CN103491659B - Heater and heating method - Google Patents
Heater and heating method Download PDFInfo
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- CN103491659B CN103491659B CN201310426337.4A CN201310426337A CN103491659B CN 103491659 B CN103491659 B CN 103491659B CN 201310426337 A CN201310426337 A CN 201310426337A CN 103491659 B CN103491659 B CN 103491659B
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- electrothermal structure
- heater
- electrothermal
- loading plate
- sacrifice layer
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title abstract description 16
- 239000000463 material Substances 0.000 claims description 21
- 238000005336 cracking Methods 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910010272 inorganic material Inorganic materials 0.000 claims description 8
- 239000011147 inorganic material Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 239000011135 tin Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- -1 polyethylene terephthalate Polymers 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000011133 lead Substances 0.000 claims description 3
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 230000000717 retained effect Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 238000010792 warming Methods 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229960001296 zinc oxide Drugs 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000476 thermogenic effect Effects 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Abstract
A heater comprises a bearing plate and a plurality of electrothermal structures. The electrothermal structures are arranged on the surface of the bearing plate, and each electrothermal structure is independently driven to heat up, wherein each electrothermal structure comprises a plurality of unit patterns connected in a string. The solid part of each unit pattern surrounds at least one blank area. In addition, a heating method using the heater is also provided.
Description
[technical field]
The invention relates to a kind of heater and heating means, and relate to a kind of electric resistor heating type heater especially and use the heating means of this heater.
[background technology]
Pliability electronic installation must use flexible base plate to realize the characteristic of deflection.But, but cause cannot directly by fabrication of electronic components problem thereon for the deflection characteristic of flexible base plate.In order to make electronic component on flexible base plate, need flexible base plate to be attached on hard loading plate or board, with the support utilizing hard loading plate or board to provide suitable, and then electronic component is formed on flexible base plate, after fabrication of electronic components completes, need flexible base plate to take off on hard loading plate or board.
At present, be exactly that laser divests (laserliftoff) technology from one of hard loading plate method of taking off flexible base plate, wherein laser divests technology and mainly laser is irradiated interface between flexible base plate and hard loading plate, applies the characteristic that heat destroys interface peel off on hard loading plate to make flexible base plate by laser.But, the price of laser equipment is relatively high, and this causes the increase of cost of manufacture and the operating condition of laser equipment is limited to the design of laser equipment itself, and this makes designer cannot carry out laser according to the demand of oneself with different condition arbitrarily to divest.But other firing equipments existing also have the problem that operating condition is limited to equipment design itself.
[summary of the invention]
The invention provides a kind of heater, simplicity of design and cost is low.
The invention provides a kind of heating means, different heating pattern can be provided.
A kind of heater of the present invention, comprises a loading plate and multiple electrothermal structure.Electrothermal structure is configured at the surface of loading plate, and each electrothermal structure is independently driven and heats up, and wherein each electrothermal structure comprises the multiple unit patterns connecting bunchiness, and wherein the entity part of each unit pattern is round at least one clear area.
According to one embodiment of the invention, two opposed ends of above-mentioned each electrothermal structure are the relative both sides laying respectively at loading plate, and wherein the line of two opposed ends of each electrothermal structure is vertical with the orientation of electrothermal structure.Electrothermal structure width and the ratio in gap be 1:1 ~ 10:1.
According to one embodiment of the invention, the warming temperature of above-mentioned each electrothermal structure is greater than cracking temperature or fusing point that one preheats thing, wherein preheats thing and comprises polyimides, polyethylene terephthalate, gathers naphthalenedicarboxylic acid second two fat or its combination.
According to one embodiment of the invention, above-mentioned heater more comprises a sacrifice layer, and electrothermal structure is between sacrifice layer and loading plate.The material of sacrifice layer comprises amorphous silicon, inorganic material, low-melting-point metal or above-mentioned combination, and inorganic material comprises silicon nitride, silicon oxynitride or its combination, and low-melting-point metal comprises aluminium, lead, copper, silver, tin or its combination.The warming temperature of each electrothermal structure is greater than the cracking temperature of sacrifice layer.The material of electrothermal structure comprises platinum, gold, silver, copper, aluminium, titanium, conductive oxide, nickel, cobalt, iron, tin or its combination.
According to one embodiment of the invention, the entire area of above-mentioned at least one clear area is 1/10 ~ 9/10 with the entire area ratio of the entity part of each unit pattern.
According to one embodiment of the invention, above-mentioned heater more comprises a driver, and wherein driver drives electrothermal structure in order or side by side.
A kind of heating means of the present invention, comprise and provide foregoing heater, and drive electrothermal structure that electrothermal structure is heated up.
According to one embodiment of the invention, driven when above-mentioned electrothermal structure is different.
According to one embodiment of the invention, before driving electrothermal structure, on loading plate, more form one preheat thing, and electrothermal structure position is preheating between thing and loading plate.
Based on above-mentioned, the heater of the embodiment of the present invention has multiple electrothermal structure, and the plurality of electrothermal structure can according to predetermined aligned transfer to improve the uniformity of resistance heating (Jouleheating).In addition, multiple electrothermal structures set in the heater of the embodiment of the present invention can independently be heated, and therefore use the heater of the embodiment of the present invention to carry out heating means and can adopt multiple heating modes.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate institute's accompanying drawings to be described in detail below.
[accompanying drawing explanation]
Fig. 1 is the schematic diagram of the heater of first embodiment of the invention.
Fig. 2 is the generalized section of heater along direction D of Fig. 1.
Fig. 3 utilizes the heater of Fig. 1 to perform heating means to take off the schematic diagram of flexible base plate.
Fig. 4 is the generalized section of heater along direction D of Fig. 3.
Fig. 5 is the partial schematic diagram of the electrothermal structure of one embodiment of the invention.
Fig. 6 is the partial schematic diagram of the electrothermal structure of another embodiment of the present invention.
Fig. 7 is the partial schematic diagram of the electrothermal structure of further embodiment of this invention.
Fig. 8 is the generalized section of the heater of second embodiment of the invention.
Fig. 9 utilizes the heater of Fig. 8 to perform heating means to take off the schematic diagram of flexible base plate.
[symbol description]
10,20: flexible base plate
100,200: heater
110: loading plate
112: surface
120,120A, 120B, 120C: electrothermal structure
122,122A, 122B, 122C, 124,124A, 124B, 124C: end
126A, 126B, 126C: unit pattern
130: driver
210: sacrifice layer
B1, B2, B3, B4: clear area
D: direction
E: bearing of trend
G: gap
O: opening
P: entity part
TB, TP: width
W: width
[embodiment]
Fig. 1 is the schematic diagram of the heater of first embodiment of the invention, and Fig. 2 is the generalized section of heater along direction D of Fig. 1.Please refer to Fig. 1, heater 100 includes loading plate 110, multiple electrothermal structure 120 and driver 130.In the present embodiment, multiple electrothermal structure 120 is arranged on the surface 112 of loading plate 110, and multiple electrothermal structure 120 arranges in order along direction D independently of one another.In addition, in the present embodiment, the plurality of electrothermal structure 120 is all connected to driver 130 to drive by driver 130, and electrothermal structure 120 in the present embodiment can independently drive by driver 130.
It is worth mentioning that, connecting line in Fig. 1 between electrothermal structure 120 and driver 130 and the graphic of driver 130 are only to represent that each electrothermal structure 120 is connected to driver 130, but not are used for limiting to the concrete connected mode of electrothermal structure 120 and driver 130.In one embodiment, each electrothermal structure 120 can be connected to driver 130 by a transmission lines, and the transmission line that different electrothermal structure 120 connects is independent separately.Or driver 130 can be formed by multiple driver element, and different electrothermal structure 120 is connected to different driver elements.
The making of above-mentioned heater 100 directly can use existing sputtering machine table equipment or CVD (Chemical Vapor Deposition) apparatus and use existing process technique, and must not use in addition, purchase special board, also need not develop new process technique in addition can reach.For example, the manufacture method of heater 100 can be adopt existing board equipment, as depositing device, sputtering equipment etc., electric conducting material is first formed on loading plate 110, recycle existing patterning equipment, as exposure sources, etching machines or laser equipment etc., patterns of conductive materials is turned to the electrothermal structure 120 with predetermined pattern design.
In the present embodiment, heater 100 can be applied to the manufacture method of flexible base plate 10 or can be applied to the manufacture method of pliability electronic installation.Therefore, what loading plate 110 carried preheats thing can be flexible base plate 10.Specifically, when making flexible base plate 10, can first by baseplate material, such as polyimides, polyethylene terephthalate, poly-to naphthalenedicarboxylic acid second two fat or its combination, is formed on loading plate 110.If when baseplate material is aqueous, the method be formed at by baseplate material on loading plate 110 comprises drip or rubbing method.Afterwards, after baseplate material solidification, namely on loading plate 110, flexible base plate 10 is formed.
Under such Making programme, because baseplate material is instiled or applied on the surface 112 of loading plate 110, therefore flexible base plate 10 is directly contacted with electrothermal structure 120.But, in other examples, instillation or coated substrates material on the surface 112 of loading plate 110 before, can (be such as sacrifice layer prior to surface 112 forms other materials layer, its material comprises amorphous silicon, inorganic material, low-melting-point metal or above-mentioned combination, wherein inorganic material comprises silicon nitride, silicon oxynitride or its combination, and low-melting-point metal comprises aluminium, titanium, tin or its combination).Now, flexible base plate 10 is not directly contacted with electrothermal structure 120 but is contacted with described other materials layer (such as sacrifice layer).
In addition, because loading plate 110 can provide desirable support function, so directly electronic component can be made on the flexible base plate 10 be positioned on loading plate 110.Electronic component is herein such as active element, display element, touch control component, filter element or above-mentioned combination.Because loading plate 110 is the plate object of hard, traditional process work bench can be used make when making the plurality of electronic component.Such as, the plain conductor made required for electronic component can use sputtering equipment, and the insulating film layer made required for electronic component can use CVD (Chemical Vapor Deposition) apparatus or sputtering equipment, therefore utilize traditional process work bench the plurality of electronic component can be formed on flexible base plate 10.
It is worth mentioning that, no matter whether flexible base plate 10 is formed with electronic component, flexible base plate 10 all needs to take off by heater 100.Therefore, in the present embodiment, the thermogenic action of electrothermal structure 120 can be utilized to heat flexible base plate 10 take off by heater 100 in order to flexible base plate 10.Especially, when the temperature after driven electrothermal structure 120 heats up is greater than cracking temperature or the fusing point of flexible base plate 10 (preheating thing), flexible base plate 10 just can be separated from heater 100.Swash light-struck mode compared to utilization and take off flexible base plate 10, the present embodiment does not need extra laser equipment and the step of electrified regulation only must be adopted just flexible base plate 10 can be taken off on heater 100.Therefore, the heater 100 of the present embodiment is designed with the cost of manufacture helping reduce flexible base plate 10.
Fig. 3 utilizes the heater of Fig. 1 to perform heating means to take off the schematic diagram of flexible base plate, and Fig. 4 is the generalized section of heater along direction D of Fig. 3.Please refer to Fig. 3 and Fig. 4, in the present embodiment, because the electrothermal structure 120 of heater 100 can independently be driven, therefore the plurality of electrothermal structure 120 can be driven in order.When difference under driven situation, temperature after one of them electrothermal structure 120 heats up can be greater than cracking temperature or the fusing point of flexible base plate 10, and the temperature after the intensification of other electrothermal structures 120 not yet may be greater than cracking temperature or the fusing point of flexible base plate 10.Thus, flexible base plate 10 can only some be separated on heater 100, and other parts are still attached on heater 100, namely shown in Fig. 3 and Fig. 4.
Therefore, through driving the heating means of electrothermal structure 120 can determine the detaching direction that flexible base plate 10 is separated from heater 100 during difference.In the present embodiment, if the plurality of electrothermal structure 120 is sequentially driven according to putting in order, then flexible base plate 10 is such as be generally parallel to direction D from the detaching direction that heater 100 is separated.In other examples, electrothermal structure 120 can be driven towards center gradually by outermost.Thus, flexible base plate 10 is just separated with heater 100 towards center gradually by outermost.Certainly, the present invention is not as limit.
The heater 100 of the present embodiment can independent driven electrothermal structure 120 because have, therefore the heating-up time of different electrothermal structure 120 can be arranged to change according to different demands to preheat thing by the condition heated.Thus, being designed with of heater 100 helps make the process conditions of heating processing more full of elasticity.Certainly, except driving the heating means of the plurality of electrothermal structure 120 during difference, the present embodiment also can drive the plurality of electrothermal structure 120 simultaneously according to design requirement.Thus, all electrothermal structures 120 can be warming up to required warming temperature when having approximate heating curve under roughly close heating rate.Specifically, drive the method for the plurality of electrothermal structure 120 be such as input current pulse give each heating arrangement 120, wherein current impulse can be square waveform pulse, sinusoidal waveform pulse or alternating-current pulse etc.
In the present embodiment, the material of electrothermal structure 120 comprises platinum, gold, silver, copper, aluminium, titanium, conductive oxide, nickel, cobalt, iron, tin or its combination and heats up with the driving via driver 120.At this, conductive oxide such as comprises zinc oxide (ZnO), indium oxide (In
2o
3), tin ash (SnO
2), indium tin oxide (indiumtinoxide, ITO), indium-zinc oxide (indiumzincoxide, IZO), aluminum zinc oxide (Aluminumdopedzincoxide, AZO), gallium-doped zinc oxide (Galliumdopedzincoxide, GZO), indium gallium zinc oxide (indium-gallium-zincoxide, or zinc tin oxide (Zinc-TinOxide, ZTO) IGZO).But, above-mentioned material is only illustrational use, and is not used to limit the present invention.Every material that can heat up by the driving of driver 130 can as the material of the electrothermal structure 120 of the present embodiment.
More specifically, each electrothermal structure 120 has two opposed ends 122 and 124, and end 122 and end 124 are the relative both sides laying respectively at loading plate 110.In addition, two opposed ends 122 of each electrothermal structure 120 are vertical with the orientation D of electrothermal structure 120 with the line of 124.That is, each electrothermal structure 120 can have a bearing of trend E, and wherein bearing of trend E can intersect or perpendicular to direction D.In addition, adjacent two electrothermal structures 120 are separated with gap g in the directiond mutually, and as shown in Fig. 2 and Fig. 4, wherein the width w of electrothermal structure 120 and the ratio of gap g can be 1:1 ~ 10:1.
In addition, each electrothermal structure 120 can be made up of the multiple unit patterns connecting bunchiness, to possess uniform heating effect.Below by the adjoint graphic design describing electrothermal structure 120 particularly.But, the present embodiment is not as limit, and the design of every electrothermal structure 120 can make temperature rise effect reach required temperature just to can be applicable in the heater 100 of the present embodiment.
Fig. 5 is the partial schematic diagram of the electrothermal structure of one embodiment of the invention.Please refer to Fig. 5, electrothermal structure 120A includes both ends 122A, 124A and multiple unit pattern 126A, and wherein unit pattern 126A connects the end section that bunchiness and both ends 122A, 124A are electrothermal structure 120A.In the present embodiment, the entity part P of unit pattern 126A is roughly round clear area B1 and B2.In addition, clear area B1 and B2 not by the entity part P Perfect Ring of unit pattern 126A around, so clear area B1 and B2 all has opening O.
The entity part P of unit pattern 126A is made up of the linearity pattern wriggled, and the overall profile of unit pattern 126A (as dotted line in Fig. 5 enclose the region of choosing) form the pattern being similar to rhombus.But, the present invention is not as limit.In other examples, the overall profile of unit pattern 126A can form the pattern being similar to other shapes such as circle, ellipse, triangle, rectangle, hexagon, octangle, irregular shape.The entire area of each clear area B1 and B2 can be 1/10 ~ 9/10 with the entire area ratio of the entity part P of each unit pattern 126A.
Certainly, above-mentioned shape and area ratio only illustrate.In other examples, the profile of unit pattern 126A and size can adjust to some extent according to the material of required impedance magnitude and electrothermal structure 120A.For example, in order to realize identical impedance magnitude, the material resistivity of electrothermal structure 120A is higher, then the live width design of unit pattern 126A can be larger.When the live width design of unit pattern 126A is larger, the entire area of clear area B1 and B2 will reduce with the entire area ratio of the entity part P of each unit pattern 126A.Otherwise the material resistivity of electrothermal structure 120A is lower, then the live width design of unit pattern 126A is less, to realize set resistance value.Now, the entire area of clear area B1 and B2 will increase with the entire area ratio of the entity part P of each unit pattern 126A.In the present embodiment, the entity part P of each unit pattern 126A is sinuous linear track, so clear area B1 or B2 has sinuous linear profile, wherein the live width TB of linear profile can do different adjustment from the ratio of the live width TP of linear track according to required impedance magnitude.
Fig. 6 is the partial schematic diagram of the electrothermal structure of another embodiment of the present invention.Please refer to Fig. 6, electrothermal structure 120B includes both ends 122B, 124B and multiple unit pattern 126B, and wherein unit pattern 126B connects the end section that bunchiness and both ends 122B, 124B are electrothermal structure 120B.In the present embodiment, unit pattern 126B is the pattern of block shape separately and has multiple opening to define multiple clear area B3.Thus, the entity part P of unit pattern 126B is in fact round the plurality of clear area B3, and in other words, clear area B3 is the opening that entity part P surrounds.Specifically, the unit pattern 126B of the present embodiment is such as having the pattern of oval shapes of multiple opening, but the present invention is not as limit.In other examples, the outline of unit pattern 126B can be other shapes such as circle, triangle, rectangle, rhombus, hexagon, octangle, irregular shape.In addition, the design of the unit pattern 126B of the present embodiment can adjust to some extent according to the impedance magnitude needed for electrothermal structure 120B, such as, the entire area of the clear area B3 of each unit pattern 126B can be 1/10 ~ 9/10 with the entire area ratio of the entity part of each unit pattern 126B.
Fig. 7 is the partial schematic diagram of the electrothermal structure of further embodiment of this invention.Please refer to Fig. 7, electrothermal structure 120C includes both ends 122C, 124C and multiple unit pattern 126C, and wherein unit pattern 126C connects the end section that bunchiness and both ends 122C, 124C are electrothermal structure 120C.In the present embodiment, unit pattern 126C is latticed pattern separately and has multiple opening to define multiple clear area B4, and in other words, clear area B4 is opening region.Thus, the entity part P of unit pattern 126C is in fact round the plurality of clear area B4.Specifically, the unit pattern 126C of the present embodiment is such as having the argyle design of multiple opening, but the present invention is not as limit.In other examples, the profile of unit pattern 126C can be other shapes such as circle, triangle, rectangle, ellipse, hexagon, octangle, irregular shape.In addition, the design of the unit pattern 126C of the present embodiment can adjust to some extent according to the impedance magnitude needed for electrothermal structure 120C, and such as, the entire area of clear area B4 can be 1/10 ~ 9/10 with the entire area ratio of the entity part of each unit pattern 126C.
Fig. 8 is the generalized section of the heater of second embodiment of the invention and Fig. 9 utilizes the heater of Fig. 8 to perform heating means to take off the schematic diagram of flexible base plate.Referring to Fig. 8 and Fig. 9, the heater 200 of the present embodiment is approximately identical to the heater 100 of aforementioned first embodiment and has loading plate 110 and multiple electrothermal structure 120.Therefore, the electrothermal structure 120 of heater 200 can have distribution as shown in Figure 1.But, the heater 200 of the present embodiment more includes a sacrifice layer 210, and sacrifice layer 210 contacts with electrothermal structure 120, and wherein electrothermal structure 120 is between sacrifice layer 210 and loading plate 110.
In the present embodiment, flexible base plate 20 is formed at or is attached on sacrifice layer 210.During for taking off flexible base plate 20 on heater 200, electrothermal structure 120 can be driven to make it heat up and allow the warming temperature of electrothermal structure 120 be greater than the cracking temperature of sacrifice layer 210.Cracking through sacrifice layer 210 can allow flexible base plate 20 be separated by heater 200.In the present embodiment, the material of sacrifice layer 210 comprises amorphous silicon, inorganic material, low-melting-point metal or above-mentioned combination, and wherein inorganic material comprises silicon nitride, silicon oxynitride or its combination, and low-melting-point metal comprises aluminium, lead, copper, silver, tin or its combination.In addition, sacrifice layer 210 can optionally complete be covered with loading plate 110 surface or be only be distributed in partly loading plate 110 surface.
Because the present embodiment utilizes the intensification of electrothermal structure 120 to make sacrifice layer 210 cracking and is separated flexible base plate 20 and electrothermal structure 120, flexible base plate 20 itself can be avoided because of the heating of heater 200 impaired.In addition, in the present embodiment, the design of electrothermal structure 120, spacing distance and size can with reference to the designs of aforementioned any one electrothermal structure 120A ~ 120C.Therefore, heater 200 can provide desirable heating effect.In addition, electrothermal structure 120 can independent driven design also can allow designer adjust heating condition with different designs demand, and this makes the more high resilience of the applicable heating means of heater 200.Further, the present embodiment and previous embodiment utilize simply on loading plate 110, to arrange the equipment cost that design that electric heating pattern 120 just can form heater 100 and 200 does not need both expensive.
It is worth mentioning that, the stripping that heater 100 and 200 is applied to flexible base plate 10 and 20 by above-described embodiment is only the use illustrated, and is not used to limit the present invention.In other examples, heater 100 and 200 can be applied to needs any heating processing of homogeneous heating or needs regional area at different time by other heating processings of heating.
In sum, the heater of the embodiment of the present invention uses simple structural design, and it will independently be arranged on loading plate by multiple electrothermal structure.Electrothermal structure on loading plate can independently be contributed to by heating performing multiple heating means, makes heating means more flexible.In addition, simple structural design just can form the heater of the embodiment of the present invention, equipment cost that must be not expensive.
Claims (8)
1. a heater, comprising:
One loading plate;
Multiple electrothermal structure, is configured at the surface of this loading plate, and respectively this electrothermal structure is independently driven and heats up, and wherein respectively this electrothermal structure comprises and connects multiple unit patterns of bunchiness, wherein respectively the entity part of this unit pattern round at least one clear area;
One sacrifice layer, the plurality of electrothermal structure is between this sacrifice layer and this loading plate, and this sacrifice layer is complete is covered with surface at this loading plate and the complete space entirely covering the Inter of a little electrothermal structure of Cover The and the plurality of electrothermal structure; And
One driver, wherein the plurality of electrothermal structure is independently driven in order or side by side by this driver.
2. heater as claimed in claim 1, it is characterized in that, respectively two opposed ends of this electrothermal structure are the relative both sides laying respectively at this loading plate, wherein respectively the line of two opposed ends of this electrothermal structure is vertical with the orientation of the plurality of electrothermal structure, wherein the plurality of electrothermal structure width and the ratio in gap be 1:1 ~ 10:1.
3. heater as claimed in claim 1, it is characterized in that, respectively this electrothermal structure heat up after temperature be greater than cracking temperature or the fusing point that preheats thing, wherein this preheats thing and comprises polyimides, polyethylene terephthalate, poly-to naphthalenedicarboxylic acid second two fat or its combination.
4. heater as claimed in claim 1, it is characterized in that, the material of this sacrifice layer comprises amorphous silicon, inorganic material, low-melting-point metal or above-mentioned combination, and this inorganic material comprises silicon nitride, silicon oxynitride or its combination, and this low-melting-point metal comprises aluminium, lead, copper, silver, tin or its combination.
5. heater as claimed in claim 1, is characterized in that, the temperature respectively after the intensification of this electrothermal structure is greater than the cracking temperature of this sacrifice layer.
6. heater as claimed in claim 1, is characterized in that, the material of the plurality of electrothermal structure comprises platinum, gold, silver, copper, aluminium, titanium, conductive oxide, nickel, cobalt, iron, tin or its combination.
7. heater as claimed in claim 1, is characterized in that, the entire area of this at least one clear area is 1/10 ~ 9/10 with the entire area ratio of each this entity part of this unit pattern.
8. heating means, comprising:
One heater as claimed in claim 1 is provided, is driven when the plurality of electrothermal structure is different; And
Drive the plurality of electrothermal structure that the plurality of electrothermal structure is heated up, before driving the plurality of electrothermal structure, on this loading plate, more form one preheat thing, and the plurality of electrothermal structure position preheats between thing and this loading plate at this, on heater, take off this when preheating thing, this sacrifice layer is retained on this loading plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102129667 | 2013-08-19 | ||
| TW102129667A TWI589178B (en) | 2013-08-19 | 2013-08-19 | Heater and haeting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103491659A CN103491659A (en) | 2014-01-01 |
| CN103491659B true CN103491659B (en) | 2016-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310426337.4A Expired - Fee Related CN103491659B (en) | 2013-08-19 | 2013-09-17 | Heater and heating method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103491659B (en) |
| TW (1) | TWI589178B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI608639B (en) * | 2016-12-06 | 2017-12-11 | 財團法人工業技術研究院 | Flexible thermoelectric structure and method for manufacturing the same |
| CN110248429A (en) * | 2019-06-04 | 2019-09-17 | 宁波石墨烯创新中心有限公司 | A kind of see-through electrothermal layer, the see-through electric calorifie installation and its application including it |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070025533A (en) * | 2005-09-02 | 2007-03-08 | 유영운 | Plate heater with flexibility |
| JP4564507B2 (en) * | 2007-03-29 | 2010-10-20 | 株式会社東芝 | Antenna device and antenna composite unit |
| CN201774686U (en) * | 2009-05-11 | 2011-03-23 | 宁波高新区健坤电热技术有限公司 | Platy electric heating element with equalized temperature |
| CN102683379A (en) * | 2011-03-10 | 2012-09-19 | 三星移动显示器株式会社 | Flexible display device and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1900253B1 (en) * | 2005-06-29 | 2013-07-31 | Watlow Electric Manufacturing Company | Smart layered heater surfaces |
| TWI374682B (en) * | 2006-07-20 | 2012-10-11 | Watlow Electric Mfg | Layered heater system having conductive overlays |
| CN102013414A (en) * | 2009-09-08 | 2011-04-13 | 群康科技(深圳)有限公司 | Making method of flexible display assembly |
| US8637794B2 (en) * | 2009-10-21 | 2014-01-28 | Lam Research Corporation | Heating plate with planar heating zones for semiconductor processing |
-
2013
- 2013-08-19 TW TW102129667A patent/TWI589178B/en not_active IP Right Cessation
- 2013-09-17 CN CN201310426337.4A patent/CN103491659B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070025533A (en) * | 2005-09-02 | 2007-03-08 | 유영운 | Plate heater with flexibility |
| JP4564507B2 (en) * | 2007-03-29 | 2010-10-20 | 株式会社東芝 | Antenna device and antenna composite unit |
| CN201774686U (en) * | 2009-05-11 | 2011-03-23 | 宁波高新区健坤电热技术有限公司 | Platy electric heating element with equalized temperature |
| CN102683379A (en) * | 2011-03-10 | 2012-09-19 | 三星移动显示器株式会社 | Flexible display device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201509224A (en) | 2015-03-01 |
| TWI589178B (en) | 2017-06-21 |
| CN103491659A (en) | 2014-01-01 |
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