CN103489991A - 一种高显色、分区域的cob封装led荧光膜 - Google Patents

一种高显色、分区域的cob封装led荧光膜 Download PDF

Info

Publication number
CN103489991A
CN103489991A CN201310451872.5A CN201310451872A CN103489991A CN 103489991 A CN103489991 A CN 103489991A CN 201310451872 A CN201310451872 A CN 201310451872A CN 103489991 A CN103489991 A CN 103489991A
Authority
CN
China
Prior art keywords
yellow
cob
red
fluorescent film
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310451872.5A
Other languages
English (en)
Other versions
CN103489991B (zh
Inventor
王忆
黄承斌
李海耀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangmen Langtian Co Ltd
Original Assignee
Wuyi University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuyi University filed Critical Wuyi University
Priority to CN201310451872.5A priority Critical patent/CN103489991B/zh
Publication of CN103489991A publication Critical patent/CN103489991A/zh
Application granted granted Critical
Publication of CN103489991B publication Critical patent/CN103489991B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种高显色、分区域的COB封装LED荧光膜,包括COB基板,所述COB基板下方设置有驱动电路,所述COB基板上设置有蓝光LED芯片,所述COB基板上还覆盖有透光板,所述的透光板上通过网格套印的方式形成互相间杂的红色方块区域和黄色方块区域,所述的红色方块区域材料为红色荧光粉及作为基料的硅树脂混合配置而成,所述的黄色方块区域材料为黄色荧光粉及作为基料的硅树脂混合配置而成,红色方块区域与黄色方块区域的数量比例为1:9~2:8。通过蓝光统一有效激发红色荧光粉和黄色荧光粉,通过红色荧光粉来提高显色指数,使得显色性能达到了85以上,光效提高了5%~15%。

Description

一种高显色、分区域的COB封装LED荧光膜
技术领域
本发明涉及一种COB封装LED荧光膜结构。
背景技术
COB光源的优势是:1、可克服LED直插灯、LED大功率有眩光的缺点,2、克服贴片类LED体积大、成本高的缺点,3、用抗衰减老化材料加上10*23MIL的大尺寸芯片和精密的封装工艺,可以使LED平面光源模块光衰小于1.2%,4、合理的封装形式可以让芯片充分散热,保证芯片质量和寿命,5、出光面一致性好,无色斑,6、节约成本,无需另外制作PCB板,7、模组化结构,应用厂家可直接安装,无需另外考虑工业设计。从成本和应用角度来看,COB为未来灯具化设计的主流方向。
现有的制备白光LED通常有两种方法:一是把红、绿和蓝光三种LED混合封装在一个基板上面,通过这三种颜色比例的调节来制造白光;二是在芯片的表面涂一层荧光粉来生成白光。一般优选的,采用在蓝光LED芯片上涂敷能被蓝光激发的黄色荧光粉的方式来生成白光,如果再添加适当比例的红色荧光粉,可以提高显色指数,但是发光效率会降低。 
发明内容
为了克服现有技术的白光LED的不足,本发明提供一种高显色、分区域的COB封装LED荧光膜,提高了LED显色指数的同时,不会损失太多发光效率。
本发明解决其技术问题所采用的技术方案是:
一种高显色、分区域的COB封装LED荧光膜,包括COB基板,所述COB基板下方设置有驱动电路,所述COB基板上设置有蓝光LED芯片,所述COB基板上还覆盖有透光板,所述的透光板上通过网格套印的方式形成互相间杂的红色方块区域和黄色方块区域,所述的红色方块区域材料为红色荧光粉及作为基料的硅树脂混合配置而成,所述的黄色方块区域材料为黄色荧光粉及作为基料的硅树脂混合配置而成,红色方块区域与黄色方块区域的数量比例为1:9~2:8。
所述的红色荧光粉为翰群YAG-13红色荧光粉,所述的黄色荧光粉为翰群YAG-1黄色荧光粉或宏大4-3-2黄色荧光粉。
所述的透光板为玻璃片或石英片。
所述的透光板印有荧光粉的一侧覆盖在蓝色LED芯片上。
本发明的有益效果是:通过蓝光统一有效激发红色荧光粉和黄色荧光粉,通过红色荧光粉来提高显色指数,使得显色性能达到了85以上,光效提高了5%~15%。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是本发明实施例1的结构示意图;
图2是本发明实施例2的结构示意图。
具体实施方式
参照图1和图2,本发明的一种高显色、分区域的COB封装LED荧光膜,包括COB基板,所述COB基板下方设置有驱动电路,所述COB基板上设置有蓝光LED芯片,所述COB基板上还覆盖有透光板1,所述的透光板1上通过网格套印的方式形成互相间杂的红色方块区域2和黄色方块区域3,所述的红色方块区域2材料为红色荧光粉及作为基料的硅树脂混合配置而成,所述的黄色方块区域3材料为黄色荧光粉及作为基料的硅树脂混合配置而成,红色方块区域2与黄色方块区域3的数量比例为1:9~2:8。
透光板1上的红色方块区域2和黄色方块区域3间杂设置,形成类似俄罗斯方块的图案。
所述的红色荧光粉为翰群YAG-13红色荧光粉,所述的黄色荧光粉为翰群YAG-1黄色荧光粉或宏大4-3-2黄色荧光粉。
所述的透光板1为玻璃片或石英片,玻璃片上含有少量的二价铁离子,可能对产品造成一定的干扰。
所述的透光板1印有荧光粉的一侧覆盖在蓝色LED芯片上。
当然,本发明除了上述实施方式之外,还可以有其它结构上的变形,这些等同技术方案也应当在其保护范围之内。

Claims (4)

1. 一种高显色、分区域的COB封装LED荧光膜,包括COB基板,所述COB基板下方设置有驱动电路,所述COB基板上设置有蓝光LED芯片,其特征在于:所述COB基板上还覆盖有透光板,所述的透光板上通过网格套印的方式形成互相间杂的红色方块区域和黄色方块区域,所述的红色方块区域材料为红色荧光粉及作为基料的硅树脂混合配置而成,所述的黄色方块区域材料为黄色荧光粉及作为基料的硅树脂混合配置而成,红色方块区域与黄色方块区域的数量比例为1:9~2:8。
2. 根据权利要求1所述的一种高显色、分区域的COB封装LED荧光膜,其特征在于:所述的红色荧光粉为翰群YAG-13红色荧光粉,所述的黄色荧光粉为翰群YAG-1黄色荧光粉或宏大4-3-2黄色荧光粉。
3. 根据权利要求1所述的一种高显色、分区域的COB封装LED荧光膜,其特征在于:所述的透光板为玻璃片或石英片。
4. 根据权利要求1~3中任一项所述的一种高显色、分区域的COB封装LED荧光膜,其特征在于:所述的透光板印有荧光粉的一侧覆盖在蓝色LED芯片上。
CN201310451872.5A 2013-09-27 2013-09-27 一种高显色、分区域的cob封装led荧光膜 Active CN103489991B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310451872.5A CN103489991B (zh) 2013-09-27 2013-09-27 一种高显色、分区域的cob封装led荧光膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310451872.5A CN103489991B (zh) 2013-09-27 2013-09-27 一种高显色、分区域的cob封装led荧光膜

Publications (2)

Publication Number Publication Date
CN103489991A true CN103489991A (zh) 2014-01-01
CN103489991B CN103489991B (zh) 2016-03-23

Family

ID=49830075

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310451872.5A Active CN103489991B (zh) 2013-09-27 2013-09-27 一种高显色、分区域的cob封装led荧光膜

Country Status (1)

Country Link
CN (1) CN103489991B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106784259A (zh) * 2016-11-10 2017-05-31 深圳天珑无线科技有限公司 一种多色温混合光源及其制作方法、移动终端
CN108807647A (zh) * 2018-06-14 2018-11-13 中国计量大学 一种led结构化荧光膜的制造方法
CN109148429A (zh) * 2018-08-28 2019-01-04 开发晶照明(厦门)有限公司 发光二极管封装结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090224693A1 (en) * 2004-12-10 2009-09-10 Kenji Mukai Illumination source, illumination system, and dimming control method for the production of different colour temperatures
US20100296280A1 (en) * 2009-05-20 2010-11-25 Kai-Jen YANG White-light LED Device and Illuminating Method of the same
CN202134535U (zh) * 2011-06-21 2012-02-01 南京汉德森科技股份有限公司 Led集成封装光源模块
CN102522398A (zh) * 2011-12-31 2012-06-27 苏州玄照光电有限公司 高显色指数高可靠性cob集成封装led
CN102709280A (zh) * 2012-05-29 2012-10-03 宁波升谱光电半导体有限公司 一种cob集成光源模块

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090224693A1 (en) * 2004-12-10 2009-09-10 Kenji Mukai Illumination source, illumination system, and dimming control method for the production of different colour temperatures
US20100296280A1 (en) * 2009-05-20 2010-11-25 Kai-Jen YANG White-light LED Device and Illuminating Method of the same
CN202134535U (zh) * 2011-06-21 2012-02-01 南京汉德森科技股份有限公司 Led集成封装光源模块
CN102522398A (zh) * 2011-12-31 2012-06-27 苏州玄照光电有限公司 高显色指数高可靠性cob集成封装led
CN102709280A (zh) * 2012-05-29 2012-10-03 宁波升谱光电半导体有限公司 一种cob集成光源模块

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106784259A (zh) * 2016-11-10 2017-05-31 深圳天珑无线科技有限公司 一种多色温混合光源及其制作方法、移动终端
CN108807647A (zh) * 2018-06-14 2018-11-13 中国计量大学 一种led结构化荧光膜的制造方法
CN109148429A (zh) * 2018-08-28 2019-01-04 开发晶照明(厦门)有限公司 发光二极管封装结构
CN109148429B (zh) * 2018-08-28 2020-09-22 开发晶照明(厦门)有限公司 发光二极管封装结构

Also Published As

Publication number Publication date
CN103489991B (zh) 2016-03-23

Similar Documents

Publication Publication Date Title
JP3164267U (ja) 照明モジュール
CN101639164B (zh) 一种高稳定的增强显色性led光源模块
US9923126B2 (en) Light emitting device having high color rendering using three phosphor types
US9076667B2 (en) White light emitting diode module
JP2008166825A (ja) 白色発光装置及びこれを用いたlcdバックライト用光源モジュール
CN101915369A (zh) Led白光光源模块
TWM462822U (zh) 雙晶片發光二極體
CN204088306U (zh) 一种白光led模组
CN103779346A (zh) 一种近紫外或紫光激发的led发光装置
TWI509844B (zh) Applied to the backlight of the LED light-emitting structure
CN107546301B (zh) 一种白胶、led灯珠及其的封装方法
CN103489991B (zh) 一种高显色、分区域的cob封装led荧光膜
CN104654052A (zh) 照明设备
CN107785476B (zh) 一种白光led用荧光玻璃薄膜及其制备方法
CN104347606A (zh) 发光二极管封装结构及光源模块
CN203068300U (zh) 一种液晶显示器背光源
CN102945918A (zh) 一种暖白光led发光装置
CN207922072U (zh) 一种高色域led背光源
CN102709280A (zh) 一种cob集成光源模块
CN202469605U (zh) 发光装置
CN203787466U (zh) Led封装结构
CN201434248Y (zh) 一种具有不同白光激发方式的led日光灯
CN101937965A (zh) 一种诱发白光led
CN101740679B (zh) 发光二极管的荧光粉封装方法
CN202678308U (zh) 一种cob集成光源模块

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: JIANGMEN LANGTIAN CO., LTD.

Free format text: FORMER OWNER: WUYI UNIVERSITY

Effective date: 20140404

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 529020 JIANGMEN, GUANGDONG PROVINCE TO: 529000 JIANGMEN, GUANGDONG PROVINCE

TA01 Transfer of patent application right

Effective date of registration: 20140404

Address after: 529000 Guangdong province Jiangmen Jianghai Road No. 383, building 8, Ca Mau first floor

Applicant after: Jiangmen Langtian Co., Ltd.

Address before: 529020 No. 22 Dongcheng village, Guangdong City, Jiangmen Province

Applicant before: Wuyi University

C14 Grant of patent or utility model
GR01 Patent grant