CN103487715A - Device for rapidly testing high density interconnect circuit board backflow coils - Google Patents

Device for rapidly testing high density interconnect circuit board backflow coils Download PDF

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Publication number
CN103487715A
CN103487715A CN201310461541.XA CN201310461541A CN103487715A CN 103487715 A CN103487715 A CN 103487715A CN 201310461541 A CN201310461541 A CN 201310461541A CN 103487715 A CN103487715 A CN 103487715A
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China
Prior art keywords
coil
probe
circuit board
test pencil
magnetic induction
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Pending
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CN201310461541.XA
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Chinese (zh)
Inventor
刘学斌
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Tianjin Printronics Circuit Corp
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Tianjin Printronics Circuit Corp
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Application filed by Tianjin Printronics Circuit Corp filed Critical Tianjin Printronics Circuit Corp
Priority to CN201310461541.XA priority Critical patent/CN103487715A/en
Publication of CN103487715A publication Critical patent/CN103487715A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a device for rapidly testing high density interconnect circuit board backflow coils. The lower end of a magnetic induction column is arranged in a base in a penetrating mode, two probe columns are installed on the base, a probe is connected to one end of each probe column, the head end point of each coil on the bottom face of a circuit board arranged outside the magnetic induction column in a sleeved mode and the tail end point of each coil on the bottom face of a circuit board arranged outside the magnetic induction column in the sleeved mode make contact with one of probe bodies which are vertically arranged in the upper end face of the base in an embedded mode, the lower end of the probe body which makes contact with the head end point of the first coil is connected with the other end of one of the probe columns, the lower end of the probe body which makes contact with the tail end point of the last coil is connected with the other end of the other probe column, and the tail end point of each coil is connected with the head end point of the next coil in series. According to the device for rapidly testing the high density interconnect circuit board backflow coils, the time for a single test is overall shortened, the probability of making mistakes is lowered, and the accuracy of a test result is guaranteed.

Description

High-density interconnected circuit board refluxes and encloses device for quick testing
Technical field
The invention belongs to the wire circle technical field of measurement and test, especially a kind of high-density interconnected circuit board refluxes and encloses device for quick testing.
Background technology
In high-density interconnected circuit board processing, a kind of structure with one or more coils is arranged, these coils can be in a certain layer circuit board or in multilayer circuit board, the first and last end points of all coils all is positioned at the front of circuit board, because most of coil can't be seen, so must carry out the detection of coil after producing well, to guarantee in batch products whether have coil, whether substandard products or the coil quantity of UNICOM do not meet the requirements of the customers.
In testing process, the equipment used is the wire circle tester, it comprises: tester, test pencil and magnetic induction post, two jacks on tester connect a test pencil by cable respectively, the magnetic induction post is passed in the hole of model to be tested center, then contact respectively the first and last end points of a coil with two test pencils, now the display screen on tester shows the quantity of coil or shows the information that coil opens circuit, and completes once test after testing each coil.
But in actual use, tester's the course of work is: 1. model to be tested is got; 2. the magnetic induction post is put into to the hole at model to be tested center; 3. both hands are picked up test pencil; 4. contact the first and last end points of each coil, the number of turns of measuring coil, the demonstration information of the display screen of the instrument of observation test simultaneously; 5 take off model to be tested.If three coils are arranged on model, the so above-mentioned course of work at least needed about 10 seconds, and each coil all needs the tester to observe display screen, when if batch products quantity is a lot, undetected or wrong situation about subtracting very easily occurs, cause the most at last the circuit board that mails to customers' place quality accident to occur.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of high-density interconnected circuit board rational in infrastructure, easy and simple to handle to reflux and enclose device for quick testing.
The technical scheme that the present invention takes is:
A kind of high-density interconnected circuit board refluxes and encloses device for quick testing, comprise the wire circle tester, test pencil and magnetic induction post, described wire circle tester connects respectively test pencil and magnetic induction post, it is characterized in that: the lower end of described magnetic induction post is installed in a base, two test pencil posts are installed on this base, one end of each test pencil post connects a described test pencil, the head-end of each coil on the circuit board bottom surface of described magnetic induction post outer rim suit contacts with a probe of the vertical setting-in in base upper surface respectively with distal point, the probe lower end contacted with the head-end of first coil is connected the other end of a described test pencil post, the probe lower end contacted with the distal point of last coil is connected the other end of another described test pencil post, the distal point of each coil all is connected in series with the head-end of next coil.
And described base comprises top panel and base plate, four jiaos of base plate upper surfaces difference is vertically installed a support column, and these four support column upper ends are crimped on the bottom surface of top panel, between this top panel and support column, are bolted.
And the vertical spacing slip of probe is inlaid in a needle tubing, this needle tubing outer rim is set with an outer tube, and this outer tube is inlaid in described top panel, and the flange of making laterally in the upper end of outer tube is crimped on the upper surface of described top panel.
And, make bulge loop on the inwall of described needle tubing upper end, be positioned on the probe outer rim of this bulge loop below and make projection, the probe lower end outer rim of this projection below is set with a spring, and this spring bottom is crimped on described needle tubing bottom.
Advantage of the present invention and good effect are:
In the present invention, install the magnetic induction post in base, a plurality of probes of setting-in on the base in the magnetic induction post outside, the head-end of each coil on the circuit board bottom surface be set with on the magnetic induction post contacts with a probe respectively with distal point, the probe of first coil head-end contact connects a test pencil post, the probe of last coil end point contact connects another test pencil post, between the probe of distal point contact of coil be connected in series the probe of the head-end contact of next coil, after using this structure, the tester only need be pressed on circuit board on probe, the wire circle tester will show the comprehensive quantity of all coils number of turns, saved like this time that test pencil contacts with each coil first and last end points, and only need to observe a display screen, shortened on the whole the time of single test, and reduced the probability of makeing mistakes, guaranteed the accurate of test result.
The accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the I section enlarged drawing of Fig. 1;
Fig. 3 is the head-end of a plurality of coils of circuit board and the distribution of distal point;
Fig. 4 is the circuit board of Fig. 3 and equivalent circuit diagram after probe contacts.
Embodiment
Below in conjunction with embodiment, the present invention is further described, and following embodiment is illustrative, is not determinate, can not limit protection scope of the present invention with following embodiment.
A kind of high-density interconnected circuit board refluxes and encloses device for quick testing, as shown in Fig. 1~4, comprise wire circle tester 12, test pencil 2 and magnetic induction post 1, the jack 13 of described wire circle tester connects two test pencils by cable 15, innovation of the present invention is: the lower end of described magnetic induction post is installed in the interior made through hole 19 of a base, two test pencil posts 6 are installed on this base, one end of each test pencil post connects a described test pencil, the head-end of each coil 30 on the circuit board bottom surface of described magnetic induction post outer rim suit contacts with a probe 9 of the vertical setting-in in base upper surface respectively with distal point, the probe lower end contacted with the head-end of first coil is connected the other end of a described test pencil post by cable 7, the probe lower end contacted with the distal point of last coil is connected the other end of another described test pencil post, the distal point of each coil all is connected in series with the head-end of next coil.
In the present embodiment, described base comprises top panel 4 and base plate 11, and four jiaos of base plate upper surfaces difference is vertically installed a support column 10, and these four support column upper ends are crimped on the bottom surface of top panel, fixing by bolt 5 between this top panel and support column.
The probe result as shown in Figure 2, its vertical spacing slip is inlaid in the cavity 25 of a needle tubing 16, this needle tubing outer rim is set with an outer tube 17, and this outer tube is inlaid in described top panel institute drilling 24, and the flange 18 of making laterally in the upper end of outer tube is crimped on the upper surface of described top panel.
Specifically: make bulge loop 20 on the inwall of described needle tubing upper end, be positioned on the probe outer rim of this bulge loop below and make projection 21, probe lower end 22 outer rims of this projection below are set with a spring 23, and this spring bottom is crimped on described needle tubing bottom.Probe can be under the effect of spring vertical motion, with the head-end that guarantees all probe upper ends and circuit board, with distal point, contact closely.A pin cap 8 is installed in each probe upper end, and this pin cap has a tip topmost, and this most advanced and sophisticated shape can arrange according to the first and last end points shape of circuit board coil.
Embodiment
Model to be tested as shown in Figure 3, comprises three coils, and the head-end of each coil and the name of distal point can set up on their own, and head-end and distal point all are positioned at a surface of circuit board.In this example, head-end and distal point that the head-end that the head-end of first coil and distal point are 29,28, the second coils and distal point are 26,32, the three coils are 31,27.Three coils are respectively 4 circles, 9 circles and 3 circles.
To there is the surface of head-end and distal point down, then model will be enclosed within to magnetic induction post outer rim, the head-end of each coil is contacted with probe with distal point, after good position, compress a little circuit board downwards.
Now equivalent electrical circuit is as shown in Figure 4:
The head-end 29 of first coil connects test pencil post 6 by probe 9, this test pencil post is by test pencil contact 3, test pencil 2 connecting coil number of turns testers, the distal point 28 of the first coil is connected in series the head-end 26 of the second coil, the distal point 32 of the second coil connects the head-end 31 of tertiary coil, the distal point 27 of tertiary coil connects another test pencil post 6 by probe, and this another test pencil post is by another test pencil contact 3, another test pencil 2 connecting coil number of turns testers.
After compressing circuit board, now on the display screen 14 of wire circle tester, demonstrate coil quantity, owing to be series relationship between above-mentioned three coils, so should show 16 circles on display screen, the number of turns of three coils only with.
The above-mentioned test process time is very short, and skilled tester only needs 3 seconds, than prior art, has saved for 1/3rd time, and only need to observe a display screen.
In the present invention, install the magnetic induction post in base, a plurality of probes of setting-in on the base in the magnetic induction post outside, the head-end of each coil on the circuit board bottom surface be set with on the magnetic induction post contacts with a probe respectively with distal point, the probe of first coil head-end contact connects a test pencil post, the probe of last coil end point contact connects another test pencil post, between the probe of distal point contact of coil be connected in series the probe of the head-end contact of next coil, after using this structure, the tester only need be pressed on circuit board on probe, the wire circle tester will show the comprehensive quantity of all coils number of turns, saved like this time that test pencil contacts with each coil first and last end points, and only need to observe a display screen, shortened on the whole the time of single test, and reduced the probability of makeing mistakes, guaranteed the accurate of test result.

Claims (4)

1. a high-density interconnected circuit board refluxes and encloses device for quick testing, comprise the wire circle tester, test pencil and magnetic induction post, described wire circle tester connects respectively test pencil and magnetic induction post, it is characterized in that: the lower end of described magnetic induction post is installed in a base, two test pencil posts are installed on this base, one end of each test pencil post connects a described test pencil, the head-end of each coil on the circuit board bottom surface of described magnetic induction post outer rim suit contacts with a probe of the vertical setting-in in base upper surface respectively with distal point, the probe lower end contacted with the head-end of first coil is connected the other end of a described test pencil post, the probe lower end contacted with the distal point of last coil is connected the other end of another described test pencil post, the distal point of each coil all is connected in series with the head-end of next coil.
2. high-density interconnected circuit board according to claim 1 refluxes and encloses device for quick testing, it is characterized in that: described base comprises top panel and base plate, four jiaos of base plate upper surfaces difference is vertically installed a support column, these four support column upper ends are crimped on the bottom surface of top panel, between this top panel and support column, are bolted.
3. high-density interconnected circuit board according to claim 2 refluxes and encloses device for quick testing, it is characterized in that: the vertical spacing slip of probe is inlaid in a needle tubing, this needle tubing outer rim is set with an outer tube, this outer tube is inlaid in described top panel, and the flange of making laterally in the upper end of outer tube is crimped on the upper surface of described top panel.
4. high-density interconnected circuit board according to claim 3 refluxes and encloses device for quick testing, it is characterized in that: on the inwall of described needle tubing upper end, make bulge loop, be positioned on the probe outer rim of this bulge loop below and make projection, the probe lower end outer rim of this projection below is set with a spring, and this spring bottom is crimped on described needle tubing bottom.
CN201310461541.XA 2013-09-29 2013-09-29 Device for rapidly testing high density interconnect circuit board backflow coils Pending CN103487715A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310461541.XA CN103487715A (en) 2013-09-29 2013-09-29 Device for rapidly testing high density interconnect circuit board backflow coils

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310461541.XA CN103487715A (en) 2013-09-29 2013-09-29 Device for rapidly testing high density interconnect circuit board backflow coils

Publications (1)

Publication Number Publication Date
CN103487715A true CN103487715A (en) 2014-01-01

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105246269A (en) * 2015-10-30 2016-01-13 程啸 Quick connection device and method for spring needle and circuit board
CN107807286A (en) * 2017-11-14 2018-03-16 保定天威集团特变电气有限公司 Disk-type winding number of turn detection means

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105246269A (en) * 2015-10-30 2016-01-13 程啸 Quick connection device and method for spring needle and circuit board
CN107807286A (en) * 2017-11-14 2018-03-16 保定天威集团特变电气有限公司 Disk-type winding number of turn detection means
CN107807286B (en) * 2017-11-14 2023-11-10 保定天威集团特变电气有限公司 Cake-type coil turns detection device

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Application publication date: 20140101