted in the polishing method, and technical advantages and effects achieved by the polishing method include technical advantages and effects achieved by the polishing head, which are not described herein.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a polishing head according to the present invention;
fig. 2 is a schematic structural diagram of a plurality of groups of vacuum adsorption structures.
Reference numerals illustrate:
100. a substrate;
1. a body; 2. pressing a disc;
3. a vacuum adsorption structure; 31. a vent groove; 32. a seal ring;
4. a ring body; 41. a first flexible film chamber; 42. a second flexible film chamber;
5. a support; 6. a pressurizing member; 7. and a limiting piece.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
As shown in fig. 1 and 2, an embodiment of the present invention provides a polishing head including a body 1, a suction holding assembly, and an edge force application assembly.
The adsorption maintaining component is fixedly arranged at the bottom center of the body 1 and used for adsorbing the substrate 100 and pressing the substrate 100 on the upper surface of the polishing pad, and the body 1 can drive the adsorption maintaining component to rotate around the rotation shaft.
The adsorption and retention assembly comprises a pressing disc 2 and a vacuum adsorption structure 3, wherein the pressing disc 2 is fixedly arranged on the bottom wall of the body 1 and used for pressing the pressing disc 2 of the substrate 100, and the pressing disc 2 is coaxially arranged with the body 1 and can rotate around a central shaft under the drive of the body 1; the vacuum adsorption structure 3 includes a vent groove 31 provided on the bottom wall of the pressing plate 2, and a seal ring 32 provided on the outer peripheral side of the vent groove 31, the vent groove 31 being adapted to communicate with an external vacuum-pumping device; when the pressing plate 2 is pressed against the substrate 100, the sealing ring is in sealing contact with the substrate 100 to form a sealed adsorption chamber communicating with the air vent groove 31 between the pressing plate 2 and the substrate 100. The ventilation groove 31 is communicated with the vacuumizing device through a vacuumizing channel, and the vacuumizing channel is a hose penetrating through the pressing disc 2. When the external vacuumizing device vacuumizes the ventilation groove 31, the ventilation groove 31 and the air in the closed adsorption cavity are vacuumized through the vacuumizing pipeline and form a negative pressure environment, so that the substrates 100 such as the substrates are adsorbed.
In the embodiment of the invention, the bottom of the pressing disc 2 is provided with the plurality of ventilation grooves 31 and the plurality of sealing rings 32 matched with the ventilation grooves to form the plurality of groups of vacuum adsorption structures 3 which are distributed and arranged at intervals along the radial direction of the pressing disc 2, so that the central area of the substrate 100 can be stably adsorbed, the substrate 100 is prevented from being displaced relative to the pressing disc 2 in the grinding process, the adsorption is firmer, a retaining ring is not required to be arranged, and the problems that the flexible film dynamically and adaptively presses the substrate for processing, the relative position of the substrate cannot be fixed, the process uniformity is lower, and the substrate is easy to discard after the process are solved. Meanwhile, the vacuum adsorption structure 3 in the embodiment is composed of the ventilation groove 31 and the annular sealing ring 32, and is simple in structure and low in processing and maintenance cost.
In addition, in the present embodiment, a plurality of closed adsorption chambers are formed, which are in one-to-one correspondence with the plurality of air channels 31, and in the polishing process, the air pressure values in each air channel 31 and each closed adsorption chamber communicated with the air channel can be controlled to adjust the adsorption force or the pressing force of each closed adsorption chamber on each radial region of the substrate 100, when a positive pressure exists in one of the adsorption chambers, the radial region corresponding to the closed chamber on the substrate 100 can be pressed, and when a negative pressure exists in one of the adsorption chambers, the radial region corresponding to the closed chamber on the substrate 100 can be adsorbed. By reducing the adsorption force of a certain closed adsorption cavity or increasing the positive pressure pressing force, the adsorbed substrate 100 is more fully ground at the position corresponding to the closed adsorption cavity; similarly, by increasing the adsorption force of a certain closed adsorption cavity or reducing the positive pressure pressing force, the grinding amount of the substrate 100 at the position corresponding to the closed adsorption cavity is reduced, so that the control of the grinding amount of the middle position of the substrate in the substrate grinding process can be effectively solved, the uniformity and consistency of the surface of the substrate are improved, and the purpose of high planarization is achieved. According to the embodiment of the invention, the Chuck/Dechuck function is removed, the risk of abnormal functions is avoided, and the efficiency is improved.
And an edge force application assembly disposed on the outer peripheral side of the suction holding assembly and below the body 1, the bottom wall of the edge force application assembly being adapted to be pressed against the peripheral region of the substrate 100 to adjust the polishing pressure applied to the edge region of the substrate 100, thereby making the edge of the substrate 100 even.
Alternatively, the vacuum suction structure 3 includes a plurality of sets of ventilation grooves 31 arranged at intervals in the radial direction of the pressing plate; each group of ventilation grooves 31 at least corresponds to one sealing ring 32 which is annular and is arranged at intervals along the radial direction of the pressing plate on the periphery side of the corresponding ventilation groove.
Alternatively, the vent groove 31 is an annular groove formed in the bottom wall of the pressing plate 2; the annular ventilation grooves 31 are coaxially arranged with the pressing disc 2, and the ventilation grooves 31 are nested and arranged at intervals from inside to outside in sequence along the radial direction of the pressing disc 2. By this arrangement, the polishing head can uniformly polish the annular areas of the substrate 100 corresponding to the plurality of annular grooves 31 during the spin polishing of the substrate 100, so that the polishing at the same circumferential position on the substrate 100 is more uniform.
Each set of vent grooves 31 comprises an annular vent groove 31, and each vent groove 31 corresponds to an annular sealing ring 32; the plurality of sealing rings 32 and the plurality of ventilation grooves 31 are coaxially arranged, and the outer diameter sizes of the plurality of sealing rings gradually increase along the radial direction of the pressing disc 2; two sealing rings 32 positioned on the inner side and the outer side of the ventilation groove 31 are matched with the bottom wall of the pressing disc 2 and the absorbed substrate 100 to form the closed absorption cavity.
Of course, the vent grooves may also be provided in a non-annular shape; each group of ventilation slots can also comprise a plurality of ventilation slots which are arranged at intervals along the same circumference so as to realize adsorption on different positions on the same circumference of the substrate. The shape of the vent groove is not limited in this embodiment, and those skilled in the art can adjust the vent groove according to actual needs.
In the embodiment of the invention, the edge force application assembly comprises a ring body 4 and a force application structure. The ring body 4 is sequentially provided with a first soft film chamber 41 and a second soft film chamber 42 along the force application direction, wherein the first soft film chamber 41 and the second soft film chamber 42 are mutually independent, and the bottom of the second soft film chamber 42 is provided with an action surface suitable for pressing the substrate 100; the force application structure is disposed at the connection between the first soft film chamber 41 and the second soft film chamber 42, one end is located in the first soft film chamber 41, and the other end extends downward to a position close to the acting surface of the second soft film chamber 42, and the force application structure is adapted to move downward to apply force to the acting surface of the second soft film chamber when the air pressure in the first soft film chamber 41 increases, so as to press the edge region of the substrate 100.
In the embodiment of the invention, when the substrate 100 is ground, the force application structure is matched with the second soft film chamber 42 to press the edge of the substrate 100, so that the bottom surface of the second soft film chamber 42 is in full contact with the substrate 100, and the grinding is more uniform; and the downward pressure generated by the hard force application structure is faster than the downward pressure generated by the vacuum pressure contact, and has no hysteresis and high timeliness, so that the substrate 100 is polished more flatly.
The force application structure comprises a support piece 5 and a pressurizing piece 6, wherein the support piece 5 is arranged in the first soft film chamber 41 and is suitable for moving and applying force to the second soft film chamber 42 when the pressure in the first soft film chamber 41 changes; the pressurizing piece 6 is arranged in the second soft film chamber 42, one end of the pressurizing piece 6 is fixedly installed and connected with the supporting piece 5, the other end of the pressurizing piece extends to an action surface close to the second soft film chamber 42, and the pressurizing piece 6 can move in the second soft film chamber 42 when being stressed so as to press the action surface of the second soft film chamber 42.
Alternatively, the end of the pressing member 6 near the active surface of the second soft film chamber 42 is formed in a flat surface. The planar arrangement increases the contact area of the pressing member 6 and the acting surface of the second soft film chamber 42, so that the downward pressure generated by the longitudinal deformation of the first soft film chamber 41 is transmitted to the pressing member 6, and the downward pressure is uniformly dispersed and acted on the substrate 100, so that the substrate 100 is prevented from being damaged due to the concentration of the downward pressure at one point.
Optionally, the edge force application assembly further includes a limiting member 7 wrapped around the peripheral wall of the first soft film chamber 41, where the limiting member 7 is configured to limit the first soft film chamber 41 from being radially deformed under the action of gas pressure. The limiting piece 7 effectively limits the radial deformation of the first soft film chamber 41, so that the first soft film chamber 41 generates constant longitudinal deformation under the action of pressure, the longitudinal deformation generates uniform downward pressure, the force is effectively transferred to the pressurizing piece 6 through the limiting piece 7, the timeliness of force transfer is further improved, the effective pressing of the edge of the substrate 100 is realized, and the pressing uniformity is ensured. The support piece 5 and the pressurizing piece 6 are connected through the fastener, the fastener can be a screw, the limiting piece 7 is sleeved outside the fastener, the limiting piece 7 is of a T-shaped structure, the T-shaped structure is connected with the support piece 5 and the pressurizing piece 6 through the screw, the limiting piece of the T-shaped structure is horizontally placed, so that the included angle of the limiting piece is coated on the side wall of the lower end of the first soft film chamber 41, the pressurizing piece 6 comprises a support part with a groove body and a force application part arranged below the support part, and the lower end of the screw is fixed in the groove body of the support part.
When the polishing head is used, the soft film chamber contacting the substrate is filled with gas with different pressures, when the first soft film chamber 41 is filled with gas, the first soft film chamber 41 deforms, the first soft film chamber 41 generates constant longitudinal deformation due to the fact that the upper portion of the limiting piece 7 limits the radial deformation of the first soft film chamber 41, the supporting piece 5 is driven to move downwards by the downward pressure generated by the longitudinal deformation of the first soft film chamber 41, and the supporting piece 5 is fixedly connected with the pressurizing piece 6, at the moment, the downward pressure generated by the longitudinal deformation of the first soft film chamber 41 is transmitted to the pressurizing piece 6, so that the pressurizing piece 6 moves in the second soft film chamber 42, the bottom end of the pressurizing piece 6 presses the outer edge of the acting surface of the second soft film chamber 42, and the acting surface of the second soft film chamber 42 contacts and presses the edge of the substrate.
In this embodiment, the polishing amount of the substrate middle portion can be adjusted by adjusting the gas pressure in the first soft film chamber 41 to control the polishing amount of the substrate edge, and by adjusting the air pressure values in each ventilation groove 31 and each closed adsorption cavity communicated with the ventilation grooves, the polishing amount of the substrate middle portion can be adjusted, so that the uniformity and consistency of the substrate surface can be improved, and the purpose of high planarization can be achieved.
The embodiment of the invention also provides a substrate polishing device, which comprises the polishing head according to any one of the previous embodiments.
The substrate polishing device provided by the invention comprises the polishing head, wherein the technical advantages and effects achieved by the substrate polishing device also comprise the technical advantages and effects achieved by the polishing head, and the technical advantages and effects are not repeated here.
The embodiment of the invention also provides a grinding method, which is performed by adopting the polishing head according to any one of the above embodiments, and comprises the following steps: mounting a polishing head on a substrate polishing apparatus; pressing the substrate 100 against the polishing surface with the suction holding member on the polishing head, and adjusting the amount of polishing at the center region position of the substrate 100 by adjusting the suction force or the pressing force of the suction holding member to the center region position of the substrate 100 during polishing; the amount of polishing in the edge region of the substrate 100 is adjusted by adjusting the amount of pressing force of the edge force application assembly against the substrate 100.
Specifically, in the polishing process, the air pressure value in each ventilation groove 31 and each closed adsorption cavity communicated with the ventilation groove is controlled to adjust the adsorption force or the pressing force of each closed adsorption cavity to each radial region of the substrate 100, when a certain adsorption cavity is positive pressure, the radial region corresponding to the closed cavity on the substrate 100 can be pressed, and when a certain adsorption cavity is negative pressure, the radial region corresponding to the closed cavity on the substrate 100 can be adsorbed. By reducing the adsorption force of a certain closed adsorption cavity or increasing the positive pressure pressing force, the adsorbed substrate 100 is more fully ground at the position corresponding to the closed adsorption cavity; similarly, by increasing the adsorption force of a certain closed adsorption cavity or reducing the positive pressure pressing force, the grinding amount of the substrate 100 at the position corresponding to the closed adsorption cavity is reduced, so that the control of the grinding amount of the middle position of the substrate in the substrate grinding process can be effectively solved, the uniformity and consistency of the surface of the substrate are improved, and the purpose of high planarization is achieved.
The beneficial effects are that:
the polishing head in the foregoing embodiment is adopted in the polishing method, and technical advantages and effects achieved by the polishing method include technical advantages and effects achieved by the polishing head, which are not described herein.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While obvious variations or modifications are contemplated as falling within the scope of the present invention.
Claims (11)
1. A polishing head, comprising:
a body (1);
the adsorption and holding assembly is fixedly arranged at the bottom center of the body (1) and is used for adsorbing the substrate (100) and pressing the substrate (100) on the polishing surface;
and an edge force application assembly arranged on the outer peripheral side of the adsorption and holding assembly and positioned below the body (1), wherein the bottom wall of the edge force application assembly is suitable for being pressed on the peripheral area of the substrate (100) so as to adjust the polishing pressure applied to the edge area of the substrate (100).
2. A polishing head according to claim 1, wherein the suction holding assembly comprises:
a pressing plate (2) fixedly mounted on the bottom wall of the body (1) for pressing the substrate (100);
the vacuum adsorption structure (3) comprises an air vent groove (31) arranged on the bottom wall of the pressing disc (2) and a sealing ring (32) arranged on the outer periphery side of the air vent groove (31), and the air vent groove (31) is suitable for being communicated with an external vacuumizing device;
when the pressing disc (2) is pressed on the substrate (100), the sealing ring (32) is in sealing contact with the substrate (100) so as to form a closed adsorption cavity communicated with the ventilation groove (31) between the pressing disc (2) and the substrate (100).
3. A polishing head according to claim 2, wherein the vacuum suction structure (3) comprises a plurality of sets of ventilation grooves (31) arranged at intervals in a radial direction of the pressing disk (2);
each group of ventilation grooves (31) at least corresponds to one sealing ring (32), and the sealing rings (32) are annular and are distributed and arranged on the periphery side of the ventilation groove (31) corresponding to the pressing disc (2) at intervals in the radial direction.
4. A polishing head according to claim 3, wherein the ventilation groove (31) is an annular groove provided in the bottom wall of the pressing plate (2); the annular ventilation grooves (31) are coaxially arranged with the pressing disc (2), and a plurality of ventilation grooves (31) are nested and distributed at intervals from inside to outside in sequence along the radial direction of the pressing disc (2).
5. A polishing head according to claim 3 or 4, wherein each set of said venting grooves (31) comprises an annular venting groove (31), each of said venting grooves (31) corresponding to an annular sealing ring (32);
the sealing rings (32) and the ventilation grooves (31) are coaxially arranged, and the outer diameter sizes of the sealing rings (32) are gradually increased along the radial direction of the pressing disc (2);
two sealing rings (32) positioned on the inner side and the outer side of the ventilation groove (31) are matched with the bottom wall of the pressing disc (2) and the adsorbed substrate (100) to form the closed adsorption cavity.
6. A polishing head according to any one of claims 1 to 4, wherein the edge force assembly comprises:
the ring body (4), the ring body (4) is sequentially provided with a first soft film chamber (41) and a second soft film chamber (42) along the force application direction, wherein the first soft film chamber (41) and the second soft film chamber (42) are mutually independent, and the bottom of the second soft film chamber (42) is provided with an action surface suitable for pressing the substrate (100);
and a force application structure, one end of which is positioned in the first soft film chamber (41) and the other end of which extends downwards to a position close to the acting surface of the second soft film chamber (42), wherein the force application structure is suitable for downwards moving to apply force to the acting surface of the second soft film chamber (42) when the air pressure in the first soft film chamber (41) is increased so as to press the edge area of the substrate (100).
7. A polishing head according to claim 6, wherein the urging structure comprises:
a support (5) disposed within the first flexible film chamber (41) and adapted to move and apply a force to the second flexible film chamber (42) upon a change in pressure within the first flexible film chamber (41);
the pressurizing piece (6) is arranged in the second soft film chamber (42), one end of the pressurizing piece (6) is fixedly connected with the supporting piece (5), the other end of the pressurizing piece extends to an action surface close to the second soft film chamber (42), and the pressurizing piece (6) can move in the second soft film chamber (42) when being stressed so as to press the action surface of the second soft film chamber (42).
8. A polishing head according to claim 7, wherein an end of the pressing member (6) adjacent to the active surface of the second soft film chamber (42) is formed in a flat surface.
9. A polishing head according to claim 7 or 8, wherein the edge force application assembly further comprises:
and the limiting piece (7) is coated on the outer peripheral wall of the first soft film chamber (41) and is suitable for limiting the radial deformation of the first soft film chamber (41) under the action of gas pressure.
10. A substrate polishing apparatus comprising the polishing head according to any one of claims 1 to 9.
11. A grinding method, characterized in that the grinding method is carried out with the polishing head according to any one of claims 1 to 9, comprising the steps of:
mounting a polishing head on a substrate polishing apparatus;
pressing the substrate (100) on the polishing surface by using an adsorption and holding assembly on the polishing head, and adjusting the polishing amount at the position of the central area of the substrate (100) by adjusting the adsorption force or the pressing force of the adsorption and holding assembly to the position of the central area of the substrate (100) in the polishing process; the amount of polishing in the edge region of the substrate (100) is adjusted by adjusting the amount of pressing force of the edge force application assembly to the substrate (100).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310152463.9A CN116038552A (en) | 2023-02-10 | 2023-02-10 | Polishing head, substrate polishing device and polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310152463.9A CN116038552A (en) | 2023-02-10 | 2023-02-10 | Polishing head, substrate polishing device and polishing method |
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| CN116038552A true CN116038552A (en) | 2023-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310152463.9A Pending CN116038552A (en) | 2023-02-10 | 2023-02-10 | Polishing head, substrate polishing device and polishing method |
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Citations (6)
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|---|---|---|---|---|
| CN101096077A (en) * | 2001-12-06 | 2008-01-02 | 株式会社荏原制作所 | Substrate holding device and polishing device |
| CN202053163U (en) * | 2011-03-03 | 2011-11-30 | 中芯国际集成电路制造(上海)有限公司 | Grinding head |
| CN103506940A (en) * | 2013-09-26 | 2014-01-15 | 中国电子科技集团公司第四十五研究所 | Chemical mechanical polishing wafer carrier |
| US20140127973A1 (en) * | 2012-09-24 | 2014-05-08 | Ebara Corporation | Polishing method and polishing apparatus |
| CN111251177A (en) * | 2020-03-10 | 2020-06-09 | 北京烁科精微电子装备有限公司 | Bearing head and polishing device with same |
| CN114654379A (en) * | 2022-03-21 | 2022-06-24 | 北京烁科精微电子装备有限公司 | Grinding head and wafer grinding device with same |
-
2023
- 2023-02-10 CN CN202310152463.9A patent/CN116038552A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101096077A (en) * | 2001-12-06 | 2008-01-02 | 株式会社荏原制作所 | Substrate holding device and polishing device |
| CN202053163U (en) * | 2011-03-03 | 2011-11-30 | 中芯国际集成电路制造(上海)有限公司 | Grinding head |
| US20140127973A1 (en) * | 2012-09-24 | 2014-05-08 | Ebara Corporation | Polishing method and polishing apparatus |
| CN103506940A (en) * | 2013-09-26 | 2014-01-15 | 中国电子科技集团公司第四十五研究所 | Chemical mechanical polishing wafer carrier |
| CN111251177A (en) * | 2020-03-10 | 2020-06-09 | 北京烁科精微电子装备有限公司 | Bearing head and polishing device with same |
| CN114654379A (en) * | 2022-03-21 | 2022-06-24 | 北京烁科精微电子装备有限公司 | Grinding head and wafer grinding device with same |
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