CN103499273B - For measuring method and the electronic packing piece of the warpage of electronic packing piece - Google Patents
For measuring method and the electronic packing piece of the warpage of electronic packing piece Download PDFInfo
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- CN103499273B CN103499273B CN201310451303.0A CN201310451303A CN103499273B CN 103499273 B CN103499273 B CN 103499273B CN 201310451303 A CN201310451303 A CN 201310451303A CN 103499273 B CN103499273 B CN 103499273B
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Abstract
The invention provides a kind of method of warpage for measuring electronic packing piece and a kind of electronic packing piece, described method includes: be respectively arranged ZnO nano-wire in the upper side and lower side of electronic packing piece, and wherein, the end of ZnO nano-wire is all connected with electrode；Current measurer is utilized to measure the current value that the ZnO nano-wire of the upper side and lower side being arranged in electronic packing piece produces respectively via electrode；And calculate be arranged in electronic packing piece the upper side and lower side ZnO nano-wire produce current value between difference, to determine the warpage degree of electronic packing piece。The warpage of electronic packing piece can be carried out in real time, measure continuously by method provided by the present invention, and in package on package, the warpage of the electronic packing piece with lower section above can be measured, it is possible to measure the warpage of any one electronic packing piece, improve measurement efficiency simultaneously。
Description
Technical field
The present invention relates to semiconductor applications, more particularly to method and the electronic packing piece of a kind of warpage (warpage) for measuring electronic packing piece。
Background technology
Along with height and the soldered ball pitch of electronic packing piece become more and more less, warpage issues becomes the key issue of electronic packing piece especially POP packaging part, currently mainly measure warpage by shade moir (shallowmoire) method, the method carries out under simulated conditions, there is problems of efficiency low and be not measure in real time。
Publication number is a kind of method that the patent application of CN1210585A discloses shade moir interference stricture of vagina commercial measurement surface flatness。Specifically, the method disclosed in this patent application includes: be sent under grating by measurement object；Generate the image of the shade moir interference collection of illustrative plates indicating measured subject surface Pingdu；Determine the parameter interfering stricture of vagina number relevant limited with at least one region of the image of described shade moir interference stricture of vagina collection of illustrative plates, thus indicated the surface flatness of measured object by this parameter。It is to say, the method involved by this patent application is traditional method measuring packaging part angularity, it there is also the problems referred to above。
Summary of the invention
In order to solve at least one in above-mentioned technical problem, a kind of method that the invention provides warpage for measuring electronic packing piece, the warpage of electronic packing piece can be carried out in real time, measure continuously by described method, especially in package on package (POP), the warpage of the electronic packing piece with lower section above can be measured simultaneously, and the warpage of any one electronic packing piece can be measured, improve measurement efficiency。
According to an aspect of the present invention, it is provided that a kind of method of warpage for measuring electronic packing piece, described method includes: respectively correspondingly arrange ZnO nano-wire in the upper side and lower side of electronic packing piece, and wherein, the end of ZnO nano-wire is all connected with electrode；Current measurer is utilized to measure the current value that the ZnO nano-wire of the upper side and lower side being arranged in electronic packing piece produces respectively via electrode；And calculate be arranged in electronic packing piece the upper side and lower side ZnO nano-wire produce current value between difference, to determine the warpage degree of electronic packing piece。
ZnO nano-wire can be arranged in the upper and lower surface of electronic packing piece respectively accordingly。
Binding agent can be utilized to be attached to accordingly respectively in the upper and lower surface of electronic packing piece by ZnO nano-wire。
ZnO nano-wire can by the printed circuit board (PCB) and the plastic packaging component that are embedded in electronic packing piece respectively accordingly。
Described electronic packing piece can include in package on package。
According to a further aspect in the invention, provide a kind of electronic packing piece, described electronic packing piece includes at least two ZnO nano-wires, to measure the warpage of electronic packing piece, wherein, ZnO nano-wire is attached in the upper and lower surface of electronic packing piece respectively accordingly, or is embedded in accordingly respectively in printed circuit board (PCB) and the plastic packaging component of electronic packing piece。
Described electronic packing piece can include in package on package。
Accompanying drawing explanation
Fig. 1 schematically shows the sectional view of the electronic packing piece being respectively disposed with ZnO nano-wire on surface and lower surface thereon；
Fig. 2 schematically shows the plane graph of the electronic packing piece being respectively disposed with ZnO nano-wire on surface and lower surface thereon；
Fig. 3 schematically shows the sectional view of the package on package (POP) being respectively disposed with ZnO nano-wire in the upper and lower surface of each unit electronic packing piece of package on package。
Detailed description of the invention
In general, a kind of method that the invention provides warpage for measuring electronic packing piece, the method includes: be respectively arranged ZnO nano-wire in the upper side and lower side of electronic packing piece, and wherein, the end of ZnO nano-wire is all connected with electrode；Current measurer is utilized to measure the current value that the ZnO nano-wire of the upper side and lower side being arranged in electronic packing piece produces respectively via electrode；And calculate be arranged in electronic packing piece the upper side and lower side ZnO nano-wire produce current value between difference, to determine the warpage degree of electronic packing piece。
In one embodiment, it is possible to ZnO nano-wire is arranged in the upper and lower surface of electronic packing piece respectively accordingly。Specifically, it is possible to use ZnO nano-wire is attached in the upper and lower surface of electronic packing piece by binding agent respectively accordingly。
In another embodiment, it is possible to ZnO nano-wire is embedded in respectively accordingly in printed circuit board (PCB) and the plastic packaging component of electronic packing piece。
In addition, the invention provides a kind of electronic packing piece, this electronic packing piece includes at least two ZnO nano-wires, to measure the warpage of electronic packing piece, wherein, ZnO nano-wire is attached in the upper and lower surface of electronic packing piece respectively accordingly, or is embedded in accordingly respectively in printed circuit board (PCB) and the plastic packaging component of electronic packing piece。It addition, electronic packing piece can be package on package。
Present invention is described in more detail below with reference to accompanying drawings。
Fig. 1 schematically shows the sectional view of the electronic packing piece being respectively disposed with ZnO nano-wire on surface and lower surface thereon, and Fig. 2 schematically shows the plane graph of the electronic packing piece being respectively disposed with ZnO nano-wire on surface and lower surface thereon。
See figures.1.and.2, the upper and lower surface of electronic packing piece 10 is respectively arranged ZnO nano-wire 11。As shown in the figure, article two, ZnO nano-wire 11 is arranged on the upper surface of electronic packing piece 10, and two ZnO nano-wire 11 is arranged on the lower surface of electronic packing piece 10, but the quantity of the ZnO nano-wire 11 being arranged on the upper surface of electronic packing piece 10 or lower surface is not limited to this。It is to say, the quantity of the ZnO nano-wire 11 being arranged on the upper surface of electronic packing piece 10 or lower surface can respectively one or more than two。
Additionally, as it can be seen, ZnO nano-wire 11 is arranged in the marginal position of the upper and lower surface of electronic packing piece 10, but the invention is not restricted to this。As required, ZnO nano-wire 11 can be arranged in any suitable position of the upper and lower surface of electronic packing piece 10。At another ZnO nano-wire 11 of location arrangements that the position with the ZnO nano-wire 11 arranged on an upper of the lower surface of electronic packing piece 10 is corresponding, to measure the difference of the current value that both of which produces。It is to say, the ZnO nano-wire 11 of upside is corresponding with the ZnO nano-wire 11 of downside in position。
The end of ZnO nano-wire 11 is all connected with electrode 12, and current measurer (not shown) measures electric current produced by ZnO nano-wire 11 by connecting two electrodes 12 being connected with two ends of a ZnO nano-wire 11。ZnO nano-wire 11 can produce electric current in the process deformed, difference by electric current produced by two ZnO nano-wires 11 of calculating levels, the difference of the deflection on the levels surface of electronic packing piece 10 can be calculated, thus extrapolating the size (or degree) of warpage。
In one embodiment, it is possible to use ZnO nano-wire 11 is attached in the upper and lower surface of electronic packing piece 10 by binding agent respectively accordingly。In another embodiment, it is possible to ZnO nano-wire 11 is embedded in respectively accordingly in printed circuit board (PCB) and the plastic packaging component of electronic packing piece 10。
That is, it is possible to be arranged in accordingly in electronic packing piece 10 by two ZnO nano-wires about 11, thus measuring current value produced by these two ZnO nano-wires 11, the difference of current value is finally calculated。
Fig. 3 schematically shows the sectional view of the package on package being respectively disposed with ZnO nano-wire in the upper and lower surface of each unit electronic packing piece of package on package。
In figure 3 it is shown that be the package on package including electronic packing piece 10 and 10 '。In package on package, electronic packing piece 10 is similar with the mode arranging ZnO nano-wire of electronic packing piece 10 described above with the mode arranging ZnO nano-wire of 10 ', therefore repeats no more here。
Utilize current measurer via electrode 12, measure respectively each electronic packing piece 10 and 10 ' being arranged in package on package the upper side and lower side ZnO nano-wire 11 produced by current value, and calculate difference therebetween and determine the warpage degree of electronic packing piece 10。
Furthermore, it is possible to by deposition process at the upper side and lower side of electronic packing piece 10 deposition ZnO nano-wire。
According to embodiments of the invention, arrange (such as accordingly respectively in the upper and lower of package on package, deposition) ZnO nano-wire, when package on package generation warpage, corresponding two ZnO nano-wire of the upper and lower being arranged on package on package can deform, and now can measure electric current produced by these two ZnO nano-wires；Then the difference between current between electric current can be utilized produced by these two ZnO nano-wires to calculate warp value (or warpage degree)。The method of the measurement warpage of the present invention can carry out in real time, even if in backflow (reflow) process, it is also possible to measure warp value。
The method of the measurement warpage of the present invention has the advantage that and the warpage of electronic packing piece can be carried out in real time, be measured continuously；Especially in package on package, the warpage of the multiple electronic packing pieces with lower section above can be measured simultaneously, this measuring method being traditional is irrealizable, and the method for the present invention can measure the warpage of any one electronic packing piece in package on package, improves measurement efficiency。Specifically, the method for the present invention can be applied more advantageously in POP encapsulation, and it is capable of traditional irrealizable above-mentioned advantage of measuring method。
Although providing above-described embodiment by illustrating with way of example, it is to be understood that, example provided above can change in some aspects, and still drops in the scope of claims。It is to be understood that, although describe the present invention with reference to preferred embodiment above, but other embodiments are also included within the scope of claims。
Claims (7)
1. the method for measuring the warpage of electronic packing piece, described method includes:
Being respectively arranged ZnO nano-wire in the upper side and lower side of electronic packing piece, wherein, the end of ZnO nano-wire is all connected with electrode；
Current measurer is utilized to measure the current value that the ZnO nano-wire of the upper side and lower side being arranged in electronic packing piece produces respectively via electrode；And
Calculating is arranged in the difference between the current value of the ZnO nano-wire generation of the upper side and lower side of electronic packing piece, to determine the warpage degree of electronic packing piece。
2. method according to claim 1, wherein, ZnO nano-wire is arranged in the upper and lower surface of electronic packing piece respectively accordingly。
3. method according to claim 2, wherein, ZnO nano-wire utilizes binding agent to be attached to accordingly respectively in the upper and lower surface of electronic packing piece。
4. method according to claim 1, wherein, ZnO nano-wire is embedded in printed circuit board (PCB) and the plastic packaging component of electronic packing piece respectively accordingly。
5. method according to claim 1, wherein, described electronic packing piece includes in package on package。
6. an electronic packing piece, described electronic packing piece includes at least two ZnO nano-wires, to measure the warpage of electronic packing piece,
Wherein, ZnO nano-wire is attached in the upper and lower surface of electronic packing piece respectively accordingly, or is embedded in accordingly respectively in printed circuit board (PCB) and the plastic packaging component of electronic packing piece。
7. electronic packing piece according to claim 6, wherein, described electronic packing piece includes in package on package。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310451303.0A CN103499273B (en) | 2013-09-27 | 2013-09-27 | For measuring method and the electronic packing piece of the warpage of electronic packing piece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310451303.0A CN103499273B (en) | 2013-09-27 | 2013-09-27 | For measuring method and the electronic packing piece of the warpage of electronic packing piece |
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| Publication Number | Publication Date |
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| CN103499273A CN103499273A (en) | 2014-01-08 |
| CN103499273B true CN103499273B (en) | 2016-06-22 |
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| CN201310451303.0A Active CN103499273B (en) | 2013-09-27 | 2013-09-27 | For measuring method and the electronic packing piece of the warpage of electronic packing piece |
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| CN105047829B (en) * | 2015-09-18 | 2017-05-10 | 京东方科技集团股份有限公司 | Packaging structure and packaging method of organic light emitting device and flexible display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0287149A2 (en) * | 1987-03-31 | 1988-10-19 | Hendrikus Herman Schutte | Angle measuring device |
| CN201266074Y (en) * | 2008-08-07 | 2009-07-01 | 和硕联合科技股份有限公司 | Strain induction module |
| CN101614520A (en) * | 2009-07-31 | 2009-12-30 | 瑞声声学科技(深圳)有限公司 | Detect the piezoelectric sensor and the method thereof of static displacement |
| CN101656486A (en) * | 2009-09-18 | 2010-02-24 | 上海理工大学 | Zinc oxide nano wire/polymer nano composite energy converter and preparation method thereof |
| CN102353324A (en) * | 2011-07-26 | 2012-02-15 | 华中科技大学 | Flexible semi-clarity strain sensor and preparation method thereof |
| CN102519351A (en) * | 2011-11-16 | 2012-06-27 | 复旦大学 | Method for measuring warpage of electronic packaging product |
-
2013
- 2013-09-27 CN CN201310451303.0A patent/CN103499273B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0287149A2 (en) * | 1987-03-31 | 1988-10-19 | Hendrikus Herman Schutte | Angle measuring device |
| CN201266074Y (en) * | 2008-08-07 | 2009-07-01 | 和硕联合科技股份有限公司 | Strain induction module |
| CN101614520A (en) * | 2009-07-31 | 2009-12-30 | 瑞声声学科技(深圳)有限公司 | Detect the piezoelectric sensor and the method thereof of static displacement |
| CN101656486A (en) * | 2009-09-18 | 2010-02-24 | 上海理工大学 | Zinc oxide nano wire/polymer nano composite energy converter and preparation method thereof |
| CN102353324A (en) * | 2011-07-26 | 2012-02-15 | 华中科技大学 | Flexible semi-clarity strain sensor and preparation method thereof |
| CN102519351A (en) * | 2011-11-16 | 2012-06-27 | 复旦大学 | Method for measuring warpage of electronic packaging product |
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