CN103489991A - 一种高显色、分区域的cob封装led荧光膜 - Google Patents
一种高显色、分区域的cob封装led荧光膜 Download PDFInfo
- Publication number
- CN103489991A CN103489991A CN201310451872.5A CN201310451872A CN103489991A CN 103489991 A CN103489991 A CN 103489991A CN 201310451872 A CN201310451872 A CN 201310451872A CN 103489991 A CN103489991 A CN 103489991A
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- Prior art keywords
- yellow
- cob
- red
- fluorescent film
- light
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- 238000009877 rendering Methods 0.000 title abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims description 27
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 239000005357 flat glass Substances 0.000 claims description 4
- 238000004587 chromatography analysis Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 230000000694 effects Effects 0.000 abstract 1
- KRQUFUKTQHISJB-YYADALCUSA-N 2-[(E)-N-[2-(4-chlorophenoxy)propoxy]-C-propylcarbonimidoyl]-3-hydroxy-5-(thian-3-yl)cyclohex-2-en-1-one Chemical compound CCC\C(=N/OCC(C)OC1=CC=C(Cl)C=C1)C1=C(O)CC(CC1=O)C1CCCSC1 KRQUFUKTQHISJB-YYADALCUSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910001448 ferrous ion Inorganic materials 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310451872.5A CN103489991B (zh) | 2013-09-27 | 2013-09-27 | 一种高显色、分区域的cob封装led荧光膜 |
Applications Claiming Priority (1)
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---|---|---|---|
CN201310451872.5A CN103489991B (zh) | 2013-09-27 | 2013-09-27 | 一种高显色、分区域的cob封装led荧光膜 |
Publications (2)
Publication Number | Publication Date |
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CN103489991A true CN103489991A (zh) | 2014-01-01 |
CN103489991B CN103489991B (zh) | 2016-03-23 |
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CN201310451872.5A Active CN103489991B (zh) | 2013-09-27 | 2013-09-27 | 一种高显色、分区域的cob封装led荧光膜 |
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CN (1) | CN103489991B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106784259A (zh) * | 2016-11-10 | 2017-05-31 | 深圳天珑无线科技有限公司 | 一种多色温混合光源及其制作方法、移动终端 |
CN108807647A (zh) * | 2018-06-14 | 2018-11-13 | 中国计量大学 | 一种led结构化荧光膜的制造方法 |
CN109148429A (zh) * | 2018-08-28 | 2019-01-04 | 开发晶照明(厦门)有限公司 | 发光二极管封装结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090224693A1 (en) * | 2004-12-10 | 2009-09-10 | Kenji Mukai | Illumination source, illumination system, and dimming control method for the production of different colour temperatures |
US20100296280A1 (en) * | 2009-05-20 | 2010-11-25 | Kai-Jen YANG | White-light LED Device and Illuminating Method of the same |
CN202134535U (zh) * | 2011-06-21 | 2012-02-01 | 南京汉德森科技股份有限公司 | Led集成封装光源模块 |
CN102522398A (zh) * | 2011-12-31 | 2012-06-27 | 苏州玄照光电有限公司 | 高显色指数高可靠性cob集成封装led |
CN102709280A (zh) * | 2012-05-29 | 2012-10-03 | 宁波升谱光电半导体有限公司 | 一种cob集成光源模块 |
-
2013
- 2013-09-27 CN CN201310451872.5A patent/CN103489991B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090224693A1 (en) * | 2004-12-10 | 2009-09-10 | Kenji Mukai | Illumination source, illumination system, and dimming control method for the production of different colour temperatures |
US20100296280A1 (en) * | 2009-05-20 | 2010-11-25 | Kai-Jen YANG | White-light LED Device and Illuminating Method of the same |
CN202134535U (zh) * | 2011-06-21 | 2012-02-01 | 南京汉德森科技股份有限公司 | Led集成封装光源模块 |
CN102522398A (zh) * | 2011-12-31 | 2012-06-27 | 苏州玄照光电有限公司 | 高显色指数高可靠性cob集成封装led |
CN102709280A (zh) * | 2012-05-29 | 2012-10-03 | 宁波升谱光电半导体有限公司 | 一种cob集成光源模块 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106784259A (zh) * | 2016-11-10 | 2017-05-31 | 深圳天珑无线科技有限公司 | 一种多色温混合光源及其制作方法、移动终端 |
CN108807647A (zh) * | 2018-06-14 | 2018-11-13 | 中国计量大学 | 一种led结构化荧光膜的制造方法 |
CN109148429A (zh) * | 2018-08-28 | 2019-01-04 | 开发晶照明(厦门)有限公司 | 发光二极管封装结构 |
CN109148429B (zh) * | 2018-08-28 | 2020-09-22 | 开发晶照明(厦门)有限公司 | 发光二极管封装结构 |
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CN103489991B (zh) | 2016-03-23 |
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