CN103491659A - Heater and heating method - Google Patents
Heater and heating method Download PDFInfo
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- CN103491659A CN103491659A CN201310426337.4A CN201310426337A CN103491659A CN 103491659 A CN103491659 A CN 103491659A CN 201310426337 A CN201310426337 A CN 201310426337A CN 103491659 A CN103491659 A CN 103491659A
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- electrothermal structure
- electrothermal
- loading plate
- unit pattern
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title abstract description 17
- 239000000463 material Substances 0.000 claims description 21
- 238000005336 cracking Methods 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910010272 inorganic material Inorganic materials 0.000 claims description 8
- 239000011147 inorganic material Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- -1 polyethylene terephthalate Polymers 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 239000011135 tin Substances 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000011133 lead Substances 0.000 claims description 3
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000007787 solid Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000011787 zinc oxide Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 210000004877 mucosa Anatomy 0.000 description 2
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000476 thermogenic effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Images
Abstract
A heater comprises a bearing plate and a plurality of electrothermal structures. The electrothermal structures are arranged on the surface of the bearing plate, and each electrothermal structure is independently driven to heat up, wherein each electrothermal structure comprises a plurality of unit patterns connected in a string. The solid part of each unit pattern surrounds at least one blank area. In addition, a heating method using the heater is also provided.
Description
[technical field]
The invention relates to a kind of heater and heating means, and particularly relevant for a kind of electric resistor heating type heater and use the heating means of this heater.
[background technology]
The pliability electronic installation must be realized with flexible base plate the characteristic of deflection.But, the deflection characteristic of flexible base plate but cause can't be directly by fabrication of electronic components problem thereon.In order to make electronic component on flexible base plate, flexible base plate need to be attached on hard loading plate or board, to utilize hard loading plate or board that suitable support is provided, and then electronic component is formed on flexible base plate, after completing, fabrication of electronic components needs flexible base plate is taken off on hard loading plate or board.
At present, one of method of taking off flexible base plate from the hard loading plate is exactly that laser divests (laser lift off) technology, wherein to divest technology be mainly the interface between flexible base plate and hard loading plate by Ear Mucosa Treated by He Ne Laser Irradiation to laser, by laser apply heat destroy interface characteristic so that flexible base plate on the hard loading plate, peel off.But, the price of laser equipment is relatively high, and this causes the operating condition of the increase of cost of manufacture and laser equipment to be limited to the design of laser equipment itself, and this makes the designer to carry out laser according to the demand of oneself with different condition arbitrarily and divests.Yet existing other firing equipments also have the problem that operating condition is limited to equipment design itself.
[summary of the invention]
The invention provides a kind of heater, simplicity of design and cost are low.
The invention provides a kind of heating means, the different heating pattern can be provided.
A kind of heater of the present invention, comprise a loading plate and a plurality of electrothermal structure.Electrothermal structure is disposed at the surface of loading plate, and each electrothermal structure is heated up by drive, and wherein each electrothermal structure comprises a plurality of unit patterns that connect bunchiness, and wherein the entity part of each unit pattern is round at least one clear area.
According to one embodiment of the invention, two opposed ends of above-mentioned each electrothermal structure are the relative both sides that lay respectively at loading plate, and wherein the line of two opposed ends of each electrothermal structure is vertical with the orientation of electrothermal structure.Electrothermal structure width and the ratio in gap be 1:1～10:1.
According to one embodiment of the invention, the intensification temperature of above-mentioned each electrothermal structure is greater than cracking temperature or a fusing point that preheats thing, wherein preheats thing and comprises polyimides, polyethylene terephthalate, poly-to naphthalenedicarboxylic acid second two fat or its combination.
According to one embodiment of the invention, above-mentioned heater more comprises a sacrifice layer, and electrothermal structure is between sacrifice layer and loading plate.The material of sacrifice layer comprises amorphous silicon, inorganic material, low-melting-point metal or above-mentioned combination, and inorganic material comprises silicon nitride, silicon oxynitride or its combination, and low-melting-point metal comprises aluminium, lead, copper, silver, tin or its combination.The intensification temperature of each electrothermal structure is greater than the cracking temperature of sacrifice layer.The material of electrothermal structure comprises platinum, gold, silver, copper, aluminium, titanium, conductive oxide, nickel, cobalt, iron, tin or its combination.
According to one embodiment of the invention, the entire area of above-mentioned at least one clear area is 1/10～9/10 with the entire area ratio of the entity part of each unit pattern.
According to one embodiment of the invention, above-mentioned heater more comprises a driver, and wherein driver drives electrothermal structure in order or side by side.
A kind of heating means of the present invention, comprise foregoing heater be provided, and drive electrothermal structure that electrothermal structure is heated up.
According to one embodiment of the invention, driven when above-mentioned electrothermal structure is different.
According to one embodiment of the invention, before driving electrothermal structure, more on loading plate, form one and preheat thing, and the electrothermal structure position is preheating between thing and loading plate.
Based on above-mentioned, the heater of the embodiment of the present invention has a plurality of electrothermal structures, and the plurality of electrothermal structure can arrange to improve according to predetermined rule the uniformity of resistance heating (Joule heating).Therefore in addition, a plurality of electrothermal structures set in the heater of the embodiment of the present invention can independently be heated, and use the heater of the embodiment of the present invention to carry out heating means and can adopt multiple heating modes.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
[accompanying drawing explanation]
The schematic diagram of the heater that Fig. 1 is first embodiment of the invention.
The heater that Fig. 2 is Fig. 1 is along the generalized section of direction D.
Fig. 3 utilizes the heater of Fig. 1 to carry out heating means to take off the schematic diagram of flexible base plate.
The heater that Fig. 4 is Fig. 3 is along the generalized section of direction D.
The partial schematic diagram of the electrothermal structure that Fig. 5 is one embodiment of the invention.
The partial schematic diagram of the electrothermal structure that Fig. 6 is another embodiment of the present invention.
The partial schematic diagram of the electrothermal structure that Fig. 7 is further embodiment of this invention.
The generalized section of the heater that Fig. 8 is second embodiment of the invention.
Fig. 9 utilizes the heater of Fig. 8 to carry out heating means to take off the schematic diagram of flexible base plate.
[symbol description]
10,20: flexible base plate
100,200: heater
110: loading plate
112: surface
120,120A, 120B, 120C: electrothermal structure
122,122A, 122B, 122C, 124,124A, 124B, 124C: end
126A, 126B, 126C: unit pattern
130: driver
210: sacrifice layer
B1, B2, B3, B4: clear area
D: direction
E: bearing of trend
G: gap
O: opening
P: entity part
TB, TP: width
W: width
[embodiment]
The schematic diagram of the heater that Fig. 1 is first embodiment of the invention, and the heater that Fig. 2 is Fig. 1 is along the generalized section of direction D.Please refer to Fig. 1, heater 100 includes loading plate 110, a plurality of electrothermal structure 120 and driver 130.In the present embodiment, a plurality of electrothermal structures 120 are arranged on the surface 112 of loading plate 110, and a plurality of electrothermal structure 120 is arranged in order along direction D independently of one another.In addition, in the present embodiment, the plurality of electrothermal structure 120 all is connected to driver 130 to drive by driver 130, and electrothermal structure 120 can independently be driven by driver 130 in the present embodiment.
It is worth mentioning that, the graphic of connecting line in Fig. 1 between electrothermal structure 120 and driver 130 and driver 130 is only in order to mean that each electrothermal structure 120 is connected to driver 130, but not is used for limiting to the concrete connected mode of electrothermal structure 120 and driver 130.In one embodiment, each electrothermal structure 120 can be connected to driver 130 by a transmission lines, and the transmission line that different electrothermal structure 120 connects is independent separately.Or driver 130 can be formed by a plurality of driver elements, and different electrothermal structure 120 is connected to different driver elements.
The making of above-mentioned heater 100 can directly be used existing sputtering machine table equipment or CVD (Chemical Vapor Deposition) apparatus, also use existing process technique, must not use in addition, purchase special board, also need not develop in addition new process technique and can reach.For instance, the manufacture method of heater 100 can be to adopt existing board equipment, as depositing device, sputtering equipment etc., electric conducting material first is formed on loading plate 110, recycle existing patterning equipment, as exposure sources, etching machines or laser equipment etc., patterns of conductive materials is turned to the electrothermal structure 120 with predetermined pattern design.
In the present embodiment, heater 100 can be applied to the manufacture method of flexible base plate 10 or can be applied to the manufacture method of pliability electronic installation.Therefore, the thing that preheats that loading plate 110 carries can be flexible base plate 10.Particularly, when making flexible base plate 10, can be first by baseplate material, for example polyimides, polyethylene terephthalate, poly-to naphthalenedicarboxylic acid second two fat or its combination, be formed on loading plate 110.When if baseplate material is aqueous, the method that baseplate material is formed on loading plate 110 comprises drip or rubbing method.Afterwards, after solidifying, baseplate material on loading plate 110, forms flexible base plate 10.
Under such making flow process, because of baseplate material instiled or the applied surface in loading plate 110 112 on, therefore flexible base plate 10 directly is contacted with electrothermal structure 120.But, in other embodiment, instil or the coated substrates material on the surface 112 of loading plate 110 before, can prior on surface 112, forming the other materials layer, (be for example sacrifice layer, its material comprises amorphous silicon, inorganic material, low-melting-point metal or above-mentioned combination, wherein inorganic material comprises silicon nitride, silicon oxynitride or its combination, and low-melting-point metal comprises aluminium, titanium, tin or its combination).Now, flexible base plate 10 directly is not contacted with electrothermal structure 120 but is contacted with described other materials layer (for example sacrifice layer).
In addition, because loading plate 110 can provide desirable support function, so can on the flexible base plate 10 be positioned on loading plate 110, directly make electronic component.Electronic component herein is for example active element, display element, touch control component, filter element or above-mentioned combination.Because the plate object that loading plate 110 is hard can be made of traditional process work bench when making the plurality of electronic component.For example, make the needed plain conductor of electronic component and can use sputtering equipment, can use CVD (Chemical Vapor Deposition) apparatus or sputtering equipment and make the needed insulating film layer of electronic component, therefore utilize traditional process work bench the plurality of electronic component can be formed on flexible base plate 10.
It is worth mentioning that no matter on flexible base plate 10, whether be formed with electronic component, flexible base plate 10 all need to be by taking off on heater 100.Therefore, in the present embodiment, can utilize the thermogenic action of electrothermal structure 120 to be heated in order to flexible base plate 10 by taking off on heater 100 flexible base plate 10.Especially, when the temperature after driven electrothermal structure 120 heats up is greater than the cracking temperature of flexible base plate 10 (preheating thing) or fusing point, flexible base plate 10 just can separate from heater 100.Take off flexible base plate 10 compared to the mode of utilizing Ear Mucosa Treated by He Ne Laser Irradiation, the present embodiment does not need extra laser equipment and only must adopt logical electrically heated step just flexible base plate 10 can be taken off on heater 100.Therefore, the heater 100 of the present embodiment is designed with the cost of manufacture that helps reduce flexible base plate 10.
Fig. 3 utilizes the heater of Fig. 1 to carry out heating means to take off the schematic diagram of flexible base plate, and the heater that Fig. 4 is Fig. 3 is along the generalized section of direction D.Please refer to Fig. 3 and Fig. 4, in the present embodiment, because the electrothermal structure 120 of heater 100 can be independently driven, therefore the plurality of electrothermal structure 120 can be driven in order.When difference under driven situation, temperature after one of them electrothermal structure 120 heats up can be greater than cracking temperature or the fusing point of flexible base plate 10, and the temperature after other electrothermal structures 120 intensifications may not yet be greater than cracking temperature or the fusing point of flexible base plate 10.Thus, flexible base plate 10 can only some separate on heater 100, and other parts still are attached on heater 100, shown in Fig. 3 and Fig. 4.
While therefore, seeing through difference, drive the heating means of electrothermal structure 120 can determine the detaching direction that flexible base plate 10 separates from heater 100.In the present embodiment, if the plurality of electrothermal structure 120 is sequentially driven according to putting in order, the detaching direction that flexible base plate 10 separates from heater 100 is for example to be generally parallel to direction D.In other embodiment, electrothermal structure 120 can be driven gradually towards center by outermost.Thus, flexible base plate 10 is just separated with heater 100 towards center gradually by outermost.Certainly, the present invention is not as limit.
The heater 100 of the present embodiment can independent driven electrothermal structure 120 because have, therefore can arrange according to different demands the heating-up time of different electrothermal structures 120 to change the heated condition of thing that preheats.Thus, being designed with of heater 100 helps make the process conditions of heating processing more full of elasticity.Certainly, during except difference, drive the heating means of the plurality of electrothermal structure 120, the present embodiment also can drive the plurality of electrothermal structure 120 according to design requirement simultaneously.Can under roughly close heating rate, be warming up to needed intensification temperature when thus, all electrothermal structures 120 have approximate heating curve.Particularly, the method that drives the plurality of electrothermal structure 120 is for example that each heating arrangement 120 is given in the input current pulse, and wherein current impulse can be square waveform pulse, sinusoidal waveform pulse or alternating-current pulse etc.
In the present embodiment, the material of electrothermal structure 120 comprises that platinum, gold, silver, copper, aluminium, titanium, conductive oxide, nickel, cobalt, iron, tin or its combination heat up with the driving via driver 120.At this, conductive oxide for example comprises zinc oxide (ZnO), indium oxide (In
2o
3), tin ash (SnO
2), indium tin oxide (indium tin oxide, ITO), indium-zinc oxide (indium zinc oxide, IZO), aluminum zinc oxide (Aluminum doped zinc oxide, AZO), gallium-doped zinc oxide (Gallium doped zinc oxide, GZO), indium gallium zinc oxide (indium-gallium-zinc oxide, IGZO) or zinc tin oxide (Zinc-Tin Oxide, ZTO).But, above-mentioned material is only illustrational use, not in order to limit the present invention.Every can be by the driving of driver 130 and the material heated up can be as the material of the electrothermal structure 120 of the present embodiment.
More specifically, each electrothermal structure 120 has two opposed ends 122 and 124, and 122Yu end, end 124 is the relative both sides that lay respectively at loading plate 110.In addition, two opposed ends 122 of each electrothermal structure 120 are vertical with the orientation D of electrothermal structure 120 with 124 line.That is to say, each electrothermal structure 120 can have a bearing of trend E, and wherein bearing of trend E can intersect or perpendicular to direction D.In addition, adjacent two electrothermal structures 120 gapped g of being separated by direction D, as shown in Fig. 2 and Fig. 4, wherein the ratio of the width w of electrothermal structure 120 and gap g can be 1:1～10:1.
In addition, each electrothermal structure 120 can be consisted of a plurality of unit pattern that connects bunchiness, to possess uniform heating effect.Below will follow the graphic design of describing particularly electrothermal structure 120.But, the present embodiment is as limit, and the design of every electrothermal structure 120 can make the intensification effect reach in the heater 100 that required temperature just can be applicable to the present embodiment.
The partial schematic diagram of the electrothermal structure that Fig. 5 is one embodiment of the invention.Please refer to Fig. 5, electrothermal structure 120A includes both ends 122A, 124A and a plurality of unit pattern 126A, the end portion that wherein unit pattern 126A connection bunchiness and both ends 122A, 124A are electrothermal structure 120A.In the present embodiment, the entity part P of unit pattern 126A is roughly round clear area B1 and B2.In addition, clear area B1 and B2 not by the entity part P Perfect Ring of unit pattern 126A around, so clear area B1 and B2 all have opening O.
The entity part P of unit pattern 126A is consisted of sinuous linearity pattern, and the overall profile of unit pattern 126A (as the zone of choosing that dotted line is enclosed in Fig. 5) forms the pattern that is similar to rhombus.But, the present invention is not as limit.In other embodiment, the overall profile of unit pattern 126A can form the pattern of other shapes such as being similar to circle, ellipse, triangle, rectangle, hexagon, octangle, irregular shape.Each clear area B1 can be 1/10～9/10 with the entire area of B2 with the entire area ratio of the entity part P of each unit pattern 126A.
Certainly, above-mentioned shape and area ratio only illustrate.In other embodiment, the profile of unit pattern 126A and size can be adjusted to some extent according to the material of needed impedance magnitude and electrothermal structure 120A.For example, in order to realize identical impedance magnitude, the material resistivity of electrothermal structure 120A is higher, and the design of the live width of unit pattern 126A can be larger.When the live width design of unit pattern 126A is larger, clear area B1 will reduce with the entire area ratio of the entity part P of each unit pattern 126A with the entire area of B2.Otherwise the material resistivity of electrothermal structure 120A is lower, the design of the live width of unit pattern 126A is less, to realize the resistance value set.Now, clear area B1 will increase with the entire area ratio of the entity part P of each unit pattern 126A with the entire area of B2.In the present embodiment, the entity part P of each unit pattern 126A is sinuous linear track, so clear area B1 or B2 have sinuous linear profile, wherein the live width TB of linear profile can do different adjustment according to needed impedance magnitude from the ratio of the live width TP of linear track.
The partial schematic diagram of the electrothermal structure that Fig. 6 is another embodiment of the present invention.Please refer to Fig. 6, electrothermal structure 120B includes both ends 122B, 124B and a plurality of unit pattern 126B, the end portion that wherein unit pattern 126B connection bunchiness and both ends 122B, 124B are electrothermal structure 120B.In the present embodiment, unit pattern 126B respectively do for oneself the block shape pattern and there are a plurality of openings to define a plurality of clear area B3.Thus, the entity part P of unit pattern 126B is in fact round the plurality of clear area B3, and in other words, clear area B3 is the opening that entity part P surrounds.Particularly, the unit pattern 126B of the present embodiment is for example for having the pattern of oval shapes of a plurality of openings, but the present invention is not as limit.In other embodiment, the outline of unit pattern 126B can be other shapes such as circle, triangle, rectangle, rhombus, hexagon, octangle, irregular shape.In addition, the design of the unit pattern 126B of the present embodiment can be required according to electrothermal structure 120B impedance magnitude and adjust to some extent, for example, the entire area of the clear area B3 of each unit pattern 126B can be 1/10～9/10 with the entire area ratio of the entity part of each unit pattern 126B.
The partial schematic diagram of the electrothermal structure that Fig. 7 is further embodiment of this invention.Please refer to Fig. 7, electrothermal structure 120C includes both ends 122C, 124C and a plurality of unit pattern 126C, the end portion that wherein unit pattern 126C connection bunchiness and both ends 122C, 124C are electrothermal structure 120C.In the present embodiment, respectively do for oneself latticed pattern there are a plurality of openings to define a plurality of clear area B4 of unit pattern 126C, in other words, clear area B4 is the opening region.Thus, the entity part P of unit pattern 126C is in fact round the plurality of clear area B4.Particularly, the unit pattern 126C of the present embodiment is for example for having the argyle design of a plurality of openings, but the present invention is not as limit.In other embodiment, the profile of unit pattern 126C can be other shapes such as circle, triangle, rectangle, ellipse, hexagon, octangle, irregular shape.In addition, the impedance magnitude that the design of the unit pattern 126C of the present embodiment can be required according to electrothermal structure 120C and adjusting to some extent, for example, the entire area of clear area B4 can be 1/10～9/10 with the entire area ratio of the entity part of each unit pattern 126C.
The generalized section of the heater that Fig. 8 is second embodiment of the invention and Fig. 9 utilize the heater of Fig. 8 to carry out heating means to take off the schematic diagram of flexible base plate.Referring to Fig. 8 and Fig. 9, the heater 200 of the present embodiment is approximately identical to the heater 100 of aforementioned the first embodiment and has loading plate 110 and a plurality of electrothermal structures 120.Therefore, the electrothermal structure 120 of heater 200 can have distribution as shown in Figure 1.But, the heater 200 of the present embodiment more includes a sacrifice layer 210, and sacrifice layer 210 contacts with electrothermal structure 120, and wherein electrothermal structure 120 is between sacrifice layer 210 and loading plate 110.
In the present embodiment, flexible base plate 20 is to be formed at or to be attached on sacrifice layer 210.While wanting to take off flexible base plate 20 on heater 200, can drive electrothermal structure 120 to make its intensification and allow the intensification temperature of electrothermal structure 120 be greater than the cracking temperature of sacrifice layer 210.The cracking that sees through sacrifice layer 210 can allow flexible base plate 20 by separating on heater 200.In the present embodiment, the material of sacrifice layer 210 comprises amorphous silicon, inorganic material, low-melting-point metal or above-mentioned combination, and wherein inorganic material comprises silicon nitride, silicon oxynitride or its combination, and low-melting-point metal comprises aluminium, lead, copper, silver, tin or its combination.In addition, sacrifice layer 210 is can be optionally complete is covered with on loading plate 110 surfaces or is only to be distributed in partly loading plate 110 surfaces.
Because the present embodiment is to utilize the intensification of electrothermal structure 120 to make sacrifice layer 210 cracking separate flexible base plate 20 and electrothermal structure 120, it is impaired because of the heating of heater 200 that flexible base plate 20 can be avoided itself.In addition, in the present embodiment, the design of electrothermal structure 120, spacing distance and size can be with reference to the designs of aforementioned any electrothermal structure 120A～120C.Therefore, heater 200 can provide desirable heating effect.In addition, electrothermal structure 120 can independent driven design also can allow the designer adjust heating condition with the different designs demand, and this makes the more high resilience of the applicable heating means of heater 200.And the present embodiment and previous embodiment are utilized simply the equipment cost that design that electric heating pattern 120 just can form heater 100 and 200 does not need both expensive are set on loading plate 110.
It is worth mentioning that, it is only the use illustrated that above-described embodiment is applied to peeling off of flexible base plate 10 and 20 by heater 100 and 200, not in order to limit the present invention.In other embodiment, heater 100 and 200 can be applied to need any heating processing of homogeneous heating or need regional area in heated other heating processings of different time.
In sum, the heater of the embodiment of the present invention uses simple structural design, and it is incited somebody to action independently a plurality of electrothermal structures and is arranged on loading plate.Electrothermal structure on loading plate can independently be heated and contribute to carry out multiple heating means, makes heating means more flexible.In addition, simple structural design just can form the heater of the embodiment of the present invention, equipment cost that must be not expensive.
Claims (12)
1. a heater comprises:
One loading plate; And
A plurality of electrothermal structures, be disposed at the surface of this loading plate, and respectively this electrothermal structure is heated up by drive, and wherein respectively this electrothermal structure comprises a plurality of unit patterns that connect bunchiness, wherein respectively the entity part of this unit pattern round at least one clear area.
2. heater as claimed in claim 1, it is characterized in that, respectively two opposed ends of this electrothermal structure are the relative both sides that lay respectively at this loading plate, wherein respectively the line of two opposed ends of this electrothermal structure is vertical with the orientation of the plurality of electrothermal structure, wherein the plurality of electrothermal structure width and the ratio in gap be 1:1～10:1.
3. heater as claimed in claim 1, it is characterized in that, respectively this electrothermal structure temperature after heating up is greater than cracking temperature or a fusing point that preheats thing, and wherein this preheats thing and comprises polyimides, polyethylene terephthalate, poly-to naphthalenedicarboxylic acid second two fat or its combination.
4. heater as claimed in claim 1, is characterized in that, more comprises a sacrifice layer, and the plurality of electrothermal structure is between this sacrifice layer and this loading plate.
5. heater as claimed in claim 4, it is characterized in that, the material of this sacrifice layer comprises amorphous silicon, inorganic material, low-melting-point metal or above-mentioned combination, and this inorganic material comprises silicon nitride, silicon oxynitride or its combination, and this low-melting-point metal comprises aluminium, lead, copper, silver, tin or its combination.
6. heater as claimed in claim 4, is characterized in that, respectively the temperature after this electrothermal structure intensification is greater than the cracking temperature of this sacrifice layer.
7. heater as claimed in claim 4, is characterized in that, the material of the plurality of electrothermal structure comprises platinum, gold, silver, copper, aluminium, titanium, conductive oxide, nickel, cobalt, iron, tin or its combination.
8. heater as claimed in claim 1, is characterized in that, the entire area of this at least one clear area is 1/10～9/10 with the entire area ratio of this entity part of this unit pattern respectively.
9. heater as claimed in claim 1, is characterized in that, more comprises a driver, and this driver drives the plurality of electrothermal structure in order or side by side.
10. heating means comprise:
One heater as claimed in claim 1 is provided; And
Drive the plurality of electrothermal structure that the plurality of electrothermal structure is heated up.
11. heating means as claimed in claim 10, is characterized in that, driven when the plurality of electrothermal structure is different.
12. heating means as claimed in claim 10, is characterized in that, before driving the plurality of electrothermal structure, more on this loading plate, form one and preheat thing, and the plurality of electrothermal structure position preheats between thing and this loading plate at this.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102129667A TWI589178B (en) | 2013-08-19 | 2013-08-19 | Heater and haeting method |
| TW102129667 | 2013-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103491659A true CN103491659A (en) | 2014-01-01 |
| CN103491659B CN103491659B (en) | 2016-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310426337.4A Expired - Fee Related CN103491659B (en) | 2013-08-19 | 2013-09-17 | Heater and heating method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103491659B (en) |
| TW (1) | TWI589178B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108156678A (en) * | 2016-12-06 | 2018-06-12 | 财团法人工业技术研究院 | Flexible thermoelectric structure and method for forming the same |
| CN110248429A (en) * | 2019-06-04 | 2019-09-17 | 宁波石墨烯创新中心有限公司 | A kind of see-through electrothermal layer, the see-through electric calorifie installation and its application including it |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201509224A (en) | 2015-03-01 |
| TWI589178B (en) | 2017-06-21 |
| CN103491659B (en) | 2016-01-06 |
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